AU2001284459A1 - Aligner and method of manufacturing a device - Google Patents

Aligner and method of manufacturing a device

Info

Publication number
AU2001284459A1
AU2001284459A1 AU2001284459A AU8445901A AU2001284459A1 AU 2001284459 A1 AU2001284459 A1 AU 2001284459A1 AU 2001284459 A AU2001284459 A AU 2001284459A AU 8445901 A AU8445901 A AU 8445901A AU 2001284459 A1 AU2001284459 A1 AU 2001284459A1
Authority
AU
Australia
Prior art keywords
aligner
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001284459A
Other languages
English (en)
Inventor
Kanefumi Nakahara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of AU2001284459A1 publication Critical patent/AU2001284459A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/66—Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/70741—Handling masks outside exposure position, e.g. reticle libraries
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70933—Purge, e.g. exchanging fluid or gas to remove pollutants
AU2001284459A 2000-09-06 2001-09-06 Aligner and method of manufacturing a device Abandoned AU2001284459A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000-269521 2000-09-06
JP2000269521 2000-09-06
PCT/JP2001/007740 WO2002021583A1 (fr) 2000-09-06 2001-09-06 Aligneur et procede de fabrication de dispositif

Publications (1)

Publication Number Publication Date
AU2001284459A1 true AU2001284459A1 (en) 2002-03-22

Family

ID=18756113

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001284459A Abandoned AU2001284459A1 (en) 2000-09-06 2001-09-06 Aligner and method of manufacturing a device

Country Status (6)

Country Link
US (1) US20040017556A1 (ja)
JP (1) JP4466811B2 (ja)
KR (1) KR20030029926A (ja)
CN (1) CN1592948A (ja)
AU (1) AU2001284459A1 (ja)
WO (1) WO2002021583A1 (ja)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3977214B2 (ja) * 2002-09-17 2007-09-19 キヤノン株式会社 露光装置
JP4326784B2 (ja) 2002-11-11 2009-09-09 株式会社半導体エネルギー研究所 生産システム
US6829035B2 (en) * 2002-11-12 2004-12-07 Applied Materials Israel, Ltd. Advanced mask cleaning and handling
US20130248734A1 (en) * 2012-03-21 2013-09-26 John Robert Berry Air purification system
KR20060007211A (ko) * 2004-07-19 2006-01-24 삼성전자주식회사 노광 시스템
KR100656182B1 (ko) * 2004-08-16 2006-12-12 두산디앤디 주식회사 유기박막 소자의 양산 제작용 선형의 증착 공정 장치와 기판 이송 장치
US7206652B2 (en) 2004-08-20 2007-04-17 International Business Machines Corporation Method and system for intelligent automated reticle management
KR100735027B1 (ko) * 2006-01-03 2007-07-03 삼성전자주식회사 레티클 식별장치와 이를 구비한 노광설비 및 노광방법
US7591624B2 (en) * 2006-01-09 2009-09-22 International Business Machines Corporation Reticle storage pod (RSP) transport system utilizing FOUP adapter plate
JP5007053B2 (ja) * 2006-02-23 2012-08-22 株式会社日立ハイテクノロジーズ 試料搬送システム、試料搬送方法、プログラムおよび記録媒体
JP4966693B2 (ja) 2007-02-28 2012-07-04 株式会社日立ハイテクノロジーズ 試料搬送装置及び方法
US8556564B2 (en) * 2007-06-26 2013-10-15 Siemens Healthcare Diagnostics Inc. Mobile sample storage and retrieval unit for a laboratory automated sample handling worksystem
JP4992668B2 (ja) * 2007-10-31 2012-08-08 旭硝子株式会社 容器交換装置および容器交換方法
JP5386137B2 (ja) * 2008-10-06 2014-01-15 株式会社日立ハイテクノロジーズ 試料測定装置
CN101825841B (zh) * 2010-03-30 2012-07-04 东莞宏威数码机械有限公司 掩膜存储清洗系统
US9164399B2 (en) * 2012-01-10 2015-10-20 Hermes-Microvision, Inc. Reticle operation system
US9385019B2 (en) 2012-06-21 2016-07-05 Globalfoundries Inc. Overhead substrate handling and storage system
JP2014157190A (ja) 2013-02-14 2014-08-28 Toshiba Corp 基板収納容器及び露光装置
CN103713472B (zh) * 2013-12-18 2016-03-30 合肥京东方光电科技有限公司 一种自动安装掩模板系统
CN105093836B (zh) * 2014-05-06 2017-08-29 上海微电子装备（集团）股份有限公司 Euv光刻装置及其曝光方法
CN105807574B (zh) * 2014-12-30 2018-03-02 上海微电子装备（集团）股份有限公司 掩模传输装置、曝光装置及掩模传输方法
JP6742189B2 (ja) * 2016-08-04 2020-08-19 キヤノン株式会社 インプリント装置、及び物品製造方法
DE102017213861A1 (de) * 2017-08-09 2019-02-14 Krones Ag Behälterbehandlungsanlage
US10714364B2 (en) * 2017-08-31 2020-07-14 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and method for inspecting wafer carriers
KR20210081597A (ko) * 2019-12-24 2021-07-02 캐논 톡키 가부시키가이샤 성막 시스템　및 전자 디바이스 제조방법
CN114280891B (zh) * 2020-09-28 2023-02-03 长鑫存储技术有限公司 光刻设备

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4999671A (en) * 1986-07-11 1991-03-12 Canon Kabushiki Kaisha Reticle conveying device
US5498118A (en) * 1992-02-07 1996-03-12 Nikon Corporation Apparatus for and method of carrying a substrate
US6473157B2 (en) * 1992-02-07 2002-10-29 Nikon Corporation Method of manufacturing exposure apparatus and method for exposing a pattern on a mask onto a substrate
US6048655A (en) * 1992-02-07 2000-04-11 Nikon Corporation Method of carrying and aligning a substrate
JP3031790B2 (ja) * 1992-12-10 2000-04-10 キヤノン株式会社 半導体製造装置
US5559584A (en) * 1993-03-08 1996-09-24 Nikon Corporation Exposure apparatus
JPH07245332A (ja) * 1994-03-04 1995-09-19 Hitachi Ltd 半導体製造装置および半導体装置の製造方法ならびに半導体装置
JPH10154646A (ja) * 1996-11-22 1998-06-09 Nikon Corp 搬送装置
JPH11204396A (ja) * 1998-01-08 1999-07-30 Canon Inc 半導体製造システムおよびデバイス製造方法
US6466838B1 (en) * 1998-05-14 2002-10-15 Canon Kabushiki Kaisha Semiconductor exposure apparatus and device manufacturing method using the same
JP2000188318A (ja) * 1998-12-22 2000-07-04 Canon Inc デバイス製造装置
TW446858B (en) * 1999-04-21 2001-07-21 Asm Lithography Bv Lithographic projection apparatus, method of manufacturing a device using such a lithographic projection apparatus, and device made by such a method of manufacturing
JP4365934B2 (ja) * 1999-05-10 2009-11-18 キヤノン株式会社 露光装置、半導体製造装置およびデバイス製造方法
JP3513437B2 (ja) * 1999-09-01 2004-03-31 キヤノン株式会社 基板管理方法及び半導体露光装置

Also Published As

Publication number Publication date
US20040017556A1 (en) 2004-01-29
CN1592948A (zh) 2005-03-09
KR20030029926A (ko) 2003-04-16
WO2002021583A9 (fr) 2003-01-23
WO2002021583A1 (fr) 2002-03-14
JP4466811B2 (ja) 2010-05-26
JPWO2002021583A1 (ja) 2004-01-15

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