ATE546983T1 - Säureresistenzfördernde zusammensetzung - Google Patents
Säureresistenzfördernde zusammensetzungInfo
- Publication number
- ATE546983T1 ATE546983T1 AT09758853T AT09758853T ATE546983T1 AT E546983 T1 ATE546983 T1 AT E546983T1 AT 09758853 T AT09758853 T AT 09758853T AT 09758853 T AT09758853 T AT 09758853T AT E546983 T1 ATE546983 T1 AT E546983T1
- Authority
- AT
- Austria
- Prior art keywords
- copper
- acid resistance
- composition
- promoting composition
- compound
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/18—Acidic compositions for etching copper or alloys thereof
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/18—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using inorganic inhibitors
- C23F11/184—Phosphorous, arsenic, antimony or bismuth containing compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
- H05K2203/124—Heterocyclic organic compounds, e.g. azole, furan
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
- Chemical Treatment Of Metals (AREA)
- Agricultural Chemicals And Associated Chemicals (AREA)
- Acyclic And Carbocyclic Compounds In Medicinal Compositions (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/156,613 US8518281B2 (en) | 2008-06-03 | 2008-06-03 | Acid-resistance promoting composition |
PCT/US2009/038590 WO2009148690A1 (en) | 2008-06-03 | 2009-03-27 | Acid-resistance promoting composition |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE546983T1 true ATE546983T1 (de) | 2012-03-15 |
Family
ID=41378422
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT09758853T ATE546983T1 (de) | 2008-06-03 | 2009-03-27 | Säureresistenzfördernde zusammensetzung |
Country Status (8)
Country | Link |
---|---|
US (1) | US8518281B2 (de) |
EP (1) | EP2304079B1 (de) |
JP (1) | JP5184699B2 (de) |
CN (1) | CN102046849B (de) |
AT (1) | ATE546983T1 (de) |
ES (1) | ES2380897T3 (de) |
TW (1) | TWI399459B (de) |
WO (1) | WO2009148690A1 (de) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7937772B1 (en) * | 2010-01-28 | 2011-05-10 | Lakeland Industries, Inc. | Chemical/biological protective garments and laminates |
US8308893B2 (en) * | 2010-02-01 | 2012-11-13 | Ming De Wang | Nano-oxide process for bonding copper/copper alloy and resin |
EP2453041B1 (de) * | 2010-11-10 | 2014-02-12 | Atotech Deutschland GmbH | Lösung und Verfahren für die Vorbehandlung von Kupferoberflächen mit einer N-alkoxylierten haftungsfördernden Verbindung |
WO2013004624A1 (en) * | 2011-07-07 | 2013-01-10 | Atotech Deutschland Gmbh | Method for providing organic resist adhesion to a copper or copper alloy surface |
US9523172B2 (en) | 2011-07-18 | 2016-12-20 | Lakeland Industries, Inc. | Process for producing polyvinyl alcohol articles |
US9797073B1 (en) | 2011-07-18 | 2017-10-24 | Lakeland Industries, Inc. | Process for producing polyvinyl alcohol articles |
JP5885971B2 (ja) * | 2011-09-08 | 2016-03-16 | 関東化學株式会社 | 銅および銅合金のエッチング液 |
CN102337546A (zh) * | 2011-11-07 | 2012-02-01 | 大连三达奥克化学股份有限公司 | 环保型铜锈清洗剂 |
JP6164861B2 (ja) * | 2013-02-15 | 2017-07-19 | 株式会社Jcu | 銅または銅合金用エッチング液およびこれを用いた銅または銅合金のエッチング方法 |
EP2862959A1 (de) * | 2013-10-21 | 2015-04-22 | ATOTECH Deutschland GmbH | Verfahren zur selektiven Behandlung von Kupfer in Gegenwart eines weiteren Metalls |
KR101827765B1 (ko) * | 2014-06-24 | 2018-02-09 | 오꾸노 케미칼 인더스트리즈 컴파니,리미티드 | 동계 금속 또는 은계 금속의 흑화 처리용 조성물 |
CN104928667B (zh) * | 2015-06-08 | 2018-07-20 | 华南理工大学 | 一种基于功能化离子液体的印制电路板处理用棕化液 |
EP3159432B1 (de) * | 2015-10-23 | 2020-08-05 | ATOTECH Deutschland GmbH | Oberflächenbehandlungsmittel für kupfer und kupferlegierungsoberflächen |
SG11201708903SA (en) * | 2016-03-03 | 2017-11-29 | Mitsui Mining & Smelting Co | Production method for copper-clad laminate plate |
JP6777420B2 (ja) * | 2016-04-21 | 2020-10-28 | 関東化学株式会社 | 単層膜または積層膜のエッチング組成物または前記組成物を用いたエッチング方法 |
CN106399996B (zh) * | 2016-11-30 | 2018-04-24 | 佛冈建滔实业有限公司 | 一种铜箔防氧化处理液及制备方法和设备 |
CN113564598B (zh) * | 2021-06-10 | 2023-06-13 | 江阴润玛电子材料股份有限公司 | 一种集成电路用铜钛腐蚀液及其生产工艺 |
Family Cites Families (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2861907A (en) * | 1956-09-28 | 1958-11-25 | Lubrizol Corp | Inhibition of corrosion of metal surfaces by salt of phosphorodithioic acid |
US3207611A (en) * | 1962-01-03 | 1965-09-21 | Lubrizol Corp | Coating composition |
US4042323A (en) * | 1972-07-17 | 1977-08-16 | Petrolite Corporation | Process of inhibiting corrosion of metal in an aqueous environment with mixtures of thio-, oxygen and thio- oxygen phosphates and pyrophosphates |
US4308072A (en) * | 1976-08-27 | 1981-12-29 | Chevron Research | Plasticized sulfur composition |
US5037482A (en) * | 1990-02-16 | 1991-08-06 | Macdermid, Incorporated | Composition and method for improving adhesion of coatings to copper surfaces |
FR2698018B1 (fr) * | 1992-11-18 | 1995-01-20 | Inst Francais Du Petrole | Produits colloïdaux renfermant du bore, et/ou du soufre, et/ou du phosphore, leur préparation et leur utilisation comme additifs pour lubrifiants. |
TW317575B (de) * | 1994-01-21 | 1997-10-11 | Olin Corp | |
GB9425090D0 (en) * | 1994-12-12 | 1995-02-08 | Alpha Metals Ltd | Copper coating |
JP2923524B2 (ja) * | 1995-08-01 | 1999-07-26 | メック株式会社 | 銅および銅合金のマイクロエッチング剤並びにマイクロエッチング方法 |
TW374802B (en) * | 1996-07-29 | 1999-11-21 | Ebara Densan Ltd | Etching composition, method for roughening copper surface and method for producing printed wiring board |
US6087704A (en) * | 1997-09-30 | 2000-07-11 | National Science Council | Structure and method for manufacturing group III-V composite Schottky contacts enhanced by a sulphur fluoride/phosphorus fluoride layer |
JP2000064067A (ja) * | 1998-06-09 | 2000-02-29 | Ebara Densan Ltd | エッチング液および銅表面の粗化処理方法 |
US6294220B1 (en) * | 1999-06-30 | 2001-09-25 | Alpha Metals, Inc. | Post-treatment for copper on printed circuit boards |
US6156221A (en) * | 1998-10-02 | 2000-12-05 | International Business Machines Corporation | Copper etching compositions, processes and products derived therefrom |
JP4063475B2 (ja) * | 1999-11-10 | 2008-03-19 | メック株式会社 | 銅または銅合金のエッチング剤 |
US7351353B1 (en) * | 2000-01-07 | 2008-04-01 | Electrochemicals, Inc. | Method for roughening copper surfaces for bonding to substrates |
KR100504359B1 (ko) * | 2000-02-04 | 2005-07-28 | 쇼와 덴코 가부시키가이샤 | Lsi 디바이스 연마용 조성물 및 lsi 디바이스의제조 방법 |
