ATE280204T1 - Nicht-korrodierende entfernungs-und reinigungs- zusammensetzung - Google Patents
Nicht-korrodierende entfernungs-und reinigungs- zusammensetzungInfo
- Publication number
- ATE280204T1 ATE280204T1 AT99940900T AT99940900T ATE280204T1 AT E280204 T1 ATE280204 T1 AT E280204T1 AT 99940900 T AT99940900 T AT 99940900T AT 99940900 T AT99940900 T AT 99940900T AT E280204 T1 ATE280204 T1 AT E280204T1
- Authority
- AT
- Austria
- Prior art keywords
- cleaning composition
- corrodive
- removal
- alkanolamine
- solvent
- Prior art date
Links
- 238000004140 cleaning Methods 0.000 title abstract 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 abstract 1
- 230000009972 noncorrosive effect Effects 0.000 abstract 1
- 229920002120 photoresistant polymer Polymers 0.000 abstract 1
- 239000002904 solvent Substances 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/261—Alcohols; Phenols
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/265—Carboxylic acids or salts thereof
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D9/00—Chemical paint or ink removers
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3218—Alkanolamines or alkanolimines
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
- C11D7/5004—Organic solvents
- C11D7/5009—Organic solvents containing phosphorus, sulfur or silicon, e.g. dimethylsulfoxide
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
- C11D7/5004—Organic solvents
- C11D7/5013—Organic solvents containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
- C11D7/5004—Organic solvents
- C11D7/5022—Organic solvents containing oxygen
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
- G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
- G03F7/426—Stripping or agents therefor using liquids only containing organic halogen compounds; containing organic sulfonic acids or salts thereof; containing sulfoxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02082—Cleaning product to be cleaned
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/264—Aldehydes; Ketones; Acetals or ketals
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3263—Amides or imides
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3281—Heterocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/34—Organic compounds containing sulfur
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Emergency Medicine (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Detergent Compositions (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Paints Or Removers (AREA)
- Weting (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/135,809 US6268323B1 (en) | 1997-05-05 | 1998-08-18 | Non-corrosive stripping and cleaning composition |
| PCT/US1999/017749 WO2000011091A1 (en) | 1998-08-18 | 1999-08-05 | Non-corrosive stripping and cleaning composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE280204T1 true ATE280204T1 (de) | 2004-11-15 |
Family
ID=22469785
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT99940900T ATE280204T1 (de) | 1998-08-18 | 1999-08-05 | Nicht-korrodierende entfernungs-und reinigungs- zusammensetzung |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US6268323B1 (de) |
| EP (1) | EP1129145B1 (de) |
| JP (2) | JP3796622B2 (de) |
| KR (1) | KR20010072673A (de) |
| AT (1) | ATE280204T1 (de) |
| DE (1) | DE69921350T2 (de) |
| TW (1) | TW552481B (de) |
| WO (1) | WO2000011091A1 (de) |
Families Citing this family (81)
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|---|---|---|---|---|
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| US20040134873A1 (en) * | 1996-07-25 | 2004-07-15 | Li Yao | Abrasive-free chemical mechanical polishing composition and polishing process containing same |
| US6268323B1 (en) * | 1997-05-05 | 2001-07-31 | Arch Specialty Chemicals, Inc. | Non-corrosive stripping and cleaning composition |
| DE19744434A1 (de) * | 1997-10-08 | 1999-04-15 | Weigert Chem Fab | Reinigungsmittel für chirurgische Instrumente |
| DK1105778T3 (da) | 1998-05-18 | 2009-10-19 | Mallinckrodt Baker Inc | Silikatholdige alkaliske sammensætninger til rensning af mikorelektroniske substrater |
| US7579308B2 (en) * | 1998-07-06 | 2009-08-25 | Ekc/Dupont Electronics Technologies | Compositions and processes for photoresist stripping and residue removal in wafer level packaging |
| DE69927181T2 (de) * | 1998-12-04 | 2006-07-20 | The Farrow System Ltd., Great Yarmouth | Methode um überzüge von oberflächen zu entfernen |
| KR20010080533A (ko) * | 1999-09-24 | 2001-08-22 | 미우라 유이찌, 쓰지 가오루 | 세정제 |
| EP1967595A3 (de) * | 2000-02-16 | 2008-12-03 | Illumina, Inc. | Paralleles Genotypisieren von mehreren Patientenproben |
| JP2002075993A (ja) * | 2000-06-15 | 2002-03-15 | Mitsubishi Electric Corp | 半導体装置の製造方法 |
| US6455479B1 (en) * | 2000-08-03 | 2002-09-24 | Shipley Company, L.L.C. | Stripping composition |
| US6498131B1 (en) | 2000-08-07 | 2002-12-24 | Ekc Technology, Inc. | Composition for cleaning chemical mechanical planarization apparatus |
| US6558879B1 (en) * | 2000-09-25 | 2003-05-06 | Ashland Inc. | Photoresist stripper/cleaner compositions containing aromatic acid inhibitors |
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| JP4634718B2 (ja) | 2002-04-25 | 2011-02-16 | フジフィルム・エレクトロニック・マテリアルズ・ユーエスエイ・インコーポレイテッド | エッチング残留物を除去するための非腐食性洗浄組成物 |
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| CN103160161B (zh) * | 2011-12-16 | 2015-06-17 | 天津立昌科技有限公司 | 一种漆膜剥离剂 |
| CN103631101B (zh) * | 2012-08-22 | 2018-01-09 | 得凯莫斯公司弗罗里达有限公司 | 包含含氟表面活性剂的光阻剥除剂 |
| US9434910B2 (en) | 2013-01-16 | 2016-09-06 | Jelmar, Llc | Mold and mildew stain removing solution |
| US9873854B2 (en) | 2013-01-16 | 2018-01-23 | Jelmar, Llc | Stain removing solution |
| CN103571670A (zh) * | 2013-10-31 | 2014-02-12 | 合肥中南光电有限公司 | 一种光伏电池硅片清洗剂及其制备方法 |
| CN103571644A (zh) * | 2013-10-31 | 2014-02-12 | 合肥中南光电有限公司 | 一种水基硅片清洗剂及其制备方法 |
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| JP2015207712A (ja) * | 2014-04-22 | 2015-11-19 | 三菱電機株式会社 | 洗浄液、洗浄設備、および実装基板の洗浄方法 |
| US9957469B2 (en) | 2014-07-14 | 2018-05-01 | Versum Materials Us, Llc | Copper corrosion inhibition system |
| US10168805B2 (en) | 2014-08-18 | 2019-01-01 | 3M Innovative Properties Company | Conductive layered structure and methods of making same |
| KR102886380B1 (ko) * | 2019-07-15 | 2025-11-13 | 버슘머트리얼즈 유에스, 엘엘씨 | 에칭 잔류물 제거용 조성물, 이의 사용 방법 및 용도 |
| WO2021049330A1 (ja) * | 2019-09-11 | 2021-03-18 | 富士フイルム株式会社 | 処理液、処理方法 |
| WO2021067147A1 (en) | 2019-09-30 | 2021-04-08 | Versum Materials Us, Llc | Photoresist remover |
| KR102334425B1 (ko) * | 2019-11-21 | 2021-12-01 | 엘티씨 (주) | 디스플레이 제조용 포토레지스트 박리액 조성물 |
| WO2025086185A1 (en) * | 2023-10-26 | 2025-05-01 | Dow Global Technologies Llc | Solvent mixture |
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-
1998
- 1998-08-18 US US09/135,809 patent/US6268323B1/en not_active Expired - Lifetime
-
1999
- 1999-08-05 JP JP2000566353A patent/JP3796622B2/ja not_active Expired - Fee Related
- 1999-08-05 WO PCT/US1999/017749 patent/WO2000011091A1/en not_active Ceased
- 1999-08-05 AT AT99940900T patent/ATE280204T1/de not_active IP Right Cessation
- 1999-08-05 EP EP99940900A patent/EP1129145B1/de not_active Expired - Lifetime
- 1999-08-05 DE DE69921350T patent/DE69921350T2/de not_active Expired - Lifetime
- 1999-08-05 KR KR1020017001956A patent/KR20010072673A/ko not_active Ceased
- 1999-08-07 TW TW088113522A patent/TW552481B/zh active
-
2001
- 2001-06-07 US US09/876,635 patent/US6372050B2/en not_active Expired - Lifetime
-
2006
- 2006-01-31 JP JP2006021917A patent/JP2006146272A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP3796622B2 (ja) | 2006-07-12 |
| EP1129145A1 (de) | 2001-09-05 |
| JP2006146272A (ja) | 2006-06-08 |
| WO2000011091A1 (en) | 2000-03-02 |
| US6372050B2 (en) | 2002-04-16 |
| US20010034313A1 (en) | 2001-10-25 |
| US6268323B1 (en) | 2001-07-31 |
| EP1129145A4 (de) | 2001-11-21 |
| KR20010072673A (ko) | 2001-07-31 |
| DE69921350T2 (de) | 2006-02-16 |
| JP2002523546A (ja) | 2002-07-30 |
| EP1129145B1 (de) | 2004-10-20 |
| TW552481B (en) | 2003-09-11 |
| DE69921350D1 (de) | 2004-11-25 |
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| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |