ATE488865T1 - Waferboot und verfahren zur herstellung eines rutschsicheren waferboots - Google Patents
Waferboot und verfahren zur herstellung eines rutschsicheren waferbootsInfo
- Publication number
- ATE488865T1 ATE488865T1 AT02741833T AT02741833T ATE488865T1 AT E488865 T1 ATE488865 T1 AT E488865T1 AT 02741833 T AT02741833 T AT 02741833T AT 02741833 T AT02741833 T AT 02741833T AT E488865 T1 ATE488865 T1 AT E488865T1
- Authority
- AT
- Austria
- Prior art keywords
- wafer
- wafer boat
- slip
- producing
- contact surface
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 235000012431 wafers Nutrition 0.000 abstract 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 3
- 229910052710 silicon Inorganic materials 0.000 abstract 3
- 239000010703 silicon Substances 0.000 abstract 3
- 238000005524 ceramic coating Methods 0.000 abstract 2
- 239000000919 ceramic Substances 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 239000012535 impurity Substances 0.000 abstract 1
- 230000005012 migration Effects 0.000 abstract 1
- 238000013508 migration Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/32—Carbides
- C23C16/325—Silicon carbide
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/12—Substrate holders or susceptors
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B31/00—Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor
- C30B31/06—Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor by contacting with diffusion material in the gaseous state
- C30B31/14—Substrate holders or susceptors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
- H01L21/67306—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by a material, a roughness, a coating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
- H01L21/67309—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by the substrate support
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Frangible Articles (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/884,720 US20020130061A1 (en) | 2000-11-02 | 2001-06-19 | Apparatus and method of making a slip free wafer boat |
PCT/US2002/017654 WO2002103759A1 (en) | 2001-06-19 | 2002-06-05 | Apparatus and method of making a slip free wafer boat |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE488865T1 true ATE488865T1 (de) | 2010-12-15 |
Family
ID=25385235
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT02741833T ATE488865T1 (de) | 2001-06-19 | 2002-06-05 | Waferboot und verfahren zur herstellung eines rutschsicheren waferboots |
Country Status (8)
Country | Link |
---|---|
US (1) | US20020130061A1 (de) |
EP (1) | EP1405333B1 (de) |
JP (1) | JP2004531891A (de) |
KR (1) | KR100578709B1 (de) |
CN (1) | CN100350551C (de) |
AT (1) | ATE488865T1 (de) |
DE (1) | DE60238324D1 (de) |
WO (1) | WO2002103759A1 (de) |
Families Citing this family (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6811040B2 (en) * | 2001-07-16 | 2004-11-02 | Rohm And Haas Company | Wafer holding apparatus |
US20030233977A1 (en) * | 2002-06-20 | 2003-12-25 | Yeshwanth Narendar | Method for forming semiconductor processing components |
DE60335392D1 (de) * | 2002-09-11 | 2011-01-27 | Shinetsu Polymer Co | Substratlagerungsbehälter |
US6825123B2 (en) * | 2003-04-15 | 2004-11-30 | Saint-Goban Ceramics & Plastics, Inc. | Method for treating semiconductor processing components and components formed thereby |
US7501370B2 (en) | 2004-01-06 | 2009-03-10 | Saint-Gobain Ceramics & Plastics, Inc. | High purity silicon carbide wafer boats |
US20050145584A1 (en) * | 2004-01-06 | 2005-07-07 | Buckley Richard F. | Wafer boat with interference fit wafer supports |
US20050205502A1 (en) * | 2004-03-18 | 2005-09-22 | Brown Steven A | Rails for semiconductor wafer carriers |
JP2005340480A (ja) * | 2004-05-26 | 2005-12-08 | Nippon Oil Corp | 基板カセット用サポートバー |
TWI248909B (en) * | 2004-10-12 | 2006-02-11 | Au Optronics Corp | A cassette for placing multiple-sized substrate |
CA2600104C (en) * | 2005-03-09 | 2012-01-24 | Ihi Corporation | Jig |
WO2007008555A2 (en) * | 2005-07-08 | 2007-01-18 | Asyst Technologies, Inc. | Workpiece support structures and apparatus for accessing same |
US7828158B2 (en) * | 2005-07-14 | 2010-11-09 | Displays Plus, Inc. | Merchandise dispensing apparatus providing theft deterrence |
KR101165466B1 (ko) * | 2005-08-31 | 2012-07-13 | 엘지디스플레이 주식회사 | 캐리어 및 이를 구비한 공정 장치 |
US7547897B2 (en) * | 2006-05-26 | 2009-06-16 | Cree, Inc. | High-temperature ion implantation apparatus and methods of fabricating semiconductor devices using high-temperature ion implantation |
JP2007329476A (ja) * | 2006-06-02 | 2007-12-20 | Rohm & Haas Electronic Materials Llc | フィレット半径結合部を有する装置 |
EP2036121A2 (de) * | 2006-06-30 | 2009-03-18 | MEMC Electronic Materials, Inc. | Wafer-plattform |
WO2009085703A2 (en) * | 2007-12-20 | 2009-07-09 | Saint-Gobain Ceramics & Plastics, Inc. | Method for treating semiconductor processing components and components formed thereby |
KR101039151B1 (ko) | 2008-12-23 | 2011-06-07 | 주식회사 테라세미콘 | 보트 |
US9153466B2 (en) * | 2012-04-26 | 2015-10-06 | Asm Ip Holding B.V. | Wafer boat |
USD734730S1 (en) * | 2012-12-27 | 2015-07-21 | Hitachi Kokusai Electric Inc. | Boat of substrate processing apparatus |
TWD166332S (zh) * | 2013-03-22 | 2015-03-01 | 日立國際電氣股份有限公司 | 基板處理裝置用晶舟之部分 |
TWD163542S (zh) * | 2013-03-22 | 2014-10-11 | 日立國際電氣股份有限公司 | 基板處理裝置用晶舟 |
JP1537313S (de) * | 2014-11-20 | 2015-11-09 | ||
JP1537312S (de) * | 2014-11-20 | 2015-11-09 | ||
JP1537630S (de) * | 2014-11-20 | 2015-11-09 | ||
JP6322159B2 (ja) * | 2015-06-10 | 2018-05-09 | クアーズテック株式会社 | ウエハボート及びその製造方法 |
JP1563649S (de) * | 2016-02-12 | 2016-11-21 | ||
CN110071064A (zh) * | 2018-01-22 | 2019-07-30 | 上海新昇半导体科技有限公司 | 一种改善外延片污染印记的方法 |
JP7030604B2 (ja) * | 2018-04-19 | 2022-03-07 | 三菱電機株式会社 | ウエハボートおよびその製造方法 |
USD846514S1 (en) * | 2018-05-03 | 2019-04-23 | Kokusai Electric Corporation | Boat of substrate processing apparatus |
USD847105S1 (en) * | 2018-05-03 | 2019-04-30 | Kokusai Electric Corporation | Boat of substrate processing apparatus |
USD908103S1 (en) * | 2019-02-20 | 2021-01-19 | Veeco Instruments Inc. | Transportable semiconductor wafer rack |
USD908102S1 (en) * | 2019-02-20 | 2021-01-19 | Veeco Instruments Inc. | Transportable semiconductor wafer rack |
CN110211914A (zh) * | 2019-07-11 | 2019-09-06 | 中威新能源(成都)有限公司 | 一种半导体制品的承载方法、传输方法、制造方法及其用途 |
TWI751806B (zh) * | 2020-11-25 | 2022-01-01 | 松勁科技股份有限公司 | 立式爐管及用於其之立式晶舟 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3951587A (en) * | 1974-12-06 | 1976-04-20 | Norton Company | Silicon carbide diffusion furnace components |
JPH0774839B2 (ja) * | 1991-09-30 | 1995-08-09 | 東芝セラミックス株式会社 | Sor用ミラー |
DE4429825C1 (de) * | 1994-08-23 | 1995-11-09 | Heraeus Quarzglas | Beschichtetes Bauteil aus Quarzglas |
WO1996035228A1 (en) * | 1995-05-05 | 1996-11-07 | Saint-Gobain Industrial Ceramics, Inc. | Slip free vertical rack design |
US5904892A (en) * | 1996-04-01 | 1999-05-18 | Saint-Gobain/Norton Industrial Ceramics Corp. | Tape cast silicon carbide dummy wafer |
JPH09306980A (ja) * | 1996-05-17 | 1997-11-28 | Asahi Glass Co Ltd | 縦型ウエハボート |
US5904778A (en) * | 1996-07-26 | 1999-05-18 | Applied Materials, Inc. | Silicon carbide composite article particularly useful for plasma reactors |
JP3686193B2 (ja) * | 1996-11-20 | 2005-08-24 | 株式会社ブリヂストン | 帯状部材のセンタリング方法及び装置 |
KR100284567B1 (ko) * | 1997-04-15 | 2001-04-02 | 후지이 아키히로 | 수직 웨이퍼 보트 |
JP3494554B2 (ja) * | 1997-06-26 | 2004-02-09 | 東芝セラミックス株式会社 | 半導体用治具およびその製造方法 |
US5931666A (en) * | 1998-02-27 | 1999-08-03 | Saint-Gobain Industrial Ceramics, Inc. | Slip free vertical rack design having rounded horizontal arms |
JP2000119079A (ja) * | 1998-08-11 | 2000-04-25 | Toshiba Ceramics Co Ltd | 半導体熱処理用Si−SiC製部材およびその製造方法 |
US6171400B1 (en) * | 1998-10-02 | 2001-01-09 | Union Oil Company Of California | Vertical semiconductor wafer carrier |
JP2001048667A (ja) * | 1999-08-13 | 2001-02-20 | Asahi Glass Co Ltd | セラミックス部品の接合方法 |
-
2001
- 2001-06-19 US US09/884,720 patent/US20020130061A1/en not_active Abandoned
-
2002
- 2002-06-05 EP EP02741833A patent/EP1405333B1/de not_active Expired - Lifetime
- 2002-06-05 JP JP2003505980A patent/JP2004531891A/ja active Pending
- 2002-06-05 KR KR1020037016503A patent/KR100578709B1/ko not_active IP Right Cessation
- 2002-06-05 AT AT02741833T patent/ATE488865T1/de not_active IP Right Cessation
- 2002-06-05 WO PCT/US2002/017654 patent/WO2002103759A1/en active Application Filing
- 2002-06-05 CN CNB028122801A patent/CN100350551C/zh not_active Expired - Lifetime
- 2002-06-05 DE DE60238324T patent/DE60238324D1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
KR100578709B1 (ko) | 2006-05-12 |
CN1518756A (zh) | 2004-08-04 |
KR20040010727A (ko) | 2004-01-31 |
WO2002103759A1 (en) | 2002-12-27 |
DE60238324D1 (de) | 2010-12-30 |
EP1405333A4 (de) | 2009-05-20 |
JP2004531891A (ja) | 2004-10-14 |
CN100350551C (zh) | 2007-11-21 |
EP1405333B1 (de) | 2010-11-17 |
EP1405333A1 (de) | 2004-04-07 |
US20020130061A1 (en) | 2002-09-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |