DE69630128D1 - Durch ionisierende strahlung härtende, kationische photoinitiatoren enthaltende epoxidharzsysteme - Google Patents

Durch ionisierende strahlung härtende, kationische photoinitiatoren enthaltende epoxidharzsysteme

Info

Publication number
DE69630128D1
DE69630128D1 DE69630128T DE69630128T DE69630128D1 DE 69630128 D1 DE69630128 D1 DE 69630128D1 DE 69630128 T DE69630128 T DE 69630128T DE 69630128 T DE69630128 T DE 69630128T DE 69630128 D1 DE69630128 D1 DE 69630128D1
Authority
DE
Germany
Prior art keywords
epoxy resin
ionizing radiation
systems containing
resin systems
containing curing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Revoked
Application number
DE69630128T
Other languages
English (en)
Other versions
DE69630128T2 (de
Inventor
J Janke
J Lopata
J Havens
F Dorsey
J Moulton
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
UT Battelle LLC
Original Assignee
UT Battelle LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=27055895&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE69630128(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by UT Battelle LLC filed Critical UT Battelle LLC
Application granted granted Critical
Publication of DE69630128D1 publication Critical patent/DE69630128D1/de
Publication of DE69630128T2 publication Critical patent/DE69630128T2/de
Anticipated expiration legal-status Critical
Revoked legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/687—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
DE69630128T 1995-07-26 1996-07-26 Durch ionisierende strahlung härtende, kationische photoinitiatoren enthaltende epoxidharzsysteme Revoked DE69630128T2 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US507569 1995-07-26
US08/507,569 US5877229A (en) 1995-07-26 1995-07-26 High energy electron beam curing of epoxy resin systems incorporating cationic photoinitiators
US676768 1996-07-08
US08/676,768 US5726216A (en) 1995-07-26 1996-07-08 Toughened epoxy resin system and a method thereof
PCT/US1996/012302 WO1997005172A1 (en) 1995-07-26 1996-07-26 Ionizing radiation curing of epoxy resin systems incorporating cationic photoinitiators

Publications (2)

Publication Number Publication Date
DE69630128D1 true DE69630128D1 (de) 2003-10-30
DE69630128T2 DE69630128T2 (de) 2004-07-08

Family

ID=27055895

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69630128T Revoked DE69630128T2 (de) 1995-07-26 1996-07-26 Durch ionisierende strahlung härtende, kationische photoinitiatoren enthaltende epoxidharzsysteme

Country Status (7)

Country Link
US (2) US5877229A (de)
EP (1) EP0843685B1 (de)
AU (1) AU6600596A (de)
CA (1) CA2224286A1 (de)
DE (1) DE69630128T2 (de)
ES (1) ES2208755T3 (de)
WO (1) WO1997005172A1 (de)

