ATE526683T1 - Chipmasstabskennzeichner und verfahren zur kennzeichnung - Google Patents

Chipmasstabskennzeichner und verfahren zur kennzeichnung

Info

Publication number
ATE526683T1
ATE526683T1 AT03250518T AT03250518T ATE526683T1 AT E526683 T1 ATE526683 T1 AT E526683T1 AT 03250518 T AT03250518 T AT 03250518T AT 03250518 T AT03250518 T AT 03250518T AT E526683 T1 ATE526683 T1 AT E526683T1
Authority
AT
Austria
Prior art keywords
marking
theta lens
wafer
chip
chip scale
Prior art date
Application number
AT03250518T
Other languages
English (en)
Inventor
You-Hie Han
Original Assignee
Eo Technics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eo Technics Co Ltd filed Critical Eo Technics Co Ltd
Application granted granted Critical
Publication of ATE526683T1 publication Critical patent/ATE526683T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67282—Marking devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Laser Beam Processing (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Adornments (AREA)
AT03250518T 2002-04-15 2003-01-28 Chipmasstabskennzeichner und verfahren zur kennzeichnung ATE526683T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR10-2002-0020412A KR100461024B1 (ko) 2002-04-15 2002-04-15 칩 스케일 마커 및 마킹 방법

Publications (1)

Publication Number Publication Date
ATE526683T1 true ATE526683T1 (de) 2011-10-15

Family

ID=28673097

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03250518T ATE526683T1 (de) 2002-04-15 2003-01-28 Chipmasstabskennzeichner und verfahren zur kennzeichnung

Country Status (8)

Country Link
US (1) US6710286B2 (de)
EP (1) EP1355350B1 (de)
JP (1) JP4113786B2 (de)
KR (1) KR100461024B1 (de)
AT (1) ATE526683T1 (de)
MY (1) MY122961A (de)
SG (1) SG106120A1 (de)
TW (1) TWI228816B (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030024913A1 (en) * 2002-04-15 2003-02-06 Downes Joseph P. Laser scanning method and system for marking articles such as printed circuit boards, integrated circuits and the like
US7119351B2 (en) * 2002-05-17 2006-10-10 Gsi Group Corporation Method and system for machine vision-based feature detection and mark verification in a workpiece or wafer marking system
KR100584840B1 (ko) * 2002-12-24 2006-05-30 주식회사 이오테크닉스 칩 스케일 마커 및 마킹위치 보정방법
JP4684687B2 (ja) * 2005-03-11 2011-05-18 株式会社ディスコ ウエーハのレーザー加工方法および加工装置
CN100397564C (zh) * 2005-08-26 2008-06-25 南茂科技股份有限公司 晶圆的激光标示方法
JP5132911B2 (ja) 2006-10-03 2013-01-30 浜松ホトニクス株式会社 レーザ加工方法
KR100828074B1 (ko) * 2006-11-22 2008-05-08 주식회사 이오테크닉스 칩 스케일 마킹 장치 및 이를 이용하는 칩 스케일 마킹방법
US7760331B2 (en) * 2007-02-20 2010-07-20 Electro Scientific Industries, Inc. Decoupled, multiple stage positioning system
US7829384B2 (en) * 2007-09-25 2010-11-09 Stats Chippac, Ltd. Semiconductor device and method of laser-marking wafers with tape applied to its active surface
US8916416B2 (en) * 2007-09-25 2014-12-23 Stats Chippac, Ltd. Semiconductor device and method of laser-marking laminate layer formed over eWLB with tape applied to opposite surface
SG152090A1 (en) * 2007-10-23 2009-05-29 Hypertronics Pte Ltd Scan head calibration system and method
CN102639280A (zh) * 2009-12-07 2012-08-15 Jp赛席尔联合股份有限公司 激光加工及切割系统与方法
US20130256286A1 (en) * 2009-12-07 2013-10-03 Ipg Microsystems Llc Laser processing using an astigmatic elongated beam spot and using ultrashort pulses and/or longer wavelengths
US9245786B2 (en) * 2011-06-02 2016-01-26 Applied Materials, Inc. Apparatus and methods for positioning a substrate using capacitive sensors
US10112258B2 (en) * 2012-03-30 2018-10-30 View, Inc. Coaxial distance measurement via folding of triangulation sensor optics path
KR20170051001A (ko) * 2015-11-02 2017-05-11 주식회사 이오테크닉스 레이저 마킹장치 및 이를 이용하는 레이저 마킹방법
KR101812209B1 (ko) * 2016-02-16 2017-12-26 주식회사 이오테크닉스 레이저 마킹 장치 및 레이저 마킹 방법
CN113035734B (zh) * 2021-02-25 2024-03-08 北京华卓精科科技股份有限公司 一种硅片偏移量确定方法及硅片交接精度检测方法
CN113959303B (zh) * 2021-10-15 2024-02-02 晋西工业集团有限责任公司 一种旋压筒形件两端螺纹连接台间距的测量方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55157231A (en) * 1979-05-25 1980-12-06 Chiyou Lsi Gijutsu Kenkyu Kumiai Method of forming pattern by electron beam
JPS6012550A (ja) * 1983-07-04 1985-01-22 Nippon Kogaku Kk <Nikon> 露光転写装置用マスク供給装置
JP2770960B2 (ja) * 1988-10-06 1998-07-02 キヤノン株式会社 Ｓｏｒ−ｘ線露光装置
JPH04186646A (ja) * 1990-11-19 1992-07-03 Oki Electric Ind Co Ltd 半導体素子のマーキング方法及びその半導体素子の固定方法
JP2682475B2 (ja) * 1994-11-17 1997-11-26 日本電気株式会社 ビームスキャン式レーザマーキング方法および装置
JPH0950951A (ja) * 1995-08-04 1997-02-18 Nikon Corp リソグラフィ方法およびリソグラフィ装置
AU9095798A (en) 1997-09-19 1999-04-12 Nikon Corporation Stage device, a scanning aligner and a scanning exposure method, and a device manufactured thereby
JP2000114129A (ja) * 1998-10-09 2000-04-21 Toshiba Corp 半導体装置及びその製造方法
KR100274206B1 (ko) * 1998-10-21 2000-12-15 한효용 칩사이즈패키지의 마킹방법 및 장치
KR20010073299A (ko) * 2000-01-13 2001-08-01 성규동 웨이퍼 마킹 장치
KR100319898B1 (ko) * 2000-03-20 2002-01-10 윤종용 웨이퍼의 치수인자 측정방법 및 그 장치

Also Published As

Publication number Publication date
US20030192866A1 (en) 2003-10-16
TWI228816B (en) 2005-03-01
US6710286B2 (en) 2004-03-23
KR20030081946A (ko) 2003-10-22
JP4113786B2 (ja) 2008-07-09
JP2003318074A (ja) 2003-11-07
MY122961A (en) 2006-05-31
SG106120A1 (en) 2004-09-30
TW200305269A (en) 2003-10-16
EP1355350A3 (de) 2005-04-20
EP1355350A2 (de) 2003-10-22
KR100461024B1 (ko) 2004-12-13
EP1355350B1 (de) 2011-09-28

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Legal Events

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