ATE66701T1 - Verfahren und vorrichtung zum auftragen von hydriertem, amorphem silizium auf ein substrat in plasmaumgebung. - Google Patents
Verfahren und vorrichtung zum auftragen von hydriertem, amorphem silizium auf ein substrat in plasmaumgebung.Info
- Publication number
- ATE66701T1 ATE66701T1 AT87810548T AT87810548T ATE66701T1 AT E66701 T1 ATE66701 T1 AT E66701T1 AT 87810548 T AT87810548 T AT 87810548T AT 87810548 T AT87810548 T AT 87810548T AT E66701 T1 ATE66701 T1 AT E66701T1
- Authority
- AT
- Austria
- Prior art keywords
- substrate
- electrodes
- frequency
- silicon
- deposition
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title abstract 3
- 229910052710 silicon Inorganic materials 0.000 title 1
- 239000010703 silicon Substances 0.000 title 1
- 230000008021 deposition Effects 0.000 abstract 3
- 239000007789 gas Substances 0.000 abstract 3
- 229910021417 amorphous silicon Inorganic materials 0.000 abstract 2
- 239000000956 alloy Substances 0.000 abstract 1
- 229910045601 alloy Inorganic materials 0.000 abstract 1
- 239000000203 mixture Substances 0.000 abstract 1
- 150000003377 silicon compounds Chemical group 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/505—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
- C23C16/509—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges using internal electrodes
- C23C16/5096—Flat-bed apparatus
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Plasma & Fusion (AREA)
- Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Photovoltaic Devices (AREA)
- Silicon Compounds (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH3868/86A CH668145A5 (fr) | 1986-09-26 | 1986-09-26 | Procede et installation de depot de silicium amorphe hydrogene sur un substrat dans une enceinte a plasma. |
EP87810548A EP0263788B1 (de) | 1986-09-26 | 1987-09-23 | Verfahren und Vorrichtung zum Auftragen von hydriertem, amorphem Silizium auf ein Substrat in Plasmaumgebung |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE66701T1 true ATE66701T1 (de) | 1991-09-15 |
Family
ID=4265212
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT87810548T ATE66701T1 (de) | 1986-09-26 | 1987-09-23 | Verfahren und vorrichtung zum auftragen von hydriertem, amorphem silizium auf ein substrat in plasmaumgebung. |
Country Status (6)
Country | Link |
---|---|
US (1) | US4933203A (de) |
EP (1) | EP0263788B1 (de) |
JP (1) | JPH07105354B2 (de) |
AT (1) | ATE66701T1 (de) |
CH (1) | CH668145A5 (de) |
DE (1) | DE3772506D1 (de) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4830702A (en) * | 1987-07-02 | 1989-05-16 | General Electric Company | Hollow cathode plasma assisted apparatus and method of diamond synthesis |
IT1227877B (it) * | 1988-11-25 | 1991-05-14 | Eniricerche S P A Agip S P A | Procedimento per la deposizione via plasma di strati multipli dimate riale amorfo a composizione variabile |
KR0170387B1 (ko) † | 1989-10-03 | 1999-03-30 | 제임스 조셉 드롱 | 고주파 반도체 웨이퍼 가공장치 및 방법 |
ES2125229T3 (es) * | 1990-07-31 | 1999-03-01 | Applied Materials Inc | Reactor de tratamiento por plasma. |
US5582880A (en) * | 1992-03-27 | 1996-12-10 | Canon Kabushiki Kaisha | Method of manufacturing non-single crystal film and non-single crystal semiconductor device |
JP3164956B2 (ja) * | 1993-01-28 | 2001-05-14 | アプライド マテリアルズ インコーポレイテッド | Cvdにより大面積のガラス基板上に高堆積速度でアモルファスシリコン薄膜を堆積する方法 |
US5849372A (en) * | 1993-09-17 | 1998-12-15 | Isis Innovation Limited | RF plasma reactor and methods of generating RF plasma |
EP0719447B1 (de) * | 1993-09-17 | 1998-07-22 | Isis Innovation Limited | Rf plasmareaktor |
US5565036A (en) * | 1994-01-19 | 1996-10-15 | Tel America, Inc. | Apparatus and method for igniting plasma in a process module |
US5926689A (en) * | 1995-12-19 | 1999-07-20 | International Business Machines Corporation | Process for reducing circuit damage during PECVD in single wafer PECVD system |
US20030143410A1 (en) * | 1997-03-24 | 2003-07-31 | Applied Materials, Inc. | Method for reduction of contaminants in amorphous-silicon film |
AUPP055497A0 (en) * | 1997-11-26 | 1997-12-18 | Pacific Solar Pty Limited | High rate deposition of amorphous silicon films |
JP3581546B2 (ja) * | 1997-11-27 | 2004-10-27 | キヤノン株式会社 | 微結晶シリコン膜形成方法および光起電力素子の製造方法 |
JPH11233801A (ja) | 1998-02-17 | 1999-08-27 | Canon Inc | 微結晶シリコン膜の形成方法、および光起電力素子 |
JP3046965B1 (ja) * | 1999-02-26 | 2000-05-29 | 鐘淵化学工業株式会社 | 非晶質シリコン系薄膜光電変換装置の製造方法 |
JP2001040478A (ja) * | 1999-05-27 | 2001-02-13 | Canon Inc | 堆積膜形成装置及び堆積膜形成方法 |
JP2001345273A (ja) | 2000-05-31 | 2001-12-14 | Canon Inc | シリコン系薄膜の形成方法、シリコン系薄膜及び光起電力素子 |
JP4557400B2 (ja) * | 2000-09-14 | 2010-10-06 | キヤノン株式会社 | 堆積膜形成方法 |
JP2003007629A (ja) | 2001-04-03 | 2003-01-10 | Canon Inc | シリコン系膜の形成方法、シリコン系膜および半導体素子 |
JP2002371357A (ja) | 2001-06-14 | 2002-12-26 | Canon Inc | シリコン系薄膜の形成方法、シリコン系薄膜及び半導体素子並びにシリコン系薄膜の形成装置 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4226898A (en) * | 1978-03-16 | 1980-10-07 | Energy Conversion Devices, Inc. | Amorphous semiconductors equivalent to crystalline semiconductors produced by a glow discharge process |
JPS56105627A (en) * | 1980-01-28 | 1981-08-22 | Fuji Photo Film Co Ltd | Manufacture of amorphous semiconductor |
JPS59128281A (ja) * | 1982-12-29 | 1984-07-24 | 信越化学工業株式会社 | 炭化けい素被覆物の製造方法 |
US4524089A (en) * | 1983-11-22 | 1985-06-18 | Olin Corporation | Three-step plasma treatment of copper foils to enhance their laminate adhesion |
JPH0685391B2 (ja) * | 1984-10-09 | 1994-10-26 | キヤノン株式会社 | 堆積膜形成方法 |
JPS6331110A (ja) * | 1986-07-25 | 1988-02-09 | Fujitsu Ltd | 半導体装置の製造方法 |
-
1986
- 1986-09-26 CH CH3868/86A patent/CH668145A5/fr not_active IP Right Cessation
-
1987
- 1987-09-23 EP EP87810548A patent/EP0263788B1/de not_active Expired - Lifetime
- 1987-09-23 DE DE8787810548T patent/DE3772506D1/de not_active Expired - Lifetime
- 1987-09-23 AT AT87810548T patent/ATE66701T1/de active
- 1987-09-25 JP JP62242397A patent/JPH07105354B2/ja not_active Expired - Lifetime
-
1989
- 1989-07-07 US US07/376,952 patent/US4933203A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US4933203A (en) | 1990-06-12 |
EP0263788B1 (de) | 1991-08-28 |
EP0263788A1 (de) | 1988-04-13 |
CH668145A5 (fr) | 1988-11-30 |
JPH07105354B2 (ja) | 1995-11-13 |
DE3772506D1 (de) | 1991-10-02 |
JPS63197329A (ja) | 1988-08-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ATE66701T1 (de) | Verfahren und vorrichtung zum auftragen von hydriertem, amorphem silizium auf ein substrat in plasmaumgebung. | |
EP0182889B1 (de) | Verfahren zur herstellung von diamantartigen kohlenstoffschichten | |
US4756794A (en) | Atomic layer etching | |
ATE207978T1 (de) | Verfahren und vorrichtung zum zünden von plasmen in einem process modul | |
DE59305729D1 (de) | Verfahren und Vorrichtung zum Modifizieren der Oberflächenaktivität eines Silikatglas Substrates | |
EP1324374A3 (de) | Ätzvorrichtung für einen Isolationsfilm | |
DE69505942T2 (de) | Verfahren und Vorrichtung zur Herstellung dünner Schichten von metallischen Verbindungen | |
DE4128779C2 (de) | Verfahren zum Herstellen von Feinstrukturen und Vorrichtung zur Durchführung des Verfahrens sowie Verwendungen des Verfahrens und der Vorrichtung | |
EP0132322A3 (de) | Thermische Crack-Anlage zur Herstellung von Pnictidfilmen in Hochvakuumverfahren | |
ATE195982T1 (de) | Verfahren und vorrichtung zum reinigen eines metallsubstrats | |
DE10010126C2 (de) | Verfahren und Vorrichtung zum Plasmabehandeln der Oberfläche von Substraten durch Ionenbeschuß | |
JPS63267430A (ja) | 反応室内の清浄方法 | |
DE3778794D1 (de) | Verfahren und vorrichtung zum ausbilden einer schicht durch plasmachemischen prozess. | |
ATE136159T1 (de) | Verfahren zum herstellen einer abgeschiedenen schicht, und verfahren zum herstellen einer halbleitervorrichtung | |
JPS5933251B2 (ja) | プラズマ気相処理装置 | |
JPS57202729A (en) | Manufacture of semiconductor device | |
JPS56138921A (en) | Method of formation for impurity introduction layer | |
ATE7714T1 (de) | Verfahren zur massenherstellung von legierungen und vorrichtung hierfuer. | |
GB2194556A (en) | Plasma enhanced chemical vapour deposition of films | |
JPH03257098A (ja) | ダイヤモンド薄膜の形成方法 | |
JPH0732147B2 (ja) | ウエハの清浄方法 | |
JPH03166376A (ja) | レーザcvd法 | |
JPS60254730A (ja) | レジスト剥離装置 | |
JPS6167920A (ja) | 光化学反応装置 | |
JPH0578850A (ja) | プラズマcvd装置 |