ATE440290T1 - System zum testen und einbrennen integrierter schaltungen - Google Patents

System zum testen und einbrennen integrierter schaltungen

Info

Publication number
ATE440290T1
ATE440290T1 AT05853389T AT05853389T ATE440290T1 AT E440290 T1 ATE440290 T1 AT E440290T1 AT 05853389 T AT05853389 T AT 05853389T AT 05853389 T AT05853389 T AT 05853389T AT E440290 T1 ATE440290 T1 AT E440290T1
Authority
AT
Austria
Prior art keywords
capacitor
distribution board
capacitors
board
contactor
Prior art date
Application number
AT05853389T
Other languages
English (en)
Inventor
Scott Lindsey
Carl Buck
Rhea Posedel
Original Assignee
Aehr Test Systems
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aehr Test Systems filed Critical Aehr Test Systems
Application granted granted Critical
Publication of ATE440290T1 publication Critical patent/ATE440290T1/de

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0491—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets for testing integrated circuits on wafers, e.g. wafer-level test cartridge
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2879—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to electrical aspects, e.g. to voltage or current supply or stimuli or to electrical loads

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Environmental & Geological Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Semiconductor Integrated Circuits (AREA)
AT05853389T 2004-12-15 2005-12-07 System zum testen und einbrennen integrierter schaltungen ATE440290T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/013,855 US7053644B1 (en) 2004-12-15 2004-12-15 System for testing and burning in of integrated circuits
PCT/US2005/044459 WO2006065621A1 (en) 2004-12-15 2005-12-07 A system for testing and burning in of integrated circuits

Publications (1)

Publication Number Publication Date
ATE440290T1 true ATE440290T1 (de) 2009-09-15

Family

ID=36036675

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05853389T ATE440290T1 (de) 2004-12-15 2005-12-07 System zum testen und einbrennen integrierter schaltungen

Country Status (9)

Country Link
US (1) US7053644B1 (de)
EP (1) EP1825281B1 (de)
JP (1) JP4997117B2 (de)
KR (1) KR101177596B1 (de)
CN (1) CN101084447B (de)
AT (1) ATE440290T1 (de)
DE (1) DE602005016146D1 (de)
TW (1) TWI290748B (de)
WO (1) WO2006065621A1 (de)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5085534B2 (ja) 2005-04-27 2012-11-28 エイアー テスト システムズ 電子デバイスを試験するための装置
CN100460870C (zh) * 2005-11-02 2009-02-11 中芯国际集成电路制造(上海)有限公司 利用熔丝测试栅极氧化物的方法与装置
US8717777B2 (en) 2005-11-17 2014-05-06 Avx Corporation Electrolytic capacitor with a thin film fuse
US7532457B2 (en) * 2007-01-15 2009-05-12 Avx Corporation Fused electrolytic capacitor assembly
CN103295949B (zh) 2007-04-05 2016-12-28 雅赫测试系统公司 测试微电子电路的方法、测试器设备及便携式组装
US7800382B2 (en) * 2007-12-19 2010-09-21 AEHR Test Ststems System for testing an integrated circuit of a device and its method of use
US7798867B2 (en) 2008-11-12 2010-09-21 Interconnect Devices, Inc. Environmentally sealed contact
US8030957B2 (en) 2009-03-25 2011-10-04 Aehr Test Systems System for testing an integrated circuit of a device and its method of use
US8506307B2 (en) 2010-12-02 2013-08-13 Interconnect Devices, Inc. Electrical connector with embedded shell layer
US9704809B2 (en) * 2013-03-05 2017-07-11 Maxim Integrated Products, Inc. Fan-out and heterogeneous packaging of electronic components
CN103723673B (zh) * 2013-12-30 2015-12-16 杭州士兰微电子股份有限公司 微机电系统及检测电路
KR101467383B1 (ko) * 2014-02-07 2014-12-02 윌테크놀러지(주) 커패시터가 구비된 반도체 검사 장치
KR102085731B1 (ko) 2014-03-31 2020-03-09 엘에스산전 주식회사 배전반 결선 시험 장치
WO2017054241A1 (zh) * 2015-10-02 2017-04-06 魏晓敏 Led芯片老化测试装置
TWI729056B (zh) 2016-01-08 2021-06-01 美商艾爾測試系統 測試器設備及測試微電子裝置的方法
KR20250126857A (ko) 2017-03-03 2025-08-25 에어 테스트 시스템즈 카트리지, 테스트 피스 및 하나 이상의 전자 디바이스들을 테스팅하는 방법
TWI791571B (zh) * 2017-07-25 2023-02-11 加拿大商皇虎科技(加拿大)有限公司 積體電路裝置上自動預燒測試的系統及方法
US10261123B2 (en) * 2017-08-24 2019-04-16 Micron Technology, Inc. Semiconductor device structures for burn-in testing and methods thereof
JP7110817B2 (ja) * 2018-08-09 2022-08-02 オムロン株式会社 検査具、検査ユニットおよび検査装置
TWI808165B (zh) * 2019-04-26 2023-07-11 致茂電子股份有限公司 用於測試邊射型雷射二極體之治具組件及具備該組件之測試設備
TWI808164B (zh) * 2019-04-26 2023-07-11 致茂電子股份有限公司 用於測試面射型雷射二極體之治具組件及具備該組件之測試設備
CN120254561B (zh) 2020-10-07 2026-03-03 雅赫测试系统公司 电子测试器
TWI812203B (zh) * 2022-05-05 2023-08-11 創意電子股份有限公司 探針卡裝置及其電路保護組件
JP2026501645A (ja) 2022-12-30 2026-01-16 エイアー テスト システムズ 電子試験器

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6288561B1 (en) * 1988-05-16 2001-09-11 Elm Technology Corporation Method and apparatus for probing, testing, burn-in, repairing and programming of integrated circuits in a closed environment using a single apparatus
US5663654A (en) * 1990-08-29 1997-09-02 Micron Technology, Inc. Universal wafer carrier for wafer level die burn-in
US5798565A (en) * 1993-08-16 1998-08-25 Micron Technology, Inc. Repairable wafer scale integration system
US5491426A (en) * 1994-06-30 1996-02-13 Vlsi Technology, Inc. Adaptable wafer probe assembly for testing ICs with different power/ground bond pad configurations
US5600257A (en) * 1995-08-09 1997-02-04 International Business Machines Corporation Semiconductor wafer test and burn-in
US6677776B2 (en) 1998-05-11 2004-01-13 Micron Technology, Inc. Method and system having switching network for testing semiconductor components on a substrate
JPH11344509A (ja) * 1998-05-29 1999-12-14 Hiroshi Katagawa プローブカード及びプローブピン
US6705876B2 (en) * 1998-07-13 2004-03-16 Formfactor, Inc. Electrical interconnect assemblies and methods
US7143500B2 (en) * 2001-06-25 2006-12-05 Micron Technology, Inc. Method to prevent damage to probe card
JP3624193B2 (ja) * 2002-03-29 2005-03-02 株式会社東芝 半導体試験装置
SG107610A1 (en) 2002-08-16 2004-12-29 Micron Technology Inc Methods and apparatus for testing and burn-in of semiconductor devices
JP2004144742A (ja) * 2002-10-02 2004-05-20 Renesas Technology Corp プローブシート、プローブカード、半導体検査装置および半導体装置の製造方法

Also Published As

Publication number Publication date
DE602005016146D1 (de) 2009-10-01
KR101177596B1 (ko) 2012-08-27
TWI290748B (en) 2007-12-01
EP1825281B1 (de) 2009-08-19
US20060125502A1 (en) 2006-06-15
CN101084447A (zh) 2007-12-05
JP2008524850A (ja) 2008-07-10
KR20070100741A (ko) 2007-10-11
JP4997117B2 (ja) 2012-08-08
TW200627573A (en) 2006-08-01
EP1825281A1 (de) 2007-08-29
WO2006065621A1 (en) 2006-06-22
CN101084447B (zh) 2010-09-29
US7053644B1 (en) 2006-05-30

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