BE1019159A5 - Werkwijze voor de afzetting van een gelijkmatige nanocoating door middel van een lage druk plasma proces. - Google Patents

Werkwijze voor de afzetting van een gelijkmatige nanocoating door middel van een lage druk plasma proces. Download PDF

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Publication number
BE1019159A5
BE1019159A5 BE2010/0035A BE201000035A BE1019159A5 BE 1019159 A5 BE1019159 A5 BE 1019159A5 BE 2010/0035 A BE2010/0035 A BE 2010/0035A BE 201000035 A BE201000035 A BE 201000035A BE 1019159 A5 BE1019159 A5 BE 1019159A5
Authority
BE
Belgium
Prior art keywords
plasma
nanocoating
coating
monomers
precursors
Prior art date
Application number
BE2010/0035A
Other languages
English (en)
Dutch (nl)
Inventor
Filip Legein
Anthony Vanlandeghem
Peter Martens
Original Assignee
Europlasma Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to BE2010/0035A priority Critical patent/BE1019159A5/nl
Application filed by Europlasma Nv filed Critical Europlasma Nv
Priority to CN2011800153321A priority patent/CN102821873A/zh
Priority to SG2012052296A priority patent/SG182542A1/en
Priority to PCT/EP2011/000242 priority patent/WO2011089009A1/en
Priority to NZ60136511A priority patent/NZ601365A/en
Priority to AU2011208879A priority patent/AU2011208879B2/en
Priority to MX2012008415A priority patent/MX2012008415A/es
Priority to CA2786855A priority patent/CA2786855A1/en
Priority to JP2012549293A priority patent/JP2013517382A/ja
Priority to EP11704527A priority patent/EP2525922A1/en
Priority to KR1020127018995A priority patent/KR20130000373A/ko
Priority to BR112012018071A priority patent/BR112012018071A2/pt
Priority to US13/574,626 priority patent/US20120308762A1/en
Application granted granted Critical
Publication of BE1019159A5 publication Critical patent/BE1019159A5/nl
Priority to CL2012001954A priority patent/CL2012001954A1/es

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/62—Plasma-deposition of organic layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32541—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2506/00—Halogenated polymers
    • B05D2506/10—Fluorinated polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/04—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases
    • B05D3/0493—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases using vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/14—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by electrical means
    • B05D3/141—Plasma treatment
    • B05D3/142—Pretreatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/08—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain an anti-friction or anti-adhesive surface
    • B05D5/083—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain an anti-friction or anti-adhesive surface involving the use of fluoropolymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09872—Insulating conformal coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/23—Sheet including cover or casing
    • Y10T428/239—Complete cover or casing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Paints Or Removers (AREA)
  • Chemical Vapour Deposition (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Physical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
  • Formation Of Insulating Films (AREA)
  • Laminated Bodies (AREA)
  • Polymerisation Methods In General (AREA)
  • Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
  • Materials For Medical Uses (AREA)
BE2010/0035A 2010-01-22 2010-01-22 Werkwijze voor de afzetting van een gelijkmatige nanocoating door middel van een lage druk plasma proces. BE1019159A5 (nl)

Priority Applications (14)

Application Number Priority Date Filing Date Title
BE2010/0035A BE1019159A5 (nl) 2010-01-22 2010-01-22 Werkwijze voor de afzetting van een gelijkmatige nanocoating door middel van een lage druk plasma proces.
JP2012549293A JP2013517382A (ja) 2010-01-22 2011-01-21 低圧プラズマ工程による適応性ナノコーティングの被覆方法
PCT/EP2011/000242 WO2011089009A1 (en) 2010-01-22 2011-01-21 Method for the application of a conformal nanocoating by means of a low pressure plasma process
NZ60136511A NZ601365A (en) 2010-01-22 2011-01-21 Method for the application of a conformal nanocoating by means of a low pressure plasma process
AU2011208879A AU2011208879B2 (en) 2010-01-22 2011-01-21 Method for the application of a conformal nanocoating by means of a low pressure plasma process
MX2012008415A MX2012008415A (es) 2010-01-22 2011-01-21 Metodo para la aplicacion de un nanorrevestimiento conformable por medio de un procedimiento de plasma de baja presion.
CN2011800153321A CN102821873A (zh) 2010-01-22 2011-01-21 通过低压等离子体工艺施加保形纳米涂层的方法
SG2012052296A SG182542A1 (en) 2010-01-22 2011-01-21 Method for the application of a conformal nanocoating by means of a low pressure plasma process
EP11704527A EP2525922A1 (en) 2010-01-22 2011-01-21 Method for the application of a conformal nanocoating by means of a low pressure plasma process
KR1020127018995A KR20130000373A (ko) 2010-01-22 2011-01-21 저압 플라즈마 공정에 의한 공형 나노코팅의 도포를 위한 방법
BR112012018071A BR112012018071A2 (pt) 2010-01-22 2011-01-21 método para a aplicação de um nanorrevestimento conformável por meio de um processo de plasma de baixa pressão
US13/574,626 US20120308762A1 (en) 2010-01-22 2011-01-21 Method for the Application of a Conformal Nanocoating by Means of a Low Pressure Plasma Process
CA2786855A CA2786855A1 (en) 2010-01-22 2011-01-21 Method for the application of a conformal nanocoating by means of a low pressure plasma process
CL2012001954A CL2012001954A1 (es) 2010-01-22 2012-07-12 Metodo para depositar un nanorevestimiento conformable sobre una estructura tridimensional o ensamblaje compuesto de elementos electricamente conductores y no conductores, el cual se deposita mediante polimerizacion por plasma de baja presion precedido de una etapa de desgasificacion de la estructura o ensamblaje.

