ATE130795T1 - Verfahren zur herstellung elektronischer packungen und intelligente strukturen durch thermisches sprühen. - Google Patents

Verfahren zur herstellung elektronischer packungen und intelligente strukturen durch thermisches sprühen.

Info

Publication number
ATE130795T1
ATE130795T1 AT92306488T AT92306488T ATE130795T1 AT E130795 T1 ATE130795 T1 AT E130795T1 AT 92306488 T AT92306488 T AT 92306488T AT 92306488 T AT92306488 T AT 92306488T AT E130795 T1 ATE130795 T1 AT E130795T1
Authority
AT
Austria
Prior art keywords
thermal spraying
masks
producing electronic
work surface
complementary
Prior art date
Application number
AT92306488T
Other languages
English (en)
Inventor
Fritz B Prinz
Lee E Weiss
Daniel P Siewiorek
Original Assignee
Fritz B Prinz
Lee E Weiss
Daniel P Siewiorek
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fritz B Prinz, Lee E Weiss, Daniel P Siewiorek filed Critical Fritz B Prinz
Application granted granted Critical
Publication of ATE130795T1 publication Critical patent/ATE130795T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0438—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/115—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces by spraying molten metal, i.e. spray sintering, spray casting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10—Processes of additive manufacturing
    • B29C64/141—Processes of additive manufacturing using only solid materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/40—Structures for supporting 3D objects during manufacture and intended to be sacrificed after completion thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y70/00—Materials specially adapted for additive manufacturing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4998—Combined manufacture including applying or shaping of fluent material
    • Y10T29/49982—Coating
    • Y10T29/49986—Subsequent to metal working

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Coating By Spraying Or Casting (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
AT92306488T 1991-07-15 1992-07-15 Verfahren zur herstellung elektronischer packungen und intelligente strukturen durch thermisches sprühen. ATE130795T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/730,226 US5278442A (en) 1991-07-15 1991-07-15 Electronic packages and smart structures formed by thermal spray deposition

Publications (1)

Publication Number Publication Date
ATE130795T1 true ATE130795T1 (de) 1995-12-15

Family

ID=24934478

Family Applications (1)

Application Number Title Priority Date Filing Date
AT92306488T ATE130795T1 (de) 1991-07-15 1992-07-15 Verfahren zur herstellung elektronischer packungen und intelligente strukturen durch thermisches sprühen.

Country Status (6)

Country Link
US (1) US5278442A (de)
EP (1) EP0523981B1 (de)
JP (1) JPH05198609A (de)
AT (1) ATE130795T1 (de)
CA (1) CA2073787A1 (de)
DE (1) DE69206344T2 (de)

