CN102473820A - 具有硅树脂层和层叠远程磷光体层的led - Google Patents

具有硅树脂层和层叠远程磷光体层的led Download PDF

Info

Publication number
CN102473820A
CN102473820A CN2010800350575A CN201080035057A CN102473820A CN 102473820 A CN102473820 A CN 102473820A CN 2010800350575 A CN2010800350575 A CN 2010800350575A CN 201080035057 A CN201080035057 A CN 201080035057A CN 102473820 A CN102473820 A CN 102473820A
Authority
CN
China
Prior art keywords
layer
phosphor
silicone
phosphor layer
led
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2010800350575A
Other languages
English (en)
Chinese (zh)
Inventor
G.巴辛
P.S.马丁
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Lumileds LLC
Original Assignee
Koninklijke Philips Electronics NV
Philips Lumileds Lighing Co LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics NV, Philips Lumileds Lighing Co LLC filed Critical Koninklijke Philips Electronics NV
Publication of CN102473820A publication Critical patent/CN102473820A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8515—Wavelength conversion means not being in contact with the bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0361—Manufacture or treatment of packages of wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape

Landscapes

  • Led Device Packages (AREA)
CN2010800350575A 2009-08-07 2010-07-07 具有硅树脂层和层叠远程磷光体层的led Pending CN102473820A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/537,909 US20110031516A1 (en) 2009-08-07 2009-08-07 Led with silicone layer and laminated remote phosphor layer
US12/537909 2009-08-07
PCT/IB2010/053113 WO2011015959A1 (en) 2009-08-07 2010-07-07 Led with silicone layer and laminated remote phosphor layer

Publications (1)

Publication Number Publication Date
CN102473820A true CN102473820A (zh) 2012-05-23

Family

ID=43017061

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010800350575A Pending CN102473820A (zh) 2009-08-07 2010-07-07 具有硅树脂层和层叠远程磷光体层的led

Country Status (9)

Country Link
US (1) US20110031516A1 (enExample)
EP (1) EP2462634A1 (enExample)
JP (1) JP2013501372A (enExample)
KR (1) KR20120056843A (enExample)
CN (1) CN102473820A (enExample)
BR (1) BR112012002431A2 (enExample)
RU (1) RU2012108576A (enExample)
TW (1) TW201123549A (enExample)
WO (1) WO2011015959A1 (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104485411A (zh) * 2014-11-14 2015-04-01 江苏脉锐光电科技有限公司 一种远程荧光粉透镜和制造方法及其应用
CN106885194A (zh) * 2015-12-15 2017-06-23 现代自动车株式会社 光源模块以及使用其的车辆头灯
CN111052422A (zh) * 2017-09-01 2020-04-21 科锐公司 发光二极管、部件及相关方法
CN113490887A (zh) * 2018-12-21 2021-10-08 亮锐控股有限公司 支持两步磷光体沉积以形成led矩阵阵列的光刻胶图案化工艺
CN115411023A (zh) * 2022-08-22 2022-11-29 深圳市未林森科技有限公司 一种误差小的cob光源颜色均匀控制工艺方法

Families Citing this family (98)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8525207B2 (en) * 2008-09-16 2013-09-03 Osram Sylvania Inc. LED package using phosphor containing elements and light source containing same
US8912023B2 (en) 2009-04-08 2014-12-16 Ledengin, Inc. Method and system for forming LED light emitters
US8323748B2 (en) * 2009-05-15 2012-12-04 Achrolux Inc. Methods for forming uniform particle layers of phosphor material on a surface
US8384114B2 (en) 2009-06-27 2013-02-26 Cooledge Lighting Inc. High efficiency LEDs and LED lamps
JP5379615B2 (ja) * 2009-09-09 2013-12-25 パナソニック株式会社 照明装置
JP2011082339A (ja) * 2009-10-07 2011-04-21 Nitto Denko Corp 光半導体封止用キット
US8384121B2 (en) 2010-06-29 2013-02-26 Cooledge Lighting Inc. Electronic devices with yielding substrates
US8653539B2 (en) 2010-01-04 2014-02-18 Cooledge Lighting, Inc. Failure mitigation in arrays of light-emitting devices
US9480133B2 (en) 2010-01-04 2016-10-25 Cooledge Lighting Inc. Light-emitting element repair in array-based lighting devices
US8771577B2 (en) 2010-02-16 2014-07-08 Koninklijke Philips N.V. Light emitting device with molded wavelength converting layer
US8901586B2 (en) * 2010-07-12 2014-12-02 Samsung Electronics Co., Ltd. Light emitting device and method of manufacturing the same
US20120081000A1 (en) * 2010-10-05 2012-04-05 Power Data Communications Co., Ltd. Led encapsulation process and shield structure made thereby
TWI445216B (zh) * 2010-11-17 2014-07-11 宏齊科技股份有限公司 具有沈積式螢光批覆層之發光二極體封裝結構及其製作方法
DE102011013369A1 (de) * 2010-12-30 2012-07-05 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen einer Mehrzahl von Halbleiterbauelementen
TWI441361B (zh) * 2010-12-31 2014-06-11 英特明光能股份有限公司 發光二極體封裝結構及其製造方法
WO2012100132A1 (en) * 2011-01-21 2012-07-26 Osram Sylvania Inc. Luminescent converter and led light source containing same
CN102683514B (zh) * 2011-03-06 2017-07-14 维亚甘有限公司 发光二极管封装和制造方法
KR20140022031A (ko) * 2011-03-25 2014-02-21 코닌클리케 필립스 엔.브이. Led 위에 패터닝된 uv에 민감한 실리콘-형광체 층
KR20120119350A (ko) * 2011-04-21 2012-10-31 삼성전자주식회사 발광소자 모듈 및 이의 제조방법
US9029887B2 (en) 2011-04-22 2015-05-12 Micron Technology, Inc. Solid state lighting devices having improved color uniformity and associated methods
DE102011102350A1 (de) * 2011-05-24 2012-11-29 Osram Opto Semiconductors Gmbh Optisches Element, optoelektronisches Bauelement und Verfahren zur Herstellung dieser
US8480267B2 (en) 2011-06-28 2013-07-09 Osram Sylvania Inc. LED lighting apparatus, systems and methods of manufacture
US8585243B2 (en) 2011-06-28 2013-11-19 Osram Sylvania Inc. LED lighting apparatus, systems and methods of manufacture
WO2013008157A1 (en) 2011-07-14 2013-01-17 Koninklijke Philips Electronics N.V. Method of manufacturing a phosphor-enhanced light source
KR101294415B1 (ko) 2011-07-20 2013-08-08 엘지이노텍 주식회사 광학 부재 및 이를 포함하는 표시장치
CN102270730A (zh) * 2011-07-27 2011-12-07 晶科电子（广州）有限公司 一种无金线的led器件
US8952402B2 (en) 2011-08-26 2015-02-10 Micron Technology, Inc. Solid-state radiation transducer devices having flip-chip mounted solid-state radiation transducers and associated systems and methods
US8579451B2 (en) 2011-09-15 2013-11-12 Osram Sylvania Inc. LED lamp
US9349927B2 (en) * 2011-10-18 2016-05-24 Nitto Denko Corporation Encapsulating sheet and optical semiconductor element device
US9444024B2 (en) * 2011-11-10 2016-09-13 Cree, Inc. Methods of forming optical conversion material caps
US10043960B2 (en) * 2011-11-15 2018-08-07 Cree, Inc. Light emitting diode (LED) packages and related methods
JP2013135084A (ja) * 2011-12-26 2013-07-08 Nitto Denko Corp 発光ダイオード装置の製造方法
US9368702B2 (en) 2012-02-10 2016-06-14 Koninklijke Philips N.V. Molded lens forming a chip scale LED package and method of manufacturing the same
US8591076B2 (en) 2012-03-02 2013-11-26 Osram Sylvania Inc. Phosphor sheet having tunable color temperature
US9388959B2 (en) 2012-03-02 2016-07-12 Osram Sylvania Inc. White-light emitter having a molded phosphor sheet and method of making same
JP5912712B2 (ja) * 2012-03-21 2016-04-27 スタンレー電気株式会社 照明用光学系
WO2013144777A1 (en) 2012-03-29 2013-10-03 Koninklijke Philips N.V. Phosphor in inorganic binder for led applications
WO2013144919A1 (en) 2012-03-29 2013-10-03 Koninklijke Philips N.V. Phosphor in inorganic binder for led applications
US20130279194A1 (en) * 2012-04-22 2013-10-24 Liteideas, Llc Light emitting systems and related methods
CN103378260A (zh) * 2012-04-24 2013-10-30 展晶科技(深圳)有限公司 发光二极管封装结构的制造方法
US8877561B2 (en) 2012-06-07 2014-11-04 Cooledge Lighting Inc. Methods of fabricating wafer-level flip chip device packages
EP2875532B1 (en) 2012-07-20 2019-02-27 Lumileds Holding B.V. Led with ceramic green phosphor and protected red phosphor layer
JP6024957B2 (ja) * 2012-09-24 2016-11-16 東芝ライテック株式会社 発光装置および照明装置
EP2917937B1 (en) 2012-11-07 2016-11-16 Koninklijke Philips N.V. Method for manufacturing a light emitting device including a filter and a protective layer
JP6419077B2 (ja) 2012-11-07 2018-11-07 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． 波長変換発光デバイス
CN103022325B (zh) * 2012-12-24 2016-01-20 佛山市香港科技大学Led-Fpd工程技术研究开发中心 应用远距式荧光粉层的led封装结构及其制成方法
US10439107B2 (en) * 2013-02-05 2019-10-08 Cree, Inc. Chip with integrated phosphor
KR101319360B1 (ko) * 2013-03-04 2013-10-16 유버 주식회사 칩온보드형 ｕｖ ｌｅｄ 패키지 및 그 제조방법
US8876312B2 (en) * 2013-03-05 2014-11-04 Avago Technologies General Ip (Singapore) Pte. Ltd. Lighting device and apparatus with spectral converter within a casing
US8928219B2 (en) 2013-03-05 2015-01-06 Avago Technologies General Ip (Singapore) Pte. Ltd. Lighting device with spectral converter
US9470395B2 (en) 2013-03-15 2016-10-18 Abl Ip Holding Llc Optic for a light source
US10400984B2 (en) * 2013-03-15 2019-09-03 Cree, Inc. LED light fixture and unitary optic member therefor
TWI527274B (zh) * 2013-04-29 2016-03-21 新世紀光電股份有限公司 發光二極體封裝結構
KR20150025231A (ko) * 2013-08-28 2015-03-10 서울반도체 주식회사 광원 모듈 및 그 제조 방법, 및 백라이트 유닛
US20150226385A1 (en) * 2014-02-11 2015-08-13 Cree, Inc. Systems and Methods for Application of Coatings Including Thixotropic Agents onto Optical Elements, and Optical Elements Having Coatings Including Thixotropic Agents
US9590148B2 (en) 2014-03-18 2017-03-07 GE Lighting Solutions, LLC Encapsulant modification in heavily phosphor loaded LED packages for improved stability
US9680067B2 (en) 2014-03-18 2017-06-13 GE Lighting Solutions, LLC Heavily phosphor loaded LED packages having higher stability
DE102014106074A1 (de) * 2014-04-30 2015-11-19 Osram Opto Semiconductors Gmbh Leuchtvorrichtung und Verfahren zum Herstellen einer Leuchtvorrichtung
US20150325748A1 (en) * 2014-05-07 2015-11-12 Genesis Photonics Inc. Light emitting device
JP6077670B2 (ja) * 2014-05-09 2017-02-08 富士高分子工業株式会社 蛍光体含有識別物体及びその製造方法
KR101641205B1 (ko) * 2014-05-12 2016-07-21 주식회사 케이케이디씨 발광각도 조절이 가능한 형광필름이 구비된 led 조명 모듈 제조 방법
US9997676B2 (en) 2014-05-14 2018-06-12 Genesis Photonics Inc. Light emitting device and manufacturing method thereof
TWI557952B (zh) 2014-06-12 2016-11-11 新世紀光電股份有限公司 發光元件
TWI641285B (zh) 2014-07-14 2018-11-11 新世紀光電股份有限公司 發光模組與發光單元的製作方法
TW201828501A (zh) * 2014-10-09 2018-08-01 新世紀光電股份有限公司 發光裝置
TWI631733B (zh) * 2014-10-09 2018-08-01 新世紀光電股份有限公司 發光裝置
US9892944B2 (en) 2016-06-23 2018-02-13 Sharp Kabushiki Kaisha Diodes offering asymmetric stability during fluidic assembly
US9985190B2 (en) 2016-05-18 2018-05-29 eLux Inc. Formation and structure of post enhanced diodes for orientation control
US10249599B2 (en) 2016-06-29 2019-04-02 eLux, Inc. Laminated printed color conversion phosphor sheets
US9917226B1 (en) 2016-09-15 2018-03-13 Sharp Kabushiki Kaisha Substrate features for enhanced fluidic assembly of electronic devices
US9755110B1 (en) 2016-07-27 2017-09-05 Sharp Laboratories Of America, Inc. Substrate with topological features for steering fluidic assembly LED disks
DE102015001723A1 (de) 2015-02-05 2016-08-11 Sergey Dyukin Die Methode der Verbesserung der Charakteristiken von Leuchtgeräten mit einer Stirnseitenbeleuchtung des Lichtleiters, die den Luminophor beinhalten, der mit Halbleiterstrukturen beleuchtet wird.
DE102015103835A1 (de) * 2015-03-16 2016-09-22 Osram Opto Semiconductors Gmbh Lichtemittierendes Bauelement und Verfahren zur Herstellung eines lichtemittierenden Bauelements
US10984735B2 (en) * 2015-04-17 2021-04-20 Nanosys, Inc. White point uniformity in display devices
US10217914B2 (en) * 2015-05-27 2019-02-26 Samsung Electronics Co., Ltd. Semiconductor light emitting device
CN106469772B (zh) * 2015-08-18 2018-01-05 江苏诚睿达光电有限公司 一种基于滚压式的热塑性树脂光转换体贴合封装led的工艺方法
US10816165B2 (en) 2015-11-19 2020-10-27 Lsi Industries, Inc. LED luminaire assembly
USD781482S1 (en) 2015-12-28 2017-03-14 Lsi Industries, Inc. Luminaire
EP3205584B1 (en) * 2016-02-12 2020-06-03 Goodrich Lighting Systems GmbH Exterior aircraft light and aircraft comprising the same
US9627437B1 (en) 2016-06-30 2017-04-18 Sharp Laboratories Of America, Inc. Patterned phosphors in through hole via (THV) glass
US10290777B2 (en) 2016-07-26 2019-05-14 Cree, Inc. Light emitting diodes, components and related methods
DE102016115533A1 (de) * 2016-08-22 2018-02-22 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterchip, Verfahren zur Herstellung eines optoelektronischen Halbleiterchips und Scheinwerfer mit einem optoelektronischen Halbleiterchip
US10243097B2 (en) 2016-09-09 2019-03-26 eLux Inc. Fluidic assembly using tunable suspension flow
US9837390B1 (en) 2016-11-07 2017-12-05 Corning Incorporated Systems and methods for creating fluidic assembly structures on a substrate
JP7108171B2 (ja) * 2016-12-27 2022-07-28 日亜化学工業株式会社 発光装置
US10319889B2 (en) * 2016-12-27 2019-06-11 Nichia Corporation Light emitting device
US11024785B2 (en) 2018-05-25 2021-06-01 Creeled, Inc. Light-emitting diode packages
US11335833B2 (en) 2018-08-31 2022-05-17 Creeled, Inc. Light-emitting diodes, light-emitting diode arrays and related devices
US11233183B2 (en) 2018-08-31 2022-01-25 Creeled, Inc. Light-emitting diodes, light-emitting diode arrays and related devices
USD902448S1 (en) 2018-08-31 2020-11-17 Cree, Inc. Light emitting diode package
CH716066A1 (de) 2019-04-03 2020-10-15 Jk Holding Gmbh Bestrahlungsmodul sowie Vorrichtung und Verfahren zum Bestrahlen mit medizinisch-kosmetischer Strahlung.
US11101411B2 (en) 2019-06-26 2021-08-24 Creeled, Inc. Solid-state light emitting devices including light emitting diodes in package structures
USD933881S1 (en) 2020-03-16 2021-10-19 Hgci, Inc. Light fixture having heat sink
US11032976B1 (en) * 2020-03-16 2021-06-15 Hgci, Inc. Light fixture for indoor grow application and components thereof
USD933872S1 (en) 2020-03-16 2021-10-19 Hgci, Inc. Light fixture
WO2021258006A1 (en) * 2020-06-18 2021-12-23 Myotek Industries Multi-injection molded optical grade silicone lens and method for producing incorporating a glow in the dark phosphor material
TWI857379B (zh) 2022-10-28 2024-10-01 財團法人工業技術研究院 色轉換面板與顯示器
EP4406858A1 (en) 2023-01-24 2024-07-31 Goodrich Lighting Systems GmbH & Co. KG Aircraft light, aircraft comprising an aircraft light, and method of manufacturing an aircraft light

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003046134A (ja) * 2001-07-26 2003-02-14 Matsushita Electric Works Ltd 発光装置の製造方法
US20050151147A1 (en) * 2003-12-22 2005-07-14 Kunihiro Izuno Semiconductor device and method for manufacturing the same
CN1667845A (zh) * 2004-03-10 2005-09-14 日东电工株式会社 制备光学半导体装置的方法
US20060171152A1 (en) * 2005-01-20 2006-08-03 Toyoda Gosei Co., Ltd. Light emitting device and method of making the same
US20070012940A1 (en) * 2005-07-14 2007-01-18 Samsung Electro-Mechanics Co., Ltd. Wavelength-convertible light emitting diode package
US20070182323A1 (en) * 2004-07-09 2007-08-09 Matsushita Electric Industrial Co., Ltd. Light-emitting device
US20070228390A1 (en) * 2006-03-30 2007-10-04 Yasushi Hattori Semiconductor light-emitting device
CN101160670A (zh) * 2005-03-29 2008-04-09 飞利浦拉米尔德斯照明设备有限责任公司 有利于背后照明的led广角发射透镜

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6194742B1 (en) 1998-06-05 2001-02-27 Lumileds Lighting, U.S., Llc Strain engineered and impurity controlled III-V nitride semiconductor films and optoelectronic devices
US5959316A (en) * 1998-09-01 1999-09-28 Hewlett-Packard Company Multiple encapsulation of phosphor-LED devices
US6133589A (en) 1999-06-08 2000-10-17 Lumileds Lighting, U.S., Llc AlGaInN-based LED having thick epitaxial layer for improved light extraction
US7361938B2 (en) 2004-06-03 2008-04-22 Philips Lumileds Lighting Company Llc Luminescent ceramic for a light emitting device
US7858408B2 (en) * 2004-11-15 2010-12-28 Koninklijke Philips Electronics N.V. LED with phosphor tile and overmolded phosphor in lens
CN100585892C (zh) * 2005-05-25 2010-01-27 皇家飞利浦电子股份有限公司 电致发光器件
US7754507B2 (en) 2005-06-09 2010-07-13 Philips Lumileds Lighting Company, Llc Method of removing the growth substrate of a semiconductor light emitting device
US7319246B2 (en) * 2005-06-23 2008-01-15 Lumination Llc Luminescent sheet covering for LEDs
US7344952B2 (en) * 2005-10-28 2008-03-18 Philips Lumileds Lighting Company, Llc Laminating encapsulant film containing phosphor over LEDs
JP2008166782A (ja) * 2006-12-26 2008-07-17 Seoul Semiconductor Co Ltd 発光素子

