ATE349504T1 - Durch uv-strahlung aktivierbare klebefolie - Google Patents

Durch uv-strahlung aktivierbare klebefolie

Info

Publication number
ATE349504T1
ATE349504T1 AT02734151T AT02734151T ATE349504T1 AT E349504 T1 ATE349504 T1 AT E349504T1 AT 02734151 T AT02734151 T AT 02734151T AT 02734151 T AT02734151 T AT 02734151T AT E349504 T1 ATE349504 T1 AT E349504T1
Authority
AT
Austria
Prior art keywords
adhesive film
radiation
cationic polymerization
ultraviolet
film activated
Prior art date
Application number
AT02734151T
Other languages
English (en)
Inventor
Hiroaki Yamaguchi
Tetsu Kitamura
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Application granted granted Critical
Publication of ATE349504T1 publication Critical patent/ATE349504T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
    • C08L25/02—Homopolymers or copolymers of hydrocarbons
    • C08L25/04—Homopolymers or copolymers of styrene
    • C08L25/08—Copolymers of styrene
    • C08L25/10—Copolymers of styrene with conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29499—Shape or distribution of the fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/066—Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
AT02734151T 2001-05-29 2002-05-03 Durch uv-strahlung aktivierbare klebefolie ATE349504T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001160759A JP2002363506A (ja) 2001-05-29 2001-05-29 紫外線活性化型接着フィルム

Publications (1)

Publication Number Publication Date
ATE349504T1 true ATE349504T1 (de) 2007-01-15

Family

ID=19004124

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02734151T ATE349504T1 (de) 2001-05-29 2002-05-03 Durch uv-strahlung aktivierbare klebefolie

Country Status (7)

Country Link
EP (1) EP1401984B1 (de)
JP (1) JP2002363506A (de)
KR (1) KR20040030634A (de)
CN (1) CN1243810C (de)
AT (1) ATE349504T1 (de)
DE (1) DE60217109T2 (de)
WO (1) WO2002097002A1 (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101103311B (zh) 2004-06-28 2011-05-04 佳能株式会社 阳离子可光致聚合环氧树脂组合物，使用该组合物的微细结构构件以及微细结构构件的制造方法
TW200831583A (en) 2006-09-29 2008-08-01 Nippon Catalytic Chem Ind Curable resin composition, optical material, and method of regulating optical material
JP2009084310A (ja) * 2007-09-27 2009-04-23 Nippon Shokubai Co Ltd 熱・光硬化性樹脂組成物、光学材料及び光学部材
WO2009041711A1 (en) 2007-09-27 2009-04-02 Nippon Shokubai Co., Ltd. Curable resin composition for molded bodies, molded body, and production method thereof
JP5069731B2 (ja) * 2009-09-17 2012-11-07 パナソニック株式会社 カチオン硬化性樹脂組成物、回路装置及びその製造方法
JP2011111557A (ja) * 2009-11-27 2011-06-09 Hitachi Chem Co Ltd 接着剤組成物、回路接続材料、接続体及び回路部材の接続方法、並びに半導体装置
KR101456396B1 (ko) * 2010-08-06 2014-10-31 아사히 가세이 이-매터리얼즈 가부시키가이샤 이방 도전성 접착 필름 및 경화제
WO2012081992A2 (en) * 2010-12-15 2012-06-21 Condalign As Method for forming uv-curable conductive compositions and a domposition thus formed
KR101391696B1 (ko) * 2011-11-23 2014-05-07 제일모직주식회사 이방 전도성 조성물 및 필름
JP5640031B2 (ja) * 2012-03-08 2014-12-10 協立化学産業株式会社 積層フィルムの製造方法
JP6518101B2 (ja) * 2014-03-26 2019-05-22 積水化学工業株式会社 光硬化性導電材料、接続構造体及び接続構造体の製造方法
JP6518100B2 (ja) * 2014-03-26 2019-05-22 積水化学工業株式会社 光硬化性導電材料、接続構造体及び接続構造体の製造方法
AT515813A1 (de) * 2014-05-30 2015-12-15 Isosport Verbundbauteile Oberflächenschutzfolie
KR20180069193A (ko) * 2016-12-14 2018-06-25 주식회사 영우 전자기파 충진제의 효율이 향상된 uv 경화형 점착 시트 및 이의 제조방법
JP7056413B2 (ja) * 2018-06-29 2022-04-19 東洋インキＳｃホールディングス株式会社 硬化物の製造方法
JP7273283B2 (ja) * 2018-09-10 2023-05-15 デクセリアルズ株式会社 接着剤組成物
CN109777326B (zh) * 2019-01-22 2022-11-15 广东天劲新能源科技股份有限公司 一种提升电芯安全性能的uv胶及其涂覆方法
DE102019006820A1 (de) * 2019-09-30 2021-04-01 Daimler Ag Verfahren zum Verkleben von Komponenten einer Brennstoffzelle
CN114958073B (zh) * 2022-05-16 2023-03-24 深圳九星印刷包装集团有限公司 一种紫外辐射指示油墨及紫外辐射指示装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU1944095A (en) * 1994-03-29 1995-10-17 Gregory Robert William McEwan Process for preparing bubble-free adhesive compositions
JP2001279215A (ja) * 2000-03-24 2001-10-10 Three M Innovative Properties Co 異方導電性接着剤組成物およびそれから形成された異方導電性接着フィルム
JP2002047474A (ja) * 2000-07-31 2002-02-12 Toppan Forms Co Ltd カチオン系光架橋型接着剤およびそれを用いた接着シート