Families Citing this family (87)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5204055A (en) * 1989-12-08 1993-04-20 Massachusetts Institute Of Technology Three-dimensional printing techniques
EP0601739B1 (de) * 1992-11-25 2001-05-30 Simmonds Precision Products Inc. Datenverarbeitungsstrukturen und Methoden
US5775402A (en) * 1995-10-31 1998-07-07 Massachusetts Institute Of Technology Enhancement of thermal properties of tooling made by solid free form fabrication techniques
US5814161A (en) * 1992-11-30 1998-09-29 Massachusetts Institute Of Technology Ceramic mold finishing techniques for removing powder
US5433115A (en) * 1993-06-14 1995-07-18 Simmonds Precision Products, Inc. Contactless interrogation of sensors for smart structures
US5602540A (en) * 1993-06-14 1997-02-11 Simmonds Precision Products Inc. Fluid gauging apparatus with inductive interrogation
US5581248A (en) * 1993-06-14 1996-12-03 Simmonds Precision Products, Inc. Embeddable device for contactless interrogation of sensors for smart structures
US5515041A (en) * 1993-06-14 1996-05-07 Simmonds Precision Products Inc. Composite shaft monitoring system
US5398193B1 (en) * 1993-08-20 1997-09-16 Alfredo O Deangelis Method of three-dimensional rapid prototyping through controlled layerwise deposition/extraction and apparatus therefor
US20020053734A1 (en) * 1993-11-16 2002-05-09 Formfactor, Inc. Probe card assembly and kit, and methods of making same
US6741085B1 (en) * 1993-11-16 2004-05-25 Formfactor, Inc. Contact carriers (tiles) for populating larger substrates with spring contacts
US7073254B2 (en) * 1993-11-16 2006-07-11 Formfactor, Inc. Method for mounting a plurality of spring contact elements
US5806181A (en) * 1993-11-16 1998-09-15 Formfactor, Inc. Contact carriers (tiles) for populating larger substrates with spring contacts
US5590454A (en) * 1994-12-21 1997-01-07 Richardson; Kendrick E. Method and apparatus for producing parts by layered subtractive machine tool techniques
US5660621A (en) * 1995-12-29 1997-08-26 Massachusetts Institute Of Technology Binder composition for use in three dimensional printing
US5994152A (en) 1996-02-21 1999-11-30 Formfactor, Inc. Fabricating interconnects and tips using sacrificial substrates
US8033838B2 (en) * 1996-02-21 2011-10-11 Formfactor, Inc. Microelectronic contact structure
GB9607715D0 (en) * 1996-04-13 1996-06-19 Marrill Eng Co Ltd Rapid modelling
US7332537B2 (en) * 1996-09-04 2008-02-19 Z Corporation Three dimensional printing material system and method
US6690185B1 (en) 1997-01-15 2004-02-10 Formfactor, Inc. Large contactor with multiple, aligned contactor units
US5996219A (en) * 1997-01-31 1999-12-07 The Board Of Trustees Of The Leland Stanford Junior University Method for embedding electric or optical components in high-temperature metals
US6141870A (en) 1997-08-04 2000-11-07 Peter K. Trzyna Method for making electrical device
US5900282A (en) * 1998-01-20 1999-05-04 Ford Global Tech Nologies, Inc. Method of depositing a dielectric onto electrically conductive elements
WO2000000344A1 (en) * 1998-06-30 2000-01-06 Trustees Of Tufts College Multiple-material prototyping by ultrasonic adhesion
US6937921B1 (en) * 1998-06-30 2005-08-30 Precision Optical Manufacturing (Pom) Production of smart dies and molds using direct metal deposition
US6524346B1 (en) * 1999-02-26 2003-02-25 Micron Technology, Inc. Stereolithographic method for applying materials to electronic component substrates and resulting structures
US6549821B1 (en) * 1999-02-26 2003-04-15 Micron Technology, Inc. Stereolithographic method and apparatus for packaging electronic components and resulting structures
US6812718B1 (en) * 1999-05-27 2004-11-02 Nanonexus, Inc. Massively parallel interface for electronic circuits
US7247035B2 (en) * 2000-06-20 2007-07-24 Nanonexus, Inc. Enhanced stress metal spring contactor
US20070245553A1 (en) * 1999-05-27 2007-10-25 Chong Fu C Fine pitch microfabricated spring contact structure & method
US7349223B2 (en) 2000-05-23 2008-03-25 Nanonexus, Inc. Enhanced compliant probe card systems having improved planarity
US7382142B2 (en) * 2000-05-23 2008-06-03 Nanonexus, Inc. High density interconnect system having rapid fabrication cycle
US7215131B1 (en) * 1999-06-07 2007-05-08 Formfactor, Inc. Segmented contactor
DE60008778T2 (de) * 1999-11-05 2005-02-10 Z Corp., Burlington Verfahren für dreidimensionales drucken
DE19964099B4 (de) * 1999-12-31 2006-04-06 Götzen, Reiner, Dipl.-Ing. Verfahren zur Herstellung dreidimensional angeordneter Leit- und Verbindungsstrukturen für Volumen- und Energieströme
