ATE146125T1 - Verstärkte kunststoff-laminate zur verwendung bei der herstellung gedruckter schaltkreise verfahren zur herstellung der laminate und erhaltene produkte - Google Patents
Verstärkte kunststoff-laminate zur verwendung bei der herstellung gedruckter schaltkreise verfahren zur herstellung der laminate und erhaltene produkteInfo
- Publication number
- ATE146125T1 ATE146125T1 AT87907042T AT87907042T ATE146125T1 AT E146125 T1 ATE146125 T1 AT E146125T1 AT 87907042 T AT87907042 T AT 87907042T AT 87907042 T AT87907042 T AT 87907042T AT E146125 T1 ATE146125 T1 AT E146125T1
- Authority
- AT
- Austria
- Prior art keywords
- laminates
- making
- reinforced plastic
- products obtained
- printed circuits
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/04—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
- B29C70/28—Shaping operations therefor
- B29C70/30—Shaping by lay-up, i.e. applying fibres, tape or broadsheet on a mould, former or core; Shaping by spray-up, i.e. spraying of fibres on a mould, former or core
- B29C70/34—Shaping by lay-up, i.e. applying fibres, tape or broadsheet on a mould, former or core; Shaping by spray-up, i.e. spraying of fibres on a mould, former or core and shaping or impregnating by compression, i.e. combined with compressing after the lay-up operation
- B29C70/347—Shaping by lay-up, i.e. applying fibres, tape or broadsheet on a mould, former or core; Shaping by spray-up, i.e. spraying of fibres on a mould, former or core and shaping or impregnating by compression, i.e. combined with compressing after the lay-up operation combined with compressing after the winding of lay-ups having a non-circular cross-section, e.g. flat spiral windings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
- B32B5/12—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer characterised by the relative arrangement of fibres or filaments of different layers, e.g. the fibres or filaments being parallel or perpendicular to each other
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C53/00—Shaping by bending, folding, twisting, straightening or flattening; Apparatus therefor
- B29C53/56—Winding and joining, e.g. winding spirally
- B29C53/564—Winding and joining, e.g. winding spirally for making non-tubular articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C53/00—Shaping by bending, folding, twisting, straightening or flattening; Apparatus therefor
- B29C53/56—Winding and joining, e.g. winding spirally
- B29C53/58—Winding and joining, e.g. winding spirally helically
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C53/00—Shaping by bending, folding, twisting, straightening or flattening; Apparatus therefor
- B29C53/56—Winding and joining, e.g. winding spirally
- B29C53/58—Winding and joining, e.g. winding spirally helically
- B29C53/76—Winding and joining, e.g. winding spirally helically about more than one axis, e.g. T-pieces, balls
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C53/00—Shaping by bending, folding, twisting, straightening or flattening; Apparatus therefor
- B29C53/80—Component parts, details or accessories; Auxiliary operations
- B29C53/8008—Component parts, details or accessories; Auxiliary operations specially adapted for winding and joining
- B29C53/8016—Storing, feeding or applying winding materials, e.g. reels, thread guides, tensioners
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/04—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
- B29C70/06—Fibrous reinforcements only
- B29C70/10—Fibrous reinforcements only characterised by the structure of fibrous reinforcements, e.g. hollow fibres
- B29C70/16—Fibrous reinforcements only characterised by the structure of fibrous reinforcements, e.g. hollow fibres using fibres of substantial or continuous length
- B29C70/20—Fibrous reinforcements only characterised by the structure of fibrous reinforcements, e.g. hollow fibres using fibres of substantial or continuous length oriented in a single direction, e.g. roofing or other parallel fibres
- B29C70/202—Fibrous reinforcements only characterised by the structure of fibrous reinforcements, e.g. hollow fibres using fibres of substantial or continuous length oriented in a single direction, e.g. roofing or other parallel fibres arranged in parallel planes or structures of fibres crossing at substantial angles, e.g. cross-moulding compound [XMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2793/00—Shaping techniques involving a cutting or machining operation
- B29C2793/009—Shaping techniques involving a cutting or machining operation after shaping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C53/00—Shaping by bending, folding, twisting, straightening or flattening; Apparatus therefor
- B29C53/80—Component parts, details or accessories; Auxiliary operations
- B29C53/82—Cores or mandrels
- B29C53/821—Mandrels especially adapted for winding and joining
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3425—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0278—Polymeric fibers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0287—Unidirectional or parallel fibers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/085—Using vacuum or low pressure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1327—Moulding over PCB locally or completely
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49174—Assembling terminal to elongated conductor
- Y10T29/49176—Assembling terminal to elongated conductor with molding of electrically insulating material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24058—Structurally defined web or sheet [e.g., overall dimension, etc.] including grain, strips, or filamentary elements in respective layers or components in angular relation
- Y10T428/24074—Strand or strand-portions
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Composite Materials (AREA)
- Chemical & Material Sciences (AREA)
- Textile Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Moulding By Coating Moulds (AREA)
- Laminated Bodies (AREA)
- Reinforced Plastic Materials (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
- Yarns And Mechanical Finishing Of Yarns Or Ropes (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/907,863 US4943334A (en) | 1986-09-15 | 1986-09-15 | Method for making reinforced plastic laminates for use in the production of circuit boards |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE146125T1 true ATE146125T1 (de) | 1996-12-15 |
Family
ID=25424770
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT87907042T ATE146125T1 (de) | 1986-09-15 | 1987-09-10 | Verstärkte kunststoff-laminate zur verwendung bei der herstellung gedruckter schaltkreise verfahren zur herstellung der laminate und erhaltene produkte |
Country Status (13)
Country | Link |
---|---|
US (4) | US4943334A (de) |
EP (2) | EP0326577B1 (de) |
JP (5) | JPH0665486B2 (de) |
KR (1) | KR960006294B1 (de) |
AT (1) | ATE146125T1 (de) |
AU (4) | AU607168B2 (de) |
BR (1) | BR8707854A (de) |
CA (1) | CA1294712C (de) |
DE (1) | DE3751977T2 (de) |
HK (1) | HK73597A (de) |
RU (1) | RU2080750C1 (de) |
SG (1) | SG48299A1 (de) |
WO (1) | WO1988001938A1 (de) |
Families Citing this family (100)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4943334A (en) * | 1986-09-15 | 1990-07-24 | Compositech Ltd. | Method for making reinforced plastic laminates for use in the production of circuit boards |
US5037691A (en) * | 1986-09-15 | 1991-08-06 | Compositech, Ltd. | Reinforced plastic laminates for use in the production of printed circuit boards and process for making such laminates and resulting products |
US4814945A (en) * | 1987-09-18 | 1989-03-21 | Trw Inc. | Multilayer printed circuit board for ceramic chip carriers |
EP0309982A3 (de) * | 1987-09-30 | 1990-09-12 | E.I. Du Pont De Nemours And Company | Polymerkeramische Verbundplatte |
AT391446B (de) * | 1989-04-06 | 1990-10-10 | Chemiefaser Lenzing Ag | Hochtemperaturbestaendige stapelauflage, verfahren zu ihrer herstellung und ihre verwendung |
US4972050A (en) * | 1989-06-30 | 1990-11-20 | Kollmorgen Corporation | Wire scribed circuit boards and methods of their manufacture |
JPH0475399A (ja) * | 1990-07-17 | 1992-03-10 | Matsushita Electric Ind Co Ltd | 多層回路部材およびその製造方法 |
ES2072531T3 (es) * | 1990-09-24 | 1995-07-16 | Amp Akzo Linlam Vof | Metodo para la fabricacion, en un procedimiento continuo, de sustratos para placas de circuitos impresos, y placas de circuitos impresos asi fabricadas. |
US5269863A (en) * | 1990-09-24 | 1993-12-14 | Akzo Nv | Continuous process for the manufacture of substrates for printed wire boards |
DE4036802A1 (de) * | 1990-11-19 | 1992-05-21 | Huels Troisdorf | Verfahren zur herstellung von kupferkaschierten basismaterialtafeln |
TW210422B (de) * | 1991-06-04 | 1993-08-01 | Akzo Nv | |
TW224561B (de) * | 1991-06-04 | 1994-06-01 | Akocho Co | |
TW244340B (de) * | 1992-07-21 | 1995-04-01 | Akzo Nv | |
WO1994008443A1 (en) * | 1992-09-29 | 1994-04-14 | Berg N Edward | Method and apparatus for fabricating printed circuit boards |
US5470414A (en) * | 1993-01-14 | 1995-11-28 | Rexnord Corporation | Method of making flat stock having a bearing surface and the flat stock made thereby |
RU2139792C1 (ru) * | 1994-01-26 | 1999-10-20 | Амп-Акцо Линлам Воф | Способ изготовления слоистой конструкции и подложки для печатных плат на ее основе |
US6361959B1 (en) | 1994-07-07 | 2002-03-26 | Tessera, Inc. | Microelectronic unit forming methods and materials |
US6828668B2 (en) * | 1994-07-07 | 2004-12-07 | Tessera, Inc. | Flexible lead structures and methods of making same |
US6117694A (en) * | 1994-07-07 | 2000-09-12 | Tessera, Inc. | Flexible lead structures and methods of making same |
US6016598A (en) * | 1995-02-13 | 2000-01-25 | Akzo Nobel N.V. | Method of manufacturing a multilayer printed wire board |
US5660380A (en) * | 1995-08-15 | 1997-08-26 | W. L. Gore & Associates, Inc. | Vacuum fixture and method for dimensioning and manipulating materials |
US6261863B1 (en) | 1995-10-24 | 2001-07-17 | Tessera, Inc. | Components with releasable leads and methods of making releasable leads |
US5763941A (en) * | 1995-10-24 | 1998-06-09 | Tessera, Inc. | Connection component with releasable leads |
WO1999024252A1 (en) * | 1997-11-11 | 1999-05-20 | Compositech Ltd. | Matrix material containing sheet member for use in making composite laminates |
FR2774021B1 (fr) * | 1998-01-23 | 2000-04-21 | Aerospatiale | Procede de depose simultanee par bobinage sur un support de plusieurs meches de fibres pre-impregnees, dispositif pour sa mise en oeuvre et structures en materiau composite ainsi obtenues |
US6283166B1 (en) | 1998-02-10 | 2001-09-04 | Nitto Boseki Co., Ltd. | Woven glass fabrics and laminate for printed wiring boards |
US6224936B1 (en) | 1998-10-07 | 2001-05-01 | Micron Technology, Inc. | Method for reducing warpage during application and curing of encapsulant materials on a printed circuit board |
US6083855A (en) * | 1999-01-04 | 2000-07-04 | Isola Laminate Systems Corp. | Methods of manufacturing voidless resin impregnated webs |
US6329603B1 (en) * | 1999-04-07 | 2001-12-11 | International Business Machines Corporation | Low CTE power and ground planes |
US6263937B1 (en) * | 1999-05-27 | 2001-07-24 | Are Industries, Inc. | Apparatus for making resin-impregnated fiber substrates |
US20030186038A1 (en) * | 1999-11-18 | 2003-10-02 | Ashton Larry J. | Multi orientation composite material impregnated with non-liquid resin |
US6749899B2 (en) * | 2000-03-03 | 2004-06-15 | Hitachi Chemical Co., Ltd. | Method for producing prepreg, prepreg, metal clad laminate and printed wiring board |
AU2001291290B2 (en) * | 2000-09-11 | 2006-06-15 | The Dow Chemical Company | Run flat tire support |
US6931723B1 (en) * | 2000-09-19 | 2005-08-23 | International Business Machines Corporation | Organic dielectric electronic interconnect structures and method for making |
US6682802B2 (en) * | 2000-12-14 | 2004-01-27 | Intel Corporation | Selective PCB stiffening with preferentially oriented fibers |
US6711947B2 (en) * | 2001-06-13 | 2004-03-30 | Rem Scientific Enterprises, Inc. | Conductive fluid logging sensor and method |
KR100478830B1 (ko) * | 2002-02-19 | 2005-03-24 | 에스엔케이폴리텍(주) | 전기전도성 고분자 탄성체로 된 가스켓 및 그 제조방법 |
EP1647170B1 (de) * | 2003-07-08 | 2007-03-28 | Viasystems Group, Inc. | Verfahren zur herstellung einer midplane |
US6915701B1 (en) * | 2003-07-18 | 2005-07-12 | Cleveland Medical Devices Inc. | Composite material for a sensor for measuring shear forces |
KR100967834B1 (ko) * | 2004-01-19 | 2010-07-07 | 엘라코 피티와이 엘티디 | 고충격강도 탄성 복합물 파이버 금속 라미네이트 |
US20050227049A1 (en) * | 2004-03-22 | 2005-10-13 | Boyack James R | Process for fabrication of printed circuit boards |
US20060003624A1 (en) * | 2004-06-14 | 2006-01-05 | Dow Richard M | Interposer structure and method |
US7364684B2 (en) * | 2004-08-16 | 2008-04-29 | Delphi Technologies, Inc. | Method of making an encapsulated microelectronic package having fluid carrying encapsulant channels |
JP4855753B2 (ja) * | 2005-10-03 | 2012-01-18 | 富士通株式会社 | 多層配線基板及びその製造方法 |
DE102005053691A1 (de) | 2005-11-10 | 2007-05-16 | Airbus Gmbh | Werkzeug für Resin-Transfer-Moulding-Verfahren |
US20070281149A1 (en) * | 2006-06-06 | 2007-12-06 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
DE102006031334A1 (de) * | 2006-07-06 | 2008-01-10 | Airbus Deutschland Gmbh | Verfahren zur Herstellung eines Faserverbundbauteils für die Luft- und Raumfahrt |
DE102006031325B4 (de) * | 2006-07-06 | 2010-07-01 | Airbus Deutschland Gmbh | Verfahren zur Herstellung eines Faserverbundbauteils für die Luft- und Raumfahrt |
DE102006031323B4 (de) * | 2006-07-06 | 2010-07-15 | Airbus Deutschland Gmbh | Verfahren zur Herstellung eines Faserverbundbauteils für die Luft- und Raumfahrt |
DE102006031335B4 (de) * | 2006-07-06 | 2011-01-27 | Airbus Operations Gmbh | Verfahren zur Herstellung eines Faserverbundbauteils für die Luft- und Raumfahrt |
DE102006031326B4 (de) * | 2006-07-06 | 2010-09-23 | Airbus Deutschland Gmbh | Formkern und Verfahren zur Herstellung eines Faserverbundbauteils für die Luft- und Raumfahrt |
DE102006031336B4 (de) | 2006-07-06 | 2010-08-05 | Airbus Deutschland Gmbh | Verfahren zur Herstellung eines Faserverbundbauteils in der Luft- und Raumfahrt |
DE102006042999B3 (de) * | 2006-09-14 | 2007-10-25 | Federal-Mogul Deva Gmbh | Gleitelement, Verfahren und Vorrichtung zu dessen Herstellung |
JP5110840B2 (ja) * | 2006-09-28 | 2012-12-26 | 京セラ株式会社 | コアレス基板およびそれを用いた半導体素子の実装構造体 |
US8017220B2 (en) * | 2006-10-04 | 2011-09-13 | Corning Incorporated | Electronic device and method of making |
WO2008093757A1 (ja) * | 2007-01-31 | 2008-08-07 | Kyocera Corporation | プリプレグシートの製造方法および製造装置ならびにプリプレグシート |
MY151594A (en) * | 2007-02-08 | 2014-06-13 | Sumitomo Bakelite Co | Laminated body, circuit board including laminated body, semiconductor package and process for manufacturing laminated body |
US20110036617A1 (en) * | 2007-08-03 | 2011-02-17 | Leonid Kokurin | Compensating Conductive Circuit |
US20100059172A1 (en) * | 2007-09-28 | 2010-03-11 | Terumasa Yamamoto | In-mold decorating apparatus and method for manufacturing in-mold decorated molded product |
US8794118B2 (en) | 2008-01-08 | 2014-08-05 | Triaxial Structures, Inc. | Machine for alternating tubular and flat braid sections and method of using the machine |
US8347772B2 (en) * | 2008-01-08 | 2013-01-08 | Triaxial Structures, Inc. | Machine for alternating tubular and flat braid sections and method of using the machine |
US7908956B2 (en) * | 2008-01-08 | 2011-03-22 | Triaxial Structures, Inc. | Machine for alternating tubular and flat braid sections |
US8943941B2 (en) | 2008-01-08 | 2015-02-03 | Triaxial Structures, Inc. | Braided tube to braided flat to braided tube with reinforcing material |
DE102008013759B4 (de) | 2008-03-12 | 2012-12-13 | Airbus Operations Gmbh | Verfahren zur Herstellung eines integralen Faserverbundbauteils sowie Kernform zur Durchführung des Verfahrens |
EP2123443A1 (de) * | 2008-05-21 | 2009-11-25 | Alcan Technology & Management Ltd. | Verfahren zur Herstellung eines flexiblen Verpackungslaminats |
NZ592790A (en) * | 2008-10-27 | 2012-06-29 | Peerless Ind Systems Pty Ltd | Polymer fabric, method of manufacture and use thereof |
FR2940167B1 (fr) * | 2008-12-24 | 2012-12-21 | Messier Dowty Sa | Procede de liaison d'un element structurel en materiau composite a un tube. |
US8388787B2 (en) * | 2009-07-17 | 2013-03-05 | Gentex Corporation | Method of making a composite sheet |
KR102040742B1 (ko) | 2009-07-17 | 2019-11-05 | 씨에프피 콤포지츠 리미티드 | 섬유 매트릭스 및 섬유 매트릭스의 제조 방법 |
TWI405594B (zh) | 2009-07-28 | 2013-08-21 | Taiwan Textile Res Inst | 創傷敷材之製作裝置 |
SE534361C2 (sv) * | 2009-10-23 | 2011-07-26 | Idea Ab R | Metod för tillverkning av ett kompositmaterial |
EP2353847A1 (de) * | 2010-01-28 | 2011-08-10 | Stichting Nationaal Lucht- en Ruimtevaart Laboratorium | Verfahren zur Herstellung eines Verbundstoffmaterials, Verbundstoffmaterial und Endprodukt |
NL2004854C2 (en) * | 2010-06-08 | 2011-12-12 | Airborne Dev B V | Method and device for manufacturing composite products comprising a planar portion. |
JP2011256946A (ja) * | 2010-06-09 | 2011-12-22 | Tohoku Univ | 減圧処理装置 |
US8448555B2 (en) | 2010-07-28 | 2013-05-28 | Triaxial Structures, Inc. | Braided loop utilizing bifurcation technology |
US20120138216A1 (en) * | 2010-12-07 | 2012-06-07 | Jkm Technologies, Llc | Filament Wound U-Shaped Support Units for Footwear |
CA2824216C (en) | 2011-01-12 | 2018-01-23 | The Board Of Trustees Of The Leland Stanford Junior University | Composite laminated structures and methods for manufacturing and using the same |
NL2006335C2 (en) | 2011-03-03 | 2012-09-04 | Airborne Composites Tubulars B V | Method for manufacturing continuous composite tube, apparatus for manufacturing continuous composite tube. |
JP2013151768A (ja) * | 2012-01-25 | 2013-08-08 | Tomi-Tex Co Ltd | 整列方法及び整列装置 |
MX367475B (es) * | 2012-12-21 | 2019-08-23 | Cytec Engineered Mat Inc | Preimpregnados curables con aberturas superficiales. |
TW201428150A (zh) * | 2013-01-14 | 2014-07-16 | Kai-Xi Zeng | 複合材料x編織布及其編織方法 |
US8910670B2 (en) * | 2013-02-12 | 2014-12-16 | Kai-Hsi Tseng | X weave of composite material and method of weaving thereof |
US9366313B2 (en) | 2013-03-15 | 2016-06-14 | General Electric Company | Torsional resonance frequency adjustor |
US9551398B2 (en) * | 2013-03-15 | 2017-01-24 | General Electric Company | Torsional mode shifting |
RU2518949C1 (ru) * | 2013-05-29 | 2014-06-10 | Константин Сергеевич Сахаров | Бумажно-слоистый пластик (варианты) |
RU2519469C1 (ru) * | 2013-05-29 | 2014-06-10 | Константин Сергеевич Сахаров | Бумажно-слоистый пластик (варианты) |
RU2520535C1 (ru) * | 2013-05-29 | 2014-06-27 | Константин Сергеевич Сахаров | Бумажно-слоистый пластик (варианты) |
KR102086098B1 (ko) * | 2013-07-03 | 2020-03-09 | 삼성디스플레이 주식회사 | 표시 장치 |
US9474148B2 (en) | 2013-09-26 | 2016-10-18 | Trumpet Holdings, Inc. | Stacked circuit board assembly with compliant middle member |
GB201403637D0 (en) * | 2014-03-01 | 2014-04-16 | Composite Technology & Applic Ltd | Self-heating tool |
US9526185B2 (en) * | 2014-04-08 | 2016-12-20 | Finisar Corporation | Hybrid PCB with multi-unreinforced laminate |
JPWO2017061046A1 (ja) * | 2015-10-09 | 2017-10-05 | 株式会社Ihi | 繊維強化複合部材の成形装置 |
JP6668675B2 (ja) * | 2015-10-21 | 2020-03-18 | 住友ゴム工業株式会社 | 繊維強化樹脂成形体の製造方法 |
US10212812B2 (en) | 2016-01-15 | 2019-02-19 | International Business Machines Corporation | Composite materials including filled hollow glass filaments |
RU170996U1 (ru) * | 2017-02-22 | 2017-05-17 | Общество с ограниченной ответственностью "ВК-СПЕЦМАТЕРИАЛЫ" | Композитный решетчатый настил |
NL2020362B1 (en) | 2018-01-31 | 2019-08-07 | Airborne Int B V | Manufacturing layered products |
RU2747635C1 (ru) * | 2019-12-11 | 2021-05-11 | Акционерное общество "Уральский научно-исследовательский институт композиционных материалов" | Способ изготовления изделий из углерод-углеродного композиционного материала в форме оболочки |
RU2743422C1 (ru) * | 2020-03-27 | 2021-02-18 | Российская Федерация, От Имени Которой Выступает Министерство Промышленности И Торговли Российской Федерации | Способ пропитки слоистых заготовок на основе тканых наполнителей и эпоксидных, кремнийорганических и полиимидных связующих и устройство для осуществления этого способа |
US11657963B2 (en) | 2020-09-15 | 2023-05-23 | Enphase Energy, Inc. | Transformer helix winding production |
CN112277338B (zh) * | 2020-09-30 | 2022-04-26 | 陕西科技大学 | 高效任意角度连续纤维增强复合材料的装置和方法 |
Family Cites Families (125)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2974284A (en) * | 1961-03-07 | Rotors for electrical indicating instruments | ||
US307583A (en) * | 1884-11-04 | Mold for casting ingots | ||
US1505600A (en) * | 1920-06-08 | 1924-08-19 | Wireless Specialty Apparatus | Process and apparatus for the manufacture of electrical condensers |
US2119479A (en) * | 1936-03-12 | 1938-05-31 | Dayton Rubber Mfg Co | Lug strap |
US2406846A (en) * | 1940-06-28 | 1946-09-03 | Bell Telephone Labor Inc | Winding machine |
US2344537A (en) * | 1943-11-27 | 1944-03-21 | Ralph R Cone | Pile fabric |
US2569292A (en) * | 1946-03-09 | 1951-09-25 | Richard C Dehmel | Wire winding machine |
US2453223A (en) * | 1946-10-01 | 1948-11-09 | Cemenstone Corp | Method for making concrete building units |
US2589503A (en) * | 1947-04-24 | 1952-03-18 | Toastswell Company Inc | Method and machine for winding electrical resistance units |
US2638278A (en) * | 1949-06-18 | 1953-05-12 | Gen Electric | Winding machine with minimum turn spacing device |
US2912177A (en) * | 1954-02-16 | 1959-11-10 | Link Aviation Inc | Coil-winding machine |
NL195131A (de) * | 1954-02-26 | |||
US2901455A (en) * | 1954-08-09 | 1959-08-25 | Union Carbide Corp | Molding composition comprising synthetic resin and metallic filaments, articles molded therefrom and method of making same |
US2936129A (en) * | 1955-10-26 | 1960-05-10 | Micafil A G Werke Fur Elektro | Multiple purpose winding machine |
US2883592A (en) * | 1955-12-30 | 1959-04-21 | Gen Electric | Encapsulated selenium rectifiers |
GB828110A (en) * | 1956-08-22 | 1960-02-17 | Polyplex Danish American Plast | Improvements in or relating to the manufacture of reinforced synthetic resin articles |
US3033730A (en) * | 1956-11-07 | 1962-05-08 | Smith Corp A O | Method of forming a prestressed article of fiber reinforced resin |
US3085295A (en) * | 1957-04-30 | 1963-04-16 | Michael A Pizzino | Method of making inlaid circuits |
US3041230A (en) * | 1958-11-21 | 1962-06-26 | Tru Scale Inc | Non-woven fabric machine and method |
US3135823A (en) * | 1960-06-28 | 1964-06-02 | Pritikin Nathan | Metallic element embedding process and product |
US3143306A (en) * | 1960-08-12 | 1964-08-04 | Preload Corp | Panel making apparatus |
AT234363B (de) | 1960-11-15 | 1964-06-25 | Plast Anstalt | Verfahren und Vorrichtung zum Vergießen von härtbaren Kunststoffen |
US3194867A (en) * | 1961-02-20 | 1965-07-13 | John K Shannon | Method of constructing storage battery covers and the uniting of the same with storage battery cases and battery elements |
US3301730A (en) * | 1961-04-03 | 1967-01-31 | Rogers Corp | Method of making a printed circuit |
US3258379A (en) * | 1961-06-26 | 1966-06-28 | Koppers Co Inc | Method of making resin bonded, filament wound articles |
US3183286A (en) * | 1961-07-31 | 1965-05-11 | American Air Filter Co | Method of making unit filter assemblies |
FR1306698A (fr) * | 1961-09-04 | 1962-10-19 | Electronique & Automatisme Sa | Procédé de réalisation de circuits électriques du genre dit |
BE629053A (de) * | 1962-03-02 | |||
US3112897A (en) * | 1962-03-20 | 1963-12-03 | Robert W Eshbaugh | Glass filament tensioning system |
BE632957A (de) * | 1962-05-29 | |||
US3212725A (en) * | 1962-07-02 | 1965-10-19 | Westinghouse Electric Corp | Grid winding machine |
US3324014A (en) * | 1962-12-03 | 1967-06-06 | United Carr Inc | Method for making flush metallic patterns |
US3325881A (en) * | 1963-01-08 | 1967-06-20 | Sperry Rand Corp | Electrical circuit board fabrication |
GB1088491A (en) * | 1970-01-22 | 1967-10-25 | Ingochem S A | Reinforcing material |
US3276106A (en) * | 1963-07-01 | 1966-10-04 | North American Aviation Inc | Preparation of multilayer boards for electrical connections between layers |
US3348990A (en) * | 1963-12-23 | 1967-10-24 | Sperry Rand Corp | Process for electrically interconnecting elements on different layers of a multilayer printed circuit assembly |
US3346689A (en) * | 1965-01-29 | 1967-10-10 | Philco Ford Corp | Multilayer circuit board suing epoxy cards and silver epoxy connectors |
US3425885A (en) * | 1965-02-11 | 1969-02-04 | Nasa | Method for making a heat insulating and ablative structure |
US3440722A (en) * | 1965-04-15 | 1969-04-29 | Electronic Eng Co California | Process for interconnecting integrated circuits |
US3436819A (en) * | 1965-09-22 | 1969-04-08 | Litton Systems Inc | Multilayer laminate |
US3698082A (en) * | 1966-04-25 | 1972-10-17 | Texas Instruments Inc | Complex circuit array method |
US3532587A (en) * | 1966-08-04 | 1970-10-06 | Esso Research & Chem Co | Press plate |
US3480498A (en) * | 1966-09-12 | 1969-11-25 | Hercules Inc | Method of making filament wound articles |
US3537937A (en) * | 1966-12-15 | 1970-11-03 | Koppers Co Inc | Method and apparatus for filament winding planar structures |
US3492392A (en) * | 1967-04-21 | 1970-01-27 | Fuji Jyu Kogyo Kk | Method of molding reinforced plastics |
US3511739A (en) * | 1967-07-31 | 1970-05-12 | Friedrich Hebberling | Array of reinforcing strands for reinforced sheet material |
US3425884A (en) * | 1967-11-06 | 1969-02-04 | Crompton & Knowles Corp | Method of making an open mesh,rigid,glass fiber reinforced resin structure |
US3740285A (en) * | 1968-03-01 | 1973-06-19 | W Goldsworthy | Method and apparatus for filament winding about three axes of a mandrel and products produced thereby |
US3751545A (en) * | 1968-04-24 | 1973-08-07 | American Cyanamid Co | Fabrication of plastic spinnerettes by means of stacked mandrels |
GB1274643A (en) * | 1968-07-04 | 1972-05-17 | Diva Cars Ltd | Improvements relating to motor land vehicles |
US3681171A (en) * | 1968-08-23 | 1972-08-01 | Hitachi Ltd | Apparatus for producing a multilayer printed circuit plate assembly |
US3649402A (en) * | 1968-09-23 | 1972-03-14 | Shell Oil Co | Method and apparatus for winding resin-impregnated filaments to reduce entrained air |
US3607566A (en) * | 1968-12-18 | 1971-09-21 | Koppers Co Inc | Filament-winding apparatus |
US3644165A (en) * | 1969-10-15 | 1972-02-22 | Griffolyn Company | Fiber reinforced laminated plastic film and method of making same |
GB1303301A (de) * | 1970-02-13 | 1973-01-17 | ||
GB1312714A (en) * | 1970-04-09 | 1973-04-04 | Gen Electric Co Ltd | Methods of making multilayer printed circuit assemblies |
US3664786A (en) * | 1970-04-15 | 1972-05-23 | Arthur J Devine | Apparatus for encapsulation under vacuum |
US3960635A (en) * | 1971-06-07 | 1976-06-01 | N.V. Hollandse Signaalapparaten | Method for the fabrication of printed circuits |
US3846525A (en) * | 1971-08-25 | 1974-11-05 | Permatank Eng & Mfg Co Inc | Method for manufacturing foam sandwich panels |
BE788117A (fr) * | 1971-08-30 | 1973-02-28 | Perstorp Ab | Procede de production d'elements pour circuits imprimes |
US3801401A (en) * | 1971-09-24 | 1974-04-02 | Du Pont | Apparatus for making convolute wound structures |
US3756905A (en) * | 1971-12-20 | 1973-09-04 | Northrop Corp | Filamentary plastic composite laminate |
US3779851A (en) * | 1971-12-22 | 1973-12-18 | Gen Dynamics Corp | Method of fabricating thin graphite reinforced composites of uniform thickness |
GB1364076A (en) * | 1972-08-29 | 1974-08-21 | British Aircraft Corp Ltd | Structural materials |
US3869563A (en) * | 1973-09-27 | 1975-03-04 | Motorola Inc | Encapsulation housing for electronic circuit boards or the like and method of encapsulating |
US3984598A (en) * | 1974-02-08 | 1976-10-05 | Universal Oil Products Company | Metal-clad laminates |
US3902944A (en) * | 1974-02-14 | 1975-09-02 | Fiber Science Inc | Noncircular filament wound article of manufacture and method of making same |
US4064606A (en) * | 1975-07-14 | 1977-12-27 | Trw Inc. | Method for making multi-layer capacitors |
US4053370A (en) * | 1975-09-18 | 1977-10-11 | Koito Manufacturing Company Limited | Process for the fabrication of printed circuits |
SE404863B (sv) * | 1975-12-17 | 1978-10-30 | Perstorp Ab | Forfarande vid framstellning av ett flerlagerkort |
US4073699A (en) * | 1976-03-01 | 1978-02-14 | Hutkin Irving J | Method for making copper foil |
CH620408A5 (de) * | 1976-05-13 | 1980-11-28 | Sulzer Ag | |
US4150201A (en) * | 1976-06-30 | 1979-04-17 | Aislantes Leon, S.A. | Multi-partitioned containers having metal connectors through the partitions and a mold assembly for producing same |
FR2359695A1 (fr) * | 1976-07-27 | 1978-02-24 | Commissariat Energie Atomique | Piece de revolution de forme plate obtenue par enroulement d'un filament impregne d'un polymere durcissable |
US4313995A (en) * | 1976-11-08 | 1982-02-02 | Fortin Laminating Corporation | Circuit board and method for producing same |
JPS5362175A (en) * | 1976-11-15 | 1978-06-03 | Matsushita Electric Works Ltd | Method of producing printed circuit board |
US4180608A (en) * | 1977-01-07 | 1979-12-25 | Del Joseph A | Process for making multi-layer printed circuit boards, and the article resulting therefrom |
US4132755A (en) * | 1977-07-22 | 1979-01-02 | Jay Johnson | Process for manufacturing resin-impregnated, reinforced articles without the presence of resin fumes |
EP0000755B1 (de) * | 1977-08-05 | 1981-12-16 | Walter Schwarz | Verfahren zur Herstellung von Formkörpern aus verstärktem Kunststoff und Vorrichtung zur Durchführung des Verfahrens |
US4252588A (en) * | 1977-09-19 | 1981-02-24 | Science Applications, Inc. | Method for fabricating a reinforced composite |
US4155791A (en) * | 1977-10-17 | 1979-05-22 | Kenichi Higuchi | Method for manufacturing unidirectionally fiber reinforced resin products |
US4333900A (en) * | 1977-12-02 | 1982-06-08 | Chloride Electro Networks, Division Of Chloride, Inc., N. American Operation | Process for manufacture of high voltage transformers and the like |
US4201616A (en) * | 1978-06-23 | 1980-05-06 | International Business Machines Corporation | Dimensionally stable laminated printed circuit cores or boards and method of fabricating same |
US4214026A (en) * | 1978-08-24 | 1980-07-22 | Asahi Kasei Kogyo Kabushiki Kaisha | Sheet molding material |
US4415403A (en) * | 1978-11-20 | 1983-11-15 | Dynamics Research Corporation | Method of fabricating an electrostatic print head |
US4290838A (en) * | 1978-12-04 | 1981-09-22 | General Dynamics, Pomona Division | Method for vacuum lamination of flex circuits |
US4250616A (en) * | 1979-03-23 | 1981-02-17 | Methode Electronics, Inc. | Method of producing multilayer backplane |
FI801415A (fi) * | 1979-05-05 | 1980-11-06 | Arthur Britton | Arkmaterial |
CH643896A5 (de) * | 1979-10-15 | 1984-06-29 | Peter Baechinger | Verfahren und vorrichtung zur herstellung von webmustern. |
US4312829A (en) * | 1979-12-10 | 1982-01-26 | Fourcher Fredric J | Molding method |
IT1126638B (it) * | 1979-12-20 | 1986-05-21 | Pier Luigi Nava | Procedimento e relativo utensile per stampare manufatti in resina armata |
JPS5698136A (en) * | 1980-01-08 | 1981-08-07 | Kanegafuchi Chem Ind Co Ltd | Continuous manufacture of laminated substance |
JPS5824037B2 (ja) * | 1980-05-26 | 1983-05-18 | 富士通株式会社 | 導体ボ−ル配列方法 |
US4522667A (en) * | 1980-06-25 | 1985-06-11 | General Electric Company | Method for making multi-layer metal core circuit board laminate with a controlled thermal coefficient of expansion |
US4357395A (en) * | 1980-08-22 | 1982-11-02 | General Electric Company | Transfer lamination of vapor deposited foils, method and product |
JPS5741920A (en) * | 1980-08-27 | 1982-03-09 | Mitsubishi Electric Corp | Manufacture of fiber-reinforced plastic product |
US4455181A (en) * | 1980-09-22 | 1984-06-19 | General Electric Company | Method of transfer lamination of copper thin sheets and films |
US4339407A (en) * | 1980-10-02 | 1982-07-13 | Alden Research Foundation | Electronic circuit encapsulation |
US4529139A (en) * | 1980-10-20 | 1985-07-16 | United Technologies Corporation | Method of manufacturing a filament wound article |
US4381852A (en) * | 1980-10-20 | 1983-05-03 | Westinghouse Electric Corp. | Automatic tensioning control for winding stator coils |
US4374080A (en) * | 1981-01-13 | 1983-02-15 | Indy Electronics, Inc. | Method and apparatus for encapsulation casting |
US4410385A (en) * | 1981-01-28 | 1983-10-18 | General Electric Company | Method of making a composite article |
US4480975A (en) * | 1981-07-01 | 1984-11-06 | Kras Corporation | Apparatus for encapsulating electronic components |
US4420359A (en) * | 1981-08-05 | 1983-12-13 | Goldsworthy Engineering, Inc. | Apparatus for producing fiber-reinforced plastic sheet structures |
EP0081843A3 (de) * | 1981-12-16 | 1986-02-05 | Kurashiki Boseki Kabushiki Kaisha | Nichtgewebte Verstärkung für ein zusammengesetztes Produkt |
US4606787A (en) * | 1982-03-04 | 1986-08-19 | Etd Technology, Inc. | Method and apparatus for manufacturing multi layer printed circuit boards |
JPS59127842A (ja) * | 1983-01-13 | 1984-07-23 | Toshiba Corp | 樹脂モ−ルド装置 |
US4528214A (en) * | 1983-04-20 | 1985-07-09 | Dayco Corporation | Polymeric product having a fabric layer means and method of making the same |
US4635071A (en) * | 1983-08-10 | 1987-01-06 | Rca Corporation | Electromagnetic radiation reflector structure |
JPS6040252A (ja) * | 1983-08-13 | 1985-03-02 | 松下電工株式会社 | 積層板の製造方法 |
US4560138A (en) * | 1983-11-25 | 1985-12-24 | Depuglia Gaston D | Encapsulation mold |
US4539253A (en) * | 1984-03-30 | 1985-09-03 | American Cyanamid Co. | High impact strength fiber resin matrix composites |
US4872825A (en) | 1984-05-23 | 1989-10-10 | Ross Milton I | Method and apparatus for making encapsulated electronic circuit devices |
US4623500A (en) * | 1984-06-08 | 1986-11-18 | Buehler Ltd. | Method of mounting a plurality of coupons in molded material and polishing surfaces thereof for cross-sectional analysis of printed circuit boards |
FR2568171B1 (fr) * | 1984-07-30 | 1986-08-29 | Garbolino Sa Ets | Procede pour la realisation d'une nappe constituee de fils formes de filaments resistants, application a la realisation d'elements tubulaires et elements tubulaires ainsi obtenus |
US4609586A (en) * | 1984-08-02 | 1986-09-02 | The Boeing Company | Thermally conductive printed wiring board laminate |
FR2572987B1 (fr) * | 1984-09-21 | 1987-01-02 | Pont A Mousson | Procede et dispositif de surmoulage d'un entourage de dimensions precises sur le pourtour d'une piece plane ou galbee a tolerances dimensionnelles |
US4628598A (en) | 1984-10-02 | 1986-12-16 | The United States Of America As Represented By The Secretary Of The Air Force | Mechanical locking between multi-layer printed wiring board conductors and through-hole plating |
JPS6189032A (ja) * | 1984-10-05 | 1986-05-07 | Matsushita Electric Works Ltd | 積層板の製法 |
US4617160A (en) * | 1984-11-23 | 1986-10-14 | Irvine Sensors Corporation | Method for fabricating modules comprising uniformly stacked, aligned circuit-carrying layers |
US4622091A (en) * | 1984-11-29 | 1986-11-11 | The Boeing Company | Resin film infusion process and apparatus |
US4681649A (en) * | 1985-04-15 | 1987-07-21 | Fazlin Fazal A | Multi-layer printed circuit board vacuum lamination method |
JPS6268748A (ja) * | 1985-09-20 | 1987-03-28 | 株式会社日立製作所 | 多層プリント板のボイドレス成形方法 |
US4654248A (en) * | 1985-12-16 | 1987-03-31 | Gte Communication Systems Corporation | Printed wiring board with zones of controlled thermal coefficient of expansion |
US4943334A (en) * | 1986-09-15 | 1990-07-24 | Compositech Ltd. | Method for making reinforced plastic laminates for use in the production of circuit boards |
-
1986
- 1986-09-15 US US06/907,863 patent/US4943334A/en not_active Expired - Lifetime
-
1987
