ATE356535T1 - Verfahren und vorrichtung zum aufbringen von viskosem oder pastösem material auf ein substrat - Google Patents

Verfahren und vorrichtung zum aufbringen von viskosem oder pastösem material auf ein substrat

Info

Publication number
ATE356535T1
ATE356535T1 AT01915542T AT01915542T ATE356535T1 AT E356535 T1 ATE356535 T1 AT E356535T1 AT 01915542 T AT01915542 T AT 01915542T AT 01915542 T AT01915542 T AT 01915542T AT E356535 T1 ATE356535 T1 AT E356535T1
Authority
AT
Austria
Prior art keywords
reservoir
fluid
inlet
applicator device
extending
Prior art date
Application number
AT01915542T
Other languages
English (en)
Inventor
David Godfrey Williams
Original Assignee
Dek Int Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GB0008207A external-priority patent/GB0008207D0/en
Priority claimed from GB0019781A external-priority patent/GB0019781D0/en
Application filed by Dek Int Gmbh filed Critical Dek Int Gmbh
Application granted granted Critical
Publication of ATE356535T1 publication Critical patent/ATE356535T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41P—INDEXING SCHEME RELATING TO PRINTING, LINING MACHINES, TYPEWRITERS, AND TO STAMPS
    • B41P2215/00—Screen printing machines
    • B41P2215/10—Screen printing machines characterised by their constructional features
    • B41P2215/13—Devices for increasing ink penetration
    • B41P2215/132—Devices for increasing ink penetration by increasing pressure above the screen
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Screen Printers (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
AT01915542T 2000-04-04 2001-03-30 Verfahren und vorrichtung zum aufbringen von viskosem oder pastösem material auf ein substrat ATE356535T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB0008207A GB0008207D0 (en) 2000-04-04 2000-04-04 Method and apparatus for applying viscous or paste material onto a substrate
GB0019781A GB0019781D0 (en) 2000-04-04 2000-08-14 Adaptor device for an applicator device with reservoir for solder paste

Publications (1)

Publication Number Publication Date
ATE356535T1 true ATE356535T1 (de) 2007-03-15

Family

ID=26244036

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01915542T ATE356535T1 (de) 2000-04-04 2001-03-30 Verfahren und vorrichtung zum aufbringen von viskosem oder pastösem material auf ein substrat

Country Status (7)

Country Link
US (1) US7040523B2 (de)
EP (1) EP1273213B1 (de)
AT (1) ATE356535T1 (de)
AU (1) AU2001242627A1 (de)
DE (1) DE60127108T2 (de)
GB (1) GB2364669A (de)
WO (1) WO2001076333A1 (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3700584B2 (ja) * 2001-01-25 2005-09-28 松下電器産業株式会社 スクリーン印刷装置およびスクリーン印刷方法
US6793733B2 (en) * 2002-01-25 2004-09-21 Applied Materials Inc. Gas distribution showerhead
US7431967B2 (en) 2002-09-19 2008-10-07 Applied Materials, Inc. Limited thermal budget formation of PMD layers
US7456116B2 (en) 2002-09-19 2008-11-25 Applied Materials, Inc. Gap-fill depositions in the formation of silicon containing dielectric materials
US7141483B2 (en) 2002-09-19 2006-11-28 Applied Materials, Inc. Nitrous oxide anneal of TEOS/ozone CVD for improved gapfill
US7642171B2 (en) 2004-08-04 2010-01-05 Applied Materials, Inc. Multi-step anneal of thin films for film densification and improved gap-fill
US8011563B2 (en) * 2006-04-05 2011-09-06 International Business Machines Corporation Compliant mold fill head with integrated cavity venting and solder cooling
JP2010507913A (ja) * 2006-10-24 2010-03-11 コミサリア、ア、レネルジ、アトミク−セーエーアー メタライゼーション装置および方法
US20100317147A1 (en) * 2006-10-24 2010-12-16 Commissariat A L'energie Atomique Metallizing device and method
JP5836018B2 (ja) * 2011-08-31 2015-12-24 日立オートモティブシステムズ株式会社 マスタシリンダのシール組付方法およびシール組付装置
RU2592790C9 (ru) 2012-06-25 2017-07-06 3М Инновейтив Пропертиз Компани Устройства для нанесения покрытия на профилированные поверхности
US9406314B1 (en) 2012-10-04 2016-08-02 Magnecomp Corporation Assembly of DSA suspensions using microactuators with partially cured adhesive, and DSA suspensions having PZTs with wrap-around electrodes
US9018108B2 (en) 2013-01-25 2015-04-28 Applied Materials, Inc. Low shrinkage dielectric films

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4043683A (en) * 1974-06-20 1977-08-23 Loctite Corporation Dispensing and wiping device
US6286422B1 (en) * 1994-12-27 2001-09-11 Visteon Global Tech., Inc. Method and apparatus for dispensing viscous material
FR2754473B1 (fr) 1996-10-15 1999-02-26 Novatec Procede de realisation de depots de produit visqueux et/ou pateux sur un substrat a travers les ouvertures d'un pochoir et dispositif distributeur de produit
EP0844740B1 (de) 1996-11-21 2003-02-26 Matsushita Electric Industrial Co., Ltd. A/D-Wandler und A/D-Wandlungsverfahren
US5947022A (en) * 1997-11-07 1999-09-07 Speedline Technologies, Inc. Apparatus for dispensing material in a printer
JPH11227157A (ja) 1998-02-18 1999-08-24 Fuji Mach Mfg Co Ltd クリーム半田印刷機
JP4255161B2 (ja) * 1998-04-10 2009-04-15 株式会社野田スクリーン 半田バンプ形成装置
GB9903146D0 (en) 1998-09-10 1999-04-07 Williams David G Method and apparatus for applying a viscous or paste material onto a substrate

Also Published As

Publication number Publication date
DE60127108T2 (de) 2007-12-13
EP1273213A1 (de) 2003-01-08
US20030168006A1 (en) 2003-09-11
GB2364669A (en) 2002-02-06
WO2001076333A1 (en) 2001-10-11
EP1273213B1 (de) 2007-03-07
AU2001242627A1 (en) 2001-10-15
DE60127108D1 (de) 2007-04-19
WO2001076333A9 (en) 2002-03-21
US7040523B2 (en) 2006-05-09
GB0107986D0 (en) 2001-05-23

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties