CN102821873A - 通过低压等离子体工艺施加保形纳米涂层的方法 - Google Patents

通过低压等离子体工艺施加保形纳米涂层的方法 Download PDF

Info

Publication number
CN102821873A
CN102821873A CN2011800153321A CN201180015332A CN102821873A CN 102821873 A CN102821873 A CN 102821873A CN 2011800153321 A CN2011800153321 A CN 2011800153321A CN 201180015332 A CN201180015332 A CN 201180015332A CN 102821873 A CN102821873 A CN 102821873A
Authority
CN
China
Prior art keywords
plasma
coating
conformal
nanocoating
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2011800153321A
Other languages
English (en)
Chinese (zh)
Inventor
F.赖盖恩
A.范兰德赫姆
P.马腾斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EUROPE PLASMA NV
Original Assignee
EUROPE PLASMA NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EUROPE PLASMA NV filed Critical EUROPE PLASMA NV
Publication of CN102821873A publication Critical patent/CN102821873A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/62—Plasma-deposition of organic layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32541—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2506/00—Halogenated polymers
    • B05D2506/10—Fluorinated polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/04—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases
    • B05D3/0493—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases using vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/14—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by electrical means
    • B05D3/141—Plasma treatment
    • B05D3/142—Pretreatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/08—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain an anti-friction or anti-adhesive surface
    • B05D5/083—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain an anti-friction or anti-adhesive surface involving the use of fluoropolymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09872—Insulating conformal coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/23—Sheet including cover or casing
    • Y10T428/239—Complete cover or casing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Paints Or Removers (AREA)
  • Chemical Vapour Deposition (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Physical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
  • Formation Of Insulating Films (AREA)
  • Laminated Bodies (AREA)
  • Polymerisation Methods In General (AREA)
  • Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
  • Materials For Medical Uses (AREA)
CN2011800153321A 2010-01-22 2011-01-21 通过低压等离子体工艺施加保形纳米涂层的方法 Pending CN102821873A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
BE2010/0035 2010-01-22
BE2010/0035A BE1019159A5 (nl) 2010-01-22 2010-01-22 Werkwijze voor de afzetting van een gelijkmatige nanocoating door middel van een lage druk plasma proces.
PCT/EP2011/000242 WO2011089009A1 (en) 2010-01-22 2011-01-21 Method for the application of a conformal nanocoating by means of a low pressure plasma process

Publications (1)

Publication Number Publication Date
CN102821873A true CN102821873A (zh) 2012-12-12

Family

ID=42289590

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011800153321A Pending CN102821873A (zh) 2010-01-22 2011-01-21 通过低压等离子体工艺施加保形纳米涂层的方法

Country Status (14)

Country Link
US (1) US20120308762A1 (enExample)
EP (1) EP2525922A1 (enExample)
JP (1) JP2013517382A (enExample)
KR (1) KR20130000373A (enExample)
CN (1) CN102821873A (enExample)
AU (1) AU2011208879B2 (enExample)
BE (1) BE1019159A5 (enExample)
BR (1) BR112012018071A2 (enExample)
CA (1) CA2786855A1 (enExample)
CL (1) CL2012001954A1 (enExample)
MX (1) MX2012008415A (enExample)
NZ (1) NZ601365A (enExample)
SG (1) SG182542A1 (enExample)
WO (1) WO2011089009A1 (enExample)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104179011A (zh) * 2014-07-18 2014-12-03 青岛纺联控股集团有限公司 纺织品纳米等离子防水处理方法
CN105047514A (zh) * 2015-07-27 2015-11-11 郑州大学 在玻璃表面等离子体刻蚀形成纹理结构的方法
CN105276554A (zh) * 2014-07-24 2016-01-27 北京中科纳通电子技术有限公司 一种纳米银溶液通过等离子体方法处理led灯体达到防水防油污增强散热效果
CN105848789A (zh) * 2013-10-07 2016-08-10 欧洲等离子公司 用于低压力等离子体工艺在连续功率模式下生成等离子体的改进方式
CN106105403A (zh) * 2013-12-10 2016-11-09 欧洲等离子公司 表面涂层
CN107058979A (zh) * 2017-01-23 2017-08-18 无锡荣坚五金工具有限公司 一种防水耐电击穿涂层的制备方法
CN107217243A (zh) * 2017-05-21 2017-09-29 无锡荣坚五金工具有限公司 一种大占空比脉冲放电制备多功能性纳米防护涂层的方法
CN107615900A (zh) * 2016-01-19 2018-01-19 华为技术有限公司 电子设备防水方法、装置及电子设备
WO2018214449A1 (zh) * 2017-05-21 2018-11-29 江苏菲沃泰纳米科技有限公司 一种循环大占空比脉冲放电制备多功能性纳米防护涂层的方法
CN109069320A (zh) * 2016-04-29 2018-12-21 卢载昊 形成有纳米涂层的吸收产品及制造方法
CN113275217A (zh) * 2021-05-18 2021-08-20 佛山市思博睿科技有限公司 等离子体接枝共聚膜层的制备方法
US11154903B2 (en) 2016-05-13 2021-10-26 Jiangsu Favored Nanotechnology Co., Ltd. Apparatus and method for surface coating by means of grid control and plasma-initiated gas-phase polymerization
US11270871B2 (en) 2017-05-21 2022-03-08 Jiangsu Favored Nanotechnology Co., LTD Multi-layer protective coating

