ATE474674T1 - Ultraschallreinigungsmodul und verfahren - Google Patents

Ultraschallreinigungsmodul und verfahren

Info

Publication number
ATE474674T1
ATE474674T1 AT03252694T AT03252694T ATE474674T1 AT E474674 T1 ATE474674 T1 AT E474674T1 AT 03252694 T AT03252694 T AT 03252694T AT 03252694 T AT03252694 T AT 03252694T AT E474674 T1 ATE474674 T1 AT E474674T1
Authority
AT
Austria
Prior art keywords
chuck
packages
nozzle
electronic packages
ultrasonic cleaning
Prior art date
Application number
AT03252694T
Other languages
English (en)
Inventor
Yiu Ming Cheung
Chak Tong Sze
Original Assignee
Asm Assembly Automation Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asm Assembly Automation Ltd filed Critical Asm Assembly Automation Ltd
Application granted granted Critical
Publication of ATE474674T1 publication Critical patent/ATE474674T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B08B3/024—Cleaning by means of spray elements moving over the surface to be cleaned
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
    • B08B2203/02—Details of machines or methods for cleaning by the force of jets or sprays
    • B08B2203/0288—Ultra or megasonic jets
AT03252694T 2002-04-30 2003-04-29 Ultraschallreinigungsmodul und verfahren ATE474674T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US37701802P 2002-04-30 2002-04-30
US10/413,602 US6949146B2 (en) 2002-04-30 2003-04-14 Ultrasonic cleaning module for singulated electronic packages

Publications (1)

Publication Number Publication Date
ATE474674T1 true ATE474674T1 (de) 2010-08-15

Family

ID=29219037

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03252694T ATE474674T1 (de) 2002-04-30 2003-04-29 Ultraschallreinigungsmodul und verfahren

Country Status (7)

Country Link
US (1) US6949146B2 (de)
EP (1) EP1358950B1 (de)
JP (1) JP2004006855A (de)
KR (1) KR100588252B1 (de)
AT (1) ATE474674T1 (de)
DE (1) DE60333416D1 (de)
SG (1) SG128506A1 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006516479A (ja) * 2003-02-04 2006-07-06 フォワード テクノロジー ア クレスト グループ カンパニー 超音波洗浄タンク
US8978673B2 (en) * 2007-08-09 2015-03-17 Asm Assembly Automation Ltd Megasonic cleaning system
KR100873333B1 (ko) * 2007-11-21 2008-12-10 세메스 주식회사 처리 유체 공급 장치 및 이를 포함하는 기판 처리 장치
JP2013169474A (ja) * 2012-02-17 2013-09-02 Mitsubishi Electric Corp 異物除去方法、異物除去装置
JP6321912B2 (ja) * 2013-03-29 2018-05-09 芝浦メカトロニクス株式会社 基板の洗浄処理装置及び洗浄処理方法
CN103456605B (zh) * 2013-09-24 2016-02-10 深圳市凯尔迪光电科技有限公司 全自动半导体封装微尘清洗设备
CN106733906B (zh) * 2016-11-30 2024-04-09 武汉大学深圳研究院 一种用于清洗太阳能电池板污垢的超声波清洗装置
US20190363018A1 (en) * 2018-05-24 2019-11-28 Semiconductor Components Industries, Llc Die cleaning systems and related methods
JP2020134289A (ja) * 2019-02-19 2020-08-31 キオクシア株式会社 半導体装置の検査方法及び検査装置
CN111889446A (zh) * 2020-06-29 2020-11-06 中国电子科技集团公司第十三研究所 元器件水溶胶清洗机

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3369418B2 (ja) * 1996-11-25 2003-01-20 大日本スクリーン製造株式会社 超音波振動子、超音波洗浄ノズル、超音波洗浄装置、基板洗浄装置、基板洗浄処理システムおよび超音波洗浄ノズル製造方法
US5803797A (en) * 1996-11-26 1998-09-08 Micron Technology, Inc. Method and apparatus to hold intergrated circuit chips onto a chuck and to simultaneously remove multiple intergrated circuit chips from a cutting chuck
JPH1154471A (ja) * 1997-08-05 1999-02-26 Tokyo Electron Ltd 処理装置及び処理方法
JP2944598B2 (ja) * 1997-11-21 1999-09-06 株式会社プレテック 洗浄装置および精密基板を洗浄する方法
JP4388640B2 (ja) * 1999-09-10 2009-12-24 株式会社ディスコ Ｃｓｐ基板保持部材及び該ｃｓｐ基板保持部材が載置されるｃｓｐ基板用テーブル
US6730176B2 (en) * 2001-07-09 2004-05-04 Birol Kuyel Single wafer megasonic cleaner method, system, and apparatus
US6746022B2 (en) * 2001-12-26 2004-06-08 Asm Assembly Automation Ltd. Chuck for holding a workpiece

Also Published As

Publication number Publication date
US6949146B2 (en) 2005-09-27
US20030200987A1 (en) 2003-10-30
EP1358950A1 (de) 2003-11-05
JP2004006855A (ja) 2004-01-08
DE60333416D1 (de) 2010-09-02
EP1358950B1 (de) 2010-07-21
KR100588252B1 (ko) 2006-06-12
SG128506A1 (en) 2007-01-30
KR20030086240A (ko) 2003-11-07

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