ATE356540T1 - Gerät zur kühlung von elektronischen baugruppen - Google Patents

Gerät zur kühlung von elektronischen baugruppen

Info

Publication number
ATE356540T1
ATE356540T1 AT00110248T AT00110248T ATE356540T1 AT E356540 T1 ATE356540 T1 AT E356540T1 AT 00110248 T AT00110248 T AT 00110248T AT 00110248 T AT00110248 T AT 00110248T AT E356540 T1 ATE356540 T1 AT E356540T1
Authority
AT
Austria
Prior art keywords
radiating portion
heat
heat radiating
electronic components
meandering capillary
Prior art date
Application number
AT00110248T
Other languages
English (en)
Inventor
Takahiro Katoh
Kiyoo Amako
Original Assignee
Ts Heatronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ts Heatronics Co Ltd filed Critical Ts Heatronics Co Ltd
Application granted granted Critical
Publication of ATE356540T1 publication Critical patent/ATE356540T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20663—Liquid coolant with phase change, e.g. heat pipes
    • H05K7/20672—Liquid coolant with phase change, e.g. heat pipes within sub-racks for removing heat from electronic boards
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Details Of Measuring And Other Instruments (AREA)
AT00110248T 1999-05-20 2000-05-19 Gerät zur kühlung von elektronischen baugruppen ATE356540T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP13960699 1999-05-20
JP14686799A JP4223628B2 (ja) 1999-05-20 1999-05-26 電子機器冷却装置

Publications (1)

Publication Number Publication Date
ATE356540T1 true ATE356540T1 (de) 2007-03-15

Family

ID=26472359

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00110248T ATE356540T1 (de) 1999-05-20 2000-05-19 Gerät zur kühlung von elektronischen baugruppen

Country Status (5)

Country Link
US (1) US6360813B1 (de)
EP (1) EP1054583B1 (de)
JP (1) JP4223628B2 (de)
AT (1) ATE356540T1 (de)
DE (1) DE60033727D1 (de)

Families Citing this family (36)

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US6762907B2 (en) * 2001-06-07 2004-07-13 Hewlett-Packard Development Company, L.P. Disc drive having integral base cooling
WO2002102124A2 (en) * 2001-06-12 2002-12-19 Liebert Corporation Single or dual buss thermal transfer system
US6536510B2 (en) * 2001-07-10 2003-03-25 Thermal Corp. Thermal bus for cabinets housing high power electronics equipment
USD475354S1 (en) 2001-12-21 2003-06-03 Tung-Yuan Wang Heat pipe of radiator of computer
US6819561B2 (en) * 2002-02-22 2004-11-16 Satcon Technology Corporation Finned-tube heat exchangers and cold plates, self-cooling electronic component systems using same, and methods for cooling electronic components using same
US20050213306A1 (en) * 2004-03-25 2005-09-29 Lockheed Martin Corporation Environmental control method and apparatus for electronic device enclosures
ES2457046T3 (es) * 2005-01-27 2014-04-24 Lg Electronics, Inc. Unidad de interior de un aparato climatizador
CN101209006A (zh) * 2005-06-23 2008-06-25 艾利森电话股份有限公司 冷却装置
DE102005036299B4 (de) * 2005-08-02 2008-01-24 Siemens Ag Kühlanordnung
US8240359B2 (en) * 2006-04-17 2012-08-14 Gerald Garrett Liquid storage and cooling computer case
US8651172B2 (en) 2007-03-22 2014-02-18 Raytheon Company System and method for separating components of a fluid coolant for cooling a structure
US20090165996A1 (en) * 2007-12-26 2009-07-02 Lynch Thomas W Reticulated heat dissipation with coolant
US7907409B2 (en) 2008-03-25 2011-03-15 Raytheon Company Systems and methods for cooling a computing component in a computing rack
US8582298B2 (en) * 2009-06-22 2013-11-12 Xyber Technologies Passive cooling enclosure system and method for electronics devices
US9036351B2 (en) * 2009-06-22 2015-05-19 Xyber Technologies, Llc Passive cooling system and method for electronics devices
US8816220B2 (en) * 2011-01-28 2014-08-26 Raytheon Company Enclosure cooling apparatus
DE102011119174A1 (de) * 2011-11-23 2013-05-23 Inheco Industrial Heating And Cooling Gmbh Vapor Chamber
FR2984472B1 (fr) * 2011-12-20 2015-10-02 Astrium Sas Dispositif de regulation thermique passif
US10209003B2 (en) 2012-02-21 2019-02-19 Thermal Corp. Electronics cabinet and rack cooling system and method
CN104509220B (zh) 2012-05-07 2018-05-29 弗诺尼克设备公司 包括保护性热密封盖和最优化界面热阻的热电热交换器组件
US20130291555A1 (en) 2012-05-07 2013-11-07 Phononic Devices, Inc. Thermoelectric refrigeration system control scheme for high efficiency performance
EP3131376B1 (de) 2014-06-04 2021-08-04 Huawei Technologies Co., Ltd. Elektronische vorrichtung
ES2770014T3 (es) 2014-07-21 2020-06-30 Phononic Devices Inc Sistemas y métodos para el funcionamiento de un módulo termoeléctrico para aumentar la eficiencia
US10209009B2 (en) 2016-06-21 2019-02-19 General Electric Company Heat exchanger including passageways
CN107734829A (zh) * 2017-09-25 2018-02-23 郑州云海信息技术有限公司 一种高效的pcb内层散热系统及实现方法
US11427330B2 (en) 2019-11-15 2022-08-30 General Electric Company System and method for cooling a leading edge of a high speed vehicle
US11260953B2 (en) 2019-11-15 2022-03-01 General Electric Company System and method for cooling a leading edge of a high speed vehicle
US11267551B2 (en) 2019-11-15 2022-03-08 General Electric Company System and method for cooling a leading edge of a high speed vehicle
US11352120B2 (en) 2019-11-15 2022-06-07 General Electric Company System and method for cooling a leading edge of a high speed vehicle
US11260976B2 (en) 2019-11-15 2022-03-01 General Electric Company System for reducing thermal stresses in a leading edge of a high speed vehicle
DE102020107173A1 (de) 2020-03-16 2021-09-16 Bayerische Motoren Werke Aktiengesellschaft Kühlungsanordnung für zumindest eine stromführende Komponente eines Kraftfahrzeugs
US11425842B2 (en) 2020-09-14 2022-08-23 Hewlett Packard Enterprise Development Lp Thermal design of an access point
DE102020212698A1 (de) 2020-10-08 2022-04-14 Robert Bosch Gesellschaft mit beschränkter Haftung Anordnung, Abgasnachbehandlungssystem
US11745847B2 (en) 2020-12-08 2023-09-05 General Electric Company System and method for cooling a leading edge of a high speed vehicle
US11407488B2 (en) 2020-12-14 2022-08-09 General Electric Company System and method for cooling a leading edge of a high speed vehicle
US11577817B2 (en) 2021-02-11 2023-02-14 General Electric Company System and method for cooling a leading edge of a high speed vehicle

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3044314C2 (de) * 1980-11-25 1986-08-14 kabelmetal electro GmbH, 3000 Hannover Gehäuse zur Aufnahme von mit Wärme erzeugenden elektronischen Bauteilen bestückten gedruckten Schaltungen
US4616699A (en) * 1984-01-05 1986-10-14 Mcdonnell Douglas Corporation Wick-fin heat pipe
ES2024412B3 (es) * 1985-12-13 1992-03-01 Hasler Ag Ascom Procedimiento y dispositivo para la evacuacion de calor perdido de por lo menos un grupo de construccion de elementos electricos
JPH0697147B2 (ja) 1990-11-22 1994-11-30 アクトロニクス株式会社 ループ型細管ヒートパイプ
US5219020A (en) 1990-11-22 1993-06-15 Actronics Kabushiki Kaisha Structure of micro-heat pipe
FR2682746B1 (fr) * 1991-10-17 1994-01-28 Etudes Electroniques Mecaniques Echangeur de chaleur destine aux dissipateurs thermiques a effet caloduc et comportant une structure a plusieurs etages d'echanges thermiques.
JP2873765B2 (ja) 1992-04-13 1999-03-24 アクトロニクス 株式会社 ▲ｌ▼字形状ピン群を有する剣山型ヒートシンク
US5283715A (en) * 1992-09-29 1994-02-01 International Business Machines, Inc. Integrated heat pipe and circuit board structure
US5343940A (en) * 1992-10-29 1994-09-06 Amigo Jean Flexible heat transfer device
US5697428A (en) 1993-08-24 1997-12-16 Actronics Kabushiki Kaisha Tunnel-plate type heat pipe
JP2544701B2 (ja) 1993-08-24 1996-10-16 アクトロニクス株式会社 プレ―ト形ヒ―トパイプ
JPH07211826A (ja) * 1994-01-13 1995-08-11 Toyo Electric Mfg Co Ltd 電気車用半導体冷却装置
DE19515095A1 (de) * 1995-04-25 1996-10-31 Dornier Gmbh Kapillarverdampfer
US5507092A (en) 1995-06-06 1996-04-16 Hisateru Akachi L-type heat sink
EP0753713B1 (de) 1995-07-14 2001-10-17 Actronics Kabushiki Kaisha Verfahren zur Herstellung von Tunnelplatten-Wärmerohren
JP3932518B2 (ja) 1995-08-09 2007-06-20 アクトロニクス株式会社 細径トンネルプレートヒートパイプの製造方法
US6104611A (en) * 1995-10-05 2000-08-15 Nortel Networks Corporation Packaging system for thermally controlling the temperature of electronic equipment
CA2199239A1 (en) * 1997-03-05 1998-09-05 Trevor Zapach Electronic unit
US6115251A (en) * 1999-04-15 2000-09-05 Hewlett Packard Company Cooling apparatus for computer subsystem

Also Published As

Publication number Publication date
EP1054583A2 (de) 2000-11-22
JP4223628B2 (ja) 2009-02-12
US6360813B1 (en) 2002-03-26
EP1054583A3 (de) 2001-06-20
DE60033727D1 (de) 2007-04-19
EP1054583B1 (de) 2007-03-07
JP2001035976A (ja) 2001-02-09

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Legal Events

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