CN1946879B - 作为添加剂含有具有特定骨架化合物的铜电解液以及由该铜电解液制造的电解铜箔 - Google Patents
作为添加剂含有具有特定骨架化合物的铜电解液以及由该铜电解液制造的电解铜箔 Download PDFInfo
- Publication number
- CN1946879B CN1946879B CN2005800128254A CN200580012825A CN1946879B CN 1946879 B CN1946879 B CN 1946879B CN 2005800128254 A CN2005800128254 A CN 2005800128254A CN 200580012825 A CN200580012825 A CN 200580012825A CN 1946879 B CN1946879 B CN 1946879B
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- Prior art keywords
- compound
- copper
- copper foil
- electrolytic copper
- additive
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 88
- 150000001875 compounds Chemical class 0.000 title claims abstract description 75
- 239000010949 copper Substances 0.000 title claims abstract description 52
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 49
- 239000011889 copper foil Substances 0.000 title claims abstract description 40
- 239000000654 additive Substances 0.000 title claims abstract description 15
- 230000000996 additive effect Effects 0.000 title claims abstract description 15
- 238000005868 electrolysis reaction Methods 0.000 title description 3
- 239000003792 electrolyte Substances 0.000 claims abstract description 30
- 239000000758 substrate Substances 0.000 claims abstract description 23
- 125000003700 epoxy group Chemical group 0.000 claims abstract description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 6
- 238000007259 addition reaction Methods 0.000 claims abstract description 5
- 150000002898 organic sulfur compounds Chemical class 0.000 claims description 11
- NAWXUBYGYWOOIX-SFHVURJKSA-N (2s)-2-[[4-[2-(2,4-diaminoquinazolin-6-yl)ethyl]benzoyl]amino]-4-methylidenepentanedioic acid Chemical compound C1=CC2=NC(N)=NC(N)=C2C=C1CCC1=CC=C(C(=O)N[C@@H](CC(=C)C(O)=O)C(O)=O)C=C1 NAWXUBYGYWOOIX-SFHVURJKSA-N 0.000 claims description 6
- 229910052728 basic metal Inorganic materials 0.000 claims description 6
- 239000001257 hydrogen Substances 0.000 claims description 6
- 229910052739 hydrogen Inorganic materials 0.000 claims description 6
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 claims description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 4
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical group OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 claims description 4
- 239000003513 alkali Substances 0.000 claims description 4
- -1 basic metal alkali Chemical class 0.000 claims description 4
- 150000003818 basic metals Chemical class 0.000 claims description 4
- 239000002585 base Substances 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 125000001118 alkylidene group Chemical group 0.000 claims description 2
- 150000003863 ammonium salts Chemical class 0.000 claims description 2
- 125000004432 carbon atom Chemical group C* 0.000 claims description 2
- 238000003825 pressing Methods 0.000 claims description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 11
- 238000000059 patterning Methods 0.000 abstract description 9
- 230000003746 surface roughness Effects 0.000 abstract description 2
- 230000015572 biosynthetic process Effects 0.000 description 26
- 238000003786 synthesis reaction Methods 0.000 description 25
- 239000011734 sodium Substances 0.000 description 22
- 239000008151 electrolyte solution Substances 0.000 description 11
- 239000004593 Epoxy Substances 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 239000002994 raw material Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 238000001644 13C nuclear magnetic resonance spectroscopy Methods 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 4
- 238000009434 installation Methods 0.000 description 4
- 239000012212 insulator Substances 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000004070 electrodeposition Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- SRRKNRDXURUMPP-UHFFFAOYSA-N sodium disulfide Chemical compound [Na+].[Na+].[S-][S-] SRRKNRDXURUMPP-UHFFFAOYSA-N 0.000 description 2
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 2
- VEPOHXYIFQMVHW-XOZOLZJESA-N 2,3-dihydroxybutanedioic acid (2S,3S)-3,4-dimethyl-2-phenylmorpholine Chemical compound OC(C(O)C(O)=O)C(O)=O.C[C@H]1[C@@H](OCCN1C)c1ccccc1 VEPOHXYIFQMVHW-XOZOLZJESA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- PCNDJXKNXGMECE-UHFFFAOYSA-N Phenazine Natural products C1=CC=CC2=NC3=CC=CC=C3N=C21 PCNDJXKNXGMECE-UHFFFAOYSA-N 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 208000037656 Respiratory Sounds Diseases 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 150000002431 hydrogen Chemical group 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- OKKJLVBELUTLKV-UHFFFAOYSA-N methyl alcohol Substances OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000002927 oxygen compounds Chemical group 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- FRTIVUOKBXDGPD-UHFFFAOYSA-M sodium;3-sulfanylpropane-1-sulfonate Chemical compound [Na+].[O-]S(=O)(=O)CCCS FRTIVUOKBXDGPD-UHFFFAOYSA-M 0.000 description 1
- 238000013517 stratification Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 210000001364 upper extremity Anatomy 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Laminated Bodies (AREA)
- Electroplating Methods And Accessories (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
Description
Claims (6)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005016760 | 2005-01-25 | ||
JP016760/2005 | 2005-01-25 | ||
PCT/JP2005/022662 WO2006080148A1 (ja) | 2005-01-25 | 2005-12-09 | 特定骨格を有する化合物を添加剤として含む銅電解液並びにそれにより製造される電解銅箔 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1946879A CN1946879A (zh) | 2007-04-11 |
CN1946879B true CN1946879B (zh) | 2010-05-05 |
Family
ID=36740182
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2005800128254A Active CN1946879B (zh) | 2005-01-25 | 2005-12-09 | 作为添加剂含有具有特定骨架化合物的铜电解液以及由该铜电解液制造的电解铜箔 |
Country Status (7)
Country | Link |
---|---|
US (2) | US7824534B2 (zh) |
EP (2) | EP2233613B1 (zh) |
JP (1) | JP4376903B2 (zh) |
CN (1) | CN1946879B (zh) |
DE (1) | DE602005026333D1 (zh) |
TW (1) | TWI311164B (zh) |
WO (1) | WO2006080148A1 (zh) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008126522A1 (ja) * | 2007-03-15 | 2008-10-23 | Nippon Mining & Metals Co., Ltd. | 銅電解液及びそれを用いて得られた2層フレキシブル基板 |
JP2008285727A (ja) * | 2007-05-18 | 2008-11-27 | Furukawa Circuit Foil Kk | 高抗張力電解銅箔及びその製造方法 |
US8470450B2 (en) * | 2007-12-27 | 2013-06-25 | Jx Nippon Mining & Metals Corporation | Method of producing two-layered copper-clad laminate, and two-layered copper-clad laminate |
CN103060859B (zh) * | 2012-12-27 | 2015-04-22 | 建滔(连州)铜箔有限公司 | 用于改善毛箔毛面锋形的添加剂和电解铜箔生产工艺 |
CN104995135A (zh) * | 2013-02-19 | 2015-10-21 | Jx日矿日石金属株式会社 | 石墨烯制造用铜箔和石墨烯的制造方法 |
JP6438208B2 (ja) * | 2013-04-03 | 2018-12-12 | Jx金属株式会社 | キャリア付銅箔、それを用いた銅張積層板、プリント配線板、電子機器及びプリント配線板の製造方法 |
JP5810197B2 (ja) * | 2013-09-11 | 2015-11-11 | 古河電気工業株式会社 | 電解銅箔、フレキシブル配線板及び電池 |
CN104674313B (zh) * | 2015-02-10 | 2017-05-31 | 华南理工大学 | 一种在镀层金属表面制备阵列微纳结构的电镀方法及装置 |
KR101734840B1 (ko) * | 2016-11-11 | 2017-05-15 | 일진머티리얼즈 주식회사 | 내굴곡성이 우수한 이차전지용 전해동박 및 그의 제조방법 |
CN113089034B (zh) * | 2021-04-02 | 2021-10-08 | 广东嘉元科技股份有限公司 | 一种侧液槽、电解液流动方法、生箔机及其工作方法 |
CN114045536B (zh) * | 2021-12-13 | 2023-05-23 | 南开大学 | 一种兼具高强度和高延性的梯度超薄铜箔制备方法 |
Citations (3)
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---|---|---|---|---|
US4038161A (en) * | 1976-03-05 | 1977-07-26 | R. O. Hull & Company, Inc. | Acid copper plating and additive composition therefor |
EP0071512A1 (fr) * | 1981-07-24 | 1983-02-09 | Rhone-Poulenc Specialites Chimiques | Procédé de préparation d'un additif pour bain de cuivrage électrolytique acide et son application |
CN1410601A (zh) * | 2001-09-27 | 2003-04-16 | 长春石油化学股份有限公司 | 用于铜集成电路内连线的铜电镀液组合物 |
Family Cites Families (20)
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US3264216A (en) * | 1962-09-26 | 1966-08-02 | Exxon Research Engineering Co | Multifunctional viscosity index improvers for lubricating oils |
US4376685A (en) * | 1981-06-24 | 1983-03-15 | M&T Chemicals Inc. | Acid copper electroplating baths containing brightening and leveling additives |
JPH0631461B2 (ja) | 1987-06-15 | 1994-04-27 | 日本電解株式会社 | 電解銅箔の製造方法 |
US5431803A (en) * | 1990-05-30 | 1995-07-11 | Gould Electronics Inc. | Electrodeposited copper foil and process for making same |
JP3356568B2 (ja) | 1994-11-30 | 2002-12-16 | 鐘淵化学工業株式会社 | 新規なフレキシブル銅張積層板 |
JP3660628B2 (ja) | 1995-09-22 | 2005-06-15 | 古河サーキットフォイル株式会社 | ファインパターン用電解銅箔とその製造方法 |
EP0857402B1 (en) | 1996-08-23 | 2007-12-19 | Nikko Materials USA, Inc. | High performance flexible laminate |
JPH10193505A (ja) | 1997-01-09 | 1998-07-28 | Sumitomo Metal Mining Co Ltd | 2層フレキシブル基板の製造方法 |
JPH10330983A (ja) | 1997-05-30 | 1998-12-15 | Fukuda Metal Foil & Powder Co Ltd | 電解銅箔及びその製造方法 |
US5863410A (en) | 1997-06-23 | 1999-01-26 | Circuit Foil Usa, Inc. | Process for the manufacture of high quality very low profile copper foil and copper foil produced thereby |
DE19758121C2 (de) | 1997-12-17 | 2000-04-06 | Atotech Deutschland Gmbh | Wäßriges Bad und Verfahren zum elektrolytischen Abscheiden von Kupferschichten |
TWI223678B (en) | 1998-03-20 | 2004-11-11 | Semitool Inc | Process for applying a metal structure to a workpiece, the treated workpiece and a solution for electroplating copper |
JP2000261113A (ja) | 1999-03-08 | 2000-09-22 | Sumitomo Bakelite Co Ltd | 2層フレキシブルプリント回路用基板およびその製造方法 |
JP4300382B2 (ja) * | 2000-03-30 | 2009-07-22 | 日本ゼオン株式会社 | 絶縁材料、絶縁材料の製造方法および多層回路基板の製造方法 |
WO2003096776A1 (fr) * | 2002-05-13 | 2003-11-20 | Mitsui Mining & Smelting Co.,Ltd. | Carte imprimee souple pour puce montee sur bande |
JP3789107B2 (ja) * | 2002-07-23 | 2006-06-21 | 株式会社日鉱マテリアルズ | 特定骨格を有するアミン化合物及び有機硫黄化合物を添加剤として含む銅電解液並びにそれにより製造される電解銅箔 |
JP4115240B2 (ja) | 2002-10-21 | 2008-07-09 | 日鉱金属株式会社 | 特定骨格を有する四級アミン化合物及び有機硫黄化合物を添加剤として含む銅電解液並びにそれにより製造される電解銅箔 |
CN100526515C (zh) | 2002-12-18 | 2009-08-12 | 日矿金属株式会社 | 铜电解液和从该铜电解液制造出的电解铜箔 |
JP4294363B2 (ja) * | 2003-04-18 | 2009-07-08 | 三井金属鉱業株式会社 | 2層フレキシブル銅張積層板及びその2層フレキシブル銅張積層板の製造方法 |
JP2006096444A (ja) * | 2004-09-28 | 2006-04-13 | Toshiba Tec Corp | シート後処理装置 |
-
2005
- 2005-12-09 EP EP10165867A patent/EP2233613B1/en not_active Expired - Fee Related
- 2005-12-09 EP EP05814382A patent/EP1842939B1/en not_active Ceased
- 2005-12-09 WO PCT/JP2005/022662 patent/WO2006080148A1/ja active Application Filing
- 2005-12-09 DE DE602005026333T patent/DE602005026333D1/de active Active
- 2005-12-09 CN CN2005800128254A patent/CN1946879B/zh active Active
- 2005-12-09 JP JP2006524973A patent/JP4376903B2/ja active Active
- 2005-12-09 US US10/588,686 patent/US7824534B2/en active Active
- 2005-12-16 TW TW094144647A patent/TWI311164B/zh active
-
2010
- 2010-02-23 US US12/660,199 patent/US20100224496A1/en not_active Abandoned
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4038161A (en) * | 1976-03-05 | 1977-07-26 | R. O. Hull & Company, Inc. | Acid copper plating and additive composition therefor |
EP0071512A1 (fr) * | 1981-07-24 | 1983-02-09 | Rhone-Poulenc Specialites Chimiques | Procédé de préparation d'un additif pour bain de cuivrage électrolytique acide et son application |
CN1410601A (zh) * | 2001-09-27 | 2003-04-16 | 长春石油化学股份有限公司 | 用于铜集成电路内连线的铜电镀液组合物 |
Non-Patent Citations (2)
Title |
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M.R.H. DE ALMEIDA等.Voltammetric and morphological characterization of copperelectrodeposition from non-cyanide electrolyte.Journal of Applied Electrochemistry32 7.2002,32(7),763-773. * |
M.R.H.DE ALMEIDA等.Voltammetric and morphological characterization of copperelectrodeposition from non-cyanide electrolyte.Journal of Applied Electrochemistry32 7.2002,32(7),763-773. * |
Also Published As
Publication number | Publication date |
---|---|
TW200626754A (en) | 2006-08-01 |
US20070170069A1 (en) | 2007-07-26 |
EP1842939B1 (en) | 2011-02-09 |
WO2006080148A1 (ja) | 2006-08-03 |
CN1946879A (zh) | 2007-04-11 |
JPWO2006080148A1 (ja) | 2008-06-19 |
TWI311164B (en) | 2009-06-21 |
JP4376903B2 (ja) | 2009-12-02 |
EP1842939A4 (en) | 2010-04-07 |
US7824534B2 (en) | 2010-11-02 |
EP2233613A1 (en) | 2010-09-29 |
DE602005026333D1 (de) | 2011-03-24 |
EP2233613B1 (en) | 2012-05-30 |
US20100224496A1 (en) | 2010-09-09 |
EP1842939A1 (en) | 2007-10-10 |
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