US6337122B1 (en) 2000-01-11 2002-01-08 Micron Technology, Inc. Stereolithographically marked semiconductors devices and methods
US6730998B1 (en) * 2000-02-10 2004-05-04 Micron Technology, Inc. Stereolithographic method for fabricating heat sinks, stereolithographically fabricated heat sinks, and semiconductor devices including same
US6468891B2 (en) * 2000-02-24 2002-10-22 Micron Technology, Inc. Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods
US6740962B1 (en) 2000-02-24 2004-05-25 Micron Technology, Inc. Tape stiffener, semiconductor device component assemblies including same, and stereolithographic methods for fabricating same
US6529027B1 (en) * 2000-03-23 2003-03-04 Micron Technology, Inc. Interposer and methods for fabricating same
US20010050031A1 (en) 2000-04-14 2001-12-13 Z Corporation Compositions for three-dimensional printing of solid objects
US6531335B1 (en) * 2000-04-28 2003-03-11 Micron Technology, Inc. Interposers including upwardly protruding dams, semiconductor device assemblies including the interposers, and methods
US7579848B2 (en) * 2000-05-23 2009-08-25 Nanonexus, Inc. High density interconnect system for IC packages and interconnect assemblies
US7952373B2 (en) 2000-05-23 2011-05-31 Verigy (Singapore) Pte. Ltd. Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies
US6506671B1 (en) 2000-06-08 2003-01-14 Micron Technology, Inc. Ring positionable about a periphery of a contact pad, semiconductor device components including same, and methods for positioning the ring around a contact pad
US6569753B1 (en) 2000-06-08 2003-05-27 Micron Technology, Inc. Collar positionable about a periphery of a contact pad and around a conductive structure secured to the contact pads, semiconductor device components including same, and methods for fabricating same
US6611053B2 (en) * 2000-06-08 2003-08-26 Micron Technology, Inc. Protective structure for bond wires
US7041533B1 (en) * 2000-06-08 2006-05-09 Micron Technology, Inc. Stereolithographic method for fabricating stabilizers for semiconductor devices
US7557452B1 (en) * 2000-06-08 2009-07-07 Micron Technology, Inc. Reinforced, self-aligning conductive structures for semiconductor device components and methods for fabricating same
US7138653B1 (en) * 2000-06-08 2006-11-21 Micron Technology, Inc. Structures for stabilizing semiconductor devices relative to test substrates and methods for fabricating the stabilizers
US6461881B1 (en) 2000-06-08 2002-10-08 Micron Technology, Inc. Stereolithographic method and apparatus for fabricating spacers for semiconductor devices and resulting structures
US6875640B1 (en) 2000-06-08 2005-04-05 Micron Technology, Inc. Stereolithographic methods for forming a protective layer on a semiconductor device substrate and substrates including protective layers so formed
JP4493814B2 (ja) * 2000-07-28 2010-06-30 ナブテスコ株式会社 硬化性樹脂から成る着色造形物の製造方法および製造装置
US6432752B1 (en) * 2000-08-17 2002-08-13 Micron Technology, Inc. Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages
US6524881B1 (en) * 2000-08-25 2003-02-25 Micron Technology, Inc. Method and apparatus for marking a bare semiconductor die
US6607689B1 (en) * 2000-08-29 2003-08-19 Micron Technology, Inc. Layer thickness control for stereolithography utilizing variable liquid elevation and laser focal length
US6762502B1 (en) 2000-08-31 2004-07-13 Micron Technology, Inc. Semiconductor device packages including a plurality of layers substantially encapsulating leads thereof
US6632575B1 (en) * 2000-08-31 2003-10-14 Micron Technology, Inc. Precision fiducial
US7153399B2 (en) * 2001-08-24 2006-12-26 Nanonexus, Inc. Method and apparatus for producing uniform isotropic stresses in a sputtered film
US7169685B2 (en) * 2002-02-25 2007-01-30 Micron Technology, Inc. Wafer back side coating to balance stress from passivation layer on front of wafer and be used as die attach adhesive
US6807731B2 (en) * 2002-04-02 2004-10-26 Delphi Technologies, Inc. Method for forming an electronic assembly
US7097801B2 (en) * 2002-07-02 2006-08-29 Visteon Global Technologies, Inc. Method of making an integrated mold product
US7709766B2 (en) * 2002-08-05 2010-05-04 Research Foundation Of The State University Of New York System and method for manufacturing embedded conformal electronics
US7087109B2 (en) * 2002-09-25 2006-08-08 Z Corporation Three dimensional printing material system and method
JP3971296B2 (ja) * 2002-12-27 2007-09-05 Ｄｏｗａホールディングス株式会社 金属−セラミックス接合基板およびその製造方法
US6921860B2 (en) 2003-03-18 2005-07-26 Micron Technology, Inc. Microelectronic component assemblies having exposed contacts
