SG47081A1 - Device for handling wafer-shaped objects in a handling plane of a local clean room - Google Patents
Device for handling wafer-shaped objects in a handling plane of a local clean roomInfo
- Publication number
- SG47081A1 SG47081A1 SG1996005812A SG1996005812A SG47081A1 SG 47081 A1 SG47081 A1 SG 47081A1 SG 1996005812 A SG1996005812 A SG 1996005812A SG 1996005812 A SG1996005812 A SG 1996005812A SG 47081 A1 SG47081 A1 SG 47081A1
- Authority
- SG
- Singapore
- Prior art keywords
- handling
- clean room
- shaped objects
- wafer
- plane
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
Abstract
In a device for handling wafer-shaped objects in a handling plane of a local clean room, the aim is to ensure the process stages preceding and succeeding the processing and inspection of the wafer-shaped objects in the conditions of a local clean room using SMIF boxes. According to the invention, the structure of the handling plane (H-H) is in a fixed relationship to a reference plane (E-E) of at least one magazine-indexing device (42) comprising the magazine feed (33) according to their magazine compartments (43) and the wafer-shaped objects therein and is arranged above an intermediate floor (9) which divides the clean room into two superimposed parts (10, 11) in which one component of an airstream from the part (10) above the intermediate floor (9) is directed into the part (11) beneath the intermediate floor (9). The invention is applicable in the manufacture of integrated circuits, especially for handling purposes.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4310149A DE4310149C2 (en) | 1993-03-29 | 1993-03-29 | Device for handling disc-shaped objects in a handling level of a local clean room |
Publications (1)
Publication Number | Publication Date |
---|---|
SG47081A1 true SG47081A1 (en) | 1998-03-20 |
Family
ID=6484131
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG1996005812A SG47081A1 (en) | 1993-03-29 | 1994-03-25 | Device for handling wafer-shaped objects in a handling plane of a local clean room |
Country Status (8)
Country | Link |
---|---|
EP (1) | EP0642697B1 (en) |
JP (1) | JP2846957B2 (en) |
KR (1) | KR0148415B1 (en) |
AT (1) | ATE167001T1 (en) |
DE (2) | DE4310149C2 (en) |
SG (1) | SG47081A1 (en) |
TW (1) | TW248613B (en) |
WO (1) | WO1994023443A1 (en) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19535871C2 (en) * | 1995-09-27 | 2000-02-10 | Jenoptik Jena Gmbh | Indexer for magazine compartments of a magazine and disc-shaped objects contained therein |
DE19549045C1 (en) * | 1995-12-28 | 1997-06-05 | Jenoptik Jena Gmbh | Device for handling disc-shaped objects |
US5674039A (en) * | 1996-07-12 | 1997-10-07 | Fusion Systems Corporation | System for transferring articles between controlled environments |
JPH1058367A (en) * | 1996-08-23 | 1998-03-03 | Advantest Corp | Ic carrying device |
DE19729525A1 (en) * | 1997-03-11 | 1998-09-17 | Leybold Systems Gmbh | Device for transportation of circular disc=form substrates, for example digital video discs |
DE19813684C2 (en) * | 1998-03-27 | 2001-08-16 | Brooks Automation Gmbh | Device for receiving transport containers at a loading and unloading station |
DE19913628A1 (en) * | 1999-03-25 | 2000-10-05 | Siemens Ag | Plant for the production of semiconductor products |
DE19958082A1 (en) | 1999-12-02 | 2001-06-07 | Logitex Reinstmedientechnik Gm | Monitoring system for a transport device for flat parts, in particular wafer slices |
DE10104555B4 (en) * | 2001-02-01 | 2007-11-08 | Krauss Maffei Gmbh | Storage device for use in clean environments |