- 1987-09-10 AT AT87907042T patent/ATE146125T1/de not_active IP Right Cessation
- 1987-09-10 AU AU81532/87A patent/AU607168B2/en not_active Ceased
- 1987-09-10 EP EP87907042A patent/EP0326577B1/de not_active Expired - Lifetime
- 1987-09-10 WO PCT/US1987/002327 patent/WO1988001938A1/en active IP Right Grant
- 1987-09-10 RU SU874613872A patent/RU2080750C1/ru active
- 1987-09-10 EP EP96100946A patent/EP0724946A3/de not_active Withdrawn
- 1987-09-10 KR KR1019880700546A patent/KR960006294B1/ko not_active IP Right Cessation
- 1987-09-10 SG SG1996008765A patent/SG48299A1/en unknown
- 1987-09-10 BR BR8707854A patent/BR8707854A/pt not_active IP Right Cessation
- 1987-09-10 DE DE3751977T patent/DE3751977T2/de not_active Expired - Fee Related
- 1987-09-10 JP JP62506385A patent/JPH0665486B2/ja not_active Expired - Fee Related
- 1987-09-14 CA CA000546838A patent/CA1294712C/en not_active Expired - Fee Related
-
1989
- 1989-08-23 US US07/398,344 patent/US5376326A/en not_active Expired - Fee Related
-
1990
- 1990-11-01 US US07/608,070 patent/US5512224A/en not_active Expired - Fee Related
-
1991
- 1991-01-10 AU AU69272/91A patent/AU653925B2/en not_active Ceased
- 1991-01-10 AU AU69273/91A patent/AU632396B2/en not_active Ceased
-
1993
- 1993-03-23 AU AU35388/93A patent/AU653893B2/en not_active Ceased
- 1993-06-30 JP JP18668893A patent/JPH0790606B2/ja not_active Expired - Lifetime
- 1993-06-30 JP JP5186689A patent/JPH0790607B2/ja not_active Expired - Lifetime
- 1993-09-28 US US08/129,553 patent/US5478421A/en not_active Expired - Lifetime
-
1995
- 1995-03-20 JP JP7061103A patent/JP2637379B2/ja not_active Expired - Lifetime
- 1995-03-20 JP JP7061082A patent/JP2637378B2/ja not_active Expired - Lifetime
-
1997
- 1997-05-29 HK HK73597A patent/HK73597A/xx not_active IP Right Cessation
Also Published As
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ATE146125T1 (de) | Verstärkte kunststoff-laminate zur verwendung bei der herstellung gedruckter schaltkreise verfahren zur herstellung der laminate und erhaltene produkte | |
DE3484570D1 (de) | Zusammengesetzte leiterplatte mit metallmusterlagen und verfahren zur herstellung. | |
ATE47267T1 (de) | Dielektrische materialien mit niedrigen dielektrizitaetskonstanten und verfahren zu ihrer herstellung. | |
AT382399B (de) | Verfahren zur herstellung von filamenten mit hohem modul und grosser zugfestigkeit | |
ATE173194T1 (de) | Verfahren zur herstellung von hohlkörper aus verbundwerkstoff durch kontaktwicklen auf einer ausdehnbaren form und dadurch hergestellte körper | |
ES2027653T3 (es) | Metodo de fabricar paneles, aparato para realizar este metodo y paneles obtenidos con los mismos. | |
ATE130795T1 (de) | Verfahren zur herstellung elektronischer packungen und intelligente strukturen durch thermisches sprühen. | |
DE69030234D1 (de) | Lichtvernetzbares kunststofflaminat und verfahren zur herstellung einer gedruckten leiterplatte unter dessen verwendung | |
DE69219240D1 (de) | Faserverstärkter Verbundwerkstoff mit über der Breite der Basisschicht stufenlos veränderter Faserdichte, und Verfahren zur Herstellung | |
EP0324352A3 (de) | Verfahren zur Herstellung einer Metallkernleiterplatte | |
DE69030225D1 (de) | Verfahren zur Herstellung von BiMOS-Schaltungen mit hoher Leistung | |
DE69003088D1 (de) | Textiler Kern, Verfahren zur Herstellung davon mit solchem textilen Kern erhaltene Kompositware. | |
ATE260761T1 (de) | Verfahren zu zur herstellung einer polyolefinfolie und ihre verwendung. | |
DE3887989D1 (de) | Verfahren zur herstellung von gedruckten schaltungen mit durchgehenden löchern für metallisierung. | |
ATE157381T1 (de) | Organopolysiloxanharzlösungen, verfahren zu deren herstellung sowie deren verwendung in beschichtungsmassen | |
ATE2882T1 (de) | Verfahren zur herstellung von thermoplastischen flachfolien mit verbesserter dimensionsstabilitaet. | |
ATE258817T1 (de) | Gleitbrett und verfahren zur herstellung desselben | |
ATE155149T1 (de) | Verfahren zur herstellung von polymeren glanzmodifiziermitteln und diese enthaltende thermoplastische harzmischung | |
ATE13836T1 (de) | Verfahren zur herstellung von pflanzenstuetzen, vorrichtung zur durchfuehrung dieses verfahrens und erhaltene pflanzenstuetzen. | |
DE69323174D1 (de) | Verbundformkörper mit dreidimensionalen mehrschichtigen leitfähigen schaltungen und verfahren zu seiner herstellung | |
DE69212526D1 (de) | Verfahren zur Herstellung von einer mit einer Gleitschutzseite und der anderen klebenden Seite flächigen Vorlage, und hergestellte Vorlage | |
ATE170797T1 (de) | Verfahren zur herstellung einer porösen folie mit hoher burstfestigkeit | |
ATE5080T1 (de) | Polymeres material in der b-stufe auf der basis von phenolharz, verfahren zu seiner herstellung und schichtkoerper mit einer schicht aus diesem material. | |
ATE128317T1 (de) | Verfahren zur herstellung von kupferkaschierten basismaterialtafeln. | |
EP0394845A3 (de) | Vorrichtung zur Herstellung von Bauteilen aus laminiertem Bandmaterial |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
UEP | Publication of translation of european patent specification | ||
REN | Ceased due to non-payment of the annual fee |