SG47081A1 - Device for handling wafer-shaped objects in a handling plane of a local clean room - Google Patents

Device for handling wafer-shaped objects in a handling plane of a local clean room

Info

Publication number
SG47081A1
SG47081A1 SG1996005812A SG1996005812A SG47081A1 SG 47081 A1 SG47081 A1 SG 47081A1 SG 1996005812 A SG1996005812 A SG 1996005812A SG 1996005812 A SG1996005812 A SG 1996005812A SG 47081 A1 SG47081 A1 SG 47081A1
Authority
SG
Singapore
Prior art keywords
handling
clean room
shaped objects
wafer
plane
Prior art date
Application number
SG1996005812A
Inventor
Axel Gaglin
Berndt Lahne
Klaus Schultz
Original Assignee
Jenoptik Jena Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jenoptik Jena Gmbh filed Critical Jenoptik Jena Gmbh
Publication of SG47081A1 publication Critical patent/SG47081A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Warehouses Or Storage Devices (AREA)

Abstract

In a device for handling wafer-shaped objects in a handling plane of a local clean room, the aim is to ensure the process stages preceding and succeeding the processing and inspection of the wafer-shaped objects in the conditions of a local clean room using SMIF boxes. According to the invention, the structure of the handling plane (H-H) is in a fixed relationship to a reference plane (E-E) of at least one magazine-indexing device (42) comprising the magazine feed (33) according to their magazine compartments (43) and the wafer-shaped objects therein and is arranged above an intermediate floor (9) which divides the clean room into two superimposed parts (10, 11) in which one component of an airstream from the part (10) above the intermediate floor (9) is directed into the part (11) beneath the intermediate floor (9). The invention is applicable in the manufacture of integrated circuits, especially for handling purposes.
SG1996005812A 1993-03-29 1994-03-25 Device for handling wafer-shaped objects in a handling plane of a local clean room SG47081A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4310149A DE4310149C2 (en) 1993-03-29 1993-03-29 Device for handling disc-shaped objects in a handling level of a local clean room

Publications (1)

Publication Number Publication Date
SG47081A1 true SG47081A1 (en) 1998-03-20

Family

ID=6484131

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1996005812A SG47081A1 (en) 1993-03-29 1994-03-25 Device for handling wafer-shaped objects in a handling plane of a local clean room

Country Status (8)

Country Link
EP (1) EP0642697B1 (en)
JP (1) JP2846957B2 (en)
KR (1) KR0148415B1 (en)
AT (1) ATE167001T1 (en)
DE (2) DE4310149C2 (en)
SG (1) SG47081A1 (en)
TW (1) TW248613B (en)
WO (1) WO1994023443A1 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19535871C2 (en) * 1995-09-27 2000-02-10 Jenoptik Jena Gmbh Indexer for magazine compartments of a magazine and disc-shaped objects contained therein
DE19549045C1 (en) * 1995-12-28 1997-06-05 Jenoptik Jena Gmbh Device for handling disc-shaped objects
US5674039A (en) * 1996-07-12 1997-10-07 Fusion Systems Corporation System for transferring articles between controlled environments
JPH1058367A (en) * 1996-08-23 1998-03-03 Advantest Corp Ic carrying device
DE19729525A1 (en) * 1997-03-11 1998-09-17 Leybold Systems Gmbh Device for transportation of circular disc=form substrates, for example digital video discs
DE19813684C2 (en) * 1998-03-27 2001-08-16 Brooks Automation Gmbh Device for receiving transport containers at a loading and unloading station
DE19913628A1 (en) * 1999-03-25 2000-10-05 Siemens Ag Plant for the production of semiconductor products
DE19958082A1 (en) * 1999-12-02 2001-06-07 Logitex Reinstmedientechnik Gm Monitoring system for a transport device for flat parts, in particular wafer slices
DE10104555B4 (en) * 2001-02-01 2007-11-08 Krauss Maffei Gmbh Storage device for use in clean environments
DE10351848A1 (en) 2003-11-06 2005-06-09 Leica Microsystems Semiconductor Gmbh System for the detection of macro defects
DE10359722A1 (en) 2003-12-19 2005-07-14 Leica Microsystems Semiconductor Gmbh Method for inspecting a wafer
DE102004062592B3 (en) * 2004-12-24 2006-06-08 Leica Microsystems Jena Gmbh Disk-shaped substrate testing system, has suction unit arranged at side of housing and spaced from mounting plate, and opening provided in suction unit, where opening has width that corresponds to distance of plate to wall of housing
CN102198888A (en) * 2010-03-26 2011-09-28 株式会社太星技研 Air supply device

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3972424A (en) * 1973-03-12 1976-08-03 The Computervision Corporation Automatic wafer loading and pre-alignment system
US3923342A (en) * 1974-06-10 1975-12-02 Motorola Inc Apparatus and method for handling frangible objects
JPS5969324A (en) * 1982-10-12 1984-04-19 Toshiba Seiki Kk Pitch feed for magazine
JPS6083245U (en) * 1983-11-15 1985-06-08 大日本スクリーン製造株式会社 Thin piece detection device for cassette type thin piece loading/unloading
JPS60120520A (en) * 1983-12-02 1985-06-28 Canon Inc Transporting device for manufacture of semiconductor
JPS61129340U (en) * 1985-01-31 1986-08-13
FR2590879A1 (en) * 1985-11-27 1987-06-05 American Telephone & Telegraph Method and apparatus for automatically loading and unloading semiconductor wafers
US4746256A (en) * 1986-03-13 1988-05-24 Roboptek, Inc. Apparatus for handling sensitive material such as semiconductor wafers
JPS62222625A (en) * 1986-03-25 1987-09-30 Shimizu Constr Co Ltd Semiconductor manufacturing equipment
KR100309932B1 (en) * 1986-04-28 2001-12-15 제임스 엠. 윌리암스 Wafer transport apparatus and method
JPH0736418B2 (en) * 1986-05-19 1995-04-19 富士通株式会社 Wafer carrier
JPS6382248A (en) * 1986-09-26 1988-04-13 Canon Inc Conveyor system for water or the like
US4895486A (en) * 1987-05-15 1990-01-23 Roboptek, Inc. Wafer monitoring device
JP3075561B2 (en) * 1989-01-27 2000-08-14 日立電子エンジニアリング株式会社 Control system for taking out wafers from cassette
US5181819A (en) * 1990-10-09 1993-01-26 Tokyo Electron Sagami Limited Apparatus for processing semiconductors
JPH0536809A (en) * 1991-07-31 1993-02-12 Mitsubishi Electric Corp Semiconductor substrate transfer arm in semiconductor substrate treatment device

Also Published As

Publication number Publication date
TW248613B (en) 1995-06-01
DE4310149A1 (en) 1994-10-06
DE4310149C2 (en) 1996-05-02
ATE167001T1 (en) 1998-06-15
WO1994023443A1 (en) 1994-10-13
KR950701766A (en) 1995-04-28
KR0148415B1 (en) 1998-12-01
JP2846957B2 (en) 1999-01-13
DE59406121D1 (en) 1998-07-09
EP0642697A1 (en) 1995-03-15
JPH07503584A (en) 1995-04-13
EP0642697B1 (en) 1998-06-03

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