ATE545155T1 - Leistungshalbleiterbauelement - Google Patents

Leistungshalbleiterbauelement

Info

Publication number
ATE545155T1
ATE545155T1 AT10167819T AT10167819T ATE545155T1 AT E545155 T1 ATE545155 T1 AT E545155T1 AT 10167819 T AT10167819 T AT 10167819T AT 10167819 T AT10167819 T AT 10167819T AT E545155 T1 ATE545155 T1 AT E545155T1
Authority
AT
Austria
Prior art keywords
doped
layer
additional
collector
power semiconductor
Prior art date
Application number
AT10167819T
Other languages
English (en)
Inventor
Friedhelm Bauer
Original Assignee
Abb Research Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Abb Research Ltd filed Critical Abb Research Ltd
Application granted granted Critical
Publication of ATE545155T1 publication Critical patent/ATE545155T1/de

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D18/00Thyristors
    • H10D18/60Gate-turn-off devices 
    • H10D18/65Gate-turn-off devices  with turn-off by field effect 
    • H10D18/655Gate-turn-off devices  with turn-off by field effect  produced by insulated gate structures
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D18/00Thyristors
    • H10D18/40Thyristors with turn-on by field effect 
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/01Manufacture or treatment
    • H10D30/021Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/028Manufacture or treatment of FETs having insulated gates [IGFET] of double-diffused metal oxide semiconductor [DMOS] FETs
    • H10D30/0291Manufacture or treatment of FETs having insulated gates [IGFET] of double-diffused metal oxide semiconductor [DMOS] FETs of vertical DMOS [VDMOS] FETs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/64Double-diffused metal-oxide semiconductor [DMOS] FETs
    • H10D30/66Vertical DMOS [VDMOS] FETs

Landscapes

  • Thyristors (AREA)
  • Electrodes Of Semiconductors (AREA)
AT10167819T 2010-06-30 2010-06-30 Leistungshalbleiterbauelement ATE545155T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP10167819A EP2402997B1 (de) 2010-06-30 2010-06-30 Leistungshalbleiterbauelement

Publications (1)

Publication Number Publication Date
ATE545155T1 true ATE545155T1 (de) 2012-02-15

Family

ID=42985587

Family Applications (1)

Application Number Title Priority Date Filing Date
AT10167819T ATE545155T1 (de) 2010-06-30 2010-06-30 Leistungshalbleiterbauelement

Country Status (7)

Country Link
US (1) US8304814B2 (de)
EP (1) EP2402997B1 (de)
JP (1) JP5781383B2 (de)
KR (1) KR101683751B1 (de)
CN (1) CN102315257B (de)
AT (1) ATE545155T1 (de)
ES (1) ES2382185T3 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5644793B2 (ja) * 2012-03-02 2014-12-24 株式会社デンソー 半導体装置
US9666705B2 (en) * 2012-05-14 2017-05-30 Infineon Technologies Austria Ag Contact structures for compound semiconductor devices
CN103579296B (zh) * 2012-08-06 2016-09-07 三垦电气株式会社 半导体装置及其制造方法
JP2015032744A (ja) * 2013-08-05 2015-02-16 株式会社東芝 半導体装置および半導体装置の製造方法
US9685506B2 (en) 2015-03-05 2017-06-20 Infineon Technologies Americas Corp. IGBT having an inter-trench superjunction structure
US9831330B2 (en) 2015-03-05 2017-11-28 Infineon Technologies Americas Corp. Bipolar semiconductor device having a deep charge-balanced structure
US9768284B2 (en) 2015-03-05 2017-09-19 Infineon Technologies Americas Corp. Bipolar semiconductor device having a charge-balanced inter-trench structure
JP6406452B2 (ja) * 2015-06-30 2018-10-17 富士電機株式会社 半導体装置及びその製造方法
WO2018030440A1 (ja) 2016-08-12 2018-02-15 富士電機株式会社 半導体装置および半導体装置の製造方法
CN109449202B (zh) * 2018-10-30 2021-10-22 广州工商学院 一种逆导双极型晶体管
CN119050128B (zh) * 2024-08-26 2025-06-06 西安电子科技大学 一种结合hk集电极栅的sj-ligbt器件结构

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0420233B1 (de) * 1989-09-27 1995-11-29 Nippon Paper Industries Co., Ltd. Phthalsäuremetallsalzderivat und eine dieses enthaltende verdunkelnde und lichtgefühlige Platte
US5202750A (en) * 1990-04-09 1993-04-13 U.S. Philips Corp. MOS-gated thyristor
JP3297060B2 (ja) * 1990-09-17 2002-07-02 株式会社東芝 絶縁ゲート型サイリスタ
KR100327323B1 (ko) * 2000-05-30 2002-03-06 김덕중 래치 업이 억제된 트랜치 게이트 구조의 전력용반도체소자 및 그 제조방법
TW543146B (en) * 2001-03-09 2003-07-21 Fairchild Semiconductor Ultra dense trench-gated power device with the reduced drain-source feedback capacitance and miller charge
JP4723816B2 (ja) * 2003-12-24 2011-07-13 株式会社豊田中央研究所 半導体装置
JP4731848B2 (ja) * 2004-07-16 2011-07-27 株式会社豊田中央研究所 半導体装置
US20080203535A1 (en) * 2007-02-27 2008-08-28 Masaaki Noda Semiconductor device
JP2008288386A (ja) * 2007-05-17 2008-11-27 Hitachi Ltd 半導体装置
JP4544360B2 (ja) * 2008-10-24 2010-09-15 トヨタ自動車株式会社 Igbtの製造方法

Also Published As

Publication number Publication date
ES2382185T3 (es) 2012-06-06
KR101683751B1 (ko) 2016-12-20
JP2012015518A (ja) 2012-01-19
EP2402997B1 (de) 2012-02-08
CN102315257B (zh) 2015-09-09
CN102315257A (zh) 2012-01-11
JP5781383B2 (ja) 2015-09-24
US20120001199A1 (en) 2012-01-05
KR20120002455A (ko) 2012-01-05
EP2402997A1 (de) 2012-01-04
US8304814B2 (en) 2012-11-06

Similar Documents

Publication Publication Date Title
ATE545155T1 (de) Leistungshalbleiterbauelement
GB2497245A (en) Bipolar non-punch-through power semiconductor device
JP2015135954A5 (de)
EP2879189A3 (de) Solarzelle und Verfahren zur Herstellung davon
GB2496067A (en) Power semiconductor device
JP2011503871A5 (de)
WO2012120359A3 (en) Insulated-gate bipolar transistor
EP2755237A3 (de) Halbleiteranordnung mit Graben-Gateelektrode und Verfahren zu deren Herstellung
EP2249392A3 (de) Rückwärtsleitende Halbleitervorrichtung
JP2016506081A5 (de)
NZ590751A (en) Semiconductor devices with non-punch-through semiconductor channels having enhanced conduction and methods of making
EP2388835A3 (de) Elektrodenanordnung für eine Leuchtdiode.
JP2014518016A5 (de)
ATE520152T1 (de) Leistungshalbleiterbauelement
WO2013055915A3 (en) Semiconductor devices having a recessed electrode structure
JP2012064849A5 (de)
EP2600402A4 (de) Halbleiterbauelement
WO2014140000A3 (en) Lateral single-photon avalanche diode and their manufacturing method
SE1751139A1 (en) Integration of a schottky diode with a mosfet
JP2011066246A5 (de)
JP2008510294A5 (de)
GB201315138D0 (en) A power semiconductor device
EP2482344A3 (de) Lichtemittierende Diode
EP2688104A4 (de) Halbleiterbauelement
JP2015153785A5 (de)