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8852693B2 (en) 2011-05-19 2014-10-07 Liquipel Ip Llc Coated electronic devices and associated methods
GB2489761B (en) * 2011-09-07 2015-03-04 Europlasma Nv Surface coatings
JP2013143563A (ja) 2012-01-10 2013-07-22 Hzo Inc 内部耐水性被覆を備える電子デバイスを組み立てるためのシステム
CN107262347A (zh) * 2012-03-06 2017-10-20 赛姆布兰特有限公司 涂覆的电气组件
CN104334287A (zh) 2012-03-23 2015-02-04 Hzo股份有限公司 用于将保护覆层施加至电子装置组件的设备、系统以及方法
GB2494946B (en) * 2012-05-11 2013-10-09 Europlasma Nv Surface coatings
EP2862428A4 (en) * 2012-06-18 2016-06-22 Hzo Inc DEVICES, SYSTEMS AND METHOD FOR PROTECTING ARRANGEMENTS OF ELECTRONIC DEVICES
WO2013192222A2 (en) 2012-06-18 2013-12-27 Hzo, Inc. Systems and methods for applying protective coatings to internal surfaces of fully assembled electronic devices
GB2510213A (en) * 2012-08-13 2014-07-30 Europlasma Nv Forming a protective polymer coating on a component
RU2015117763A (ru) * 2012-10-09 2016-12-10 Европлазма Нв Аппарат и способ для нанесения покрытий на поверхности
US9894776B2 (en) 2013-01-08 2018-02-13 Hzo, Inc. System for refurbishing or remanufacturing an electronic device
US10449568B2 (en) 2013-01-08 2019-10-22 Hzo, Inc. Masking substrates for application of protective coatings
WO2014110046A1 (en) 2013-01-08 2014-07-17 Hzo, Inc. Masking substrates for application of protective coatings
US9002041B2 (en) 2013-05-14 2015-04-07 Logitech Europe S.A. Method and apparatus for improved acoustic transparency
GB201610481D0 (en) * 2016-06-14 2016-08-03 Surface Innovations Ltd Coating
CN106868473B (zh) * 2017-01-23 2018-07-13 江苏菲沃泰纳米科技有限公司 一种梯度递减结构防液涂层的制备方法
CN107904574A (zh) * 2017-10-27 2018-04-13 中国船舶重工集团公司第七二三研究所 一种基于海上复杂环境的纳米防护涂层涂覆方法
IT201900019760A1 (it) 2019-10-24 2021-04-24 Saati Spa Procedimento per la realizzazione di un mezzo filtrante composito e mezzo filtrante composito ottenuto con questo procedimento.
CN114502252A (zh) 2019-10-24 2022-05-13 纱帝股份公司 一种用于制备复合过滤介质的方法和用该方法获得的复合过滤介质
WO2021079282A1 (en) 2019-10-24 2021-04-29 Saati S.P.A. A method for preparing a composite filter medium and the composite filter medium obtained with this method
JP7526290B2 (ja) 2020-06-09 2024-07-31 江蘇菲沃泰納米科技股▲フン▼有限公司 保護コーティングおよびその製造方法
CN113365433B (zh) * 2021-06-07 2024-02-02 深圳奥拦科技有限责任公司 Pcba板表面派瑞林膜层的除去方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4628006A (en) * 1984-01-20 1986-12-09 The United States Of America As Represented By The Secretary Of The Navy Passivation of hybrid microelectronic circuits
JPH02102038A (ja) * 1988-10-12 1990-04-13 Furukawa Alum Co Ltd 耐食性金属板
US5618619A (en) * 1994-03-03 1997-04-08 Monsanto Company Highly abrasion-resistant, flexible coatings for soft substrates
US20020134580A1 (en) * 2001-03-26 2002-09-26 Harry Hedler Configuration having an electronic device electrically connected to a printed circuit board
US20060001700A1 (en) * 2004-06-30 2006-01-05 Bertelsen Craig M Flexible circuit corrosion protection
US20070202340A1 (en) * 2004-11-02 2007-08-30 Asahi Glass Co., Ltd. Fluorocarbon film and process for its production

