AU695142B2 - Semiconductor unit package, semiconductor unit packaging method and encapsulant for use in semiconductor unit packaging - Google Patents

Semiconductor unit package, semiconductor unit packaging method and encapsulant for use in semiconductor unit packaging

Info

Publication number
AU695142B2
AU695142B2 AU60154/96A AU6015496A AU695142B2 AU 695142 B2 AU695142 B2 AU 695142B2 AU 60154/96 A AU60154/96 A AU 60154/96A AU 6015496 A AU6015496 A AU 6015496A AU 695142 B2 AU695142 B2 AU 695142B2
Authority
AU
Australia
Prior art keywords
encapsulant
anhydride
semiconductor unit
semiconductor device
rheology modifier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
AU60154/96A
Other languages
English (en)
Other versions
AU6015496A (en
Inventor
Yoshihiro Bessho
Mitsuru Harada
Kazunori Omoya
Takashi Oobayashi
Wataru Sakurai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP07308798A external-priority patent/JP3093621B2/ja
Priority claimed from US08/593,675 external-priority patent/US5641996A/en
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of AU6015496A publication Critical patent/AU6015496A/en
Application granted granted Critical
Publication of AU695142B2 publication Critical patent/AU695142B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H01L2924/11—Device type
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
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    • H01L2924/351—Thermal stress

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Packages (AREA)
  • Tires In General (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
AU60154/96A 1995-06-12 1996-06-12 Semiconductor unit package, semiconductor unit packaging method and encapsulant for use in semiconductor unit packaging Ceased AU695142B2 (en)

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Application Number Priority Date Filing Date Title
JP7-144373 1995-06-12
JP14437395 1995-06-12
JP07308798A JP3093621B2 (ja) 1995-01-30 1995-11-28 半導体装置の実装方法
JP7-308798 1995-11-28
US593675 1996-01-29
US08/593,675 US5641996A (en) 1995-01-30 1996-01-29 Semiconductor unit package, semiconductor unit packaging method, and encapsulant for use in semiconductor unit packaging
PCT/JP1996/001600 WO1996042106A1 (en) 1995-06-12 1996-06-12 Semiconductor unit package, semiconductor unit packaging method, and encapsulant for use in semiconductor unit packaging

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AU6015496A AU6015496A (en) 1997-01-09
AU695142B2 true AU695142B2 (en) 1998-08-06

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FI (1) FI974488A (fi)
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WO1998033217A1 (en) * 1997-01-24 1998-07-30 Rohm Co., Ltd. Semiconductor device and method for manufacturing thereof
JPH10270496A (ja) 1997-03-27 1998-10-09 Hitachi Ltd 電子装置、情報処理装置、半導体装置並びに半導体チップの実装方法
US6407461B1 (en) 1997-06-27 2002-06-18 International Business Machines Corporation Injection molded integrated circuit chip assembly
EP0933809B1 (en) * 1998-02-02 2006-11-29 Shin-Etsu Chemical Co., Ltd. Method for mounting flip-chip semiconductor devices
CN1143374C (zh) 1998-07-01 2004-03-24 精工爱普生株式会社 半导体装置及其制造方法、电路基板和电子装置
US7834464B2 (en) * 2007-10-09 2010-11-16 Infineon Technologies Ag Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device
US8957508B2 (en) * 2011-05-13 2015-02-17 Fuji Electric Co., Ltd. Semiconductor device and method of manufacturing the same
JP5658088B2 (ja) * 2011-05-23 2015-01-21 パナソニックＩｐマネジメント株式会社 半導体パッケージ部品の実装構造体および製造方法
CN107034028B (zh) * 2015-12-04 2021-05-25 三星电子株式会社 用于除去有机硅树脂的组合物、使用其薄化基材和制造半导体封装体的方法及使用其的系统
US10894935B2 (en) 2015-12-04 2021-01-19 Samsung Electronics Co., Ltd. Composition for removing silicone resins and method of thinning substrate by using the same
US10157887B2 (en) 2017-03-09 2018-12-18 Advanced Semiconductor Engineering, Inc. Semiconductor device package and method of manufacturing the same

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JPS63268724A (ja) * 1987-04-24 1988-11-07 Matsushita Electric Works Ltd 液状エポキシ樹脂組成物
JP2515344B2 (ja) * 1987-07-24 1996-07-10 松下電工株式会社 封止用一液性の液状エポキシ樹脂組成物
JPH04130633A (ja) * 1990-09-20 1992-05-01 Matsushita Electron Corp 半導体装置とその製造方法およびそれに用いるキャピラリ
US5194930A (en) * 1991-09-16 1993-03-16 International Business Machines Dielectric composition and solder interconnection structure for its use
JP2826049B2 (ja) * 1992-11-18 1998-11-18 松下電子工業株式会社 半導体装置およびその製造方法
US5436503A (en) * 1992-11-18 1995-07-25 Matsushita Electronics Corporation Semiconductor device and method of manufacturing the same
JPH06279654A (ja) * 1993-02-26 1994-10-04 Matsushita Electric Works Ltd 液状エポキシ樹脂組成物
JPH06313027A (ja) * 1993-05-06 1994-11-08 Matsushita Electric Works Ltd 封止用エポキシ樹脂成形材料

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CA2221286A1 (en) 1996-12-27
SE522253C2 (sv) 2004-01-27
NO321429B1 (no) 2006-05-08
CN1185231A (zh) 1998-06-17
ID19376A (id) 1998-07-09
AU6015496A (en) 1997-01-09
IN192021B (fi) 2004-02-07
SE9704602D0 (sv) 1997-12-10
SE9704602L (sv) 1998-02-05
FI974488A (fi) 1998-02-09
ID19377A (id) 1998-07-09
NO975833L (no) 1998-02-03
FI974488A0 (fi) 1997-12-11
CN1101594C (zh) 2003-02-12
WO1996042106A1 (en) 1996-12-27
NO975833D0 (no) 1997-12-11

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