ATE528972T1 - Leiterplatte und herstellungsverfahren dafür - Google Patents

Leiterplatte und herstellungsverfahren dafür

Info

Publication number
ATE528972T1
ATE528972T1 AT09250025T AT09250025T ATE528972T1 AT E528972 T1 ATE528972 T1 AT E528972T1 AT 09250025 T AT09250025 T AT 09250025T AT 09250025 T AT09250025 T AT 09250025T AT E528972 T1 ATE528972 T1 AT E528972T1
Authority
AT
Austria
Prior art keywords
mounting region
conductive trace
insulating layer
circuit board
metal layer
Prior art date
Application number
AT09250025T
Other languages
English (en)
Inventor
Yasuto Ishimaru
Hirofumi Ebe
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Application granted granted Critical
Publication of ATE528972T1 publication Critical patent/ATE528972T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/121—Arrangements for protection of devices protecting against mechanical damage
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H10W70/687—Shapes or dispositions thereof comprising multiple insulating layers characterized by the outer layers being for protection, e.g. solder masks, or for protection against chemical or mechanical damage
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09318—Core having one signal plane and one power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0969—Apertured conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Wire Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
AT09250025T 2008-01-31 2009-01-07 Leiterplatte und herstellungsverfahren dafür ATE528972T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008021273A JP2009182228A (ja) 2008-01-31 2008-01-31 配線回路基板およびその製造方法

Publications (1)

Publication Number Publication Date
ATE528972T1 true ATE528972T1 (de) 2011-10-15

Family

ID=40637836

Family Applications (1)

Application Number Title Priority Date Filing Date
AT09250025T ATE528972T1 (de) 2008-01-31 2009-01-07 Leiterplatte und herstellungsverfahren dafür

Country Status (7)

Country Link
US (1) US8581110B2 (de)
EP (1) EP2086295B1 (de)
JP (1) JP2009182228A (de)
KR (1) KR101536360B1 (de)
CN (1) CN101499454B (de)
AT (1) ATE528972T1 (de)
TW (1) TW200942092A (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5095460B2 (ja) * 2008-01-17 2012-12-12 シャープ株式会社 半導体装置および表示装置
JP5466966B2 (ja) * 2010-02-16 2014-04-09 新藤電子工業株式会社 配線板、半導体装置、半導体モジュール及びディスプレイ装置
DE102010050343A1 (de) * 2010-11-05 2012-05-10 Heraeus Materials Technology Gmbh & Co. Kg Chipintegrierte Durchkontaktierung von Mehrlagensubstraten
KR101444883B1 (ko) 2014-01-27 2014-09-26 주식회사 기가코리아 숫자 ｕｒｌ 서비스 제공 방법
KR102616482B1 (ko) 2018-07-26 2023-12-26 삼성전자주식회사 전원 배선에서 발생된 전자기파를 상쇄하기 위한 접지 배선을 포함하는 인쇄 회로 기판 및 이를 포함하는 전자 장치
CN113518515B (zh) * 2021-03-15 2023-09-08 江西宇睿电子科技有限公司 断节金属化边制作方法和电路板

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2844085B2 (ja) * 1989-07-20 1999-01-06 セイコーインスツルメンツ株式会社 回路基板及び半導体素子の実装方法
JP2875076B2 (ja) * 1990-11-29 1999-03-24 三井化学株式会社 フレキシブル配線基板
JP2808952B2 (ja) 1991-11-27 1998-10-08 日立電線株式会社 半導体素子搭載用基板
FR2796801B1 (fr) * 1999-07-23 2001-10-05 Valeo Electronique Assemblage du type comportant une carte a circuit imprime et une semelle formant drain thermique disposes sur une embase formant radiateur
JP2001119107A (ja) 1999-10-19 2001-04-27 Nec Saitama Ltd プリント配線板
JP3866058B2 (ja) * 2001-07-05 2007-01-10 シャープ株式会社 半導体装置、配線基板及びテープキャリア
US7265983B2 (en) * 2003-10-13 2007-09-04 Tyco Electronics Raychem Gmbh Power unit comprising a heat sink, and assembly method
KR20060126070A (ko) * 2005-06-03 2006-12-07 삼성전자주식회사 구동 집적 회로칩 패키지 및 이를 구비한 표시 장치
KR100652519B1 (ko) * 2005-07-18 2006-12-01 삼성전자주식회사 듀얼 금속층을 갖는 테이프 배선기판 및 그를 이용한 칩 온필름 패키지
JP4779826B2 (ja) * 2006-06-29 2011-09-28 パナソニック株式会社 フレキシブルプリント基板

Also Published As

Publication number Publication date
TW200942092A (en) 2009-10-01
EP2086295A3 (de) 2010-05-12
CN101499454B (zh) 2012-11-07
KR20090084710A (ko) 2009-08-05
US20090194321A1 (en) 2009-08-06
CN101499454A (zh) 2009-08-05
JP2009182228A (ja) 2009-08-13
EP2086295B1 (de) 2011-10-12
US8581110B2 (en) 2013-11-12
KR101536360B1 (ko) 2015-07-13
EP2086295A2 (de) 2009-08-05

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