Families Citing this family (65)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6309502B1 (en) * 1997-08-19 2001-10-30 3M Innovative Properties Company Conductive epoxy resin compositions, anisotropically conductive adhesive films and electrical connecting methods
US6107008A (en) * 1997-08-29 2000-08-22 Lockheed Martin Energy Research Ionizing radiation post-curing of objects produced by stereolithography and other methods
US6261665B1 (en) * 1997-09-16 2001-07-17 Tomoegawa Paper Co., Ltd. Anti-reflection material and method for producing the same
JP3950241B2 (ja) * 1997-10-17 2007-07-25 三菱重工業株式会社 樹脂組成物、樹脂硬化物、及び構造物の補修方法、補強方法、補修用材料、補強用材料
US20030157414A1 (en) * 1997-11-13 2003-08-21 Pradeep K. Dhal Holographic medium and process for use thereof
TW374948B (en) * 1998-07-28 1999-11-21 United Microelectronics Corp Method of prevention of poisoning trenches in dual damascene process structures and dielectric layer windows
JP2000204108A (ja) * 1999-01-13 2000-07-25 Jsr Corp 光硬化性樹脂組成物
US6605355B1 (en) * 1999-02-18 2003-08-12 Three Bond Co., Ltd. Epoxy resin composition
JP2001081438A (ja) * 1999-09-14 2001-03-27 Sony Chem Corp 接続材料
US6664318B1 (en) 1999-12-20 2003-12-16 3M Innovative Properties Company Encapsulant compositions with thermal shock resistance
US6409316B1 (en) * 2000-03-28 2002-06-25 Xerox Corporation Thermal ink jet printhead with crosslinked polymer layer
US6716568B1 (en) * 2000-09-15 2004-04-06 Microchem Corp. Epoxy photoresist composition with improved cracking resistance
US6420460B1 (en) 2001-02-12 2002-07-16 Ucb S.A. Cationically curable compositions containing triarylcyclopropenylium salts
GB0103752D0 (en) * 2001-02-15 2001-04-04 Vantico Ltd Three-Dimensional printing
US6599632B1 (en) * 2001-04-18 2003-07-29 Edge Structural Composites, Llc Composite system and method for reinforcement of existing structures
GB0112675D0 (en) * 2001-05-24 2001-07-18 Vantico Ltd Three-dimensional structured printing
TW561102B (en) * 2001-10-22 2003-11-11 Hrl Lab Llc Preparing composites by using resins
US7118837B2 (en) * 2002-01-08 2006-10-10 International Business Machines Corporation Photoimaged dielectric polymer and film, and circuit package containing the same
US6806033B2 (en) 2002-01-08 2004-10-19 International Business Machines Corporation Photoimaged dielectric, its manufacture and use in electronics
US6858378B1 (en) * 2002-04-17 2005-02-22 Sandia National Laboratories Photoimageable composition
US6884315B2 (en) * 2002-08-20 2005-04-26 Ucb, S.A. Method for bonding DVD layers
US20040144479A1 (en) * 2003-01-23 2004-07-29 Peter Cueli Preparation of novel physical transfer elements such as hot stamping foil and methods for using the same in producing chemically resistant bonds