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003046134A (ja) * 2001-07-26 2003-02-14 Matsushita Electric Works Ltd 発光装置の製造方法
US20050151147A1 (en) * 2003-12-22 2005-07-14 Kunihiro Izuno Semiconductor device and method for manufacturing the same
CN1667845A (zh) * 2004-03-10 2005-09-14 日东电工株式会社 制备光学半导体装置的方法
US20070182323A1 (en) * 2004-07-09 2007-08-09 Matsushita Electric Industrial Co., Ltd. Light-emitting device
US20060171152A1 (en) * 2005-01-20 2006-08-03 Toyoda Gosei Co., Ltd. Light emitting device and method of making the same
CN101160670A (zh) * 2005-03-29 2008-04-09 飞利浦拉米尔德斯照明设备有限责任公司 有利于背后照明的led广角发射透镜
US20070012940A1 (en) * 2005-07-14 2007-01-18 Samsung Electro-Mechanics Co., Ltd. Wavelength-convertible light emitting diode package
US20070228390A1 (en) * 2006-03-30 2007-10-04 Yasushi Hattori Semiconductor light-emitting device

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104485411A (zh) * 2014-11-14 2015-04-01 江苏脉锐光电科技有限公司 一种远程荧光粉透镜和制造方法及其应用
CN106885194A (zh) * 2015-12-15 2017-06-23 现代自动车株式会社 光源模块以及使用其的车辆头灯
US10598325B2 (en) 2015-12-15 2020-03-24 Hyundai Motor Company Light source module and vehicle headlamp using the same
CN106885194B (zh) * 2015-12-15 2021-02-02 现代自动车株式会社 光源模块以及使用其的车辆头灯
CN111052422A (zh) * 2017-09-01 2020-04-21 科锐公司 发光二极管、部件及相关方法
CN111052422B (zh) * 2017-09-01 2023-10-31 科锐Led公司 制造发光二极管器件的方法
CN113490887A (zh) * 2018-12-21 2021-10-08 亮锐控股有限公司 支持两步磷光体沉积以形成led矩阵阵列的光刻胶图案化工艺
CN115411023A (zh) * 2022-08-22 2022-11-29 深圳市未林森科技有限公司 一种误差小的cob光源颜色均匀控制工艺方法
CN115411023B (zh) * 2022-08-22 2023-09-19 深圳市未林森科技有限公司 一种误差小的cob光源颜色均匀控制工艺方法

Also Published As

Publication number Publication date
JP2013501372A (ja) 2013-01-10
EP2462634A1 (en) 2012-06-13
RU2012108576A (ru) 2013-09-20
WO2011015959A1 (en) 2011-02-10
TW201123549A (en) 2011-07-01
KR20120056843A (ko) 2012-06-04
BR112012002431A2 (pt) 2019-09-24
US20110031516A1 (en) 2011-02-10

Similar Documents

Publication Publication Date Title
CN102473820A (zh) 具有硅树脂层和层叠远程磷光体层的led
US7858408B2 (en) LED with phosphor tile and overmolded phosphor in lens
EP1922767B1 (en) Color converted light emitting diode
US8536608B2 (en) LED with remote phosphor layer and reflective submount
EP1657758B1 (en) Method of manufacturing a light emitting diode with molded lens
CN102800797B (zh) 具有远离荧光结构的蝙蝠翼透镜
US7452737B2 (en) Molded lens over LED die
US8748929B2 (en) Light-emitting dies incorporating wavelength-conversion materials and related methods
KR20180127292A (ko) 경사 반사기를 갖는 발광 디바이스 및 그 제조 방법
US20100109025A1 (en) Over the mold phosphor lens for an led
US7910944B2 (en) Side mountable semiconductor light emitting device packages and panels

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20120523