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52116897A (en) * 1976-03-29 1977-09-30 Matsushita Electric Ind Co Ltd Forming transparent conductive film on organic substrate
JPS6047024B2 (ja) 1981-07-31 1985-10-19 日産自動車株式会社 プレス型における製品押出装置
US4606929A (en) * 1984-12-20 1986-08-19 Petrakov Vladimir P Method of ionized-plasma spraying and apparatus for performing same
EP0187595A3 (en) 1984-12-24 1987-09-30 Sangamo Weston, Inc. Protective coating for electrolytic capacitor
JPS6277463A (ja) * 1985-09-30 1987-04-09 Sumitomo Bakelite Co Ltd 耐熱性樹脂フイルム用真空ロ−ルコ−タ−
JPS63311794A (ja) * 1987-06-12 1988-12-20 Sumitomo Electric Ind Ltd フレキシブル配線板の製造方法
JPH0196364A (ja) * 1987-10-07 1989-04-14 Teijin Ltd 高分子樹脂基板の水分除去方法
EP0492828A1 (en) 1990-12-26 1992-07-01 Dow Corning Corporation Mixture of adhesion additives useful in UV curable compositions and compositions containing same
JPH04296337A (ja) * 1991-03-26 1992-10-20 Matsushita Electric Works Ltd 高分子膜の製造方法
SG48462A1 (en) * 1995-10-26 1998-04-17 Ibm Lead protective coating composition process and structure thereof
JP4260907B2 (ja) * 1995-12-12 2009-04-30 東洋紡績株式会社 フィルム積層体
US5843239A (en) * 1997-03-03 1998-12-01 Applied Materials, Inc. Two-step process for cleaning a substrate processing chamber
US6127038A (en) 1997-12-11 2000-10-03 American Meter Company Printed circuit board coating and method
JP4150001B2 (ja) * 2003-01-30 2008-09-17 ユーロプラズマ 開放気泡構造を有する製品の表面にその構造全体にわたってコーティングを提供する方法およびその方法の使用方法
US7202172B2 (en) * 2003-12-05 2007-04-10 Taiwan Semiconductor Manufacturing Company, Ltd. Microelectronic device having disposable spacer
GB2434369B (en) * 2006-01-20 2010-08-25 P2I Ltd Plasma coated electrical or electronic devices
GB0703172D0 (en) * 2007-02-19 2007-03-28 Pa Knowledge Ltd Printed circuit boards
JP5223325B2 (ja) * 2007-12-21 2013-06-26 住友金属鉱山株式会社 金属被覆ポリエチレンナフタレート基板とその製造方法
GB0800305D0 (en) * 2008-01-09 2008-02-20 P2I Ltd Abatement apparatus and processing method

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4628006A (en) * 1984-01-20 1986-12-09 The United States Of America As Represented By The Secretary Of The Navy Passivation of hybrid microelectronic circuits
JPH02102038A (ja) * 1988-10-12 1990-04-13 Furukawa Alum Co Ltd 耐食性金属板
US5618619A (en) * 1994-03-03 1997-04-08 Monsanto Company Highly abrasion-resistant, flexible coatings for soft substrates
US20020134580A1 (en) * 2001-03-26 2002-09-26 Harry Hedler Configuration having an electronic device electrically connected to a printed circuit board
US20060001700A1 (en) * 2004-06-30 2006-01-05 Bertelsen Craig M Flexible circuit corrosion protection
US20070202340A1 (en) * 2004-11-02 2007-08-30 Asahi Glass Co., Ltd. Fluorocarbon film and process for its production