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
BE201000035 2010-01-22
BE2010/0035A BE1019159A5 (nl) 2010-01-22 2010-01-22 Werkwijze voor de afzetting van een gelijkmatige nanocoating door middel van een lage druk plasma proces.

Publications (1)

Publication Number Publication Date
BE1019159A5 true BE1019159A5 (nl) 2012-04-03

Family

ID=42289590

Family Applications (1)

Application Number Title Priority Date Filing Date
BE2010/0035A BE1019159A5 (nl) 2010-01-22 2010-01-22 Werkwijze voor de afzetting van een gelijkmatige nanocoating door middel van een lage druk plasma proces.

Country Status (14)

Country Link
US (1) US20120308762A1 (enExample)
EP (1) EP2525922A1 (enExample)
JP (1) JP2013517382A (enExample)
KR (1) KR20130000373A (enExample)
CN (1) CN102821873A (enExample)
AU (1) AU2011208879B2 (enExample)
BE (1) BE1019159A5 (enExample)
BR (1) BR112012018071A2 (enExample)
CA (1) CA2786855A1 (enExample)
CL (1) CL2012001954A1 (enExample)
MX (1) MX2012008415A (enExample)
NZ (1) NZ601365A (enExample)
SG (1) SG182542A1 (enExample)
WO (1) WO2011089009A1 (enExample)

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BE1021288B1 (nl) * 2013-10-07 2015-10-20 Europlasma Nv Verbeterde manieren om plasma te genereren op continue vermogens wijze voor lage druk plasma processen
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CN105276554A (zh) * 2014-07-24 2016-01-27 北京中科纳通电子技术有限公司 一种纳米银溶液通过等离子体方法处理led灯体达到防水防油污增强散热效果
CN105047514B (zh) * 2015-07-27 2017-06-13 郑州大学 在玻璃表面等离子体刻蚀形成纹理结构的方法
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US11154903B2 (en) 2016-05-13 2021-10-26 Jiangsu Favored Nanotechnology Co., Ltd. Apparatus and method for surface coating by means of grid control and plasma-initiated gas-phase polymerization
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CN107058979B (zh) * 2017-01-23 2018-05-11 江苏菲沃泰纳米科技有限公司 一种防水耐电击穿涂层的制备方法
CN106868473B (zh) * 2017-01-23 2018-07-13 江苏菲沃泰纳米科技有限公司 一种梯度递减结构防液涂层的制备方法
CN107217243B (zh) * 2017-05-21 2018-07-13 江苏菲沃泰纳米科技有限公司 一种大占空比脉冲放电制备多功能性纳米防护涂层的方法
US11270871B2 (en) 2017-05-21 2022-03-08 Jiangsu Favored Nanotechnology Co., LTD Multi-layer protective coating
CN107177835B (zh) * 2017-05-21 2018-06-19 江苏菲沃泰纳米科技有限公司 一种循环大占空比脉冲放电制备多功能性纳米防护涂层的方法
CN107904574A (zh) * 2017-10-27 2018-04-13 中国船舶重工集团公司第七二三研究所 一种基于海上复杂环境的纳米防护涂层涂覆方法
IT201900019760A1 (it) 2019-10-24 2021-04-24 Saati Spa Procedimento per la realizzazione di un mezzo filtrante composito e mezzo filtrante composito ottenuto con questo procedimento.
CN114502252A (zh) 2019-10-24 2022-05-13 纱帝股份公司 一种用于制备复合过滤介质的方法和用该方法获得的复合过滤介质
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EP2525922A1 (en) 2012-11-28
WO2011089009A1 (en) 2011-07-28
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CA2786855A1 (en) 2011-07-28
BR112012018071A2 (pt) 2016-05-03
MX2012008415A (es) 2012-08-15
US20120308762A1 (en) 2012-12-06
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AU2011208879B2 (en) 2015-12-17

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