KR102104307B1 - Linear evaporation source - Google Patents

Abstract

A high temperature linear vapor deposition source is disclosed. A crucible accommodating unit in which a crucible provided with a deposition material according to an embodiment of the present invention is accommodated; And it is disposed outside the crucible in the crucible receiving unit, and includes an evaporation material external heating unit for heating the evaporation material in the crucible at the corresponding position.

Description

Linear evaporation source for high temperature

The present invention relates to a linear evaporation source for high temperature, and more specifically, since it is possible to heat a deposition material in the crucible from the outside of the crucible, it is possible to increase the capacity of the crucible than the conventional under the same conditions. In addition, the present invention relates to a linear deposition source for high temperature capable of improving conductance in a deposition source and uniformity of a substrate.

With the rapid development of information and communication technology and the expansion of the market, flat panel displays have been spotlighted as display devices. Such flat panel display devices include liquid crystal display devices, plasma display panels, and organic light emitting diodes.

Among them, organic light emitting devices, such as OLEDs, have very good advantages such as fast response speed, lower power consumption than conventional LCDs, light weight, and the fact that they do not require a separate back light device, making them ultra-thin and high brightness. It has recently been spotlighted as a display element.

The organic electroluminescent device is a principle in which an appropriate energy difference is formed on an organic thin film and emits light by applying an anode film, an organic thin film, and a cathode film on a substrate in order, and applying a voltage between the anode and the cathode.

In other words, the injected electrons and holes recombine, and the remaining excitation energy is generated as light. At this time, since the wavelength of light generated according to the amount of the dopant of the organic material can be adjusted, full color can be realized.

1 is a structural diagram of an organic light emitting device.

As shown in this figure, the organic light emitting device has an anode, a hole injection layer, a hole transport layer, a light emitting layer, and a hole blocking layer on a substrate. layer), an electron transport layer, an electron injection layer, and a film such as a cathode are formed in order.

In this structure, ITO (Indium Tin Oxide) having small surface resistance and good permeability is mainly used as the anode. In addition, the organic thin film is formed of a multi-layer of a hole injection layer, a hole transport layer, a light emitting layer, a hole blocking layer, an electron transport layer, and an electron injection layer to increase luminous efficiency. Organic materials used as the light emitting layer include Alq3, TPD, PBD, m-MTDATA, TCTA, and the like. As the cathode, a Lie-Al metal film is used. In addition, since the organic thin film is very weak to moisture and oxygen in the air, an encapsulating film is formed on the top to seal the device to increase the life time of the device.

When the organic light emitting device shown in FIG. 1 is briefly summarized, the organic light emitting device includes an anode, a cathode, and a light emitting layer interposed between the anode and the cathode, and when driven, holes are injected into the light emitting layer from the anode, and electrons Is injected into the light emitting layer from the cathode. Holes and electrons injected into the light emitting layer are combined in the light emitting layer to generate excitons, and these excitons emit light while transitioning from an excited state to a ground state.

The organic light emitting device may be divided into a single color or a full color organic light emitting device according to the color to be implemented. The full color organic light emitting device includes red (R), green (G) and three primary colors of light. A full color is realized by having a light emitting layer patterned for each blue (B).

A substrate deposition apparatus for a flat panel display device is applied to make an organic light emitting device having the structure shown in FIG. 1, that is, to deposit a light emitting layer (organic material) and an electrode layer (inorganic material).

A substrate deposition apparatus for a flat panel display device to which a vacuum evaporation method is applied is provided with a linear evaporation source for high temperature spraying a deposition material toward a substrate.

Recently, a linear deposition source of a linear type is applied to secure uniformity of the thickness of the thin film, simplify the control device, and reduce the volume of the chamber.

On the other hand, in a conventional linear deposition source, a heater that heats a deposition material is generally disposed inside a crucible.

As described above, since a heater for heating the deposition material has been disposed in the crucible, in order to increase the capacity of the crucible, it is inevitable to increase the height of the crucible or increase the outer diameter.

However, increasing the height of the crucible is limited because it causes the height of the chamber to increase, and increasing the outer diameter of the crucible increases the thermal gradient of the deposition material in the crucible, thereby controlling the process ratio (rate) control), making it difficult to apply.

In addition, in the case where the heater is disposed in the crucible as in the past, there is a high possibility to reduce the conductance and uniformity of the substrate inside the evaporation source, so it is necessary to develop a technology to solve the problem.

Korea Patent Office Application No. 10-2006-0063602

Therefore, the technical problem to be achieved by the present invention is, since it is possible to heat the deposition material in the crucible from the outside of the crucible, it is possible to increase the capacity of the crucible than the conventional under the same conditions, and furthermore, the conductance in the deposition source ( It is to provide a linear deposition source for high temperature that can improve conductance and uniformity of the substrate.

According to an aspect of the present invention, a crucible accommodating unit in which a crucible having a deposition material is accommodated therein; And a deposition material external heating unit disposed outside the crucible in the crucible accommodating unit and heating the deposition material in the crucible at the corresponding position. Can be.

The deposition material external heating unit, a heater provided in the crucible receiving unit; And an externally arranged heating wire connected to the heater and arranged in a zigzag shape outside the crucible in the crucible accommodating unit to heat the deposition material.

The deposition material external heating unit may be disposed in the crucible accommodating unit, and may further include a wire support plate supporting the external placement type heating wire.

A plurality of positions are provided for each position on the wire support plate, and may further include a plurality of wire clamps for clamping the externally arranged heating wire.

The wire clamp may include a metal support boss disposed on the wire support plate; And a wire guide holder inserted into the metal support boss and guided by the externally arranged heating wire on a circumferential surface.

The wire clamp may further include a departure-prevention pin that is fastened to the metal support boss through the wire guide holder and prevents the displacement of the wire guide holder.

The wire guide holder may have a long gear shape, and the wire guide roller may be made of a ceramic material.

A metal reflector for heat reflection may be provided on the wire support plate.

It may be further connected to the crucible accommodating unit, and may further include a deposition material delivery unit that delivers the deposition material on the crucible side.

Cooling means may be interposed in the crucible accommodating unit and the deposition material transfer unit.

It is provided on the deposition material delivery unit, and may further include a built-in heating module for heating the deposition material delivered from the crucible.

A nozzle head having a deposition material receiving portion through which the deposition material from the crucible is transferred and received, and a module placement portion disposed on a radially inner side of the deposition material receiving portion and on which the built-in heating module is disposed, are further provided. It can contain.

One end is coupled to the deposition material receiving portion of the nozzle head in communication, the other end is exposed to the outside of the nozzle head a plurality of nozzles (nozzle) for spraying the deposition material evaporated by the built-in heating module to the outside It can contain.

The built-in heating module, the module body; And it may further include a spiral heating wire disposed in a spiral on the outside of the module body.

The built-in heating module may further include an insulator disposed outside the module body to support the spiral heating wire, and to prevent the spiral heating wire from directly contacting the module body and the nozzle head. have.

A plurality of insulators are disposed at equal angle intervals along the circumferential direction from the outside of the module body, and may be supported by a plurality of ring members.

A stepped head coupling portion to which an end of the nozzle head is coupled may be further formed at one end of the module body, and a plurality of cutout portions may be formed at the head coupling portion.

According to the present invention, since it is possible to heat the deposition material in the crucible from the outside of the crucible, it is possible to increase the capacity of the crucible than the conventional one under the same conditions, and furthermore, the conductance of the deposition source and the substrate Uniformity can be improved.

1 is a structural diagram of an organic light emitting device.
2 is a schematic structural diagram of a substrate deposition apparatus for a flat panel display device to which a linear deposition source for high temperature is applied according to an embodiment of the present invention.
3 is a cross-sectional structure diagram of a high temperature linear vapor deposition source.
4 is an enlarged view of area A of FIG. 3.
5 is a perspective view of the nozzle head and the built-in heating module.
6 is an enlarged view of region B of FIG. 5.
7 is an enlarged view of the crucible area of FIG. 3.
8 is a front view of FIG. 7.
FIG. 9 is a layout view of the externally arranged heating wire and wire clamp for the region C of FIG. 7.
10 is an exploded view of the wire clamp.

In order to fully understand the present invention, the operational advantages of the present invention, and the objects achieved by the practice of the present invention, reference should be made to the accompanying drawings and the contents described in the accompanying drawings, which illustrate preferred embodiments of the present invention.

