ATE343157T1 - Methode zur bestimmung eines maskensatzes zur herstellung eines integrierten schaltkreises - Google Patents

Methode zur bestimmung eines maskensatzes zur herstellung eines integrierten schaltkreises

Info

Publication number
ATE343157T1
ATE343157T1 AT00950849T AT00950849T ATE343157T1 AT E343157 T1 ATE343157 T1 AT E343157T1 AT 00950849 T AT00950849 T AT 00950849T AT 00950849 T AT00950849 T AT 00950849T AT E343157 T1 ATE343157 T1 AT E343157T1
Authority
AT
Austria
Prior art keywords
mask
integrated circuit
phase shifting
manufactured
producing
Prior art date
Application number
AT00950849T
Other languages
English (en)
Inventor
Nicolas Bailey Cobb
Kyohei Sakajiri
Original Assignee
Mentor Graphics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=23612127&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ATE343157(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Mentor Graphics Corp filed Critical Mentor Graphics Corp
Application granted granted Critical
Publication of ATE343157T1 publication Critical patent/ATE343157T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/26—Phase shift masks [PSM]; PSM blanks; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/70—Adapting basic layout or design of masks to lithographic process requirements, e.g., second iteration correction of mask patterns for imaging
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
    • G03F7/2026—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure for the removal of unwanted material, e.g. image or background correction

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Networks Using Active Elements (AREA)
AT00950849T 1999-09-28 2000-07-28 Methode zur bestimmung eines maskensatzes zur herstellung eines integrierten schaltkreises ATE343157T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/407,447 US6335128B1 (en) 1999-09-28 1999-09-28 Method and apparatus for determining phase shifts and trim masks for an integrated circuit

Publications (1)

Publication Number Publication Date
ATE343157T1 true ATE343157T1 (de) 2006-11-15

Family

ID=23612127

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00950849T ATE343157T1 (de) 1999-09-28 2000-07-28 Methode zur bestimmung eines maskensatzes zur herstellung eines integrierten schaltkreises

Country Status (8)

Country Link
US (2) US6335128B1 (de)
EP (1) EP1218798B1 (de)
JP (2) JP3916462B2 (de)
KR (1) KR100473197B1 (de)
AT (1) ATE343157T1 (de)
AU (1) AU6388700A (de)
DE (1) DE60031429T2 (de)
WO (1) WO2001023961A1 (de)

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US6733929B2 (en) * 2000-07-05 2004-05-11 Numerical Technologies, Inc. Phase shift masking for complex patterns with proximity adjustments
US7083879B2 (en) 2001-06-08 2006-08-01 Synopsys, Inc. Phase conflict resolution for photolithographic masks
US6787271B2 (en) * 2000-07-05 2004-09-07 Numerical Technologies, Inc. Design and layout of phase shifting photolithographic masks
US6978436B2 (en) * 2000-07-05 2005-12-20 Synopsys, Inc. Design data format and hierarchy management for phase processing
US6681379B2 (en) 2000-07-05 2004-01-20 Numerical Technologies, Inc. Phase shifting design and layout for static random access memory
US7028285B2 (en) * 2000-07-05 2006-04-11 Synopsys, Inc. Standard cell design incorporating phase information
US6777141B2 (en) 2000-07-05 2004-08-17 Numerical Technologies, Inc. Phase shift mask including sub-resolution assist features for isolated spaces
US6811935B2 (en) * 2000-07-05 2004-11-02 Numerical Technologies, Inc. Phase shift mask layout process for patterns including intersecting line segments
US6503666B1 (en) * 2000-07-05 2003-01-07 Numerical Technologies, Inc. Phase shift masking for complex patterns
US6866971B2 (en) 2000-09-26 2005-03-15 Synopsys, Inc. Full phase shifting mask in damascene process
US6901575B2 (en) 2000-10-25 2005-05-31 Numerical Technologies, Inc. Resolving phase-shift conflicts in layouts using weighted links between phase shifters
US6584610B1 (en) 2000-10-25 2003-06-24 Numerical Technologies, Inc. Incrementally resolved phase-shift conflicts in layouts for phase-shifted features
US6622288B1 (en) 2000-10-25 2003-09-16 Numerical Technologies, Inc. Conflict sensitive compaction for resolving phase-shift conflicts in layouts for phase-shifted features
US6635393B2 (en) 2001-03-23 2003-10-21 Numerical Technologies, Inc. Blank for alternating PSM photomask with charge dissipation layer
US6553560B2 (en) * 2001-04-03 2003-04-22 Numerical Technologies, Inc. Alleviating line end shortening in transistor endcaps by extending phase shifters
US6566019B2 (en) 2001-04-03 2003-05-20 Numerical Technologies, Inc. Using double exposure effects during phase shifting to control line end shortening
US6573010B2 (en) 2001-04-03 2003-06-03 Numerical Technologies, Inc. Method and apparatus for reducing incidental exposure by using a phase shifter with a variable regulator
US6569583B2 (en) 2001-05-04 2003-05-27 Numerical Technologies, Inc. Method and apparatus for using phase shifter cutbacks to resolve phase shifter conflicts
US6593038B2 (en) 2001-05-04 2003-07-15 Numerical Technologies, Inc. Method and apparatus for reducing color conflicts during trim generation for phase shifters
KR100498442B1 (ko) * 2001-05-23 2005-07-01 삼성전자주식회사 광 마스크 세트 및 그의 제조 방법
US6852471B2 (en) * 2001-06-08 2005-02-08 Numerical Technologies, Inc. Exposure control for phase shifting photolithographic masks
US6721938B2 (en) 2001-06-08 2004-04-13 Numerical Technologies, Inc. Optical proximity correction for phase shifting photolithographic masks
US7178128B2 (en) * 2001-07-13 2007-02-13 Synopsys Inc. Alternating phase shift mask design conflict resolution
US6523165B2 (en) 2001-07-13 2003-02-18 Numerical Technologies, Inc. Alternating phase shift mask design conflict resolution
US6664009B2 (en) 2001-07-27 2003-12-16 Numerical Technologies, Inc. Method and apparatus for allowing phase conflicts in phase shifting mask and chromeless phase edges
US6738958B2 (en) 2001-09-10 2004-05-18 Numerical Technologies, Inc. Modifying a hierarchical representation of a circuit to process composite gates
US6698007B2 (en) 2001-10-09 2004-02-24 Numerical Technologies, Inc. Method and apparatus for resolving coloring conflicts between phase shifters
US6981240B2 (en) 2001-11-15 2005-12-27 Synopsys, Inc. Cutting patterns for full phase shifting masks
US6749970B2 (en) 2001-12-11 2004-06-15 Advanced Micro Devices, Inc. Method of enhancing clear field phase shift masks with border regions around phase 0 and phase 180 regions
US7122281B2 (en) * 2002-02-26 2006-10-17 Synopsys, Inc. Critical dimension control using full phase and trim masks
US6605481B1 (en) 2002-03-08 2003-08-12 Numerical Technologies, Inc. Facilitating an adjustable level of phase shifting during an optical lithography process for manufacturing an integrated circuit
JP3813562B2 (ja) * 2002-03-15 2006-08-23 富士通株式会社 半導体装置及びその製造方法
US6704921B2 (en) 2002-04-03 2004-03-09 Numerical Technologies, Inc. Automated flow in PSM phase assignment
US6785879B2 (en) * 2002-06-11 2004-08-31 Numerical Technologies, Inc. Model-based data conversion
US6821689B2 (en) 2002-09-16 2004-11-23 Numerical Technologies Using second exposure to assist a PSM exposure in printing a tight space adjacent to large feature
KR100462887B1 (ko) * 2002-10-22 2004-12-17 삼성전자주식회사 필드 게이트 이미지의 폭을 보강하는 위상 에지 위상 변이마스크 및 제조방법
US7135255B2 (en) * 2003-03-31 2006-11-14 International Business Machines Corporation Layout impact reduction with angled phase shapes
US6993741B2 (en) * 2003-07-15 2006-01-31 International Business Machines Corporation Generating mask patterns for alternating phase-shift mask lithography
US7279209B2 (en) * 2003-12-05 2007-10-09 Ricoh Electronics, Inc. Runnable splice
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US7071085B1 (en) 2004-05-25 2006-07-04 Advanced Micro Devices, Inc. Predefined critical spaces in IC patterning to reduce line end pull back
US7617473B2 (en) 2005-01-21 2009-11-10 International Business Machines Corporation Differential alternating phase shift mask optimization
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JP5833437B2 (ja) * 2011-12-29 2015-12-16 ルネサスエレクトロニクス株式会社 シミュレーション装置およびシミュレーションプログラム

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US5538833A (en) * 1994-08-03 1996-07-23 International Business Machines Corporation High resolution phase edge lithography without the need for a trim mask
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Also Published As

Publication number Publication date
JP2006178498A (ja) 2006-07-06
AU6388700A (en) 2001-04-30
DE60031429D1 (de) 2006-11-30
JP2003510652A (ja) 2003-03-18
US20020081500A1 (en) 2002-06-27
EP1218798B1 (de) 2006-10-18
US6455205B1 (en) 2002-09-24
DE60031429T2 (de) 2007-08-30
US6335128B1 (en) 2002-01-01
KR100473197B1 (ko) 2005-03-10
KR20020041814A (ko) 2002-06-03
JP4218972B2 (ja) 2009-02-04
WO2001023961A1 (en) 2001-04-05
EP1218798A1 (de) 2002-07-03
JP3916462B2 (ja) 2007-05-16

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