ATE519169T1 - Ausdruckbarkeitsverifikation durch schrittweise modellierungsgenauigkeit - Google Patents
Ausdruckbarkeitsverifikation durch schrittweise modellierungsgenauigkeitInfo
- Publication number
- ATE519169T1 ATE519169T1 AT07844831T AT07844831T ATE519169T1 AT E519169 T1 ATE519169 T1 AT E519169T1 AT 07844831 T AT07844831 T AT 07844831T AT 07844831 T AT07844831 T AT 07844831T AT E519169 T1 ATE519169 T1 AT E519169T1
- Authority
- AT
- Austria
- Prior art keywords
- errors
- models
- optical
- progressively
- identified
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/36—Masks having proximity correction features; Preparation thereof, e.g. optical proximity correction [OPC] design processes
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
- G03F7/70433—Layout for increasing efficiency or for compensating imaging errors, e.g. layout of exposure fields for reducing focus errors; Use of mask features for increasing efficiency or for compensating imaging errors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/705—Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Toxicology (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/555,854 US7512927B2 (en) | 2006-11-02 | 2006-11-02 | Printability verification by progressive modeling accuracy |
PCT/US2007/083441 WO2008057996A2 (en) | 2006-11-02 | 2007-11-02 | Printability verification by progressive modeling accuracy |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE519169T1 true ATE519169T1 (de) | 2011-08-15 |
Family
ID=39365257
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT07844831T ATE519169T1 (de) | 2006-11-02 | 2007-11-02 | Ausdruckbarkeitsverifikation durch schrittweise modellierungsgenauigkeit |
Country Status (5)
Country | Link |
---|---|
US (1) | US7512927B2 (de) |
EP (1) | EP2095280B1 (de) |
KR (1) | KR20090085651A (de) |
AT (1) | ATE519169T1 (de) |
WO (1) | WO2008057996A2 (de) |
Families Citing this family (58)
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US7124394B1 (en) * | 2003-04-06 | 2006-10-17 | Luminescent Technologies, Inc. | Method for time-evolving rectilinear contours representing photo masks |
US7698665B2 (en) * | 2003-04-06 | 2010-04-13 | Luminescent Technologies, Inc. | Systems, masks, and methods for manufacturable masks using a functional representation of polygon pattern |
US7448012B1 (en) | 2004-04-21 | 2008-11-04 | Qi-De Qian | Methods and system for improving integrated circuit layout |
US7921385B2 (en) * | 2005-10-03 | 2011-04-05 | Luminescent Technologies Inc. | Mask-pattern determination using topology types |
US7788627B2 (en) * | 2005-10-03 | 2010-08-31 | Luminescent Technologies, Inc. | Lithography verification using guard bands |
US7793253B2 (en) * | 2005-10-04 | 2010-09-07 | Luminescent Technologies, Inc. | Mask-patterns including intentional breaks |
US7703049B2 (en) | 2005-10-06 | 2010-04-20 | Luminescent Technologies, Inc. | System, masks, and methods for photomasks optimized with approximate and accurate merit functions |
US7962868B2 (en) * | 2005-10-28 | 2011-06-14 | Freescale Semiconductor, Inc. | Method for forming a semiconductor device using optical proximity correction for the optical lithography |
US20070253637A1 (en) * | 2006-03-08 | 2007-11-01 | Mentor Graphics Corp. | Image intensity calculation using a sectored source map |
US7836423B2 (en) * | 2006-03-08 | 2010-11-16 | Mentor Graphics Corporation | Sum of coherent systems (SOCS) approximation based on object information |
US8370773B2 (en) * | 2006-08-16 | 2013-02-05 | Freescale Semiconductor, Inc. | Method and apparatus for designing an integrated circuit using inverse lithography technology |
JP5032948B2 (ja) * | 2006-11-14 | 2012-09-26 | エーエスエムエル マスクツールズ ビー.ブイ. | Dptプロセスで用いられるパターン分解を行うための方法、プログラムおよび装置 |
WO2008112605A2 (en) * | 2007-03-09 | 2008-09-18 | Mentor Graphics Corporation | Incremental layout analysis |
US7788630B2 (en) * | 2007-03-21 | 2010-08-31 | Synopsys, Inc. | Method and apparatus for determining an optical model that models the effect of optical proximity correction |
WO2008135810A2 (en) * | 2007-05-03 | 2008-11-13 | Freescale Semiconductor, Inc. | Method and apparatus for designing an integrated circuit |
KR100881194B1 (ko) * | 2007-05-16 | 2009-02-05 | 삼성전자주식회사 | 공간 영상 검사 장비를 이용한 마스크 측정 방법 |
US7631289B1 (en) * | 2007-06-28 | 2009-12-08 | Cadence Design Systems, Inc. | Method and system for implementing optimized lithography models for accuracy and resolution |
NL1036189A1 (nl) * | 2007-12-05 | 2009-06-08 | Brion Tech Inc | Methods and System for Lithography Process Window Simulation. |
US7966586B2 (en) * | 2007-12-07 | 2011-06-21 | Cadence Design Systems, Inc. | Intelligent pattern signature based on lithography effects |
US7904853B1 (en) | 2007-12-27 | 2011-03-08 | Cadence Design Systems, Inc. | Pattern signature |
US8358828B2 (en) * | 2007-12-28 | 2013-01-22 | Cadence Design Systems, Inc. | Interpolation of irregular data in a finite-dimensional metric space in lithographic simulation |
US8381152B2 (en) | 2008-06-05 | 2013-02-19 | Cadence Design Systems, Inc. | Method and system for model-based design and layout of an integrated circuit |
JP2009302206A (ja) * | 2008-06-11 | 2009-12-24 | Canon Inc | 露光パラメータの決定方法、露光パラメータを決定するためのプログラム、露光方法及びデバイス製造方法 |
US8103983B2 (en) * | 2008-11-12 | 2012-01-24 | International Business Machines Corporation | Electrically-driven optical proximity correction to compensate for non-optical effects |
NL2003699A (en) * | 2008-12-18 | 2010-06-21 | Brion Tech Inc | Method and system for lithography process-window-maximixing optical proximity correction. |
JP2010156866A (ja) * | 2008-12-27 | 2010-07-15 | Toshiba Corp | 特徴量抽出方法、テストパターン選択方法、レジストモデル作成方法および設計回路パターン検証方法 |
JP2010177374A (ja) * | 2009-01-28 | 2010-08-12 | Toshiba Corp | パターン検証方法および半導体装置の製造方法 |
US8166423B2 (en) * | 2009-09-08 | 2012-04-24 | International Business Machines Corporation | Photomask design verification |
JP4918598B2 (ja) * | 2010-01-18 | 2012-04-18 | 株式会社ニューフレアテクノロジー | 検査装置および検査方法 |
US8797721B2 (en) | 2010-02-02 | 2014-08-05 | Apple Inc. | Portable electronic device housing with outer glass surfaces |
KR20110094467A (ko) * | 2010-02-16 | 2011-08-24 | 삼성전자주식회사 | 리타겟 프로세스 모델링 방법, 및 그 프로세스 모델링 방법을 이용한 마스크 제조방법 |
NL2006091A (en) * | 2010-03-05 | 2011-09-06 | Asml Netherlands Bv | Design rule optimization in lithographic imaging based on correlation of functions representing mask and predefined optical conditions. |
US8321822B2 (en) * | 2010-05-27 | 2012-11-27 | United Microelectronics Corp. | Method and computer-readable medium of optical proximity correction |
US8402397B2 (en) * | 2011-07-26 | 2013-03-19 | Mentor Graphics Corporation | Hotspot detection based on machine learning |
JP5730721B2 (ja) * | 2011-09-08 | 2015-06-10 | 株式会社日立ハイテクノロジーズ | パターン計測装置、およびパターン計測方法 |
US8832621B1 (en) | 2011-11-28 | 2014-09-09 | Cadence Design Systems, Inc. | Topology design using squish patterns |
US8881071B2 (en) * | 2011-12-29 | 2014-11-04 | Intel Corporation | Photolithography mask design simplification |
US8745550B2 (en) * | 2012-07-09 | 2014-06-03 | Taiwan Semiconductor Manufacturing Company, Ltd. | Fracture aware OPC |
US8972908B2 (en) * | 2013-07-30 | 2015-03-03 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method for electron beam proximity correction with improved critical dimension accuracy |
US8997027B2 (en) * | 2013-07-31 | 2015-03-31 | GlobalFoundries, Inc. | Methods for modifying an integrated circuit layout design |
US9529255B2 (en) * | 2013-12-04 | 2016-12-27 | Taiwan Semiconductor Manufacturing Co., Ltd. | Image process method to improve mask inspection performance |
US20150287176A1 (en) * | 2014-04-02 | 2015-10-08 | Globalfoundries Inc. | Method and appratus for hybrid test pattern generation for opc model calibration |
US9547892B2 (en) * | 2014-05-06 | 2017-01-17 | Kla-Tencor Corporation | Apparatus and methods for predicting wafer-level defect printability |
KR102343850B1 (ko) * | 2015-05-06 | 2021-12-28 | 삼성전자주식회사 | 광 근접 보정에서 공통의 바이어스 값을 이용하여 마스크를 제작하는 방법 |
US10395361B2 (en) | 2015-08-10 | 2019-08-27 | Kla-Tencor Corporation | Apparatus and methods for inspecting reticles |
KR20180030228A (ko) | 2015-08-10 | 2018-03-21 | 케이엘에이-텐코 코포레이션 | 웨이퍼-레벨 결함 인쇄성을 예측하기 위한 장치 및 방법들 |
KR102387459B1 (ko) | 2015-11-20 | 2022-04-15 | 삼성전자주식회사 | 반도체 소자의 패턴 형성 방법 |
US10394984B2 (en) | 2015-11-25 | 2019-08-27 | International Business Machines Corporation | Tool to provide integrated circuit masks with accurate dimensional compensation of patterns |
