BR112012002431A2 - método para fabricar um dispositivo emissor de luz e dispositivo emissor de luz - Google Patents
método para fabricar um dispositivo emissor de luz e dispositivo emissor de luzInfo
- Publication number
- BR112012002431A2 BR112012002431A2 BR112012002431A BR112012002431A BR112012002431A2 BR 112012002431 A2 BR112012002431 A2 BR 112012002431A2 BR 112012002431 A BR112012002431 A BR 112012002431A BR 112012002431 A BR112012002431 A BR 112012002431A BR 112012002431 A2 BR112012002431 A2 BR 112012002431A2
- Authority
- BR
- Brazil
- Prior art keywords
- light emitting
- emitting device
- manufacturing
- light
- emitting
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8515—Wavelength conversion means not being in contact with the bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0361—Manufacture or treatment of packages of wavelength conversion means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/8506—Containers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/853—Encapsulations characterised by their shape
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/537,909 US20110031516A1 (en) | 2009-08-07 | 2009-08-07 | Led with silicone layer and laminated remote phosphor layer |
| PCT/IB2010/053113 WO2011015959A1 (en) | 2009-08-07 | 2010-07-07 | Led with silicone layer and laminated remote phosphor layer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BR112012002431A2 true BR112012002431A2 (pt) | 2019-09-24 |
Family
ID=43017061
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BR112012002431A BR112012002431A2 (pt) | 2009-08-07 | 2010-07-07 | método para fabricar um dispositivo emissor de luz e dispositivo emissor de luz |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US20110031516A1 (enExample) |
| EP (1) | EP2462634A1 (enExample) |
| JP (1) | JP2013501372A (enExample) |
| KR (1) | KR20120056843A (enExample) |
| CN (1) | CN102473820A (enExample) |
| BR (1) | BR112012002431A2 (enExample) |
| RU (1) | RU2012108576A (enExample) |
| TW (1) | TW201123549A (enExample) |
| WO (1) | WO2011015959A1 (enExample) |
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| JP4122738B2 (ja) * | 2001-07-26 | 2008-07-23 | 松下電工株式会社 | 発光装置の製造方法 |
| JP4496774B2 (ja) * | 2003-12-22 | 2010-07-07 | 日亜化学工業株式会社 | 半導体装置の製造方法 |
| JP2005259847A (ja) * | 2004-03-10 | 2005-09-22 | Nitto Denko Corp | 光半導体装置の製造方法 |
| US7361938B2 (en) | 2004-06-03 | 2008-04-22 | Philips Lumileds Lighting Company Llc | Luminescent ceramic for a light emitting device |
| TW200614548A (en) * | 2004-07-09 | 2006-05-01 | Matsushita Electric Industrial Co Ltd | Light-emitting device |
| US7858408B2 (en) * | 2004-11-15 | 2010-12-28 | Koninklijke Philips Electronics N.V. | LED with phosphor tile and overmolded phosphor in lens |
| US7352011B2 (en) * | 2004-11-15 | 2008-04-01 | Philips Lumileds Lighting Company, Llc | Wide emitting lens for LED useful for backlighting |
| US20060171152A1 (en) * | 2005-01-20 | 2006-08-03 | Toyoda Gosei Co., Ltd. | Light emitting device and method of making the same |
| JP5291458B2 (ja) * | 2005-05-25 | 2013-09-18 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | エレクトロルミネッセンス装置 |
| US7754507B2 (en) | 2005-06-09 | 2010-07-13 | Philips Lumileds Lighting Company, Llc | Method of removing the growth substrate of a semiconductor light emitting device |
| US7319246B2 (en) * | 2005-06-23 | 2008-01-15 | Lumination Llc | Luminescent sheet covering for LEDs |
| KR100665219B1 (ko) * | 2005-07-14 | 2007-01-09 | 삼성전기주식회사 | 파장변환형 발광다이오드 패키지 |
| US7344952B2 (en) * | 2005-10-28 | 2008-03-18 | Philips Lumileds Lighting Company, Llc | Laminating encapsulant film containing phosphor over LEDs |
| JP2007273562A (ja) * | 2006-03-30 | 2007-10-18 | Toshiba Corp | 半導体発光装置 |
| JP2008166782A (ja) * | 2006-12-26 | 2008-07-17 | Seoul Semiconductor Co Ltd | 発光素子 |
-
2009
- 2009-08-07 US US12/537,909 patent/US20110031516A1/en not_active Abandoned
-
2010
- 2010-07-07 JP JP2012523405A patent/JP2013501372A/ja not_active Withdrawn
- 2010-07-07 KR KR1020127006022A patent/KR20120056843A/ko not_active Withdrawn
- 2010-07-07 EP EP10740008A patent/EP2462634A1/en not_active Withdrawn
- 2010-07-07 CN CN2010800350575A patent/CN102473820A/zh active Pending
- 2010-07-07 WO PCT/IB2010/053113 patent/WO2011015959A1/en not_active Ceased
- 2010-07-07 BR BR112012002431A patent/BR112012002431A2/pt not_active IP Right Cessation
- 2010-07-07 RU RU2012108576/28A patent/RU2012108576A/ru unknown
- 2010-07-13 TW TW099123014A patent/TW201123549A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| US20110031516A1 (en) | 2011-02-10 |
| KR20120056843A (ko) | 2012-06-04 |
| EP2462634A1 (en) | 2012-06-13 |
| RU2012108576A (ru) | 2013-09-20 |
| CN102473820A (zh) | 2012-05-23 |
| JP2013501372A (ja) | 2013-01-10 |
| TW201123549A (en) | 2011-07-01 |
| WO2011015959A1 (en) | 2011-02-10 |
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| B08F | Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette] | ||
| B08K | Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette] |
Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2543 DE 01-10-2019 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013. |