Hereinafter, the present invention will be described in detail by explaining preferred embodiments of the present invention with reference to the accompanying drawings. The same reference numerals in each drawing denote the same members.

2 is a schematic structural diagram of a substrate deposition apparatus for a flat panel display device to which a linear deposition source for high temperature is applied according to an embodiment of the present invention.

Prior to the description relative to the drawings, the flat panel display device includes a liquid crystal display device, a plasma display panel, organic light emitting diodes, etc. It will be described as a substrate for a light emitting element (OLED).

Referring to FIG. 2, a substrate deposition apparatus for a flat panel display device includes a process chamber 10 in which a deposition process for a substrate proceeds, and a linear deposition source for high temperature that is provided on one side of the process chamber 10 and sprays a deposition material toward the substrate (100).

The process chamber 10 is a place where a deposition process for a substrate is performed. That is, a place for depositing a light emitting layer (organic substance) and an electrode layer (inorganic substance) is formed for manufacturing the organic electroluminescent element shown in FIG. 1. The deposition apparatus of this embodiment may be a deposition apparatus that deposits organic substances.

During the deposition process, the inside of the process chamber 10 maintains a vacuum atmosphere. Therefore, a vacuum pump or the like may be connected to the process chamber 10.

On the other hand, a linear deposition source for high temperature 100 is provided on one side of the process chamber 10 to spray the deposition material toward the substrate.

As will be described later in detail, since the linear evaporation source 100 for high temperature in this embodiment is disposed long in the longitudinal direction of the process chamber 10 and discloses an integral structure that does not require additional assembly, a temperature deviation that may occur at every use occurs Can be reduced.

In particular, since the linear evaporation source 100 for high temperature according to this embodiment having structural features to be described later is applied, it is possible to heat the deposition material in the crucible 120 from the outside of the crucible 120. Under the same conditions, it is possible to increase the capacity of the crucible 120 than in the prior art, and further improve the conductance in the deposition source and the uniformity of the substrate.

Hereinafter, with reference to FIGS. 3 to 10 will be described in detail with respect to the high-temperature linear deposition source 100 of this embodiment.

3 is a cross-sectional structure diagram of a linear deposition source for high temperature, FIG. 4 is an enlarged view of area A of FIG. 3, FIG. 5 is a perspective view of a nozzle head and an embedded heating module, and FIG. 6 is an enlarged view of area B of FIG. 5 , FIG. 7 is an enlarged view of the crucible area of FIG. 3, FIG. 8 is a front view of FIG. 7, FIG. 9 is a layout view of an externally arranged heating wire and a wire clamp for the area C of FIG. 7, and FIG. 10 is a wire It is an exploded view of the clamp.

Referring to these drawings, since the deposition material in the crucible 120 can be heated outside the crucible 120, it is possible to increase the capacity of the crucible 120 under the same conditions. , The crucible accommodating unit 110 in which the crucible 120 provided with the evaporation material is accommodated therein, is cross-connected to the crucible accommodating unit 110 and deposited material on the crucible 120 side Deposition material delivery unit 115 for transmitting the, and is disposed outside the crucible 120 in the crucible accommodating unit 110, the deposition to heat the deposition material in the crucible 120 at the corresponding position The material may include an external heating unit 160 and an internal heating module 130 provided on the deposition material delivery unit 115 and heating the deposition material transferred from the crucible 120.

The crucible accommodating unit 110 and the deposition material transfer unit 115 are a kind of cabinet, respectively accommodating and supporting the crucible 120 and the built-in heating module 130 at corresponding positions. Cooling means may be interposed in the crucible accommodating unit 110 and the deposition material transfer unit 115, respectively. The cooling means may include, for example, a cooling line (C / L) shown in FIGS. 7 and 8. As the cooling water flows through the cooling line (C / L), the crucible accommodating unit 110 or the deposition material transfer unit 115 may be cooled. For convenience, the cooling line (C / L) on the deposition material delivery unit 115 side is omitted.

The crucible 120 is a tubular structure disposed in the crucible receiving unit 110. In the crucible 120, a deposition material deposited on the surface of the substrate of FIG. 2 while evaporating upon heating is accommodated. The deposition material accommodated in the crucible 120 may be an organic material or an inorganic material.

On the other hand, as described above, previously, a series of means for heating the deposition material accommodated in the crucible 120 has been disposed inside the crucible 120, so the capacity of the crucible 120 is increased. In order to increase, it was inevitable to increase the height of the crucible or increase the outer diameter.

However, increasing the height of the crucible 120 is limited because it causes an increase in the height of the chamber 10 (see FIG. 2), and increasing the outer diameter of the crucible 120 is the crucible ( Since it increases the thermal gradient of the deposited material in 120), it is difficult to apply because it creates difficulties in process rate control.

Thus, in the present embodiment, this problem is solved by arranging a series of means for heating the deposition material outside the crucible 120.

That is, in the present embodiment, the external heating unit 160 of the deposition material is applied so that the capacity of the crucible 120 can be increased under the same conditions as in the prior art. In other words, the deposition material external heating unit 160 is disposed outside the crucible 120 in the crucible accommodating unit 110 as shown in detail in FIGS. 7 to 10, and is crucible in the corresponding position. It serves to heat the deposited material in (120).

Since the deposition material external heating unit 160 can heat the deposition material in the crucible 120 from the outside of the crucible 120, it is possible to increase the capacity of the crucible 120 under the same conditions than in the prior art. have. That is, since a separate component does not need to be provided in the crucible 120, the capacity of the crucible 120 can be increased.

The external heating unit 160 of the deposition material is connected to the heater 161 provided in the crucible accommodating unit 110 and the heater 161, but the crucible 120 is connected within the crucible accommodating unit 110. It may be arranged in a zigzag (zigzag) shape on the outside may include an externally arranged heating wire (163, heating wire) for heating the deposition material.

In the case of the linear deposition source 100 for high temperature, for example, the process temperature is higher than 1000 ° C, as in the present embodiment, the heater 161 is a resistor that applies voltage and current to the externally arranged heating wire 163, such as tungsten or tantalum. Use heating method. At this time, since the temperature of the externally arranged heating wire 163 exceeds 1000 ° C, the externally arranged heating wire 163 may be applied in a nude type exposed to the outside.

The externally arranged heating wire 163 is arranged in a zigzag manner on the wire support plate 165. Since the externally arranged heating wire 163 is arranged in a zigzag manner, thermal efficiency may be increased. The wire support plate 165 is a structure disposed in the crucible accommodating unit 110 and supports the externally arranged heating wire 163.

The wire support plate 165 is provided with a metal reflector 166 for heat reflection. Since the heat reflected by the metal reflector 166 is directed to the crucible 120, thermal efficiency may be increased.

A plurality of wire clamps 170 are provided to clamp the externally arranged heating wire 163 onto the wire support plate 165. A plurality of wire clamps 170 are provided on the wire support plate 165 for each location, and serve to clamp the externally arranged heating wire 163.

The wire clamp 170 is inserted into the metal support boss 171 disposed on the wire support plate 165 and the metal support boss 171, and an externally arranged heating wire 163 is guided on the circumferential surface. It includes a wire guide holder 172, and is fastened to the boss 171 for metal support through the wire guide holder 172, and includes a pin 173 for preventing the departure of the wire guide holder 172.

In this embodiment, the wire guide holder 172 may have a roller shape or a long gear shape. Therefore, when the externally arranged heating wire 163 is arranged in a zigzag shape as shown in FIG. 9, the externally arranged heating wire 163 can be easily guided without disconnection. The wire guide holder 172 may be made of a ceramic material resistant to heat distortion.

Meanwhile, referring to FIGS. 3 to 6 again, the linear evaporation source 100 for high temperature according to the present embodiment is cross-connected with the crucible accommodating unit 110 and deposited material on the crucible 120 side. Deposition material delivery unit 115 for transferring the is provided.

The deposition material delivery unit 115 is provided with an embedded heating module 130 that heats the deposition material delivered from the crucible 120.

In this embodiment, the crucible receiving unit 110 is heating the deposition material by an external heating method, while the deposition material delivery unit 115 is heating the deposition material by an internal heating method by the built-in heating module 130. do.

As illustrated in FIG. 4, a nozzle placement hole 111 in which a nozzle 150 to which a heated deposition material is injected is disposed is formed in the deposition material delivery unit 115. The nozzle placement hole 111 is formed in a larger volume than the nozzle 150. The nozzle 150 is disposed in the nozzle placement hole 111 but is not exposed outside the nozzle placement hole 111.

The deposition material delivery unit 115 is provided with a nozzle head 140 to which a plurality of nozzles 150 are coupled. The end of the nozzle head 140 is coupled to the outlet 120a of the crucible 120 (see FIG. 8).

The built-in heating module 130 serves to heat the deposition material transferred from the crucible 120 into the nozzle head 140.

The built-in heating module 130 includes a module body 131, a spiral heating wire 132 disposed spirally outside the module body 131, and a spiral heating wire disposed outside the module body 131. It supports 132, and includes an insulator 133 that prevents the spiral heating wire 132 from directly contacting the module body 131 and the nozzle head 140.

When the insulator 133 is installed on the outside of the module body 131 as in this embodiment, and the spiral heating wire 132 is wound and arranged in a spiral form through the insulator 133 to produce the built-in heating module 130, The convenience of production can be greatly improved.

A plurality of insulators 133 may be arranged at an isometric interval along the circumferential direction from the outside of the module body 131. In the present embodiment, four insulators 133 are disposed at equal angle intervals along the circumferential direction from the outside of the module body 131, but the scope of the present invention is not limited to the number thereof.

A head engaging portion 134 is formed at one end of the module body 131 to which the end of the nozzle head 140 is coupled. The head coupling portion 134 has a stepped structure. Although not necessarily, a plurality of incisions 134a are further formed in the head coupling portion 134.

In addition, a plurality of ring members 135 are combined at various locations along the longitudinal direction of the module body 131. The ring members 135 serve to support the insulator 133.

On the other hand, the nozzle head 140 not only forms a place where the deposition material from the crucible 120 is transferred, but also has an internal heating module 130 mounted therein, and a plurality of nozzles 150 are coupled to the outer surface. do.

Unlike the previous head, the nozzle head 140 has a double tube structure. That is, the nozzle head 140 is disposed on the radially inner side of the deposition material accommodating portion 141 and the deposition material accommodating portion 141 where the deposition material from the crucible 120 is transferred and received, and the built-in heating module 130 ) Has a double tube structure having a module arrangement portion 142 on which it is disposed.

As described above, the built-in heating module 130 is disposed on the innermost module placement portion 142 of the nozzle head 140 to generate heat, and the deposition from the crucible 120 is deposited on the outer deposition material receiving portion 141. As the material is delivered and received, the deposition material may be heated by the built-in heating module 130 and sprayed to the outside.

Particularly, in the case of such a structure, since a structure such as a reflector is not required, there is an advantage in that the structure is simplified, and thus there is an advantage in that it is convenient to manufacture and easy to install or maintain.

On the other hand, the nozzle 150 is one end of which is coupled to the deposition material receiving portion 141 of the nozzle head 140 and the other end is exposed to the outside of the nozzle head 140, the nozzle of the deposition material transfer unit 115 It is disposed in the placement hole 111, and serves to spray the deposited material evaporated by the built-in heating module 130 toward the substrate of FIG. 2.

In the present embodiment, the built-in heating module 130 is disposed in the module arrangement part 142, which is the innermost part of the nozzle head 140, and is heated, and the crucible 120 is disposed in the deposition material receiving part 141 outside ) As the deposition material from) is transferred and received, the deposition material is heated by the built-in heating module 130, and unlike the prior art, it has a structure in which the nozzle 150 is connected to the deposition material receiving portion 141. The length of the nozzle 150 can be kept as short as possible. Therefore, it is good to prevent clogging, which is a phenomenon in which a hole in the nozzle 150 is clogged because an organic substance that is a deposition material is hardened.

A brief look at the operation of the substrate deposition apparatus for a flat panel display device having such a configuration is as follows.

In order to proceed with the deposition process for the substrate, power is supplied to the external heating unit 160 of the deposition material of the high temperature linear deposition source 100. Then, the heater 161 is operated, and the externally arranged heating wire 163 is heated, so that the deposition material in the crucible 120 is heated.

The deposition material in the heated crucible 120 is sprayed to the substrate through the nozzle 150 via the deposition material delivery unit 115. At this time, since the built-in heating module 130 is running, the heat of the built-in heating module 130 is transferred to the deposition material receiving portion 141 of the nozzle head 140.

Then, the deposition material from the crucible 120 passing through the deposition material accommodating portion 141 can be kept heated and maintained in an evaporated state, whereby the deposition material is deposited on the surface of the substrate through a plurality of nozzles 150. It becomes possible.

According to the present embodiment having the structure and action as described above, since the deposition material in the crucible 120 can be heated outside the crucible 120, the crucible 120 is more conventional than the conventional under the same conditions. It is possible to increase the capacity of, and further improve the conductance and the uniformity of the substrate in the evaporation source.

As described above, the present invention is not limited to the described embodiments, and it is obvious to those skilled in the art that various modifications and modifications can be made without departing from the spirit and scope of the present invention. Therefore, such modifications or variations will have to belong to the claims of the present invention.

10: process chamber 100: linear deposition source for high temperature
110: Crucible receiving unit 115: Deposition material delivery unit
120: crucible 130: built-in heating module
131: module body 132: heating wire
133: insulator 134: head engaging portion
134a: incision 135: ring member
140: nozzle head 140a: the first flange portion
141: deposition material receiving unit 142: module arrangement unit
150: nozzle 160: deposition material external heating part
161: heater 163: externally arranged heating wire
165: wire support plate 166: metal reflector
170: wire clamp 171: metal support boss
172: wire guide holder 173: departure stop pin

Claims (17)

A crucible accommodating unit in which a crucible having a deposition material is accommodated therein;
A deposition material external heating unit disposed outside the crucible in the crucible accommodating unit and heating the deposition material in the crucible at a corresponding position;
A deposition material delivery unit which is cross-connected with the crucible receiving unit and delivers the deposition material on the crucible side;
A module body, a helical heating wire helically disposed on the outside of the module body, and a plurality of is disposed at equal angle intervals along a circumferential direction from the outside of the module body to support the helical heating wire, but by a plurality of ring members It is supported, and is provided with an insulator that prevents the spiral heating wire from directly contacting the module body and the nozzle head, and is provided in the deposition material delivery unit to heat the deposition material delivered from the crucible. Heating module; And
It includes a nozzle head (nozzle head) having a deposition material receiving portion for receiving and receiving the deposition material from the crucible, and a module arrangement portion disposed on the radially inner side of the deposition material receiving portion to place the built-in heating module. And
The deposition material external heating unit,
A heater provided in the crucible accommodating unit;
An externally arranged heating wire connected to the heater and arranged in a zigzag shape outside the crucible in the crucible accommodating unit to heat the deposition material;
A wire support plate disposed in the crucible accommodating unit and supporting the externally arranged heating wire; And
A metal support boss disposed on the wire support plate, a wire guide holder inserted into the metal support boss and guided by the externally arranged heating wire on a circumferential surface, and the metal support boss through the wire guide holder It is fastened to the provided with a pin for preventing the departure to prevent the seat of the wire guide holder, but provided in a plurality by position on the wire support plate, including a plurality of wire clamps for clamping the externally arranged heating wire Characterized by a linear deposition source for high temperature. delete delete delete delete delete According to claim 1,
The wire guide holder has a long gear shape,
The wire guide roller is a linear deposition source for high temperature, characterized in that it is made of a ceramic (ceramic) material. According to claim 1,
A linear deposition source for high temperature, wherein the wire support plate is provided with a metal reflector for heat reflection. delete According to claim 1,
A linear evaporation source for high temperature, characterized in that a cooling means is interposed in the crucible accommodating unit and the evaporation material delivery unit. delete delete According to claim 1,
One end is coupled to the deposition material receiving portion of the nozzle head in communication, the other end is exposed to the outside of the nozzle head a plurality of nozzles for spraying the deposition material evaporated by the built-in heating module to the outside (nozzle) further Linear deposition source for high temperature, characterized in that it comprises. delete delete delete According to claim 1,
A stepped head coupling portion to which an end of the nozzle head is coupled is further formed at one end of the module body,
A linear evaporation source for high temperature, characterized in that a plurality of incisions are formed in the head coupling portion.

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