ATE285386T1 - Glas-keramik-zusammensetzung, glas-keramik gesintertes material und keramischs mehrschichtsubstrat - Google Patents

Glas-keramik-zusammensetzung, glas-keramik gesintertes material und keramischs mehrschichtsubstrat

Info

Publication number
ATE285386T1
ATE285386T1 AT03010831T AT03010831T ATE285386T1 AT E285386 T1 ATE285386 T1 AT E285386T1 AT 03010831 T AT03010831 T AT 03010831T AT 03010831 T AT03010831 T AT 03010831T AT E285386 T1 ATE285386 T1 AT E285386T1
Authority
AT
Austria
Prior art keywords
ceramic
glass
layer substrate
sintered material
ceramic composition
Prior art date
Application number
AT03010831T
Other languages
English (en)
Inventor
Sadaaki Sakamoto
Original Assignee
Murata Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co filed Critical Murata Manufacturing Co
Application granted granted Critical
Publication of ATE285386T1 publication Critical patent/ATE285386T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/46—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
    • H01B3/12—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances ceramics
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C14/00—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix
    • C03C14/004—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix the non-glass component being in the form of particles or flakes
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09672—Superposed layout, i.e. in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Dispersion Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Structural Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Glass Compositions (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
  • Inorganic Insulating Materials (AREA)
AT03010831T 2002-05-23 2003-05-14 Glas-keramik-zusammensetzung, glas-keramik gesintertes material und keramischs mehrschichtsubstrat ATE285386T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002149546A JP3988533B2 (ja) 2002-05-23 2002-05-23 ガラスセラミック組成物、ガラスセラミック、およびセラミック多層基板

Publications (1)

Publication Number Publication Date
ATE285386T1 true ATE285386T1 (de) 2005-01-15

Family

ID=29397914

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03010831T ATE285386T1 (de) 2002-05-23 2003-05-14 Glas-keramik-zusammensetzung, glas-keramik gesintertes material und keramischs mehrschichtsubstrat

Country Status (7)

Country Link
US (1) US6924245B2 (de)
EP (1) EP1364921B1 (de)
JP (1) JP3988533B2 (de)
KR (1) KR100485736B1 (de)
CN (1) CN1212996C (de)
AT (1) ATE285386T1 (de)
DE (1) DE60300230T2 (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4293553B2 (ja) * 2005-05-31 2009-07-08 Ｔｄｋ株式会社 積層型電子部品及び積層セラミックコンデンサ
KR101469997B1 (ko) * 2008-06-25 2014-12-10 엘지이노텍 주식회사 다층 기판 및 그 제조방법
CN102050627B (zh) * 2009-10-27 2013-03-06 复旦大学 结构色陶瓷的制备方法
WO2012119750A1 (de) * 2011-03-07 2012-09-13 Schott Ag Glassystem zum hermetischen verbund von cu bauteilen sowie gehäuse für elektronische bauteile
JP5897944B2 (ja) * 2012-03-22 2016-04-06 日本碍子株式会社 積層焼結セラミックインターポーザ、及び当該積層焼結セラミックインターポーザを含む半導体パッケージ
JP5893975B2 (ja) * 2012-03-22 2016-03-23 日本碍子株式会社 積層焼結セラミック配線基板、及び当該配線基板を含む半導体パッケージ
CN102627456B (zh) * 2012-04-23 2014-06-25 江苏大学 一种低损耗高压陶瓷电容器介质
WO2014061069A1 (ja) * 2012-10-19 2014-04-24 株式会社岡崎製作所 極低温用測温抵抗体素子
JPWO2015076121A1 (ja) * 2013-11-20 2017-03-16 株式会社村田製作所 多層配線基板およびこれを備えるプローブカード
JP6451406B2 (ja) * 2014-03-04 2019-01-16 Tdk株式会社 誘電体組成物
EP3247181B1 (de) * 2015-01-13 2025-02-19 Niterra Co., Ltd. Herstellungsverfahren für eine leiterplatte
CN105084527B (zh) * 2015-08-04 2017-04-26 中广核宏达环境科技有限责任公司 一种生活污水净化用生物填料及其制备方法
CN107898126A (zh) * 2017-11-29 2018-04-13 浙江大学 一种复合型除垢牙刷丝及其制备方法
CN108030228A (zh) * 2017-11-29 2018-05-15 浙江大学 一种除垢牙刷丝及其制备方法
PL3887329T3 (pl) 2018-11-26 2024-06-03 Owens Corning Intellectual Capital, Llc Wysokowydajna kompozycja włókna szklanego o ulepszonym module sprężystości
US11524918B2 (en) 2018-11-26 2022-12-13 Owens Corning Intellectual Capital, Llc High performance fiberglass composition with improved specific modulus
CN111925190B (zh) * 2020-07-02 2022-06-10 杭州电子科技大学 Mg3B2O6-CaTiO3复合微波介电陶瓷材料及制备方法
CN120441198B (zh) * 2025-07-09 2025-09-09 景德镇陶瓷大学 一种具有微纳结构粗糙平面构筑的自清洁生料陶瓷釉的制备方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1177681A (en) * 1967-03-10 1970-01-14 Matsushita Electric Industrial Co Ltd Improvements in and relating to Dielectric Materials
US3676351A (en) * 1967-03-27 1972-07-11 Matsushita Electric Industrial Co Ltd Ceramic dielectric comprising calcium titanosilicate
US3785837A (en) * 1972-06-14 1974-01-15 Du Pont Partially crystallizable glasses for producing low-k crossover dielectrics
US3787219A (en) * 1972-09-22 1974-01-22 Du Pont CaTiO{11 -CRYSTALLIZABLE GLASS DIELECTRIC COMPOSITIONS
JP2539169B2 (ja) * 1993-12-03 1996-10-02 松下電器産業株式会社 ガラスセラミックス組成物
JP2741842B2 (ja) * 1994-10-25 1998-04-22 インターナショナル・ビジネス・マシーンズ・コーポレイション バッテリーの着脱機構
US5801108A (en) * 1996-09-11 1998-09-01 Motorola Inc. Low temperature cofireable dielectric paste
JP2000264724A (ja) * 1999-03-18 2000-09-26 Murata Mfg Co Ltd 誘電体セラミック組成物及びセラミック多層基板
US6447888B2 (en) * 2000-01-31 2002-09-10 Kyocera Corporation Ceramic wiring board
JP2002020163A (ja) * 2000-06-29 2002-01-23 Kyocera Corp ガラスセラミック焼結体及びそれを用いた多層配線基板
GB2580112A (en) 2018-12-21 2020-07-15 Millfield Terminations Ltd Termination assembly for retaining a tension member

Also Published As

Publication number Publication date
JP2003342063A (ja) 2003-12-03
DE60300230D1 (de) 2005-01-27
US20030220185A1 (en) 2003-11-27
US6924245B2 (en) 2005-08-02
EP1364921A1 (de) 2003-11-26
CN1482097A (zh) 2004-03-17
KR100485736B1 (ko) 2005-04-28
DE60300230T2 (de) 2005-06-23
KR20030091042A (ko) 2003-12-01
JP3988533B2 (ja) 2007-10-10
EP1364921B1 (de) 2004-12-22
CN1212996C (zh) 2005-08-03

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