ATE13697T1 - Verfahren zur herstellung eines zusatzmittels fuer ein saures kupferelektroplattierbad und seine verwendung. - Google Patents
Verfahren zur herstellung eines zusatzmittels fuer ein saures kupferelektroplattierbad und seine verwendung.Info
- Publication number
- ATE13697T1 ATE13697T1 AT82401328T AT82401328T ATE13697T1 AT E13697 T1 ATE13697 T1 AT E13697T1 AT 82401328 T AT82401328 T AT 82401328T AT 82401328 T AT82401328 T AT 82401328T AT E13697 T1 ATE13697 T1 AT E13697T1
- Authority
- AT
- Austria
- Prior art keywords
- additive
- preparation
- acid copper
- plating bath
- electric plating
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electrolytic Production Of Metals (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8114394A FR2510145B1 (fr) | 1981-07-24 | 1981-07-24 | Additif pour bain de cuivrage electrolytique acide, son procede de preparation et son application au cuivrage des circuits imprimes |
EP82401328A EP0071512B1 (de) | 1981-07-24 | 1982-07-16 | Verfahren zur Herstellung eines Zusatzmittels für ein saures Kupferelektroplattierbad und seine Verwendung |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE13697T1 true ATE13697T1 (de) | 1985-06-15 |
Family
ID=9260823
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT82401328T ATE13697T1 (de) | 1981-07-24 | 1982-07-16 | Verfahren zur herstellung eines zusatzmittels fuer ein saures kupferelektroplattierbad und seine verwendung. |
Country Status (9)
Country | Link |
---|---|
US (1) | US4430173A (de) |
EP (1) | EP0071512B1 (de) |
JP (1) | JPS5827992A (de) |
AT (1) | ATE13697T1 (de) |
DE (1) | DE3264038D1 (de) |
FR (1) | FR2510145B1 (de) |
HK (1) | HK96586A (de) |
IE (1) | IE53352B1 (de) |
SG (1) | SG64086G (de) |
Families Citing this family (51)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4667049A (en) * | 1984-11-02 | 1987-05-19 | Etd Technology Inc. | Method of making dialkylamino-thioxomethyl-thioalkanesulfonic acid compounds |
DE4032864A1 (de) * | 1990-10-13 | 1992-04-16 | Schering Ag | Saures bad zur galvanischen abscheidung von kupferueberzuegen und verfahren unter verwendung dieser kombination |
DE4126502C1 (de) * | 1991-08-07 | 1993-02-11 | Schering Ag Berlin Und Bergkamen, 1000 Berlin, De | |
US6024857A (en) * | 1997-10-08 | 2000-02-15 | Novellus Systems, Inc. | Electroplating additive for filling sub-micron features |
DE19758121C2 (de) * | 1997-12-17 | 2000-04-06 | Atotech Deutschland Gmbh | Wäßriges Bad und Verfahren zum elektrolytischen Abscheiden von Kupferschichten |
EP1118696A4 (de) * | 1998-09-03 | 2007-10-17 | Ebara Corp | Verfahren und vorrichtung zum beschichten von substraten |
US7425250B2 (en) * | 1998-12-01 | 2008-09-16 | Novellus Systems, Inc. | Electrochemical mechanical processing apparatus |
US6610190B2 (en) * | 2000-11-03 | 2003-08-26 | Nutool, Inc. | Method and apparatus for electrodeposition of uniform film with minimal edge exclusion on substrate |
US7578923B2 (en) * | 1998-12-01 | 2009-08-25 | Novellus Systems, Inc. | Electropolishing system and process |
US6497800B1 (en) * | 2000-03-17 | 2002-12-24 | Nutool Inc. | Device providing electrical contact to the surface of a semiconductor workpiece during metal plating |
US6413388B1 (en) | 2000-02-23 | 2002-07-02 | Nutool Inc. | Pad designs and structures for a versatile materials processing apparatus |
US7204924B2 (en) * | 1998-12-01 | 2007-04-17 | Novellus Systems, Inc. | Method and apparatus to deposit layers with uniform properties |
US7427337B2 (en) * | 1998-12-01 | 2008-09-23 | Novellus Systems, Inc. | System for electropolishing and electrochemical mechanical polishing |
KR100665745B1 (ko) * | 1999-01-26 | 2007-01-09 | 가부시키가이샤 에바라 세이사꾸쇼 | 구리도금방법 및 그 장치 |
JP2001073182A (ja) * | 1999-07-15 | 2001-03-21 | Boc Group Inc:The | 改良された酸性銅電気メッキ用溶液 |
US6355153B1 (en) * | 1999-09-17 | 2002-03-12 | Nutool, Inc. | Chip interconnect and packaging deposition methods and structures |
US6612915B1 (en) | 1999-12-27 | 2003-09-02 | Nutool Inc. | Work piece carrier head for plating and polishing |
US6354916B1 (en) | 2000-02-11 | 2002-03-12 | Nu Tool Inc. | Modified plating solution for plating and planarization and process utilizing same |
US20090020437A1 (en) * | 2000-02-23 | 2009-01-22 | Basol Bulent M | Method and system for controlled material removal by electrochemical polishing |
US20060131177A1 (en) * | 2000-02-23 | 2006-06-22 | Jeffrey Bogart | Means to eliminate bubble entrapment during electrochemical processing of workpiece surface |
US7141146B2 (en) * | 2000-02-23 | 2006-11-28 | Asm Nutool, Inc. | Means to improve center to edge uniformity of electrochemical mechanical processing of workpiece surface |
US6406609B1 (en) * | 2000-02-25 | 2002-06-18 | Agere Systems Guardian Corp. | Method of fabricating an integrated circuit |
US6482307B2 (en) | 2000-05-12 | 2002-11-19 | Nutool, Inc. | Method of and apparatus for making electrical contact to wafer surface for full-face electroplating or electropolishing |
US6852208B2 (en) | 2000-03-17 | 2005-02-08 | Nutool, Inc. | Method and apparatus for full surface electrotreating of a wafer |
US20060118425A1 (en) * | 2000-04-19 | 2006-06-08 | Basol Bulent M | Process to minimize and/or eliminate conductive material coating over the top surface of a patterned substrate |
WO2001084617A1 (en) * | 2000-04-27 | 2001-11-08 | Nu Tool Inc. | Conductive structure for use in multi-level metallization and process |
US6695962B2 (en) | 2001-05-01 | 2004-02-24 | Nutool Inc. | Anode designs for planar metal deposits with enhanced electrolyte solution blending and process of supplying electrolyte solution using such designs |
US6478936B1 (en) * | 2000-05-11 | 2002-11-12 | Nutool Inc. | Anode assembly for plating and planarizing a conductive layer |
US7195696B2 (en) * | 2000-05-11 | 2007-03-27 | Novellus Systems, Inc. | Electrode assembly for electrochemical processing of workpiece |
US6921551B2 (en) * | 2000-08-10 | 2005-07-26 | Asm Nutool, Inc. | Plating method and apparatus for controlling deposition on predetermined portions of a workpiece |
US7754061B2 (en) * | 2000-08-10 | 2010-07-13 | Novellus Systems, Inc. | Method for controlling conductor deposition on predetermined portions of a wafer |
US6776893B1 (en) | 2000-11-20 | 2004-08-17 | Enthone Inc. | Electroplating chemistry for the CU filling of submicron features of VLSI/ULSI interconnect |
US6802946B2 (en) | 2000-12-21 | 2004-10-12 | Nutool Inc. | Apparatus for controlling thickness uniformity of electroplated and electroetched layers |
US6866763B2 (en) * | 2001-01-17 | 2005-03-15 | Asm Nutool. Inc. | Method and system monitoring and controlling film thickness profile during plating and electroetching |
US20050040049A1 (en) * | 2002-09-20 | 2005-02-24 | Rimma Volodarsky | Anode assembly for plating and planarizing a conductive layer |
US20070131563A1 (en) * | 2003-04-14 | 2007-06-14 | Asm Nutool, Inc. | Means to improve center to edge uniformity of electrochemical mechanical processing of workpiece surface |
US7297247B2 (en) * | 2003-05-06 | 2007-11-20 | Applied Materials, Inc. | Electroformed sputtering target |
DE10337669B4 (de) * | 2003-08-08 | 2006-04-27 | Atotech Deutschland Gmbh | Wässrige, saure Lösung und Verfahren zum galvanischen Abscheiden von Kupferüberzügen sowie Verwendung der Lösung |
US7648622B2 (en) * | 2004-02-27 | 2010-01-19 | Novellus Systems, Inc. | System and method for electrochemical mechanical polishing |
CN1946879B (zh) * | 2005-01-25 | 2010-05-05 | 日矿金属株式会社 | 作为添加剂含有具有特定骨架化合物的铜电解液以及由该铜电解液制造的电解铜箔 |
US9127362B2 (en) | 2005-10-31 | 2015-09-08 | Applied Materials, Inc. | Process kit and target for substrate processing chamber |
US8790499B2 (en) * | 2005-11-25 | 2014-07-29 | Applied Materials, Inc. | Process kit components for titanium sputtering chamber |
EP1839695A1 (de) * | 2006-03-31 | 2007-10-03 | Debiotech S.A. | Vorrichtung zur Injektion einer medizinischen Flüssigkeit |
US8500985B2 (en) * | 2006-07-21 | 2013-08-06 | Novellus Systems, Inc. | Photoresist-free metal deposition |
US20080237048A1 (en) * | 2007-03-30 | 2008-10-02 | Ismail Emesh | Method and apparatus for selective electrofilling of through-wafer vias |
US8968536B2 (en) * | 2007-06-18 | 2015-03-03 | Applied Materials, Inc. | Sputtering target having increased life and sputtering uniformity |
US7901552B2 (en) | 2007-10-05 | 2011-03-08 | Applied Materials, Inc. | Sputtering target with grooves and intersecting channels |
KR20110079466A (ko) | 2009-12-31 | 2011-07-07 | 제일모직주식회사 | 열가소성 수지 조성물 및 이를 이용한 성형품 |
CN105568326A (zh) * | 2015-12-31 | 2016-05-11 | 深圳市鑫鸿顺科技有限公司 | 一种pcb垂直连续电镀专用镀铜溶液 |
CN113166962A (zh) | 2018-11-07 | 2021-07-23 | 科文特亚股份有限公司 | 缎面铜浴和沉积缎面铜层的方法 |
CN110284163B (zh) * | 2019-07-31 | 2020-08-04 | 广州三孚新材料科技股份有限公司 | 一种太阳能电池用镀铜液及其制备方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4036710A (en) * | 1974-11-21 | 1977-07-19 | M & T Chemicals Inc. | Electrodeposition of copper |
US4038161A (en) * | 1976-03-05 | 1977-07-26 | R. O. Hull & Company, Inc. | Acid copper plating and additive composition therefor |
-
1981
- 1981-07-24 FR FR8114394A patent/FR2510145B1/fr not_active Expired
-
1982
- 1982-07-16 DE DE8282401328T patent/DE3264038D1/de not_active Expired
- 1982-07-16 EP EP82401328A patent/EP0071512B1/de not_active Expired
- 1982-07-16 AT AT82401328T patent/ATE13697T1/de not_active IP Right Cessation
- 1982-07-16 US US06/398,805 patent/US4430173A/en not_active Expired - Fee Related
- 1982-07-22 IE IE1754/82A patent/IE53352B1/en not_active IP Right Cessation
- 1982-07-22 JP JP57126848A patent/JPS5827992A/ja active Granted
-
1986
- 1986-07-24 SG SG640/86A patent/SG64086G/en unknown
- 1986-12-11 HK HK965/86A patent/HK96586A/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
DE3264038D1 (en) | 1985-07-11 |
IE821754L (en) | 1983-01-24 |
FR2510145B1 (fr) | 1986-02-07 |
JPS6155599B2 (de) | 1986-11-28 |
SG64086G (en) | 1987-09-18 |
EP0071512B1 (de) | 1985-06-05 |
US4430173A (en) | 1984-02-07 |
IE53352B1 (en) | 1988-10-26 |
FR2510145A1 (fr) | 1983-01-28 |
EP0071512A1 (de) | 1983-02-09 |
HK96586A (en) | 1986-12-19 |
JPS5827992A (ja) | 1983-02-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
UEP | Publication of translation of european patent specification | ||
REN | Ceased due to non-payment of the annual fee |