ATE259276T1 - Fensterloses polierband und verfahren zum vor-ort überwachen einer halbleiterscheibe - Google Patents

Fensterloses polierband und verfahren zum vor-ort überwachen einer halbleiterscheibe

Info

Publication number
ATE259276T1
ATE259276T1 AT00954098T AT00954098T ATE259276T1 AT E259276 T1 ATE259276 T1 AT E259276T1 AT 00954098 T AT00954098 T AT 00954098T AT 00954098 T AT00954098 T AT 00954098T AT E259276 T1 ATE259276 T1 AT E259276T1
Authority
AT
Austria
Prior art keywords
polishing belt
site monitoring
semiconductor disc
windowless
belt
Prior art date
Application number
AT00954098T
Other languages
English (en)
Inventor
Cangshan Xu
Brian S Lombardo
Rajeev Bajaj
Rahul K Surana
Original Assignee
Lam Res Corp
Scapa Group Plc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Corp, Scapa Group Plc filed Critical Lam Res Corp
Application granted granted Critical
Publication of ATE259276T1 publication Critical patent/ATE259276T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/008—Finishing manufactured abrasive sheets, e.g. cutting, deforming

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
AT00954098T 1999-08-31 2000-08-16 Fensterloses polierband und verfahren zum vor-ort überwachen einer halbleiterscheibe ATE259276T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/386,745 US20020090819A1 (en) 1999-08-31 1999-08-31 Windowless belt and method for improved in-situ wafer monitoring
PCT/US2000/022429 WO2001015863A1 (en) 1999-08-31 2000-08-16 Windowless belt and method for in-situ wafer monitoring

Publications (1)

Publication Number Publication Date
ATE259276T1 true ATE259276T1 (de) 2004-02-15

Family

ID=23526875

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00954098T ATE259276T1 (de) 1999-08-31 2000-08-16 Fensterloses polierband und verfahren zum vor-ort überwachen einer halbleiterscheibe

Country Status (8)

Country Link
US (1) US20020090819A1 (de)
EP (1) EP1214174B1 (de)
JP (1) JP2003521811A (de)
KR (1) KR20020038740A (de)
AT (1) ATE259276T1 (de)
DE (1) DE60008259T2 (de)
TW (1) TW474849B (de)
WO (1) WO2001015863A1 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001074535A1 (en) * 2000-03-31 2001-10-11 Lam Research Corporation Fixed abrasive linear polishing belt and system using the same
US6609961B2 (en) 2001-01-09 2003-08-26 Lam Research Corporation Chemical mechanical planarization belt assembly and method of assembly
US6612902B1 (en) 2001-03-29 2003-09-02 Lam Research Corporation Method and apparatus for end point triggering with integrated steering
US6913517B2 (en) 2002-05-23 2005-07-05 Cabot Microelectronics Corporation Microporous polishing pads
US7267607B2 (en) 2002-10-28 2007-09-11 Cabot Microelectronics Corporation Transparent microporous materials for CMP
US7435165B2 (en) 2002-10-28 2008-10-14 Cabot Microelectronics Corporation Transparent microporous materials for CMP
US7311862B2 (en) 2002-10-28 2007-12-25 Cabot Microelectronics Corporation Method for manufacturing microporous CMP materials having controlled pore size
US8075372B2 (en) 2004-09-01 2011-12-13 Cabot Microelectronics Corporation Polishing pad with microporous regions
US8439723B2 (en) * 2008-08-11 2013-05-14 Applied Materials, Inc. Chemical mechanical polisher with heater and method
DE102009040964A1 (de) * 2009-09-11 2011-03-24 Sgl Carbon Se Seil
US10099339B2 (en) * 2016-06-02 2018-10-16 Semiconductor Manufacturing International (Shanghai) Corporation Chemical mechanical polishing (CMP) apparatus and method
CN108555738B (zh) * 2018-07-04 2023-11-24 苏州市相城区宏达电子有限公司 一种金属材料定向打磨装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6146248A (en) * 1997-05-28 2000-11-14 Lam Research Corporation Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher
US6736714B2 (en) * 1997-07-30 2004-05-18 Praxair S.T. Technology, Inc. Polishing silicon wafers

Also Published As

Publication number Publication date
EP1214174A1 (de) 2002-06-19
DE60008259D1 (de) 2004-03-18
DE60008259T2 (de) 2005-04-14
EP1214174B1 (de) 2004-02-11
US20020090819A1 (en) 2002-07-11
WO2001015863A1 (en) 2001-03-08
KR20020038740A (ko) 2002-05-23
TW474849B (en) 2002-02-01
JP2003521811A (ja) 2003-07-15

Similar Documents

Publication Publication Date Title
DE69509561T2 (de) Verfahren und Vorrichtung zum Abfasen von Halbleiterscheiben
DE59704120D1 (de) Verfahren und Vorrichtung zum Polieren von Halbleiterscheiben
DE69607547D1 (de) Verfahren und Vorrichtung zum Polieren von Halbleiterscheiben
DE69419479D1 (de) Verfahren zum Schleifen von Halbleiterwafern und Gerät dafür
DE60014994D1 (de) Verfahren und Vorrichtung zum Polieren von Halbleiterscheiben
DE69119367T2 (de) Befestigungsmethode und -einrichtung für Wafer
ATE259276T1 (de) Fensterloses polierband und verfahren zum vor-ort überwachen einer halbleiterscheibe
DE60316575D1 (de) Verfahren und vorrichtung zum aufnehmen von halbleiterchips sowie dazu verwendbares saugung ablöswerkzeug
DE69713108T2 (de) Schleifvorrichtung zum modifizieren von halbleiterwafer
ATA2998A (de) Verfahren und vorrichtung zum ausgerichteten zusammenführen von scheibenförmigen halbleitersubstraten
EP0494311A4 (en) Method of inspecting semiconductor device, apparatus for inspecting the same, and method of manufacturing the same
DE69521579D1 (de) Herstellungsverfahren für MOS-Halbleiterbauelement
DE69615603D1 (de) Vorrichtung und Verfahren zum Reinigen von Halbleiterplättchen
DE68914479D1 (de) Randbelichtungsverfahren für Halbleiterscheiben.
DE69800756D1 (de) Verfahren und Vorrichtung zum Detektieren, Überwachung und Charakterisierung von Kantendefekten in Halbleiterscheiben
DE69428618D1 (de) Thermischer Reaktor für Operationen zur Bearbeitung von Halbleiter-Wafer
DE69416771D1 (de) Inspektionsapparat für Halbleiterscheiben
DE69414534T2 (de) Bonding-Verfahren für Silizium-Wafer
DE60103701D1 (de) Verfahren und Vorrichtung zum schleifen von Halbleiterscheiben
DE69711994T2 (de) Verfahren und Vorrichtung zum Regeln der Planheit von polierten Halbleiterscheiben
DE69618882T2 (de) Verfahren und Vorrichtung zum Polieren von Halbleitersubstraten
DE69703312T2 (de) Vorrichtung und Verfahren zum Polieren von Halbleiterscheiben
ATE461799T1 (de) Verringerung von anziehungskräften zwischen siliziumscheiben
EP0468213A3 (en) Semiconductor substrate, method of manufacturing semiconductor substrate and semiconductor device, and method of inspecting and evaluating semiconductor substrate
DE69019309T2 (de) Apparat zur Beurteilung von Halbleiterplättchen.

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties