ATE377341T1 - Datenbusverbindung für eine speicheranordnung - Google Patents

Datenbusverbindung für eine speicheranordnung

Info

Publication number
ATE377341T1
ATE377341T1 AT02790420T AT02790420T ATE377341T1 AT E377341 T1 ATE377341 T1 AT E377341T1 AT 02790420 T AT02790420 T AT 02790420T AT 02790420 T AT02790420 T AT 02790420T AT E377341 T1 ATE377341 T1 AT E377341T1
Authority
AT
Austria
Prior art keywords
data bus
order
ports
logical
integrated circuit
Prior art date
Application number
AT02790420T
Other languages
English (en)
Inventor
Hua Li
Yuan Fuat Chin
Original Assignee
Thomson Licensing
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson Licensing filed Critical Thomson Licensing
Application granted granted Critical
Publication of ATE377341T1 publication Critical patent/ATE377341T1/de

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F13/38—Information transfer, e.g. on bus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09236—Parallel layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09772—Conductors directly under a component but not electrically connected to the component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Dram (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Exchange Systems With Centralized Control (AREA)
  • Bus Control (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structure Of Printed Boards (AREA)
AT02790420T 2001-11-29 2002-11-21 Datenbusverbindung für eine speicheranordnung ATE377341T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP01403063A EP1317168A1 (de) 2001-11-29 2001-11-29 Datenbusverbindung für eine Speicheranordnung

Publications (1)

Publication Number Publication Date
ATE377341T1 true ATE377341T1 (de) 2007-11-15

Family

ID=8182989

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02790420T ATE377341T1 (de) 2001-11-29 2002-11-21 Datenbusverbindung für eine speicheranordnung

Country Status (11)

Country Link
US (1) US7647447B2 (de)
EP (2) EP1317168A1 (de)
JP (1) JP2005510822A (de)
KR (1) KR20040068553A (de)
CN (1) CN100334925C (de)
AT (1) ATE377341T1 (de)
AU (1) AU2002365323A1 (de)
DE (1) DE60223281T2 (de)
MY (1) MY135150A (de)
TW (1) TWI253652B (de)
WO (1) WO2003047322A1 (de)

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5221059B2 (de) 1972-04-22 1977-06-08
JP2537926B2 (ja) 1987-11-30 1996-09-25 松下電器産業株式会社 半導体メモリを使用する電子機器のプリント基板
US5096852A (en) * 1988-06-02 1992-03-17 Burr-Brown Corporation Method of making plastic encapsulated multichip hybrid integrated circuits
JPH02250389A (ja) * 1989-03-24 1990-10-08 Hitachi Medical Corp 基板における電子部品の搭載構造
US5015191A (en) * 1990-03-05 1991-05-14 Amp Incorporated Flat IC chip connector
JP3108536B2 (ja) 1992-07-29 2000-11-13 ローム株式会社 Ｉｃメモリカード
JPH06326500A (ja) 1993-05-13 1994-11-25 Canon Inc パッケージｉｃの基板実装方法
US5838603A (en) * 1994-10-11 1998-11-17 Matsushita Electric Industrial Co., Ltd. Semiconductor device and method for fabricating the same, memory core chip and memory peripheral circuit chip
US5815426A (en) * 1996-08-13 1998-09-29 Nexcom Technology, Inc. Adapter for interfacing an insertable/removable digital memory apparatus to a host data part
US5815427A (en) * 1997-04-02 1998-09-29 Micron Technology, Inc. Modular memory circuit and method for forming same
US6153929A (en) * 1998-08-21 2000-11-28 Micron Technology, Inc. Low profile multi-IC package connector
JP2000133895A (ja) 1998-10-26 2000-05-12 Sony Corp 基板上のパターン配線構造及びその設計方法
US6256769B1 (en) * 1999-09-30 2001-07-03 Unisys Corporation Printed circuit board routing techniques
DE10345549B3 (de) * 2003-09-30 2005-04-28 Infineon Technologies Ag Integrierte Speicherschaltung

Also Published As

Publication number Publication date
EP1317168A1 (de) 2003-06-04
MY135150A (en) 2008-02-29
KR20040068553A (ko) 2004-07-31
WO2003047322A1 (en) 2003-06-05
CN1589595A (zh) 2005-03-02
EP1449412B1 (de) 2007-10-31
US20050033865A1 (en) 2005-02-10
TW200409138A (en) 2004-06-01
DE60223281D1 (de) 2007-12-13
EP1449412A1 (de) 2004-08-25
AU2002365323A1 (en) 2003-06-10
DE60223281T2 (de) 2008-04-10
US7647447B2 (en) 2010-01-12
TWI253652B (en) 2006-04-21
CN100334925C (zh) 2007-08-29
JP2005510822A (ja) 2005-04-21

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Legal Events

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