DE10351848A1 (en) | 2003-11-06 | 2005-06-09 | Leica Microsystems Semiconductor Gmbh | System for the detection of macro defects |
DE10359722A1 (en) | 2003-12-19 | 2005-07-14 | Leica Microsystems Semiconductor Gmbh | Method for inspecting a wafer |
DE102004062592B3 (en) | 2004-12-24 | 2006-06-08 | Leica Microsystems Jena Gmbh | Disk-shaped substrate testing system, has suction unit arranged at side of housing and spaced from mounting plate, and opening provided in suction unit, where opening has width that corresponds to distance of plate to wall of housing |
JP5615218B2 (en) * | 2010-03-26 | 2014-10-29 | テソン エンジニアリング カンパニー リミテッド | Air supply device |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3972424A (en) * | 1973-03-12 | 1976-08-03 | The Computervision Corporation | Automatic wafer loading and pre-alignment system |
US3923342A (en) * | 1974-06-10 | 1975-12-02 | Motorola Inc | Apparatus and method for handling frangible objects |
JPS5969324A (en) * | 1982-10-12 | 1984-04-19 | Toshiba Seiki Kk | Pitch feed for magazine |
JPS6083245U (en) * | 1983-11-15 | 1985-06-08 | 大日本スクリーン製造株式会社 | Thin piece detection device for cassette type thin piece loading/unloading |
JPS60120520A (en) * | 1983-12-02 | 1985-06-28 | Canon Inc | Transporting device for manufacture of semiconductor |
JPS61129340U (en) * | 1985-01-31 | 1986-08-13 | ||
FR2590879A1 (en) * | 1985-11-27 | 1987-06-05 | American Telephone & Telegraph | Method and apparatus for automatically loading and unloading semiconductor wafers |
US4746256A (en) * | 1986-03-13 | 1988-05-24 | Roboptek, Inc. | Apparatus for handling sensitive material such as semiconductor wafers |
JPS62222625A (en) * | 1986-03-25 | 1987-09-30 | Shimizu Constr Co Ltd | Semiconductor manufacturing equipment |
EP0244202B1 (en) * | 1986-04-28 | 1994-09-21 | Varian Associates, Inc. | Wafer transfer system |
JPH0736418B2 (en) * | 1986-05-19 | 1995-04-19 | 富士通株式会社 | Wafer carrier |
JPS6382248A (en) * | 1986-09-26 | 1988-04-13 | Canon Inc | Conveyor system for water or the like |
US4895486A (en) * | 1987-05-15 | 1990-01-23 | Roboptek, Inc. | Wafer monitoring device |
JP3075561B2 (en) * | 1989-01-27 | 2000-08-14 | 日立電子エンジニアリング株式会社 | Control system for taking out wafers from cassette |
US5181819A (en) * | 1990-10-09 | 1993-01-26 | Tokyo Electron Sagami Limited | Apparatus for processing semiconductors |
JPH0536809A (en) * | 1991-07-31 | 1993-02-12 | Mitsubishi Electric Corp | Semiconductor substrate transfer arm in semiconductor substrate treatment device |
-
1993
- 1993-03-29 DE DE4310149A patent/DE4310149C2/en not_active Expired - Fee Related
-
1994
- 1994-02-28 TW TW083101719A patent/TW248613B/zh active
- 1994-03-25 DE DE59406121T patent/DE59406121D1/en not_active Expired - Fee Related
- 1994-03-25 JP JP6521651A patent/JP2846957B2/en not_active Expired - Fee Related
- 1994-03-25 SG SG1996005812A patent/SG47081A1/en unknown
- 1994-03-25 WO PCT/EP1994/000959 patent/WO1994023443A1/en active IP Right Grant
- 1994-03-25 EP EP94911956A patent/EP0642697B1/en not_active Expired - Lifetime
- 1994-03-25 AT AT94911956T patent/ATE167001T1/en not_active IP Right Cessation
- 1994-03-25 KR KR1019940704141A patent/KR0148415B1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
WO1994023443A1 (en) | 1994-10-13 |
KR950701766A (en) | 1995-04-28 |
TW248613B (en) | 1995-06-01 |
DE4310149A1 (en) | 1994-10-06 |
EP0642697B1 (en) | 1998-06-03 |
JPH07503584A (en) | 1995-04-13 |
JP2846957B2 (en) | 1999-01-13 |
DE59406121D1 (en) | 1998-07-09 |
ATE167001T1 (en) | 1998-06-15 |
DE4310149C2 (en) | 1996-05-02 |
EP0642697A1 (en) | 1995-03-15 |
KR0148415B1 (en) | 1998-12-01 |
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