ATE402594T1 - Oberflächenbehandelte kupferfolie und ihre herstellung und kupferkaschiertes laminat daraus - Google Patents
Oberflächenbehandelte kupferfolie und ihre herstellung und kupferkaschiertes laminat darausInfo
- Publication number
- ATE402594T1 ATE402594T1 AT01947018T AT01947018T ATE402594T1 AT E402594 T1 ATE402594 T1 AT E402594T1 AT 01947018 T AT01947018 T AT 01947018T AT 01947018 T AT01947018 T AT 01947018T AT E402594 T1 ATE402594 T1 AT E402594T1
- Authority
- AT
- Austria
- Prior art keywords
- copper foil
- copper
- production
- layer
- surface treated
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/565—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of zinc
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2222/00—Aspects relating to chemical surface treatment of metallic material by reaction of the surface with a reactive medium
- C23C2222/20—Use of solutions containing silanes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12431—Foil or filament smaller than 6 mils
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Laminated Bodies (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Chemical Treatment Of Metals (AREA)
- Preventing Corrosion Or Incrustation Of Metals (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000020884A JP3670185B2 (ja) | 2000-01-28 | 2000-01-28 | プリント配線板用表面処理銅箔の製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE402594T1 true ATE402594T1 (de) | 2008-08-15 |
Family
ID=18547373
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT01947018T ATE402594T1 (de) | 2000-01-28 | 2001-01-24 | Oberflächenbehandelte kupferfolie und ihre herstellung und kupferkaschiertes laminat daraus |
Country Status (10)
Country | Link |
---|---|
US (1) | US6531045B2 (de) |
EP (1) | EP1185152B1 (de) |
JP (1) | JP3670185B2 (de) |
KR (1) | KR100743512B1 (de) |
CN (1) | CN1213645C (de) |
AT (1) | ATE402594T1 (de) |
DE (1) | DE60134926D1 (de) |
MY (1) | MY128582A (de) |
TW (1) | TW511407B (de) |
WO (1) | WO2001056343A1 (de) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100602896B1 (ko) * | 2002-06-04 | 2006-07-19 | 미쓰이 긴조꾸 고교 가부시키가이샤 | 저유전성 기재용 표면처리 동박과 그것을 사용한 동클래드적층판 및 프린트 배선판 |
US7476449B2 (en) * | 2003-02-27 | 2009-01-13 | Furukawa Circuit Foil Co., Ltd. | Electromagnetic shielding copper foil, method of production thereof and electromagnetic shield |
TWI282259B (en) | 2004-01-30 | 2007-06-01 | Hitachi Chemical Co Ltd | Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board |
JP4913328B2 (ja) * | 2004-01-30 | 2012-04-11 | 日立化成工業株式会社 | 接着補助剤付金属箔及びそれを用いたプリント配線板 |
JP4567360B2 (ja) * | 2004-04-02 | 2010-10-20 | 三井金属鉱業株式会社 | 銅箔の製造方法及びその製造方法で得られる銅箔 |
KR101228168B1 (ko) * | 2007-09-28 | 2013-01-30 | 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 | 인쇄 회로용 동박 및 동장 적층판 |
CN101556846B (zh) * | 2009-05-19 | 2010-11-03 | 丹凤县永鑫电子材料有限责任公司 | 镀镍铈合金软铜线生产工艺 |
KR101344176B1 (ko) * | 2010-02-24 | 2013-12-20 | 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 | 인쇄 회로 기판용 동박 및 인쇄 회로 기판용 동장 적층판 |
CN103924268B (zh) * | 2013-12-26 | 2016-04-13 | 苏州昕皓新材料科技有限公司 | 一种酸铜整平剂的应用 |
CN103924269B (zh) * | 2013-12-26 | 2016-04-13 | 苏州昕皓新材料科技有限公司 | 一种非染料系整平剂的应用 |
JP6570430B2 (ja) * | 2015-11-12 | 2019-09-04 | Jx金属株式会社 | キャリア付銅箔の製造方法、プリント配線板の製造方法及び電子機器の製造方法 |
JP7033905B2 (ja) * | 2017-02-07 | 2022-03-11 | Jx金属株式会社 | 表面処理銅箔、キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法 |
JP7366436B2 (ja) | 2021-05-31 | 2023-10-23 | 古河電気工業株式会社 | 表面処理銅箔、銅張積層板、及びプリント配線板 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5515216A (en) * | 1978-07-20 | 1980-02-02 | Mitsui Anakonda Dohaku Kk | Printed circut copper foil and method of manufacturing same |
KR930006103B1 (ko) * | 1991-03-11 | 1993-07-07 | 덕산금속 주식회사 | 인쇄회로용 전해동박 및 그 제조방법 |
US5215646A (en) * | 1992-05-06 | 1993-06-01 | Circuit Foil Usa, Inc. | Low profile copper foil and process and apparatus for making bondable metal foils |
JP2717911B2 (ja) * | 1992-11-19 | 1998-02-25 | 日鉱グールド・フォイル株式会社 | 印刷回路用銅箔及びその製造方法 |
US5482784A (en) * | 1993-12-24 | 1996-01-09 | Mitsui Mining And Smelting Co., Ltd. | Printed circuit inner-layer copper foil and process for producing the same |
JP3292774B2 (ja) * | 1994-02-15 | 2002-06-17 | 三井金属鉱業株式会社 | プリント配線板用銅箔およびその製造方法 |
JP3199208B2 (ja) * | 1994-03-24 | 2001-08-13 | 三井金属鉱業株式会社 | 有機防錆処理銅箔およびその製造方法 |
JP2684164B2 (ja) * | 1995-03-17 | 1997-12-03 | 福田金属箔粉工業株式会社 | 印刷回路用銅箔の表面処理方法 |
JPH0974273A (ja) * | 1995-06-27 | 1997-03-18 | Nippon Denkai Kk | プリント回路用銅張積層板とその接着剤 |
MY138743A (en) * | 1996-05-13 | 2009-07-31 | Mitsui Mining & Smelting Co | High tensile strength electrodeposited copper foil and the production process of the same |
JPH10341066A (ja) * | 1997-06-10 | 1998-12-22 | Furukawa Electric Co Ltd:The | 印刷回路用銅箔、前記銅箔を用いた印刷回路用樹脂接着剤付銅箔、および前記銅箔を用いた印刷回路用銅張り積層板 |
-
2000
- 2000-01-28 JP JP2000020884A patent/JP3670185B2/ja not_active Expired - Lifetime
-
2001
- 2001-01-16 TW TW090100897A patent/TW511407B/zh not_active IP Right Cessation
- 2001-01-23 MY MYPI20010316A patent/MY128582A/en unknown
- 2001-01-24 WO PCT/JP2001/000432 patent/WO2001056343A1/ja active IP Right Grant
- 2001-01-24 CN CNB018001106A patent/CN1213645C/zh not_active Expired - Lifetime
- 2001-01-24 DE DE60134926T patent/DE60134926D1/de not_active Expired - Lifetime
- 2001-01-24 KR KR1020017011509A patent/KR100743512B1/ko active IP Right Grant
- 2001-01-24 AT AT01947018T patent/ATE402594T1/de not_active IP Right Cessation
- 2001-01-24 EP EP01947018A patent/EP1185152B1/de not_active Expired - Lifetime
- 2001-01-26 US US09/769,244 patent/US6531045B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
MY128582A (en) | 2007-02-28 |
JP2001214298A (ja) | 2001-08-07 |
JP3670185B2 (ja) | 2005-07-13 |
KR20010102562A (ko) | 2001-11-15 |
TW511407B (en) | 2002-11-21 |
CN1358407A (zh) | 2002-07-10 |
KR100743512B1 (ko) | 2007-07-27 |
EP1185152A1 (de) | 2002-03-06 |
EP1185152A4 (de) | 2006-11-22 |
DE60134926D1 (de) | 2008-09-04 |
WO2001056343A1 (fr) | 2001-08-02 |
US6531045B2 (en) | 2003-03-11 |
EP1185152B1 (de) | 2008-07-23 |
CN1213645C (zh) | 2005-08-03 |
US20010014406A1 (en) | 2001-08-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |