BR112017006411A2 - método de fabricação de cartão com chip e cartão de chip obtido pelo dito método - Google Patents
método de fabricação de cartão com chip e cartão de chip obtido pelo dito métodoInfo
- Publication number
- BR112017006411A2 BR112017006411A2 BR112017006411A BR112017006411A BR112017006411A2 BR 112017006411 A2 BR112017006411 A2 BR 112017006411A2 BR 112017006411 A BR112017006411 A BR 112017006411A BR 112017006411 A BR112017006411 A BR 112017006411A BR 112017006411 A2 BR112017006411 A2 BR 112017006411A2
- Authority
- BR
- Brazil
- Prior art keywords
- chip card
- solder
- module
- antenna
- manufacturing
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
- G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
- G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
- G06K19/07754—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being galvanic
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
- H01L2924/1816—Exposing the passive side of the semiconductor or solid-state body
- H01L2924/18161—Exposing the passive side of the semiconductor or solid-state body of a flip chip
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
- H01L2924/1816—Exposing the passive side of the semiconductor or solid-state body
- H01L2924/18165—Exposing the passive side of the semiconductor or solid-state body of a wire bonded chip
Abstract
resumo método de fabricação de cartão com chip e cartão de chip obtido pelo dito método a invenção refere-se a método de fabricação de cartão de chip. de acordo com o referido método, são produzidos módulo, compreendendo substrato que suporta contatos numa superfície, pistas condutoras e chip na outra; e antena (200) em um suporte, compreendendo almofada de contacto (220) para ligar respectivamente cada uma das suas extremidades. uma gota de solda (230) é colocada em cada uma das almofadas de contacto (220) da antena (200). o suporte da antena (200) é então inserido entre camadas de plástico. é proporcionada uma cavidade (400), na qual o módulo pode ser acomodado e as gotas de solda (230) permanecem acessíveis. a altura da solda antes do aquecimento se projeta a partir da superfície da cavidade. um módulo é então colocado em cada cavidade (400). as áreas do módulo onde estão localizadas as gotas de solda (230) são então aquecidas para fundir a solda e soldar as almofadas de contacto (220) da antena (200) nas pistas condutoras do módulo.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1459310 | 2014-09-30 | ||
FR1459310A FR3026529B1 (fr) | 2014-09-30 | 2014-09-30 | Procede de fabrication de carte a puce et carte a puce obtenue par ce procede. |
PCT/FR2015/052621 WO2016051092A1 (fr) | 2014-09-30 | 2015-09-30 | Procédé de fabrication de carte à puce et carte à puce obtenue par ce procédé. |
Publications (2)
Publication Number | Publication Date |
---|---|
BR112017006411A2 true BR112017006411A2 (pt) | 2017-12-19 |
BR112017006411B1 BR112017006411B1 (pt) | 2023-01-31 |
Family
ID=51866267
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR112017006411-1A BR112017006411B1 (pt) | 2014-09-30 | 2015-09-30 | Método para a fabricação de um cartão com chip, suporte de antena para um cartão com chip e cartão com chip |
Country Status (8)
Country | Link |
---|---|
US (1) | US10592796B2 (pt) |
EP (1) | EP3201843B1 (pt) |
KR (1) | KR102481332B1 (pt) |
CN (1) | CN107209870B (pt) |
AU (2) | AU2015326677A1 (pt) |
BR (1) | BR112017006411B1 (pt) |
FR (1) | FR3026529B1 (pt) |
WO (1) | WO2016051092A1 (pt) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR3051063B1 (fr) | 2016-05-06 | 2021-02-12 | Linxens Holding | Procede de fabrication de cartes a puce et carte a puce obtenue par ce procede |
FR3063555B1 (fr) * | 2017-03-03 | 2021-07-09 | Linxens Holding | Carte a puce et procede de fabrication d’une carte a puce |
KR102440366B1 (ko) | 2018-01-04 | 2022-09-05 | 삼성전자주식회사 | 메모리 카드 및 이를 포함하는 전자 장치 |
JP6703629B2 (ja) * | 2018-06-19 | 2020-06-03 | コナ アイ カンパニー リミテッド | メタルカード及びメタルカードの製造方法 |
US11416729B2 (en) * | 2018-06-20 | 2022-08-16 | Kona I Co., Ltd. | Metal card manufacturing method |
FR3088515B1 (fr) * | 2018-11-08 | 2022-01-28 | Smart Packaging Solutions | Module electronique pour carte a puce |
FR3092788B1 (fr) * | 2019-02-18 | 2022-09-02 | Idemia France | Carte électronique comportant une sous-cavité de réception d’adhésif pour l’encartage d’un module et procédé de réalisation d’une telle carte électronique |
TWI759098B (zh) * | 2021-02-05 | 2022-03-21 | 宏通數碼科技股份有限公司 | 雙天線發光感應卡 |
Family Cites Families (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5217597A (en) * | 1991-04-01 | 1993-06-08 | Motorola, Inc. | Solder bump transfer method |
US5219117A (en) * | 1991-11-01 | 1993-06-15 | Motorola, Inc. | Method of transferring solder balls onto a semiconductor device |
WO1996009175A1 (fr) * | 1994-09-22 | 1996-03-28 | Rohm Co., Ltd. | Carte de ci du type sans contact et procede de fabrication de cette carte |
DE19605966A1 (de) * | 1996-02-17 | 1997-08-21 | Bosch Gmbh Robert | Vorrichtung, insbesondere zur Verwendung in einem elektronischen Steuergerät |
FR2752077B1 (fr) * | 1996-08-02 | 1998-09-18 | Solaic Sa | Carte a circuit integre a connexion mixte et module a circuit integre correspondant |
AU3944597A (en) * | 1996-08-02 | 1998-02-25 | Solaic | Integrated circuit card with two connection modes |
FR2753819B1 (fr) * | 1996-09-20 | 1998-11-27 | Carte a circuit integre a connexion mixte | |
DE19709985A1 (de) * | 1997-03-11 | 1998-09-17 | Pav Card Gmbh | Chipkarte, Verbindungsanordnung und Verfahren zum Herstellen einer Chipkarte |
FR2769390B1 (fr) * | 1997-10-08 | 2003-02-14 | Gemplus Card Int | Procede de fabrication de cartes a puce aptes a assurer un fonctionnement a contact et sans contact, et de cartes a puce sans contact |
AU5283399A (en) * | 1998-07-15 | 2000-02-07 | Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E.V. | Method for transferring solder to a device and/or testing the device |
US6333104B1 (en) * | 2000-05-30 | 2001-12-25 | International Business Machines Corporation | Conductive polymer interconnection configurations |
US6759743B2 (en) * | 2000-09-11 | 2004-07-06 | Xytrans, Inc. | Thick film millimeter wave transceiver module |
US6857552B2 (en) * | 2003-04-17 | 2005-02-22 | Intercard Limited | Method and apparatus for making smart card solder contacts |
US7038571B2 (en) * | 2003-05-30 | 2006-05-02 | Motorola, Inc. | Polymer thick film resistor, layout cell, and method |
TWI284842B (en) * | 2003-07-14 | 2007-08-01 | Nec Tokin Corp | Communication medium capable of carrying out contactless communication and method of producing the same |
FR2863747B1 (fr) * | 2003-12-11 | 2006-03-24 | Oberthur Card Syst Sa | Fiabilisation des cartes dual interface par grille continue |
KR20070006885A (ko) * | 2004-03-31 | 2007-01-11 | 어플라이드 머티어리얼스, 인코포레이티드 | 반도체 장치 제조과정 동안 전도성 부품을 운반하기 위한장치 및 방법 |
CN200976243Y (zh) * | 2006-12-03 | 2007-11-14 | 蔡小如 | 一种双芯uhf电子标签 |
US7980477B2 (en) * | 2007-05-17 | 2011-07-19 | Féinics Amatech Teoranta | Dual interface inlays |
EP2001077A1 (fr) * | 2007-05-21 | 2008-12-10 | Gemplus | Procédé de réalisation d'un dispositif comportant une antenne de transpondeur connectée à des plages de contact et dispositif obtenu |
KR100838647B1 (ko) * | 2007-07-23 | 2008-06-16 | 한국과학기술원 | Acf/ncf 이중층을 이용한 웨이퍼 레벨 플립칩패키지의 제조방법 |
US8522431B2 (en) * | 2008-01-09 | 2013-09-03 | Féines Amatech Teoranta | Mounting and connecting an antenna wire in a transponder |
US20150227829A1 (en) * | 2008-08-29 | 2015-08-13 | David Finn | Laminates for security documents |
FR2938380B1 (fr) * | 2008-11-07 | 2010-12-24 | Oberthur Technologies | Couche support d'antenne filaire et/ou d'elements de connexion filaire pour carte a microcircuit |
JP2011107865A (ja) * | 2009-11-16 | 2011-06-02 | Toppan Printing Co Ltd | デュアルインターフェイス型icカードおよびその製造方法 |
US8870080B2 (en) * | 2010-08-12 | 2014-10-28 | Féinics Amatech Teoranta | RFID antenna modules and methods |
KR101151025B1 (ko) * | 2010-10-26 | 2012-06-08 | 쎄네스테크놀로지(주) | 접촉 및 비접촉 겸용 카드의 제조방법 |
EP2541471A1 (fr) * | 2011-07-01 | 2013-01-02 | Gemalto SA | Dispositif portatif à contacts électriques évidés |
US8950681B2 (en) * | 2011-11-07 | 2015-02-10 | Blackberry Limited | Universal integrated circuit card apparatus and related methods |
US9224695B2 (en) * | 2013-02-28 | 2015-12-29 | Infineon Technologies Ag | Chip arrangement and a method for manufacturing a chip arrangement |
CN109712946B (zh) * | 2013-03-29 | 2021-01-19 | 日月光半导体制造股份有限公司 | 半导体封装件 |
CN103729675B (zh) * | 2013-12-04 | 2018-12-28 | 上海中卡智能卡有限公司 | 一种非接触智能识别卡inlay层及其制备方法 |
WO2015157222A2 (en) * | 2014-04-07 | 2015-10-15 | American Banknote Corporation | System and method for detecting the depth of an antenna in the card body of a smart card |
GB2548639A (en) * | 2016-03-24 | 2017-09-27 | Zwipe As | Method of manufacturing a smartcard |
DE102016114199B4 (de) * | 2016-08-01 | 2021-07-22 | Infineon Technologies Ag | Chipkartenmodul, chipkarte, chipkartenanordnung, verfahren zum ausbilden eines chipkartenmoduls und verfahren zum ausbilden einer chipkarte |
-
2014
- 2014-09-30 FR FR1459310A patent/FR3026529B1/fr not_active Expired - Fee Related
-
2015
- 2015-09-30 BR BR112017006411-1A patent/BR112017006411B1/pt active IP Right Grant
- 2015-09-30 CN CN201580061286.7A patent/CN107209870B/zh active Active
- 2015-09-30 AU AU2015326677A patent/AU2015326677A1/en not_active Abandoned
- 2015-09-30 US US15/515,675 patent/US10592796B2/en active Active
- 2015-09-30 EP EP15788471.9A patent/EP3201843B1/fr active Active
- 2015-09-30 KR KR1020177011453A patent/KR102481332B1/ko active IP Right Grant
- 2015-09-30 WO PCT/FR2015/052621 patent/WO2016051092A1/fr active Application Filing
-
2018
- 2018-12-13 AU AU2018278977A patent/AU2018278977B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
FR3026529B1 (fr) | 2017-12-29 |
EP3201843B1 (fr) | 2020-03-04 |
AU2018278977A1 (en) | 2019-01-17 |
AU2015326677A1 (en) | 2017-05-18 |
EP3201843A1 (fr) | 2017-08-09 |
BR112017006411B1 (pt) | 2023-01-31 |
US10592796B2 (en) | 2020-03-17 |
CN107209870B (zh) | 2020-10-30 |
AU2018278977B2 (en) | 2020-10-22 |
FR3026529A1 (fr) | 2016-04-01 |
US20170249545A1 (en) | 2017-08-31 |
KR102481332B1 (ko) | 2022-12-23 |
CN107209870A (zh) | 2017-09-26 |
WO2016051092A1 (fr) | 2016-04-07 |
KR20170066486A (ko) | 2017-06-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
BR112017006411A2 (pt) | método de fabricação de cartão com chip e cartão de chip obtido pelo dito método | |
WO2013009866A3 (en) | Memory module in a package | |
MY171050A (en) | Semiconductor component and method of manufacture | |
WO2012094663A3 (en) | Packaging photon building blocks having only top side connections in an interconnect structure | |
WO2013052372A3 (en) | Stub minimization for multi-die wirebond assemblies with parallel windows | |
AR097558A1 (es) | Entrepaño con -al menos- dos elementos de conexión eléctrica y un conductor de conexión | |
IN2014CH02039A (pt) | ||
EP2866257A3 (en) | Printed circuit board and manufacturing method thereof and semiconductor pacakge using the same | |
GB2532869A (en) | Semiconductor die and package jigsaw submount | |
RU2015103666A (ru) | Способ соединения электрического компонента с носителем электрического компонента и устройство | |
BR112015020828A2 (pt) | indutor de fator de alta qualidade implementado em empacotamento de nível de wafer (wlp) | |
BR112018016242A2 (pt) | métodos de fabricação de cartões com chip e dos suportes de antena de cartão com chip | |
EP2500944A3 (en) | Semiconductor light emitting diode chip, method of manufacturing thereof and method for quality control thereof | |
MY198980A (en) | Capacitors embedded in stiffeners for small form-factor and methods of assembling same | |
PH12019500156A1 (en) | Connector pin apparatus for semiconductor chip testing, and method for manufacturing same | |
TW200731433A (en) | Semiconductor device and manufacturing method for the same | |
PH12015502386A1 (en) | Socket for semiconductor chip test and method of manufacturing the same | |
BR112016004138A2 (pt) | Método para fabricar um dispositivo de detecção de superfície de líquido, e, dispositivo de detecção de superfície de líquido | |
MX2018009123A (es) | Metodo para producir un modulo de tarjeta de chip y una tarjeta de chip. | |
WO2013052398A3 (en) | Stub minimization for assemblies without wirebonds to package substrate | |
MX2012008351A (es) | Paquete invertido de chip de dos lados. | |
WO2015096946A3 (de) | Verfahren zur herstellung eines chipmoduls | |
MY167837A (en) | Integrated circuit film and method of manufacturing the same | |
WO2013052441A3 (en) | Stub minimization for wirebond stacked assemblies without windows | |
WO2014118044A3 (de) | Halbleiterchipanordnung und verfahren zur deren herstellung |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
B25G | Requested change of headquarter approved |
Owner name: LINXENS HOLDING (FR) |
|
B06U | Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette] | ||
B09A | Decision: intention to grant [chapter 9.1 patent gazette] | ||
B16A | Patent or certificate of addition of invention granted [chapter 16.1 patent gazette] |
Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 30/09/2015, OBSERVADAS AS CONDICOES LEGAIS |