Also Published As

Publication number Publication date
KR20040030634A (ko) 2004-04-09
WO2002097002A1 (en) 2002-12-05
CN1243810C (zh) 2006-03-01
CN1527869A (zh) 2004-09-08
DE60217109T2 (de) 2007-07-12
JP2002363506A (ja) 2002-12-18
EP1401984B1 (de) 2006-12-27
DE60217109D1 (de) 2007-02-08
EP1401984A1 (de) 2004-03-31

Similar Documents

Publication Publication Date Title
ATE349504T1 (de) Durch uv-strahlung aktivierbare klebefolie
EA200801546A1 (ru) Зеркало серебряное, устойчивое к ультрафиолетовому излучению для использования в солнечных рефлекторах
DE60238212D1 (de) Cellulosematerial mit verbesserter saugfähigkeit
FR2846970A1 (fr) Procede de traitement de surface par photopolymerisation pour obtenir des proprietes biocides
BR0213794A (pt) Sistema para desinfectar ar prefiltrado usando radiação ultravioleta(uv)
BRPI0213348A2 (pt) sistema para desinfectar água usando radiação ultravioleta(uv)
DE69630128D1 (de) Durch ionisierende strahlung härtende, kationische photoinitiatoren enthaltende epoxidharzsysteme
JP2018524426A5 (de)
DK0873187T3 (da) Med umættede aminoalkoholer tværbundne, vandkvældbare polymerisater, deres fremstilling og anvendelse
SG75809A1 (en) Silicone die attach adhesive and method for fabrication of semiconductor devices
DE602004024178D1 (de) Strahlungshärtende acryloxy-funktionelle siliconzusammensetzung
EA200400866A1 (ru) Ламинированный инсектицидный диспенсер
DE69802129D1 (de) Durch Aktivierungsenergiestrahlen härtbare Beschichtungszusammensetzung
DE69730932D1 (de) Härtbare Harzzusammensetzung, Klebmittel sowie Schichtstoff daraus
RS20050639A (en) Uv stable transdermal therapeutic plaster
BRPI0511369A (pt) usos de um polìmero hidrossolúvel floculante e processo cosmético para o tratamento da transpiração humana
DE69906792T2 (de) Durch mikrowellen betätigte ultraviolett-lichtquelle
DK1626777T3 (da) Indretning til reduktion af mikroorganismer
EP1151853A4 (de) Leicht delaminierbares laminat und harzzusammensetzung für dessen herstellung
ATE502974T1 (de) Ätzstopp harze
DE60103634D1 (de) Anisotropisch leitfähige klebstoffzusammensetzung und daraus hergestellte anisotropisch leitfähige klebstofffolie
ATE349316T1 (de) Brandschutz-verglasungseinheit
EP1634935A4 (de) Strahlenhärtbarer haftklebstoff und strahlenhärtbare klebefolien
WO2006128047A3 (en) Blood irradiation system device
ATE483002T1 (de) Energie-härtbare beschichtungszusammensetzungen

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties