BR112014003130A2 - aperfeiçoamentos de acoplamento em e para cartões inteligentes rfid - Google Patents

aperfeiçoamentos de acoplamento em e para cartões inteligentes rfid

Info

Publication number
BR112014003130A2
BR112014003130A2 BR112014003130A BR112014003130A BR112014003130A2 BR 112014003130 A2 BR112014003130 A2 BR 112014003130A2 BR 112014003130 A BR112014003130 A BR 112014003130A BR 112014003130 A BR112014003130 A BR 112014003130A BR 112014003130 A2 BR112014003130 A2 BR 112014003130A2
Authority
BR
Brazil
Prior art keywords
smart cards
rfid smart
enhancements
coupling
coupling enhancements
Prior art date
Application number
BR112014003130A
Other languages
English (en)
Portuguese (pt)
Inventor
Finn David
Ummenhofer Klaus
Original Assignee
Féinics Amatech Teoranta
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US13/205,600 external-priority patent/US8474726B2/en
Priority claimed from US13/294,578 external-priority patent/US20120055013A1/en
Application filed by Féinics Amatech Teoranta filed Critical Féinics Amatech Teoranta
Publication of BR112014003130A2 publication Critical patent/BR112014003130A2/pt

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Details Of Aerials (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
BR112014003130A 2011-08-08 2011-12-06 aperfeiçoamentos de acoplamento em e para cartões inteligentes rfid BR112014003130A2 (pt)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US13/205,600 US8474726B2 (en) 2010-08-12 2011-08-08 RFID antenna modules and increasing coupling
US201161521741P 2011-08-09 2011-08-09
US201161533228P 2011-09-11 2011-09-11
US201161536153P 2011-09-19 2011-09-19
US13/294,578 US20120055013A1 (en) 2010-07-13 2011-11-11 Forming microstructures and antennas for transponders
US201161561938P 2011-11-21 2011-11-21
PCT/EP2011/071885 WO2013020610A1 (fr) 2011-08-08 2011-12-06 Amélioration du couplage dans et sur des cartes intelligentes d'identification par radiofréquence (rfid)

Publications (1)

Publication Number Publication Date
BR112014003130A2 true BR112014003130A2 (pt) 2017-06-06

Family

ID=45217552

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112014003130A BR112014003130A2 (pt) 2011-08-08 2011-12-06 aperfeiçoamentos de acoplamento em e para cartões inteligentes rfid

Country Status (9)

Country Link
EP (1) EP2742464A1 (fr)
JP (1) JP2014529927A (fr)
KR (1) KR20140082648A (fr)
CN (1) CN103907125A (fr)
AU (1) AU2011374571A1 (fr)
BR (1) BR112014003130A2 (fr)
CA (1) CA2853767A1 (fr)
MX (1) MX2014001531A (fr)
WO (1) WO2013020610A1 (fr)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3036541B1 (fr) * 2015-05-19 2018-06-29 Smart Packaging Solutions Antenne a circuits rlc entremeles
KR101732944B1 (ko) * 2015-11-11 2017-05-08 주식회사 이엠따블유 복합 페라이트 자기장 차폐시트, 이의 제조방법 및 이를 이용한 안테나 모듈
DE102016100898B4 (de) * 2016-01-20 2021-08-12 Infineon Technologies Ag Chipkarte und Verfahren zum Ausbilden einer Chipkarte
US9761522B2 (en) * 2016-01-29 2017-09-12 Taiwan Semiconductor Manufacturing Company, Ltd. Wireless charging package with chip integrated in coil center
GB2548638A (en) * 2016-03-24 2017-09-27 Zwipe As Method of manufacturing a smartcard
CN205721902U (zh) 2016-04-11 2016-11-23 深圳市高福科技有限公司 一种可以射频通讯与支付的金属芯片卡
JPWO2018092897A1 (ja) 2016-11-18 2019-10-17 凸版印刷株式会社 電磁結合デュアルｉｃカード及びｉｃモジュール
US10373045B2 (en) * 2016-12-01 2019-08-06 Avery Dennison Retail Information Services, Llc Coupling of RFID straps to antennae using a combination of magnetic and electric fields
CN108021971A (zh) * 2018-01-08 2018-05-11 内蒙古聚能节能服务有限公司 一种用于无线充电计费结算系统的电子标签
CN112384932A (zh) * 2018-05-10 2021-02-19 安全创造有限责任公司 具有增强天线的双接口金属智能卡
DE102018009579A1 (de) * 2018-12-05 2020-06-10 Giesecke+Devrient Mobile Security Gmbh Datenträger aufweisend ein kompaktes Chipmodul
CN110808448B (zh) * 2019-10-15 2021-02-26 元彰精密科技(扬州)有限公司 一种基于透明柔性基材的rfid高频天线及制备工艺
CN113871136B (zh) * 2021-08-24 2022-07-26 锐石创芯(深圳)科技股份有限公司 耦合器及射频前端模组

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5084699A (en) 1989-05-26 1992-01-28 Trovan Limited Impedance matching coil assembly for an inductively coupled transponder
JP2554338Y2 (ja) * 1991-01-29 1997-11-17 富士通テン株式会社 マルチバンドアンテナ
DE4311493C2 (de) 1993-04-07 2000-04-06 Amatech Advanced Micromechanic IC-Kartenmodul zur Herstellung einer IC-Karte
US5955723A (en) 1995-05-03 1999-09-21 Siemens Aktiengesellschaft Contactless chip card
DE19534480C2 (de) 1995-09-18 1999-11-11 David Finn IC-Kartenmodul zur Herstellung einer IC-Karte sowie IC-Karte mit einem IC-Kartenmodul
DE59701709C5 (de) 1996-02-12 2014-01-09 Smartrac Ip B.V. Verfahren und vorrichtung zur kontaktierung eines drahtleiters
ES2146989T3 (es) 1996-02-12 2000-08-16 David Finn Procedimiento y dispositivo para el contacto de un conductor de hilo.
DE19654902C2 (de) 1996-03-15 2000-02-03 David Finn Chipkarte
DE19634661A1 (de) 1996-08-28 1998-03-05 David Finn Verfahren und Vorrichtung zur Herstellung einer Spulenanordnung
DE19703029A1 (de) 1997-01-28 1998-07-30 Amatech Gmbh & Co Kg Übertragungsmodul für eine Transpondervorrichtung sowie Transpondervorrichtung und Verfahren zum Betrieb einer Transpondervorrichtung
CN1179295C (zh) 1997-11-14 2004-12-08 凸版印刷株式会社 复合ic模块及复合ic卡
IL122250A (en) 1997-11-19 2003-07-31 On Track Innovations Ltd Smart card amenable to assembly using two manufacturing stages and a method of manufacture thereof
CN1243294A (zh) * 1998-07-28 2000-02-02 东芝株式会社 集成电路卡和数据读写装置和无线标记及它们的制造方法
EP0977145A3 (fr) * 1998-07-28 2002-11-06 Kabushiki Kaisha Toshiba Carte à puce radio
US6373447B1 (en) 1998-12-28 2002-04-16 Kawasaki Steel Corporation On-chip antenna, and systems utilizing same
FR2801707B1 (fr) 1999-11-29 2002-02-15 A S K Procede de fabrication d'une carte a puce hybride contact- sans contact avec un support d'antenne en materiau fibreux
KR100741039B1 (ko) * 2000-06-21 2007-07-20 히다치 막셀 가부시키가이샤 반도체칩 및 이것을 사용한 반도체장치
JP2002015292A (ja) * 2000-06-30 2002-01-18 Hitachi Maxell Ltd 非接触通信式情報担体
FR2820548A1 (fr) 2001-02-02 2002-08-09 Schlumberger Systems & Service Objet portatif a puce et a antenne, module destine a former un objet portatif a puce et a antenne et leurs procedes de fabrication
FR2882174B1 (fr) 2005-02-11 2007-09-07 Smart Packaging Solutions Sps Procede de fabrication d'un dispositif microelectronique a fonctionnement sans contact notamment pour passeport electronique
FR2890502A1 (fr) 2005-09-02 2007-03-09 Gemplus Sa Ajustement de frequence de resonance par reglage de capacite repartie inter-spires
JP2007150642A (ja) * 2005-11-28 2007-06-14 Hitachi Ulsi Systems Co Ltd 無線タグ用質問器、無線タグ用アンテナ、無線タグシステムおよび無線タグ選別装置
CN101432926B (zh) * 2006-04-28 2013-10-09 松下电器产业株式会社 内置天线电路模块及其制造方法
JP2008167190A (ja) * 2006-12-28 2008-07-17 Philtech Inc 基体シート
FR2915011B1 (fr) 2007-03-29 2009-06-05 Smart Packaging Solutions Sps Carte a puce a double interface de communication
US7980477B2 (en) 2007-05-17 2011-07-19 Féinics Amatech Teoranta Dual interface inlays
FR2919409B1 (fr) 2007-07-26 2009-09-04 Smart Packaging Solutions Sps Document securise a puce sans contact avec protection des donnees contre les lectures non autorisees.
ATE520167T1 (de) 2007-10-03 2011-08-15 Assa Abloy Ab Kopplungsvorrichtung für einen transponder und chipkarte mit derartiger vorrichtung
US8102021B2 (en) * 2008-05-12 2012-01-24 Sychip Inc. RF devices
FR2932910B1 (fr) 2008-06-20 2011-02-11 Smart Packaging Solutions Sps Carte sans contact avec logo securitaire

Also Published As

Publication number Publication date
WO2013020610A1 (fr) 2013-02-14
CN103907125A (zh) 2014-07-02
KR20140082648A (ko) 2014-07-02
CA2853767A1 (fr) 2013-02-14
AU2011374571A1 (en) 2014-02-20
EP2742464A1 (fr) 2014-06-18
JP2014529927A (ja) 2014-11-13
MX2014001531A (es) 2014-06-04

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Legal Events

Date Code Title Description
B08F Application fees: dismissal - article 86 of industrial property law
B08K Lapse as no evidence of payment of the annual fee has been furnished to inpi (acc. art. 87)