AU2001247263A1 - Memory cell, method of formation, and operation - Google Patents
Memory cell, method of formation, and operationInfo
- Publication number
- AU2001247263A1 AU2001247263A1 AU2001247263A AU4726301A AU2001247263A1 AU 2001247263 A1 AU2001247263 A1 AU 2001247263A1 AU 2001247263 A AU2001247263 A AU 2001247263A AU 4726301 A AU4726301 A AU 4726301A AU 2001247263 A1 AU2001247263 A1 AU 2001247263A1
- Authority
- AU
- Australia
- Prior art keywords
- formation
- memory cell
- cell
- memory
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 230000015572 biosynthetic process Effects 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/788—Field effect transistors with field effect produced by an insulated gate with floating gate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/56—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/56—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency
- G11C11/5671—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency using charge trapping in an insulator
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/04—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
- G11C16/0408—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors
- G11C16/0416—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors comprising cells containing a single floating gate transistor and no select transistor, e.g. UV EPROM
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/788—Field effect transistors with field effect produced by an insulated gate with floating gate
- H01L29/7887—Programmable transistors with more than two possible different levels of programmation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/788—Field effect transistors with field effect produced by an insulated gate with floating gate
- H01L29/7888—Transistors programmable by two single electrons
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2216/00—Indexing scheme relating to G11C16/00 and subgroups, for features not directly covered by these groups
- G11C2216/02—Structural aspects of erasable programmable read-only memories
- G11C2216/08—Nonvolatile memory wherein data storage is accomplished by storing relatively few electrons in the storage layer, i.e. single electron memory
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Semiconductor Memories (AREA)
- Non-Volatile Memory (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09524916 | 2000-03-14 | ||
US09/524,916 US6320784B1 (en) | 2000-03-14 | 2000-03-14 | Memory cell and method for programming thereof |
PCT/US2001/006842 WO2001069607A2 (fr) | 2000-03-14 | 2001-03-02 | Cellule de memoire, procede de formation et fonctionnement |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001247263A1 true AU2001247263A1 (en) | 2001-09-24 |
Family
ID=24091168
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001247263A Abandoned AU2001247263A1 (en) | 2000-03-14 | 2001-03-02 | Memory cell, method of formation, and operation |
Country Status (8)
Country | Link |
---|---|
US (1) | US6320784B1 (fr) |
EP (1) | EP1269477B1 (fr) |
JP (1) | JP2003527747A (fr) |
KR (1) | KR100705301B1 (fr) |
AU (1) | AU2001247263A1 (fr) |
DE (1) | DE60117132T2 (fr) |
TW (1) | TW493268B (fr) |
WO (1) | WO2001069607A2 (fr) |
Families Citing this family (95)
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KR100545706B1 (ko) * | 2000-06-28 | 2006-01-24 | 주식회사 하이닉스반도체 | 반도체 소자 제조방법 |
US6400610B1 (en) * | 2000-07-05 | 2002-06-04 | Motorola, Inc. | Memory device including isolated storage elements that utilize hole conduction and method therefor |
US6602805B2 (en) * | 2000-12-14 | 2003-08-05 | Macronix International Co., Ltd. | Method for forming gate dielectric layer in NROM |
KR100455282B1 (ko) * | 2001-01-11 | 2004-11-08 | 삼성전자주식회사 | 램 및 롬 기능을 갖는 단일 트랜지스터를 포함하는 메모리소자와 그 동작 및 제조방법 |
US20020102797A1 (en) * | 2001-02-01 | 2002-08-01 | Muller David A. | Composite gate dielectric layer |
US6531731B2 (en) * | 2001-06-15 | 2003-03-11 | Motorola, Inc. | Integration of two memory types on the same integrated circuit |
US6455890B1 (en) * | 2001-09-05 | 2002-09-24 | Macronix International Co., Ltd. | Structure of fabricating high gate performance for NROM technology |
US6656792B2 (en) * | 2001-10-19 | 2003-12-02 | Chartered Semiconductor Manufacturing Ltd | Nanocrystal flash memory device and manufacturing method therefor |
US7453083B2 (en) | 2001-12-21 | 2008-11-18 | Synopsys, Inc. | Negative differential resistance field effect transistor for implementing a pull up element in a memory cell |
US6750066B1 (en) * | 2002-04-08 | 2004-06-15 | Advanced Micro Devices, Inc. | Precision high-K intergate dielectric layer |
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US6804136B2 (en) | 2002-06-21 | 2004-10-12 | Micron Technology, Inc. | Write once read only memory employing charge trapping in insulators |
US7193893B2 (en) * | 2002-06-21 | 2007-03-20 | Micron Technology, Inc. | Write once read only memory employing floating gates |
US6795337B2 (en) | 2002-06-28 | 2004-09-21 | Progressant Technologies, Inc. | Negative differential resistance (NDR) elements and memory device using the same |
US6567292B1 (en) | 2002-06-28 | 2003-05-20 | Progressant Technologies, Inc. | Negative differential resistance (NDR) element and memory with reduced soft error rate |
US7221586B2 (en) | 2002-07-08 | 2007-05-22 | Micron Technology, Inc. | Memory utilizing oxide nanolaminates |
US7847344B2 (en) * | 2002-07-08 | 2010-12-07 | Micron Technology, Inc. | Memory utilizing oxide-nitride nanolaminates |
US7221017B2 (en) | 2002-07-08 | 2007-05-22 | Micron Technology, Inc. | Memory utilizing oxide-conductor nanolaminates |
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US6808986B2 (en) * | 2002-08-30 | 2004-10-26 | Freescale Semiconductor, Inc. | Method of forming nanocrystals in a memory device |
US7259984B2 (en) * | 2002-11-26 | 2007-08-21 | Cornell Research Foundation, Inc. | Multibit metal nanocrystal memories and fabrication |
US6812084B2 (en) | 2002-12-09 | 2004-11-02 | Progressant Technologies, Inc. | Adaptive negative differential resistance device |
US6806117B2 (en) | 2002-12-09 | 2004-10-19 | Progressant Technologies, Inc. | Methods of testing/stressing a charge trapping device |
US7005711B2 (en) | 2002-12-20 | 2006-02-28 | Progressant Technologies, Inc. | N-channel pull-up element and logic circuit |
KR100526463B1 (ko) * | 2003-05-07 | 2005-11-08 | 매그나칩 반도체 유한회사 | 반도체 소자의 제조 방법 |
US7045851B2 (en) * | 2003-06-20 | 2006-05-16 | International Business Machines Corporation | Nonvolatile memory device using semiconductor nanocrystals and method of forming same |
DE10336876B4 (de) * | 2003-08-11 | 2006-08-24 | Infineon Technologies Ag | Speicherzelle mit Nanokristallen oder Nanodots und Verfahren zu deren Herstellung |
US6958265B2 (en) * | 2003-09-16 | 2005-10-25 | Freescale Semiconductor, Inc. | Semiconductor device with nanoclusters |
JP4072621B2 (ja) * | 2003-10-23 | 2008-04-09 | 国立大学法人名古屋大学 | シリコンナノ結晶の作製方法及びフローティングゲート型メモリキャパシタ構造の作製方法 |
TWI276206B (en) * | 2003-11-25 | 2007-03-11 | Promos Technologies Inc | Method for fabricating flash memory device and structure thereof |
KR100601943B1 (ko) * | 2004-03-04 | 2006-07-14 | 삼성전자주식회사 | 고르게 분포된 실리콘 나노 도트가 포함된 게이트를구비하는 메모리 소자의 제조 방법 |
US7968273B2 (en) * | 2004-06-08 | 2011-06-28 | Nanosys, Inc. | Methods and devices for forming nanostructure monolayers and devices including such monolayers |
US7776758B2 (en) | 2004-06-08 | 2010-08-17 | Nanosys, Inc. | Methods and devices for forming nanostructure monolayers and devices including such monolayers |
EP1797584A4 (fr) * | 2004-06-08 | 2014-08-13 | Sandisk Corp | Procedes et dispositifs permettant de former des monocouches de nanostructures et dispositifs comprenant de telles monocouches |
US8563133B2 (en) * | 2004-06-08 | 2013-10-22 | Sandisk Corporation | Compositions and methods for modulation of nanostructure energy levels |
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KR100615093B1 (ko) * | 2004-08-24 | 2006-08-22 | 삼성전자주식회사 | 나노크리스탈을 갖는 비휘발성 메모리 소자의 제조방법 |
US7098505B1 (en) | 2004-09-09 | 2006-08-29 | Actel Corporation | Memory device with multiple memory layers of local charge storage |
US7430137B2 (en) * | 2004-09-09 | 2008-09-30 | Actel Corporation | Non-volatile memory cells in a field programmable gate array |
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JPS62204955A (ja) * | 1986-03-05 | 1987-09-09 | Minolta Camera Co Ltd | 文字画像発生回路 |
JPS63237580A (ja) * | 1987-03-26 | 1988-10-04 | Toshiba Corp | 半導体装置及びその製造方法 |
DE69123782T2 (de) * | 1990-05-22 | 1997-07-10 | Nippon Electric Co | Programmierbare nichtflüchtige Hochgeschwindigkeitsnurlesespeicheranordnung, die mittels selektiver Dotierungstechnik hergestellt wird |
US5446286A (en) * | 1994-08-11 | 1995-08-29 | Bhargava; Rameshwar N. | Ultra-fast detectors using doped nanocrystal insulators |
DE19534778C1 (de) * | 1995-09-19 | 1997-04-03 | Siemens Ag | Verfahren zum Erzeugen der Sourcebereiche eines Flash-EEPROM-Speicherzellenfeldes |
US5714766A (en) | 1995-09-29 | 1998-02-03 | International Business Machines Corporation | Nano-structure memory device |
FR2757307B1 (fr) * | 1996-12-13 | 1999-02-26 | Sgs Thomson Microelectronics | Cellule memoire a quatre etats |
US6159620A (en) * | 1997-03-31 | 2000-12-12 | The Regents Of The University Of California | Single-electron solid state electronic device |
FR2772989B1 (fr) * | 1997-12-19 | 2003-06-06 | Commissariat Energie Atomique | Dispositif de memoire multiniveaux a blocage de coulomb, procede de fabrication et procede de lecture/ecriture/ effacement d'un tel dispositif |
-
2000
- 2000-03-14 US US09/524,916 patent/US6320784B1/en not_active Expired - Lifetime
-
2001
- 2001-03-02 AU AU2001247263A patent/AU2001247263A1/en not_active Abandoned
- 2001-03-02 KR KR1020027012007A patent/KR100705301B1/ko active IP Right Grant
- 2001-03-02 WO PCT/US2001/006842 patent/WO2001069607A2/fr active IP Right Grant
- 2001-03-02 DE DE60117132T patent/DE60117132T2/de not_active Expired - Fee Related
- 2001-03-02 JP JP2001567595A patent/JP2003527747A/ja active Pending
- 2001-03-02 EP EP01920186A patent/EP1269477B1/fr not_active Expired - Lifetime
- 2001-03-13 TW TW090105796A patent/TW493268B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TW493268B (en) | 2002-07-01 |
JP2003527747A (ja) | 2003-09-16 |
WO2001069607A3 (fr) | 2002-03-21 |
DE60117132T2 (de) | 2006-07-13 |
KR20020092383A (ko) | 2002-12-11 |
KR100705301B1 (ko) | 2007-04-11 |
DE60117132D1 (de) | 2006-04-20 |
US6320784B1 (en) | 2001-11-20 |
EP1269477A2 (fr) | 2003-01-02 |
WO2001069607A2 (fr) | 2001-09-20 |
EP1269477B1 (fr) | 2006-02-08 |
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