ES2376237T3 (es) * 2003-05-21 2012-03-12 Z Corporation Sistema de material en polvo termopl�?stico para modelos de apariencia a partir de sistemas de impresión en 3d.
US7477050B2 (en) * 2003-08-05 2009-01-13 Research Foundation Of The State University Of New York Magnetic sensor having a coil around a permeable magnetic core
US7781725B2 (en) * 2004-10-21 2010-08-24 Mossman Guy E Optical fiber based sensor system suitable for monitoring remote aqueous infiltration
US20050082467A1 (en) * 2003-10-21 2005-04-21 Guy Mossman Optical fiber based sensor system suitable for monitoring remote aqueous infiltration
US7261542B2 (en) * 2004-03-18 2007-08-28 Desktop Factory, Inc. Apparatus for three dimensional printing using image layers
US20060074836A1 (en) * 2004-09-03 2006-04-06 Biowisdom Limited System and method for graphically displaying ontology data
WO2007114895A2 (en) * 2006-04-06 2007-10-11 Z Corporation Production of three-dimensional objects by use of electromagnetic radiation
WO2008073297A2 (en) * 2006-12-08 2008-06-19 Z Corporation Three dimensional printing material system and method using peroxide cure
JP5129267B2 (ja) * 2007-01-10 2013-01-30 スリーディー システムズ インコーポレーテッド 改良された色、物品性能及び使用の容易さ、を持つ３次元印刷材料システム
US7968626B2 (en) * 2007-02-22 2011-06-28 Z Corporation Three dimensional printing material system and method using plasticizer-assisted sintering
EP2195830A2 (de) * 2007-09-14 2010-06-16 Nxp B.V. Verfahren und vorrichtung zur bildung beliebiger strukturen für integrierte schaltungsanordnungen
US8745864B2 (en) * 2009-08-10 2014-06-10 The Boeing Company Method of coupling digitizing sensors to a structure
WO2016007207A2 (en) 2014-04-21 2016-01-14 Cornell University System and methods for additive manufacturing of electromechanical assemblies
US10311381B2 (en) * 2014-12-12 2019-06-04 Autodesk, Inc. Tool and method for conductive trace generation in a 3D model for a hybrid electro-mechanical 3D printer
JP2018514427A (ja) * 2015-05-07 2018-06-07 アディファブ アーペーエス 積層造形装置及び積層造形方法
JP6573510B2 (ja) * 2015-09-11 2019-09-11 日本碍子株式会社 多孔質体の製造方法及び製造装置
US10677229B2 (en) 2017-03-03 2020-06-09 Metis Design Corporation Thermally driven actuator system
WO2020232222A1 (en) 2019-05-16 2020-11-19 Dragonfly Energy Corp. Systems and methods for dry powder coating layers of an electrochemical cell
US11523513B2 (en) * 2019-10-11 2022-12-06 Schlumberger Technology Corporation Passive component adapter for downhole application
US11533809B2 (en) 2019-10-11 2022-12-20 Schlumberger Technology Corporation Three dimensional printed resistor for downhole applications
CN112297423B (zh) * 2020-10-13 2022-03-22 青岛五维智造科技有限公司 一种用于柔性混合电子制造的3d打印系统及方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB322257A (en) * 1928-09-10 1929-12-05 Percy Farrow An improved liquid fuel burner
US3880633A (en) * 1974-01-08 1975-04-29 Baldwin Co D H Method of coating a glass ribbon on a liquid float bath
DE3051195C2 (de) * 1980-08-05 1997-08-28 Gao Ges Automation Org Trägerelement zum Einbau in Ausweiskarten
US4471369A (en) * 1981-08-17 1984-09-11 General Electric Company Robotic pressure imagers
GB2150360B (en) * 1983-11-21 1987-08-12 Casio Computer Co Ltd A method of manufacturing a small electronic device
US4665492A (en) * 1984-07-02 1987-05-12 Masters William E Computer automated manufacturing process and system
US4685081A (en) * 1984-12-17 1987-08-04 Allied Corporation Peltier junction used for thermal control of solid state devices
FR2599893B1 (fr) * 1986-05-23 1996-08-02 Ricoh Kk Procede de montage d'un module electronique sur un substrat et carte a circuit integre
IL84936A (en) * 1987-12-23 1997-02-18 Cubital Ltd Three-dimensional modelling apparatus
US4752352A (en) * 1986-06-06 1988-06-21 Michael Feygin Apparatus and method for forming an integral object from laminations
US4811082A (en) * 1986-11-12 1989-03-07 International Business Machines Corporation High performance integrated circuit packaging structure
FR2621173B1 (fr) * 1987-09-29 1989-12-08 Bull Sa Boitier pour circuit integre de haute densite
US4972253A (en) * 1988-06-27 1990-11-20 Digital Equipment Corporation Programmable ceramic high performance custom package
US4924291A (en) * 1988-10-24 1990-05-08 Motorola Inc. Flagless semiconductor package
US5285107A (en) * 1989-04-20 1994-02-08 Sanyo Electric Co., Ltd. Hybrid integrated circuit device
GB2233928B (en) * 1989-05-23 1992-12-23 Brother Ind Ltd Apparatus and method for forming three-dimensional article
US5126529A (en) * 1990-12-03 1992-06-30 Weiss Lee E Method and apparatus for fabrication of three-dimensional articles by thermal spray deposition

Also Published As

Publication number Publication date
CA2073787A1 (en) 1993-01-16
DE69206344D1 (de) 1996-01-11
DE69206344T2 (de) 1996-05-15
EP0523981B1 (de) 1995-11-29
EP0523981A1 (de) 1993-01-20
US5278442A (en) 1994-01-11
JPH05198609A (ja) 1993-08-06

Similar Documents

Publication Publication Date Title
ATE130795T1 (de) Verfahren zur herstellung elektronischer packungen und intelligente strukturen durch thermisches sprühen.
DE69116662D1 (de) Verfahren und Vorrichtung zur Herstellung dreidimensionaler Gegenstände durch thermisches Sprühen
DE3585180D1 (de) Verfahren zum herstellen einer halbleiteranordnung mit leiterschichten.
DE69633143D1 (de) Verfahren und Vorrichtung zur Herstellung einer 3-D Sandform mit Kern durch Ausbildung von Sandschichten
DE3483356D1 (de) Mit einer deckschicht versehene isolierplatte aus schaumstoff und schaumschlagverfahren zur herstellung derselben.
DE59409157D1 (de) Verfahren zur Herstellung einer Schicht mit reduzierten mechanischen Spannungen
DE69423143D1 (de) Verfahren zur Herstellung einer Doppelschichtfolie
DE69326706D1 (de) Verfahren zur Herstellung einer Schicht auf einem Halbleiterkörper
ATE103806T1 (de) Verfahren zur herstellung einer nichtkohaesiven ueberzugsschicht.
ATA208983A (de) Schichtverbundwerkstoff und verfahren zu seiner herstellung
DE3888184D1 (de) Verfahren zur Herstellung von Masken mit Strukturen im Submikrometerbereich.
DE69012019D1 (de) Aussenschichtmaterial von einer gedruckten mehrschichtleiterplatte und verfahren zu deren herstellung.
DE59108894D1 (de) Verfahren zum Herstellen von Oberflächenschichten auf Werkstücken, Vorrichtung zum Durchführen des Verfahrens sowie Werkstück mit nach dem Verfahren hergestellter Oberflächenschicht
DE69415927D1 (de) Verfahren zur Herstellung eines Halbleiterbauelements mit einer Höckerelectrode
DE69410137D1 (de) Verfahren zur Herstellung einer chalkopyrit-Halbleiterschicht
DE69325417D1 (de) Verfahren zur Herstellung von Photomasken mit einer Phasenverschiebringsschicht
DE3872430D1 (de) Verfahren zur herstellung einer schicht aus supraleitendem material.
DE3578618D1 (de) Verfahren zur herstellung von halbleiteranordnungen mit einer ueberlagerten schicht aus polykristallinem silizium.
DE69208692D1 (de) Verfahren zur Herstellung einer hundfussformigen Schicht aus Verbundwerkstoff und dafür gebrauchtes (benötigtes) Werkzeug
DE69306655D1 (de) Verfahren zur Herstellung eines gemusterten Formkörpers
DE69208109D1 (de) Verfahren zur Herstellung eines metallischen Trägers mit einer supraleitenden Schicht
DE68906433D1 (de) Verfahren zur herstellung eines halbleitersubstrats mit einer schicht mit uebergitterstruktur mit spannungsschicht.
ATE15509T1 (de) Verfahren zur herstellung von faserverstaerkten, flaechigen koerpern.
DE69118676D1 (de) Verfahren zur herstellung einer dünnen schicht aus hochtemperatur-supraleiteroxyd
DE69302569D1 (de) Verfahren zur beschichtung eines piezoelektrischen substrats mit einem halbleitermaterial und verfahren zur herstellung eines tröpfchenausstosssystems mit dem beschichtungsverfahren

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties