ATE545008T1 - Halbleiter-drucksensor - Google Patents

Halbleiter-drucksensor

Info

Publication number
ATE545008T1
ATE545008T1 AT05800425T AT05800425T ATE545008T1 AT E545008 T1 ATE545008 T1 AT E545008T1 AT 05800425 T AT05800425 T AT 05800425T AT 05800425 T AT05800425 T AT 05800425T AT E545008 T1 ATE545008 T1 AT E545008T1
Authority
AT
Austria
Prior art keywords
corroded
prevented
aluminum
wires
corrosive
Prior art date
Application number
AT05800425T
Other languages
English (en)
Inventor
Toshiaki Kaminaga
Masahide Hayashi
Katsumichi Ueyanagi
Kazunori Saito
Mutsuo Nishikawa
Original Assignee
Hitachi Ltd
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Fuji Electric Co Ltd filed Critical Hitachi Ltd
Application granted granted Critical
Publication of ATE545008T1 publication Critical patent/ATE545008T1/de

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L15/00—Devices or apparatus for measuring two or more fluid pressure values simultaneously
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0007—Fluidic connecting means
    • G01L19/0038—Fluidic connecting means being part of the housing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means
    • G01L19/0084—Electrical connection means to the outside of the housing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
    • G01L19/0627—Protection against aggressive medium in general
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/141—Monolithic housings, e.g. molded or one-piece housings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/147—Details about the mounting of the sensor to support or covering means
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5522—
    • H10W72/5524—
    • H10W72/932—

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)
  • Wire Bonding (AREA)
AT05800425T 2005-11-01 2005-11-01 Halbleiter-drucksensor ATE545008T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2005/020072 WO2007052335A1 (ja) 2005-11-01 2005-11-01 半導体圧力センサ

Publications (1)

Publication Number Publication Date
ATE545008T1 true ATE545008T1 (de) 2012-02-15

Family

ID=38005499

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05800425T ATE545008T1 (de) 2005-11-01 2005-11-01 Halbleiter-drucksensor

Country Status (5)

Country Link
US (1) US8304847B2 (de)
EP (1) EP1947439B1 (de)
JP (1) JPWO2007052335A1 (de)
AT (1) ATE545008T1 (de)
WO (1) WO2007052335A1 (de)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007003541A1 (de) * 2007-01-24 2008-07-31 Robert Bosch Gmbh Elektronisches Bauteil
JP5157654B2 (ja) * 2008-06-04 2013-03-06 富士電機株式会社 半導体装置の製造方法
US20120292770A1 (en) * 2011-05-19 2012-11-22 General Electric Company Method and device for preventing corrosion on sensors
USD689390S1 (en) * 2011-09-14 2013-09-10 Alps Electric Co., Ltd. Pressure sensor package
USD689391S1 (en) * 2012-04-12 2013-09-10 Alps Electric Co., Ltd. Pressure sensor package
JP2014006138A (ja) * 2012-06-25 2014-01-16 Hitachi Automotive Systems Ltd 圧力センサ装置
JP6136644B2 (ja) 2013-06-28 2017-05-31 富士電機株式会社 半導体圧力センサ装置およびその製造方法
JP5952785B2 (ja) * 2013-07-19 2016-07-13 長野計器株式会社 物理量測定センサ及びその製造方法
US9423315B2 (en) * 2013-10-15 2016-08-23 Rosemount Aerospace Inc. Duplex pressure transducers
FR3016439B1 (fr) * 2014-01-12 2017-08-25 Sc2N Sa Dispositif de mesure de pression d'un fluide
JP6372148B2 (ja) * 2014-04-23 2018-08-15 株式会社デンソー 半導体装置
FR3026182B1 (fr) * 2014-09-19 2018-04-13 Valeo Systemes De Controle Moteur Dispositif de mesure de pression differentielle
EP3211394B1 (de) 2016-02-29 2021-03-31 Melexis Technologies NV Halbleiterdrucksensor für anwendung in rauen medien
JP6233445B2 (ja) * 2016-04-26 2017-11-22 株式会社村田製作所 電子部品
EP3260833B1 (de) 2016-06-21 2021-10-27 Melexis Technologies NV Halbleitersensoranordnung zur anwendung in rauen bedingungen
CN106644187A (zh) * 2016-10-14 2017-05-10 沈阳市传感技术研究所 蓝宝石绝缘体定电极的电容压力传感器
CN106353014A (zh) * 2016-10-14 2017-01-25 沈阳市传感技术研究所 带有过渡焊接环的电容压力传感器
CN106225962A (zh) * 2016-10-14 2016-12-14 沈阳市传感技术研究所 动电极板镀金的电容压力传感器
WO2018116785A1 (ja) 2016-12-20 2018-06-28 株式会社デンソー 半導体装置およびその製造方法
JP6515944B2 (ja) 2016-12-20 2019-05-22 株式会社デンソー 半導体装置およびその製造方法
EP3358616B1 (de) 2017-02-02 2021-10-27 Melexis Technologies NV Bondpadschutz für anwendungen für raue medien
JP2019152625A (ja) * 2018-03-06 2019-09-12 株式会社デンソー 電子装置
JP7387338B2 (ja) * 2019-08-30 2023-11-28 キヤノン株式会社 電気接続部付き基板の製造方法及び液体吐出ヘッド用基板の製造方法
US11506557B2 (en) * 2020-10-07 2022-11-22 Honywell International Inc. Differential pressure sensor and method of using the same
CN117257268B (zh) * 2023-11-23 2024-03-12 微智医疗器械有限公司 一种颅内压监测探头制作方法及颅内压监测探头
CN117288368B (zh) * 2023-11-24 2024-01-30 微智医疗器械有限公司 一种压力传感器组件制造方法及压力传感器组件
CN117322861B (zh) * 2023-11-30 2024-03-12 微智医疗器械有限公司 一种颅内压探头制作方法及颅内压探头

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0567937A3 (de) 1992-04-30 1993-12-08 Texas Instruments Incorporated Bearbeitung eines Halbleiterwürfels mit höher Zuverlässigkeit
JPH09250962A (ja) * 1996-03-15 1997-09-22 Matsushita Electric Works Ltd 半導体装置
JPH10153508A (ja) 1996-11-26 1998-06-09 Fuji Electric Co Ltd 半導体圧力センサ
US5942448A (en) 1997-02-24 1999-08-24 Sarnoff Corporation Method of making contacts on an integrated circuit
US6107170A (en) * 1998-07-24 2000-08-22 Smi Corporation Silicon sensor contact with platinum silicide, titanium/tungsten and gold
JP3859403B2 (ja) 1999-09-22 2006-12-20 株式会社東芝 半導体装置及びその製造方法
JP2001138521A (ja) * 1999-11-11 2001-05-22 Canon Inc インクジェット記録ヘッドおよび該記録ヘッドを用いたインクジェット記録装置
WO2004059722A1 (ja) * 2002-12-24 2004-07-15 Denso Corporation 半導体式センサおよび半導体装置のめっき方法
US20050001316A1 (en) * 2003-07-01 2005-01-06 Motorola, Inc. Corrosion-resistant bond pad and integrated device
JP3661695B2 (ja) * 2003-07-11 2005-06-15 株式会社デンソー 半導体装置
FR2867854B1 (fr) * 2004-03-17 2007-03-30 Denso Corp Detecteur de pression compact, tres precis et resistant fortement a la corrosion

Also Published As

Publication number Publication date
EP1947439A4 (de) 2009-07-01
US8304847B2 (en) 2012-11-06
EP1947439A1 (de) 2008-07-23
EP1947439B1 (de) 2012-02-08
JPWO2007052335A1 (ja) 2009-04-30
US20090218643A1 (en) 2009-09-03
WO2007052335A1 (ja) 2007-05-10

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