ATE257053T1 - Vorrichtung zum aufbringen eines materials auf einem substrat - Google Patents

Vorrichtung zum aufbringen eines materials auf einem substrat

Info

Publication number
ATE257053T1
ATE257053T1 AT98956382T AT98956382T ATE257053T1 AT E257053 T1 ATE257053 T1 AT E257053T1 AT 98956382 T AT98956382 T AT 98956382T AT 98956382 T AT98956382 T AT 98956382T AT E257053 T1 ATE257053 T1 AT E257053T1
Authority
AT
Austria
Prior art keywords
chamber
frame
viscous material
substrate
dispenser
Prior art date
Application number
AT98956382T
Other languages
English (en)
Inventor
Gary T Freeman
Robert J Balog
Mark Rossmeisl
Original Assignee
Speedline Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Speedline Technologies Inc filed Critical Speedline Technologies Inc
Application granted granted Critical
Publication of ATE257053T1 publication Critical patent/ATE257053T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0692—Solder baths with intermediary means for bringing solder on workpiece, e.g. rollers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3485—Application of solder paste, slurry or powder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Screen Printers (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
AT98956382T 1997-11-07 1998-10-30 Vorrichtung zum aufbringen eines materials auf einem substrat ATE257053T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/966,057 US5947022A (en) 1997-11-07 1997-11-07 Apparatus for dispensing material in a printer
PCT/US1998/023089 WO1999024211A1 (en) 1997-11-07 1998-10-30 Method and apparatus for dispensing materials on a substrate

Publications (1)

Publication Number Publication Date
ATE257053T1 true ATE257053T1 (de) 2004-01-15

Family

ID=25510864

Family Applications (1)

Application Number Title Priority Date Filing Date
AT98956382T ATE257053T1 (de) 1997-11-07 1998-10-30 Vorrichtung zum aufbringen eines materials auf einem substrat

Country Status (5)

Country Link
US (1) US5947022A (de)
EP (2) EP1035940B1 (de)
AT (1) ATE257053T1 (de)
DE (1) DE69820905T2 (de)
WO (1) WO1999024211A1 (de)

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US6324973B2 (en) 1997-11-07 2001-12-04 Speedline Technologies, Inc. Method and apparatus for dispensing material in a printer
US6453810B1 (en) 1997-11-07 2002-09-24 Speedline Technologies, Inc. Method and apparatus for dispensing material in a printer
GB9903146D0 (en) * 1998-09-10 1999-04-07 Williams David G Method and apparatus for applying a viscous or paste material onto a substrate
JP3058454U (ja) * 1998-10-14 1999-06-18 谷電機工業株式会社 印刷用ペースト供給装置
DE19854494C2 (de) * 1998-11-25 2001-07-26 Heidelberger Druckmasch Ag Vorrichtung zur Farbversorgung eines Farbwerkes einer Druckmaschine
US6158338A (en) * 1998-12-22 2000-12-12 Dek Printing Machines Limited Cassette for holding and dispensing a viscous material for use in an apparatus for depositing the viscous material on a substrate
US6957783B1 (en) 1999-01-26 2005-10-25 Dl Technology Llc Dispense tip with vented outlets
US7207498B1 (en) 2000-01-26 2007-04-24 Dl Technology, Llc Fluid dispense tips
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SE518640C2 (sv) * 2000-07-11 2002-11-05 Mydata Automation Ab Förfarande, anordning för applicering av ett visköst medium på ett substrat, anordning för applicering av ytterligare visköst medium samt användningen av screentryckning
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US7249558B2 (en) * 2004-07-15 2007-07-31 Speedline Technologies, Inc. Solder paste dispenser for a stencil printer
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US8128753B2 (en) 2004-11-19 2012-03-06 Massachusetts Institute Of Technology Method and apparatus for depositing LED organic film
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US8331844B2 (en) 2010-04-14 2012-12-11 Xerox Corporation Proof printing using recycled marking material
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JP5408159B2 (ja) * 2011-03-09 2014-02-05 パナソニック株式会社 スクリーン印刷装置およびスクリーン印刷方法
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JP6051411B2 (ja) * 2013-12-27 2016-12-27 パナソニックＩｐマネジメント株式会社 ペースト供給装置、スクリーン印刷機及びペースト供給方法
KR102669753B1 (ko) 2014-01-21 2024-05-28 카티바, 인크. 전자 장치 인캡슐레이션을 위한 기기 및 기술
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Also Published As

Publication number Publication date
WO1999024211A1 (en) 1999-05-20
EP1035940A1 (de) 2000-09-20
US5947022A (en) 1999-09-07
DE69820905D1 (de) 2004-02-05
EP1410866A2 (de) 2004-04-21
EP1035940B1 (de) 2004-01-02
DE69820905T2 (de) 2004-12-30

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