ATE455371T1 - Strahlungshärtbare cycloaliphatische sperrdichtstoffe - Google Patents

Strahlungshärtbare cycloaliphatische sperrdichtstoffe

Info

Publication number
ATE455371T1
ATE455371T1 AT06749107T AT06749107T ATE455371T1 AT E455371 T1 ATE455371 T1 AT E455371T1 AT 06749107 T AT06749107 T AT 06749107T AT 06749107 T AT06749107 T AT 06749107T AT E455371 T1 ATE455371 T1 AT E455371T1
Authority
AT
Austria
Prior art keywords
radiation cured
cured cycloaliphatic
cycloaliphatic
barrier sealants
sealants
Prior art date
Application number
AT06749107T
Other languages
English (en)
Inventor
Donald Herr
Shengqian Kong
Original Assignee
Henkel Ag & Co Kgaa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel Ag & Co Kgaa filed Critical Henkel Ag & Co Kgaa
Application granted granted Critical
Publication of ATE455371T1 publication Critical patent/ATE455371T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
    • C08G75/02—Polythioethers
    • C08G75/04—Polythioethers from mercapto compounds or metallic derivatives thereof
    • C08G75/045—Polythioethers from mercapto compounds or metallic derivatives thereof from mercapto compounds and unsaturated compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
    • C08G75/12—Polythioether-ethers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
AT06749107T 2005-04-04 2006-04-03 Strahlungshärtbare cycloaliphatische sperrdichtstoffe ATE455371T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/098,115 US20060223937A1 (en) 2005-04-04 2005-04-04 Radiation curable cycloaliphatic barrier sealants
PCT/US2006/012181 WO2006107802A1 (en) 2005-04-04 2006-04-03 Radiation curable cycloaliphatic barrier sealants

Publications (1)

Publication Number Publication Date
ATE455371T1 true ATE455371T1 (de) 2010-01-15

Family

ID=36790973

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06749107T ATE455371T1 (de) 2005-04-04 2006-04-03 Strahlungshärtbare cycloaliphatische sperrdichtstoffe

Country Status (9)

Country Link
US (2) US20060223937A1 (de)
EP (1) EP1866960B1 (de)
JP (1) JP5575393B2 (de)
KR (1) KR101332702B1 (de)
CN (1) CN101151726B (de)
AT (1) ATE455371T1 (de)
DE (1) DE602006011724D1 (de)
TW (1) TWI406364B (de)
WO (1) WO2006107802A1 (de)

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CN106062075B (zh) * 2014-02-19 2019-11-01 汉高股份有限及两合公司 用于密封液晶的可固化树脂组合物
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KR20180048690A (ko) 2015-08-31 2018-05-10 카티바, 인크. 디- 및 모노(메트)아크릴레이트 기초 유기 박막 잉크 조성물
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CN111788265B (zh) 2017-04-21 2024-04-23 柯狄公司 用于形成有机薄膜的组合物和技术
CN109305896B (zh) * 2017-07-26 2022-07-19 郑州大学 一种低极性树脂及其制备方法和应用
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Also Published As

Publication number Publication date
KR101332702B1 (ko) 2013-11-25
CN101151726B (zh) 2010-06-23
KR20070118139A (ko) 2007-12-13
TWI406364B (zh) 2013-08-21
CN101151726A (zh) 2008-03-26
TW200703597A (en) 2007-01-16
EP1866960A1 (de) 2007-12-19
DE602006011724D1 (de) 2010-03-04
WO2006107802A1 (en) 2006-10-12
JP5575393B2 (ja) 2014-08-20
US20070117917A1 (en) 2007-05-24
US20060223937A1 (en) 2006-10-05
JP2008536968A (ja) 2008-09-11
EP1866960B1 (de) 2010-01-13

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