ATE7486T1 - Dielektrisches material des systems (1x)bao.xtio2 insbesondere zur verwendung in einer mikrowellenvorrichtung. - Google Patents

Dielektrisches material des systems (1x)bao.xtio2 insbesondere zur verwendung in einer mikrowellenvorrichtung.

Info

Publication number
ATE7486T1
ATE7486T1 AT80100457T AT80100457T ATE7486T1 AT E7486 T1 ATE7486 T1 AT E7486T1 AT 80100457 T AT80100457 T AT 80100457T AT 80100457 T AT80100457 T AT 80100457T AT E7486 T1 ATE7486 T1 AT E7486T1
Authority
AT
Austria
Prior art keywords
dielectric material
uniform
bao
dielectric
xtio2
Prior art date
Application number
AT80100457T
Other languages
English (en)
Inventor
Tsutomu C/O Nippon Electric C Noguchi
Yuji C/O Nippon Electric Com Kajiwara
Masanori C/O Nippon Electric C Suzuki
Hideo C/O Nippon Electric Takamizawa
Original Assignee
Nec Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=11707446&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ATE7486(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Nec Corporation filed Critical Nec Corporation
Application granted granted Critical
Publication of ATE7486T1 publication Critical patent/ATE7486T1/de

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Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
    • H03F3/20—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers
    • H03F3/24—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers of transmitter output stages
    • H03F3/245—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers of transmitter output stages with semiconductor devices only
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/46—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates
    • C04B35/462—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates
    • C04B35/465—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates
    • C04B35/468—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates based on barium titanates
    • C04B35/4682—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates based on barium titanates based on BaTiO3 perovskite phase
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
    • H01B3/12—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances ceramics
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Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Inorganic Insulating Materials (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Amplifiers (AREA)
AT80100457T 1979-01-29 1980-01-29 Dielektrisches material des systems (1x)bao.xtio2 insbesondere zur verwendung in einer mikrowellenvorrichtung. ATE7486T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP896779A JPS55102292A (en) 1979-01-29 1979-01-29 High frequency high output transistor amplifier
EP80100457A EP0014002B2 (de) 1979-01-29 1980-01-29 Dielektrisches Material des Systems (1-x)BaO.xTiO2 zur Verwendung in einer Mikrowellenvorrichtung

Publications (1)

Publication Number Publication Date
ATE7486T1 true ATE7486T1 (de) 1984-06-15

Family

ID=11707446

Family Applications (1)

Application Number Title Priority Date Filing Date
AT80100457T ATE7486T1 (de) 1979-01-29 1980-01-29 Dielektrisches material des systems (1x)bao.xtio2 insbesondere zur verwendung in einer mikrowellenvorrichtung.

Country Status (5)

Country Link
US (1) US4353047A (de)
EP (1) EP0014002B2 (de)
JP (1) JPS55102292A (de)
AT (1) ATE7486T1 (de)
DE (1) DE3067797D1 (de)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4442220A (en) * 1981-04-15 1984-04-10 Matsushita Electric Industrial Co., Ltd. Dielectric ceramics
JPS5873908A (ja) * 1981-10-28 1983-05-04 ティーディーケイ株式会社 高周波用誘電体磁器組成物
JPS6022451B2 (ja) * 1981-12-17 1985-06-01 三菱鉱業セメント株式会社 誘電体磁器組成物
JPS58206003A (ja) * 1982-05-26 1983-12-01 日本放送協会 低損失マイクロ波誘電材料
JPS5918160A (ja) * 1982-07-20 1984-01-30 三菱鉱業セメント株式会社 誘電体磁器組成物
JPS609220U (ja) * 1983-06-28 1985-01-22 株式会社村田製作所 Ｌｃ複合部品
JPS6122656A (ja) * 1984-07-10 1986-01-31 Nec Corp 発振用トランジスタ素子
FR2568722B1 (fr) * 1984-08-03 1987-10-23 Thomson Csf Substrat en ceramique dielectrique et procede d'obtention
US5223462A (en) * 1985-03-18 1993-06-29 Kyocera Corporation Dielectric ceramic composition
JPS622407A (ja) * 1985-06-27 1987-01-08 株式会社東芝 回路基板
US5027089A (en) * 1988-06-10 1991-06-25 Adc Telecommunications, Inc. High frequency noise bypassing
US5027082A (en) * 1990-05-01 1991-06-25 Microwave Modules & Devices, Inc. Solid state RF power amplifier having improved efficiency and reduced distortion
JPH0583017A (ja) * 1991-09-24 1993-04-02 Mitsubishi Electric Corp マイクロ波集積回路装置
US5389904A (en) * 1992-09-11 1995-02-14 Industrial Technology Research Institute, Taiwan, R.O.C. Surface-mountable, frequency selective microwave IC package
JPH06333426A (ja) * 1993-05-21 1994-12-02 Murata Mfg Co Ltd 高周波用誘電体磁器組成物
JPH07297609A (ja) * 1994-04-28 1995-11-10 Nec Yamagata Ltd 半導体装置
TW277053B (de) * 1994-06-02 1996-06-01 At & T Corp
US6034015A (en) * 1997-05-14 2000-03-07 Georgia Tech Research Corporation Ceramic compositions for microwave wireless communication
US6201454B1 (en) * 1999-03-30 2001-03-13 The Whitaker Corporation Compensation structure for a bond wire at high frequency operation
JP5036105B2 (ja) * 2001-06-07 2012-09-26 三菱電機株式会社 高周波半導体集積回路
US20090258247A1 (en) * 2008-04-11 2009-10-15 Siemens Power Generation, Inc. Anisotropic Soft Ceramics for Abradable Coatings in Gas Turbines
US6903447B2 (en) * 2002-05-09 2005-06-07 M/A-Com, Inc. Apparatus, methods and articles of manufacture for packaging an integrated circuit with internal matching
US6828658B2 (en) * 2002-05-09 2004-12-07 M/A-Com, Inc. Package for integrated circuit with internal matching
US20040212025A1 (en) * 2003-04-28 2004-10-28 Wilman Tsai High k oxide
JP2007300159A (ja) * 2006-04-27 2007-11-15 Sharp Corp 回路ユニット、電源バイアス回路、ｌｎｂ、およびトランスミッタ
JP4982596B2 (ja) * 2009-09-08 2012-07-25 株式会社東芝 モジュールの接続構造
US8685545B2 (en) 2012-02-13 2014-04-01 Siemens Aktiengesellschaft Thermal barrier coating system with porous tungsten bronze structured underlayer
JP6430694B2 (ja) * 2013-08-23 2018-11-28 住友電工デバイス・イノベーション株式会社 半導体装置
CN104149420A (zh) * 2014-05-12 2014-11-19 华东理工大学 非烧结成型高性能聚四氟乙烯高频通讯用覆铜箔板的制备
CN109265163A (zh) * 2018-09-29 2019-01-25 苏州旷视智能科技有限公司 陶瓷电容器的制备方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL231805A (de) * 1957-10-03
US3775142A (en) * 1971-01-26 1973-11-27 Solid State Dielectrics Inc Improved ceramic compositions for high stability capacitors
US3718730A (en) * 1971-06-23 1973-02-27 Us Army Method of treating barium titanate
DE2158952B1 (de) * 1971-11-27 1973-03-15 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Keramisches Dielektrikum
US4026811A (en) * 1973-08-02 1977-05-31 Raytheon Company Microwave dielectrics
US3938064A (en) * 1973-09-04 1976-02-10 Bell Telephone Laboratories, Incorporated Devices using low loss dielectric material
US4004256A (en) * 1974-06-10 1977-01-18 Duncan David M High frequency amplifier stage with input reference translation and output matching
JPS5233453A (en) * 1975-09-10 1977-03-14 Nec Corp High frequency high output transistor amplifier

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EP0014002A2 (de) 1980-08-06
JPS5612035B2 (de) 1981-03-18
EP0014002B2 (de) 1989-09-20
EP0014002A3 (en) 1980-08-20
DE3067797D1 (en) 1984-06-20
JPS55102292A (en) 1980-08-05
US4353047A (en) 1982-10-05
EP0014002B1 (de) 1984-05-16

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