ATE167001T1 - Einrichtung zum handeln von scheibenförmigen objekten in einer handlingebene eines lokalen reinraumes - Google Patents

Einrichtung zum handeln von scheibenförmigen objekten in einer handlingebene eines lokalen reinraumes

Info

Publication number
ATE167001T1
ATE167001T1 AT94911956T AT94911956T ATE167001T1 AT E167001 T1 ATE167001 T1 AT E167001T1 AT 94911956 T AT94911956 T AT 94911956T AT 94911956 T AT94911956 T AT 94911956T AT E167001 T1 ATE167001 T1 AT E167001T1
Authority
AT
Austria
Prior art keywords
handling
clean room
shaped objects
local clean
wafer
Prior art date
Application number
AT94911956T
Other languages
German (de)
English (en)
Inventor
Berndt Lahne
Klaus Schultz
Werner Scheler
Michael Heitmann
Axel Gaglin
Original Assignee
Jenoptik Jena Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jenoptik Jena Gmbh filed Critical Jenoptik Jena Gmbh
Application granted granted Critical
Publication of ATE167001T1 publication Critical patent/ATE167001T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H10P72/0608—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Warehouses Or Storage Devices (AREA)
AT94911956T 1993-03-29 1994-03-25 Einrichtung zum handeln von scheibenförmigen objekten in einer handlingebene eines lokalen reinraumes ATE167001T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4310149A DE4310149C2 (de) 1993-03-29 1993-03-29 Einrichtung zur Handhabung von scheibenförmigen Objekten in einer Handhabungsebene eines lokalen Reinraumes

Publications (1)

Publication Number Publication Date
ATE167001T1 true ATE167001T1 (de) 1998-06-15

Family

ID=6484131

Family Applications (1)

Application Number Title Priority Date Filing Date
AT94911956T ATE167001T1 (de) 1993-03-29 1994-03-25 Einrichtung zum handeln von scheibenförmigen objekten in einer handlingebene eines lokalen reinraumes

Country Status (8)

Country Link
EP (1) EP0642697B1 (enExample)
JP (1) JP2846957B2 (enExample)
KR (1) KR0148415B1 (enExample)
AT (1) ATE167001T1 (enExample)
DE (2) DE4310149C2 (enExample)
SG (1) SG47081A1 (enExample)
TW (1) TW248613B (enExample)
WO (1) WO1994023443A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19535871C2 (de) * 1995-09-27 2000-02-10 Jenoptik Jena Gmbh Indexer für Magazinfächer eines Magazins und darin enthaltene scheibenförmige Objekte
DE19549045C1 (de) * 1995-12-28 1997-06-05 Jenoptik Jena Gmbh Einrichtung zur Handhabung von scheibenförmigen Objekten
US5674039A (en) * 1996-07-12 1997-10-07 Fusion Systems Corporation System for transferring articles between controlled environments
JPH1058367A (ja) * 1996-08-23 1998-03-03 Advantest Corp Ｉｃ搬送装置
DE19729525A1 (de) * 1997-03-11 1998-09-17 Leybold Systems Gmbh Vorrichtung für den Transport von Substraten
DE19813684C2 (de) 1998-03-27 2001-08-16 Brooks Automation Gmbh Einrichtung zur Aufnahme von Transportbehältern an einer Be- und Entladestation
DE19913628A1 (de) * 1999-03-25 2000-10-05 Siemens Ag Anlage zur Fertigung von Halbleiterprodukten
DE19958082A1 (de) 1999-12-02 2001-06-07 Logitex Reinstmedientechnik Gm Überwachungssystem für eine Transportvorrichtung von Flachteilen, insbesondere Wafer-Scheiben
DE10104555B4 (de) * 2001-02-01 2007-11-08 Krauss Maffei Gmbh Lagervorrichtung zum Einsatz in Reinumgebungen
DE10351848A1 (de) 2003-11-06 2005-06-09 Leica Microsystems Semiconductor Gmbh System zur Detektion von Makrodefekten
DE10359722A1 (de) 2003-12-19 2005-07-14 Leica Microsystems Semiconductor Gmbh Verfahren zur Inspektion eines Wafers
DE102004062592B3 (de) 2004-12-24 2006-06-08 Leica Microsystems Jena Gmbh System zur Untersuchung eines scheibenförmigen Substrats
CN102198888A (zh) * 2010-03-26 2011-09-28 株式会社太星技研 空气供应装置

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3972424A (en) * 1973-03-12 1976-08-03 The Computervision Corporation Automatic wafer loading and pre-alignment system
US3923342A (en) * 1974-06-10 1975-12-02 Motorola Inc Apparatus and method for handling frangible objects
JPS5969324A (ja) * 1982-10-12 1984-04-19 Toshiba Seiki Kk マガジンのピツチ送り方法
JPS6083245U (ja) * 1983-11-15 1985-06-08 大日本スクリーン製造株式会社 カセツト式薄片搬出入用薄片検知装置
JPS60120520A (ja) * 1983-12-02 1985-06-28 Canon Inc 半導体製造用搬送装置
JPS61129340U (enExample) * 1985-01-31 1986-08-13
FR2590879A1 (fr) * 1985-11-27 1987-06-05 American Telephone & Telegraph Procede et appareil pour le chargement et le dechargement automatiques de tranches de semi-conducteur
US4746256A (en) * 1986-03-13 1988-05-24 Roboptek, Inc. Apparatus for handling sensitive material such as semiconductor wafers
JPS62222625A (ja) * 1986-03-25 1987-09-30 Shimizu Constr Co Ltd 半導体製造装置
KR100309932B1 (ko) * 1986-04-28 2001-12-15 제임스 엠. 윌리암스 웨이퍼 운반 장치 및 방법
JPH0736418B2 (ja) * 1986-05-19 1995-04-19 富士通株式会社 ウエーハキャリア
JPS6382248A (ja) * 1986-09-26 1988-04-13 Canon Inc 薄板状物品の搬出または搬入装置
US4895486A (en) * 1987-05-15 1990-01-23 Roboptek, Inc. Wafer monitoring device
JP3075561B2 (ja) * 1989-01-27 2000-08-14 日立電子エンジニアリング株式会社 カセット内のウェハ取出し制御方式
US5181819A (en) * 1990-10-09 1993-01-26 Tokyo Electron Sagami Limited Apparatus for processing semiconductors
JPH0536809A (ja) * 1991-07-31 1993-02-12 Mitsubishi Electric Corp 半導体基板処理装置に於ける半導体基板搬送アーム

Also Published As

Publication number Publication date
JP2846957B2 (ja) 1999-01-13
KR950701766A (ko) 1995-04-28
DE4310149A1 (de) 1994-10-06
EP0642697B1 (de) 1998-06-03
WO1994023443A1 (de) 1994-10-13
KR0148415B1 (ko) 1998-12-01
DE59406121D1 (de) 1998-07-09
JPH07503584A (ja) 1995-04-13
EP0642697A1 (de) 1995-03-15
SG47081A1 (en) 1998-03-20
TW248613B (enExample) 1995-06-01
DE4310149C2 (de) 1996-05-02

Similar Documents

Publication Publication Date Title
ATE167001T1 (de) Einrichtung zum handeln von scheibenförmigen objekten in einer handlingebene eines lokalen reinraumes
DE69123508D1 (de) Vorrichtung zur Bearbeitung von Halbleiterscheiben
DE68914479D1 (de) Randbelichtungsverfahren für Halbleiterscheiben.
DE69106285D1 (de) Termische Reaktoranlage zur Bearbeitung von Halbleiterscheiben und Betriebsverfahren eines solchem Reaktors.
JPS55102233A (en) Removing method of dust
ES460416A1 (es) Procedimiento para el apresto antiestatico y antimaculante simultaneo de materiales textiles sinteticos.
EP0138473A3 (en) System for integrated circuit processing
DE59700621D1 (de) Verfahren zur materialabtragenden Bearbeitung der Kante einer Halbleiterscheibe
JPS5210069A (en) Automatic apparatus for cleaning and drying wafer
MY103718A (en) Method and system for inspecting semiconductor devices.
SE8302081D0 (sv) Anordning for successiv hopkoppling av foremal med ett kopplingsorgan
JPS5318967A (en) Wafer sucking jig
DE69229251D1 (de) Einrichtung zur Entölung von Spänen die bei mechanischer Bearbeitung anfallen
FR2528331B1 (enExample)
JPS51138464A (en) Device for detecting relative position of plural articles
JPS5719219A (en) Wafer carrier jig conveyor
JPS5652314A (en) Equipment for conveying parts in regular state
DE69013065D1 (de) Verfahren zum Polieren von Halbleiterplättchen.
DE59204451D1 (de) Verfahren zum flächenhaften Verbinden von Siliziumhalbleiterscheiben.
JPS52156552A (en) Wafer inspection apparatus
JP2007230739A (ja) ストッカ
DE69019270D1 (de) Plasma-Bearbeitung von III-V-Halbleitern, gesteuert bei Photolumineszenz-Spektroskopie.
KR950015630A (ko) 자동 웨이퍼 핸들러를 구비한 다이싱 머신
JPS538061A (en) Automatic positioning apparatus of articles
NL190496C (nl) Belichtingsstelsel voor het achtereenvolgens belichten van halfgeleiderplakken.

Legal Events

Date Code Title Description
REN Ceased due to non-payment of the annual fee