US9885951B2 (en) | 2015-12-11 | 2018-02-06 | International Business Machines Corporation | Structure design generation for fixing metal tip-to-tip across cell boundary |
US10025177B2 (en) * | 2016-03-16 | 2018-07-17 | Samsung Electronics Co., Ltd. | Efficient way to creating process window enhanced photomask layout |
US11681849B2 (en) * | 2016-10-24 | 2023-06-20 | Asml Netherlands B.V. | Method for optimizing a patterning device pattern |
US10394985B2 (en) * | 2017-01-11 | 2019-08-27 | Samsung Electronics Co., Ltd. | Apparatus and method for modeling random process using reduced length least-squares autoregressive parameter estimation |
US11074376B2 (en) * | 2017-04-26 | 2021-07-27 | United Microelectronics Corp. | Method for analyzing process output and method for creating equipment parameter model |
US10678142B2 (en) * | 2017-11-14 | 2020-06-09 | Taiwan Semiconductor Manufacturing Co., Ltd. | Optical proximity correction and photomasks |
DE102018125109B4 (de) | 2017-11-14 | 2022-10-13 | Taiwan Semiconductor Manufacturing Co., Ltd. | Optische Nahbereichskorrektur |
EP3731018A1 (de) * | 2019-04-23 | 2020-10-28 | ASML Netherlands B.V. | Verfahren zur erneuten bildgebung eines bildes und zugehörige metrologievorrichtung |
US11574103B2 (en) * | 2020-01-31 | 2023-02-07 | International Business Machines Corporation | Addressing layout retargeting shortfalls |
CN112987488B (zh) * | 2021-02-22 | 2024-03-12 | 上海华力集成电路制造有限公司 | Opc修正方法 |
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JP4748343B2 (ja) * | 2001-04-26 | 2011-08-17 | 大日本印刷株式会社 | ウエーハ転写検証方法 |
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US6574784B1 (en) * | 2001-06-14 | 2003-06-03 | George P. Lippincott | Short edge management in rule based OPC |
JP3615182B2 (ja) * | 2001-11-26 | 2005-01-26 | 株式会社東芝 | 光近接効果補正方法及び光近接効果補正システム |
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US6807663B2 (en) * | 2002-09-23 | 2004-10-19 | Numerical Technologies, Inc. | Accelerated layout processing using OPC pre-processing |
US6934929B2 (en) * | 2003-01-13 | 2005-08-23 | Lsi Logic Corporation | Method for improving OPC modeling |
US7245356B2 (en) * | 2003-02-11 | 2007-07-17 | Asml Netherlands B.V. | Lithographic apparatus and method for optimizing illumination using a photolithographic simulation |
US7043712B2 (en) * | 2003-09-09 | 2006-05-09 | International Business Machines Corporation | Method for adaptive segment refinement in optical proximity correction |
US7127699B2 (en) * | 2003-12-16 | 2006-10-24 | International Business Machines Corporation | Method for optimizing a number of kernels used in a sum of coherent sources for optical proximity correction in an optical microlithography process |
US7536660B2 (en) * | 2004-02-24 | 2009-05-19 | Konstantinos Adam | OPC simulation model using SOCS decomposition of edge fragments |
KR100841729B1 (ko) * | 2004-09-14 | 2008-06-27 | 에이에스엠엘 마스크툴즈 비.브이. | 풀-칩 제조 신뢰성 체크 및 보정 수행 방법 및 이를 수행하기 위한 컴퓨터 프로그램을 기록한 컴퓨터로 읽을 수 있는 기록매체 |
JP4768251B2 (ja) * | 2004-11-01 | 2011-09-07 | 株式会社東芝 | 半導体集積回路の設計方法、半導体集積回路の設計システム及び半導体集積回路の製造方法 |
US7350183B2 (en) * | 2004-11-05 | 2008-03-25 | International Business Machines Corporation | Method for improving optical proximity correction |
DE102005003001B4 (de) * | 2005-01-21 | 2009-10-08 | Qimonda Ag | Verfahren zur Korrektur des optischen Proximity-Effektes |
-
2006
- 2006-11-02 US US11/555,854 patent/US7512927B2/en not_active Expired - Fee Related
-
2007
- 2007-11-02 AT AT07844831T patent/ATE519169T1/de not_active IP Right Cessation
- 2007-11-02 EP EP07844831A patent/EP2095280B1/de not_active Not-in-force
- 2007-11-02 WO PCT/US2007/083441 patent/WO2008057996A2/en active Application Filing
- 2007-11-02 KR KR1020097011074A patent/KR20090085651A/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
US7512927B2 (en) | 2009-03-31 |
KR20090085651A (ko) | 2009-08-07 |
EP2095280B1 (de) | 2011-08-03 |
WO2008057996A2 (en) | 2008-05-15 |
EP2095280A2 (de) | 2009-09-02 |
WO2008057996A3 (en) | 2008-07-10 |
EP2095280A4 (de) | 2009-12-09 |
US20080127027A1 (en) | 2008-05-29 |
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