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105848789A (zh) * 2013-10-07 2016-08-10 欧洲等离子公司 用于低压力等离子体工艺在连续功率模式下生成等离子体的改进方式
CN105848789B (zh) * 2013-10-07 2023-01-03 欧洲等离子公司 用于低压力等离子体工艺在连续功率模式下生成等离子体的改进方式
CN106105403A (zh) * 2013-12-10 2016-11-09 欧洲等离子公司 表面涂层
CN104179011A (zh) * 2014-07-18 2014-12-03 青岛纺联控股集团有限公司 纺织品纳米等离子防水处理方法
CN105276554A (zh) * 2014-07-24 2016-01-27 北京中科纳通电子技术有限公司 一种纳米银溶液通过等离子体方法处理led灯体达到防水防油污增强散热效果
CN105047514A (zh) * 2015-07-27 2015-11-11 郑州大学 在玻璃表面等离子体刻蚀形成纹理结构的方法
CN107615900A (zh) * 2016-01-19 2018-01-19 华为技术有限公司 电子设备防水方法、装置及电子设备
CN109069320A (zh) * 2016-04-29 2018-12-21 卢载昊 形成有纳米涂层的吸收产品及制造方法
US11154903B2 (en) 2016-05-13 2021-10-26 Jiangsu Favored Nanotechnology Co., Ltd. Apparatus and method for surface coating by means of grid control and plasma-initiated gas-phase polymerization
CN107058979B (zh) * 2017-01-23 2018-05-11 江苏菲沃泰纳米科技有限公司 一种防水耐电击穿涂层的制备方法
CN107058979A (zh) * 2017-01-23 2017-08-18 无锡荣坚五金工具有限公司 一种防水耐电击穿涂层的制备方法
WO2018214449A1 (zh) * 2017-05-21 2018-11-29 江苏菲沃泰纳米科技有限公司 一种循环大占空比脉冲放电制备多功能性纳米防护涂层的方法
CN107217243B (zh) * 2017-05-21 2018-07-13 江苏菲沃泰纳米科技有限公司 一种大占空比脉冲放电制备多功能性纳米防护涂层的方法
CN107217243A (zh) * 2017-05-21 2017-09-29 无锡荣坚五金工具有限公司 一种大占空比脉冲放电制备多功能性纳米防护涂层的方法
US11270871B2 (en) 2017-05-21 2022-03-08 Jiangsu Favored Nanotechnology Co., LTD Multi-layer protective coating
US11587772B2 (en) 2017-05-21 2023-02-21 Jiangsu Favored Nanotechnology Co., LTD Multi-layer protective coating
US11742186B2 (en) 2017-05-21 2023-08-29 Jiangsu Favored Nanotechnology Co., LTD Multi-functional protective coating
CN113275217A (zh) * 2021-05-18 2021-08-20 佛山市思博睿科技有限公司 等离子体接枝共聚膜层的制备方法
CN113275217B (zh) * 2021-05-18 2022-06-24 佛山市思博睿科技有限公司 等离子体接枝共聚膜层的制备方法

Also Published As

Publication number Publication date
AU2011208879A1 (en) 2012-08-09
KR20130000373A (ko) 2013-01-02
SG182542A1 (en) 2012-08-30
JP2013517382A (ja) 2013-05-16
EP2525922A1 (en) 2012-11-28
BE1019159A5 (nl) 2012-04-03
WO2011089009A1 (en) 2011-07-28
CL2012001954A1 (es) 2013-02-01
CA2786855A1 (en) 2011-07-28
BR112012018071A2 (pt) 2016-05-03
MX2012008415A (es) 2012-08-15
US20120308762A1 (en) 2012-12-06
NZ601365A (en) 2015-03-27
AU2011208879B2 (en) 2015-12-17

Similar Documents

Publication Publication Date Title
AU2011208879B2 (en) Method for the application of a conformal nanocoating by means of a low pressure plasma process
CN105075408B (zh) 涂覆的电组件
JP6225125B2 (ja) コーティングされた電気アセンブリ
CN104718258B (zh) 表面涂层
US8852693B2 (en) Coated electronic devices and associated methods
RU2573583C2 (ru) Способ снижения ползучей коррозии
US20220046803A1 (en) Coated electrical assembly
JP2013527973A (ja) プラズマ重合ポリマーコーティング
CN103930192A (zh) 表面聚合物涂层
JP7019588B2 (ja) プラズマ堆積方法
KR20160097326A (ko) 표면 코팅
CN109277269B (zh) 一种环氧纳米涂层及其制备方法
GB2494946A (en) Surface coatings formed by plasma polymerisation
Brooks et al. Plasma polymerization: A versatile and attractive process for conformal coating
HK1178841A (en) Method for the application of a conformal nanocoating by means of a low pressure plasma process
KR102856709B1 (ko) 보호 코팅 및 그 제조 방법
KR20150137882A (ko) 플라즈마 유기 중합체 박막 및 그 제조방법

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
REG Reference to a national code

Ref country code: HK

Ref legal event code: DE

Ref document number: 1178841

Country of ref document: HK

C12 Rejection of a patent application after its publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20121212