US6383272B1 (en) * | 2000-06-08 | 2002-05-07 | Donald Ferrier | Process for improving the adhesion of polymeric materials to metal surfaces |
DE10066028C2 (de) * | 2000-07-07 | 2003-04-24 | Atotech Deutschland Gmbh | Kupfersubstrat mit aufgerauhten Oberflächen |
US6521139B1 (en) * | 2000-08-04 | 2003-02-18 | Shipley Company L.L.C. | Composition for circuit board manufacture |
US6554948B1 (en) * | 2000-08-22 | 2003-04-29 | Donald Ferrier | Process for improving the adhesion of polymeric materials to metal surfaces |
US6679983B2 (en) * | 2000-10-13 | 2004-01-20 | Shipley Company, L.L.C. | Method of electrodepositing copper |
US6573223B1 (en) * | 2002-03-04 | 2003-06-03 | The Lubrizol Corporation | Lubricating compositions with good thermal stability and demulsibility properties |
US6716281B2 (en) * | 2002-05-10 | 2004-04-06 | Electrochemicals, Inc. | Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates |
US7186305B2 (en) * | 2002-11-26 | 2007-03-06 | Donald Ferrier | Process for improving the adhesion of polymeric materials to metal surfaces |
US6911393B2 (en) * | 2002-12-02 | 2005-06-28 | Arkema Inc. | Composition and method for copper chemical mechanical planarization |
JP2005086071A (ja) * | 2003-09-10 | 2005-03-31 | Hitachi Chem Co Ltd | 多層配線基板、半導体チップ搭載基板及び半導体パッケージ、並びにそれらの製造方法 |
US7063800B2 (en) * | 2003-11-10 | 2006-06-20 | Ying Ding | Methods of cleaning copper surfaces in the manufacture of printed circuit boards |
US20050236359A1 (en) * | 2004-04-22 | 2005-10-27 | Ginning Hu | Copper/copper alloy surface bonding promotor and its usage |
EP1754732B1 (de) * | 2005-08-12 | 2009-04-15 | Sika Technology AG | Primerzusammensetzung |
US7456114B2 (en) * | 2005-12-21 | 2008-11-25 | Kesheng Feng | Microetching composition and method of using the same |
US20080317962A1 (en) * | 2007-03-05 | 2008-12-25 | Scott Hayes | Multi-layer and composite corrosion resistant coatings |
KR101512523B1 (ko) * | 2007-04-24 | 2015-04-15 | 다우 글로벌 테크놀로지스 엘엘씨 | 개선된 프라이머 접착 촉진제, 조성물 및 방법 |
US7645393B2 (en) * | 2007-04-27 | 2010-01-12 | Kesheng Feng | Metal surface treatment composition |
-
2008
- 2008-06-03 US US12/156,613 patent/US8518281B2/en active Active
-
2009
- 2009-03-27 CN CN200980119809.3A patent/CN102046849B/zh not_active Expired - Fee Related
- 2009-03-27 ES ES09758853T patent/ES2380897T3/es active Active
- 2009-03-27 WO PCT/US2009/038590 patent/WO2009148690A1/en active Application Filing
- 2009-03-27 EP EP09758853A patent/EP2304079B1/de not_active Not-in-force
- 2009-03-27 JP JP2011512484A patent/JP5184699B2/ja not_active Expired - Fee Related
- 2009-03-27 AT AT09758853T patent/ATE546983T1/de active
- 2009-04-09 TW TW098111756A patent/TWI399459B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP2304079A1 (de) | 2011-04-06 |
US8518281B2 (en) | 2013-08-27 |
EP2304079B1 (de) | 2012-02-22 |
TWI399459B (zh) | 2013-06-21 |
JP5184699B2 (ja) | 2013-04-17 |
US20090294294A1 (en) | 2009-12-03 |
JP2011523790A (ja) | 2011-08-18 |
TW201000674A (en) | 2010-01-01 |
EP2304079A4 (de) | 2011-07-27 |
ES2380897T3 (es) | 2012-05-21 |
CN102046849A (zh) | 2011-05-04 |
WO2009148690A1 (en) | 2009-12-10 |
CN102046849B (zh) | 2013-01-16 |
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