JP4251612B2 (ja) * 2003-01-30 2009-04-08 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． エポキシ含有物質を含むネガ型感光性樹脂組成物
JP4397601B2 (ja) * 2003-02-06 2010-01-13 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． フェノール−ビフェニレン樹脂を含むネガ型感光性樹脂組成物
FR2854407B1 (fr) * 2003-05-02 2006-08-25 Eads Launch Vehicles Materiau a haute tenacite a base d'une resine vinylester et/ou d'une resine epoxyde, son procede de fabrication, materiau composite le comprenant et ses utilisations
US20050260522A1 (en) * 2004-02-13 2005-11-24 William Weber Permanent resist composition, cured product thereof, and use thereof
DE102004009355A1 (de) * 2004-02-26 2005-09-15 Covion Organic Semiconductors Gmbh Verfahren zur Vernetzung organischer Halbleiter
AU2005229547B2 (en) * 2004-03-31 2010-06-10 Toho Tenax Europe Gmbh Epoxy resin impregnated yarn and the use thereof for producing a preform
US7449280B2 (en) * 2004-05-26 2008-11-11 Microchem Corp. Photoimageable coating composition and composite article thereof
CN1950419B (zh) * 2004-06-17 2011-06-08 三邦株式会社 一种光阳离子聚合性组合物
JP2008528760A (ja) * 2005-01-28 2008-07-31 ダウ グローバル テクノロジーズ インコーポレイティド ウォッシュ・オフ耐性ならびに衝撃および膨張のような物理的特性を改善するために熱可塑性樹脂と結合したアラミド繊維の使用
JP4633500B2 (ja) * 2005-03-01 2011-02-16 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． エポキシ含有物質を含むネガ型感光性樹脂組成物
EP1879070A4 (de) * 2005-04-19 2010-09-29 Nissan Chemical Ind Ltd Zusammensetzung zur resistunterschichtfilmbildung zur bildung eines photovernetzungs-ausgehärteten resistunterschichtfilms
US20060283133A1 (en) * 2005-06-17 2006-12-21 The Boeing Company Composite reinforcement of metallic structural elements
US20070004871A1 (en) * 2005-06-30 2007-01-04 Qiwei Lu Curable composition and method
US7378455B2 (en) * 2005-06-30 2008-05-27 General Electric Company Molding composition and method, and molded article
JP4703450B2 (ja) * 2005-11-11 2011-06-15 日信工業株式会社 熱硬化性樹脂組成物の製造方法、硬化した樹脂組成物及びその製造方法
EP1801142B1 (de) * 2005-12-16 2016-02-24 Canon Kabushiki Kaisha Harzzusammensetzung, gehärtetes Harzprodukt und Flüssigkeitsausstosskopf
EP2004746B1 (de) * 2006-03-29 2018-08-01 Henkel AG & Co. KGaA Strahlungshärtbarer kautschuk-klebstoff/dichtstoff
DE102006057142A1 (de) * 2006-12-01 2008-06-05 Henkel Kgaa Metallverbindungen als Initiatoren
US20080292993A1 (en) * 2006-12-22 2008-11-27 Canon Kabushiki Kaisha Photo-cationic polymerizable epoxy resin composition, liquid discharge head, and manufacturing method thereof
US20080236864A1 (en) * 2007-03-28 2008-10-02 General Electric Company Cross linked polysiloxane/polyimide copolymers, methods of making, blends thereof, and articles derived therefrom
EP2203515B1 (de) * 2007-09-02 2014-12-17 PolyOne Corporation Flammenhemmende thermoplastische elastomere
DE102007041988A1 (de) 2007-09-05 2009-03-12 Forschungszentrum Karlsruhe Gmbh Flammhemmende Additive
ES2332629B1 (es) * 2007-12-14 2011-01-31 Airbus España S.L. Util y procedimiento para la fabricacion de estructuras de materialescompuestos fuera de autoclave.
RU2455317C1 (ru) * 2008-04-14 2012-07-10 Хексел Композитс, Лтд. Термореактивная смола, содержащая облученный термопластический агент для повышения ударной прочности
WO2009127891A1 (en) * 2008-04-14 2009-10-22 Hexcel Composites, Ltd. Thermosetting resin containing irradiated thermoplastic toughening agent
FR2935388B1 (fr) * 2008-08-28 2012-08-10 Astrium Sas Utilisation de resines polymerisables, a faible degazage sous vide, pour la fabrication de materiaux composites a usage spatial
JP5329299B2 (ja) * 2009-05-13 2013-10-30 日東電工株式会社 光学レンズ
US20120282434A1 (en) * 2009-10-07 2012-11-08 Hexcel Composites, Ltd. Thermosetting resin adhesive containing irradiated thermoplastic toughening agent
CN103930472B (zh) 2011-07-29 2016-01-06 艾德昂有限责任公司 一种通过电子束辐射、并通过气体产生的等离子和紫外辐射进行固化组合物的方法
AU2012301383B2 (en) * 2011-08-31 2015-11-26 Huntsman Advanced Materials Licensing (Switzerland) Gmbh Process for the impregnation of air core reactors, impregnated air core reactor and use of an impregnation system
US8895148B2 (en) 2011-11-09 2014-11-25 Cytec Technology Corp. Structural adhesive and bonding application thereof
JP6255717B2 (ja) * 2012-06-08 2018-01-10 住友化学株式会社 レジスト組成物及びレジストパターンの製造方法
US9580574B2 (en) * 2012-12-12 2017-02-28 Galata Chemicals Llc Bio-based biocide compositions and methods of preserving therewith
KR101481263B1 (ko) * 2013-04-29 2015-01-13 전북대학교산학협력단 강인화 에폭시 수지 조성물, 이의 제조방법 및 강인화 에폭시 수지
JP5785236B2 (ja) * 2013-10-02 2015-09-24 ヘンケル・アーゲー・アンド・カンパニー・カーゲーアーアー 放射線−または熱−硬化性バリヤシーラント
CN104892902B (zh) * 2014-03-03 2018-01-05 广东生益科技股份有限公司 一种热固性树脂组合物及其用途
EP3114161B1 (de) * 2014-03-07 2023-10-18 Henkel AG & Co. KGaA Photohärtbare epoxidharzsysteme
PL3093305T3 (pl) * 2015-05-12 2018-01-31 Refractory Intellectual Property Gmbh & Co Kg Zestaw do wytwarzania surowej kształtki do wytwarzania wiązanego poprzez węgiel wyrobu ogniotrwałego, sposób wytwarzania takiej surowej kształtki jak również surowa kształtka wytworzona tym sposobem
TWI557177B (zh) * 2015-12-16 2016-11-11 財團法人工業技術研究院 低介電無溶劑型樹脂組成物及基板結構
US11289689B2 (en) 2017-05-01 2022-03-29 Utbattele, Llc Method of solvent-free manufacturing of composite electrodes incorporating radiation curable binders
EP3668907B1 (de) 2017-08-18 2023-02-15 Fina Technology, Inc. Epoxidiertes polyfarnesen und verfahren zur herstellung davon
CN111303588A (zh) * 2020-03-06 2020-06-19 中国航空制造技术研究院 一种具有高伸长率的环氧树脂及其胶膜的制备方法
CN114940857A (zh) * 2022-06-23 2022-08-26 上海镭利电子材料有限公司 一种抗腐蚀复合型环氧树脂光固化薄膜及其制备方法

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3660371A (en) * 1970-12-21 1972-05-02 Ford Motor Co Unsaturated polyester and epoxy-functional graded-rubber paint and process i
US3936557A (en) * 1971-05-18 1976-02-03 American Can Company Epoxide blend for polymerizable coating compositions and process
AU497960B2 (en) * 1974-04-11 1979-01-25 Minnesota Mining And Manufacturing Company Photopolymerizable compositions
US4318766A (en) * 1975-09-02 1982-03-09 Minnesota Mining And Manufacturing Company Process of using photocopolymerizable compositions based on epoxy and hydroxyl-containing organic materials
US4256828A (en) * 1975-09-02 1981-03-17 Minnesota Mining And Manufacturing Company Photocopolymerizable compositions based on epoxy and hydroxyl-containing organic materials
US4101513A (en) * 1977-02-02 1978-07-18 Minnesota Mining And Manufacturing Company Catalyst for condensation of hydrolyzable silanes and storage stable compositions thereof
US4231951A (en) * 1978-02-08 1980-11-04 Minnesota Mining And Manufacturing Company Complex salt photoinitiator
US4154872A (en) * 1978-05-09 1979-05-15 W. R. Grace & Co. Process for preparing catalytic solutions of sulfonium salts
US4297401A (en) * 1978-12-26 1981-10-27 Minnesota Mining & Manufacturing Company Liquid crystal display and photopolymerizable sealant therefor
US4310469A (en) * 1978-12-29 1982-01-12 General Electric Company Diaryliodonium salts
US4201640A (en) * 1979-03-14 1980-05-06 American Can Company Method for producing bis-[4-(diphenylsulfonio)phenyl] sulfide bis-M.X6
US4289595A (en) * 1979-11-26 1981-09-15 American Can Company Ambient temperature curing photopolymerizable epoxide compositions utilizing epoxide ethers and methods
EP0082602A3 (de) * 1981-12-22 1983-08-10 Mobil Oil Corporation Pigmentiertes Überzugsmittel auf der Basis von Epoxydharzen
US4593051A (en) * 1983-02-07 1986-06-03 Union Carbide Corporation Photocopolymerizable compositons based on epoxy and polymer/hydroxyl-containing organic materials
JPS60202120A (ja) * 1984-03-26 1985-10-12 Toshiba Corp 電子線硬化性エポキシ樹脂組成物
JPS61190524A (ja) * 1985-01-25 1986-08-25 Asahi Denka Kogyo Kk エネルギ−線硬化性組成物
US4786569A (en) * 1985-09-04 1988-11-22 Ciba-Geigy Corporation Adhesively bonded photostructurable polyimide film
CA1312040C (en) * 1985-12-19 1992-12-29 Joseph Victor Koleske Conformal coatings cured with actinic radiation
CA1305823C (en) * 1986-08-29 1992-07-28 Union Carbide Corporation Photocurable blends of cyclic ethers and cycloaliphatic epoxides
US4920182A (en) * 1987-12-18 1990-04-24 Ciba-Geigy Corporation Epoxy resin compositions containing polyester flexibilizer and metallocene complex initiator
US4885319A (en) * 1988-02-29 1989-12-05 Gaf Corporation Solvent resistant irradiation curable coatings
EP0431564B1 (de) * 1989-12-05 1996-04-10 Konica Corporation Aufzeichnungsmaterial eines photographischen Bildes.
US5144051A (en) * 1990-05-29 1992-09-01 Minnesota Mining And Manufacturing Company Branched alkoxyphenyl iodonium salt photoinitiators
US5141970A (en) * 1990-12-10 1992-08-25 Loctite (Ireland) Limited Method of forming high-temperature resistant polymers
US5260349A (en) * 1991-01-04 1993-11-09 Polyset Corporation Electron beam curable epoxy compositions
FR2672896B1 (fr) * 1991-02-15 1993-06-04 Aerospatiale Soc Nat Industrielle Procede de durcissement sous rayonnement ionisant d'une resine bis-maleimide et d'un materiau composite utilisant cette resine.
US5268489A (en) * 1991-06-26 1993-12-07 Union Carbide Chemicals & Plastics Technology Corporation Production of unsaturated cycloaliphatic esters and derivatives thereof
US5252694A (en) * 1992-01-22 1993-10-12 Minnesota Mining And Manufacturing Company Energy-polymerization adhesive, coating, film and process for making the same
FR2688790B1 (fr) * 1992-03-23 1994-05-13 Rhone Poulenc Chimie Compositions a base de polyorganosiloxanes a groupements fonctionnels reticulables et leur utilisation pour la realisation de revetements anti-adhesifs.
US5328940A (en) * 1992-07-20 1994-07-12 Lord Corporation Radiation-curable compositions containing hydroxy-terminated polyurethanes and an epoxy compound
US5350604A (en) * 1992-12-09 1994-09-27 Rensselaer Polytechnic Institute Photocurable compositions of polyindane and 1,3-diisopropenylbenzene, and coating process
DE4324322B4 (de) * 1993-07-20 2005-11-24 Delo Industrieklebstoffe Gmbh & Co. Kg Flexibilisierte, lichtinitiiert härtende Epoxidharzmassen, ihre Herstellung und Verwendung
DE69527197T2 (de) * 1994-04-15 2003-01-09 Kraton Polymers Res Bv Epoxydierter kautschuk mit niedriger viscosität und seine verwendung zur änderung der zähigkeit von epoxydharzen

Also Published As

Publication number Publication date
EP0843685B1 (de) 2003-09-24
WO1997005172A1 (en) 1997-02-13
AU6600596A (en) 1997-02-26
US5726216A (en) 1998-03-10
EP0843685A4 (de) 1998-10-28
EP0843685A1 (de) 1998-05-27
ES2208755T3 (es) 2004-06-16
DE69630128T2 (de) 2004-07-08
US5877229A (en) 1999-03-02
CA2224286A1 (en) 1997-02-13

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8363 Opposition against the patent
8331 Complete revocation