KR20190080374A - Linear evaporation source - Google Patents

Abstract

Disclosed is a linear evaporation source for high temperature. According to an embodiment of the present invention, the linear evaporation source for high temperature comprises: a crucible storage unit in which a crucible having an evaporation material is stored; and an evaporation material external heating unit disposed outside the crucible in the crucible storage unit and heating the evaporation material in the crucible at a corresponding position.

Description

{Linear evaporation source}

The present invention relates to a high-temperature linear deposition source, and more particularly, to a vapor deposition source for a high-temperature linear deposition source capable of heating a vapor deposition material in a crucible from outside of the crucible to increase the capacity of the crucible And moreover, to a linear evaporation source for high temperature which can improve the conductance in the evaporation source and the uniformity of the substrate.

As a result of the rapid development of information and communication technology and the expansion of the market, a flat panel display is attracting attention as a display device. Such flat panel display devices include liquid crystal display devices, plasma display panels, and organic light emitting diodes.

Among these organic electroluminescent devices, for example, OLEDs have very good advantages such as high response speed, lower power consumption than conventional LCD, light weight, no need for a separate backlight device, And has recently attracted attention as a display device.

Such an organic electroluminescent device is a principle in which an anode film, an organic thin film, and a cathode film are sequentially formed on a substrate, and a voltage is applied between the anode and the cathode to form a proper energy difference in the organic thin film and emit light by itself.

In other words, the injected electrons and holes are recombined, and the excitation energy generated is generated by light. At this time, since the wavelength of light generated according to the amount of the dopant of the organic material can be controlled, full color can be realized.

1 is a structural view of an organic electroluminescent device.

As shown in this figure, an organic electroluminescent device includes an anode, a hole injection layer, a hole transfer layer, an emitting layer, a hole blocking layer, an electron injection layer, a cathode, and the like are stacked in this order.

In this structure, ITO (Indium Tin Oxide), which has small surface resistance and good transparency, is mainly used as the anode. The organic thin film is composed of a multilayer of a hole injecting layer, a hole transporting layer, a light emitting layer, a hole blocking layer, an electron transporting layer, and an electron injecting layer in order to increase the luminous efficiency. Organic materials used as the light emitting layer include Alq3, TPD, PBD, m-MTDATA, and TCTA. As the cathode, a Lie-Al metal film is used. And since the organic thin film is very weak to moisture and oxygen in the air, a sealing film for sealing is formed at the top to increase the lifetime of the device.

1, the organic electroluminescent device includes an anode, a cathode, and a light emitting layer interposed between the anode and the cathode. When the organic electroluminescent device is driven, holes are injected into the light emitting layer from the anode, Is injected into the light emitting layer from the cathode. The holes and electrons injected into the light emitting layer are combined in the light emitting layer to generate excitons, and the excitons emit light while transitioning from the excited state to the ground state.

Such an organic electroluminescent device can be classified into a monochromatic or full color organic electroluminescent device according to the color to be realized. The full-color organic electroluminescent device includes red (R), green (G) and And a light emitting layer patterned for each blue (B) color is provided to realize a full color.

In order to form an organic electroluminescent device having a structure as shown in FIG. 1, that is, a substrate deposition apparatus for a flat panel display device is applied to deposit a light emitting layer (organic material) and an electrode layer (inorganic material).

A substrate evaporation apparatus for a flat panel display device to which a thermal evaporation is applied is provided with a linear evaporation source for injecting a deposition material toward a substrate.

Recently, a linear type linear evaporation source is applied to secure uniformity of thin film thickness, simplify control device, and reduce the volume of a chamber.

On the other hand, in a conventional linear deposition source, a heater for heating a deposition material is generally disposed inside a crucible.

As described above, since the heater for heating the deposition material has been disposed in the crucible, the height of the crucible or the outer diameter is inevitably increased in order to increase the capacity of the crucible.

However, increasing the height of the crucible is limited because it causes height increase of the chamber, and increasing the outer diameter of the crucible increases the thermal gradient of the deposition material in the crucible, control is difficult to apply.

In addition, when the heater is disposed in the crucible as in the past, there is a considerable room for reducing the conductance of the inside of the evaporation source and the uniformity of the substrate.

Korea Patent Office Application No. 10-2006-0063602

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a method and apparatus for heating a deposition material in a crucible outside a crucible, thereby increasing the capacity of the crucible under the same conditions as the conventional case, The present invention provides a high-temperature linear deposition source capable of improving conductivity and uniformity of a substrate.

According to an aspect of the present invention, there is provided a plasma processing apparatus comprising: a crucible accommodating unit in which a crucible having an evaporation material is accommodated; And an evaporation material external heating unit disposed outside the crucible in the crucible accommodating unit and heating the evaporation material in the crucible at the position. .

Wherein the evaporation material external heating unit includes: a heater provided in the crucible accommodating unit; And an externally disposed heating wire connected to the heater and arranged in a zigzag shape outside the crucible in the crucible accommodating unit to heat the evaporation material.

The deposition material external heating portion may further include a wire support plate disposed in the crucible accommodating unit and supporting the external arrangement type heating wire.

A plurality of wire clamps may be further provided on the wire support plate to clamp the external arrangement type heating wire.

The wire clamp comprising: a metal supporting boss disposed on the wire supporting plate; And a wire guide holder inserted into the metal supporting boss and guided by the outer placement type heating wire on a circumferential surface thereof.

The wire clamp may further include a release pin for fastening the wire guide holder to the metal support boss through the wire guide holder to prevent displacement of the wire guide holder.

The wire guide holder may have a long shape, and the wire guide roller may be made of a ceramic material.

A metal reflector for heat reflection may be provided on the wire support plate.

And a deposition material transfer unit connected to the crucible accommodating unit in a crossing manner to transfer the deposition material on the crucible side.

Cooling means may be interposed in the crucible accommodating unit and the evaporation material conveying unit.

The heating module may further include a built-in heating module provided in the deposition material transfer unit and heating the deposition material transferred from the crucible.

A nozzle head including a deposition material receiving portion for receiving the deposition material from the crucible and receiving the deposition material and a module arrangement portion disposed radially inward of the deposition material receiving portion to dispose the built- .

One end of the nozzle head is connected to the deposition material receiving portion of the nozzle head and the other end of the nozzle head is exposed to the outside of the nozzle head to eject a plurality of evaporation materials evaporated by the built- .

The built-in heating module includes: a module body; And a helical heating wire disposed spirally outside the module body.

The built-in heating module may further include an insulator disposed outside the module body to support the helical heating wire and to prevent direct contact of the helical heating wire with the module body and the nozzle head have.

A plurality of the insulators are disposed at equal angular intervals along the circumferential direction from the outer side of the module body and can be supported by a plurality of ring members.

The module body may be provided with a stepped head coupling portion to which an end of the nozzle head is coupled, and a plurality of cutouts may be formed in the head coupling portion.

According to the present invention, since the deposition material in the crucible can be heated from outside the crucible, the capacity of the crucible can be increased more than the conventional one under the same conditions, and further, the conductance in the evaporation source and the Uniformity can be improved.

1 is a structural view of an organic electroluminescent device.
FIG. 2 is a schematic structural view of a substrate deposition apparatus for a flat panel display device to which a high-temperature linear deposition source according to an embodiment of the present invention is applied.
3 is a cross-sectional structural view of a linear deposition source for high temperature.
4 is an enlarged view of the area A in Fig.
5 is a perspective view of the nozzle head and the built-in heating module.
6 is an enlarged view of the area B in Fig.
Fig. 7 is an enlarged view of the crucible area of Fig. 3;
8 is a front view of Fig.
9 is a layout diagram of an externally disposed heating wire and a wire clamp with respect to a region C in Fig.
10 is an exploded view of a wire clamp.

In order to fully understand the present invention, operational advantages of the present invention, and objects achieved by the practice of the present invention, reference should be made to the accompanying drawings and the accompanying drawings which illustrate preferred embodiments of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Like reference symbols in the drawings denote like elements.

FIG. 2 is a schematic structural view of a substrate deposition apparatus for a flat panel display device to which a high-temperature linear deposition source according to an embodiment of the present invention is applied.

Prior to describing the drawings, the flat panel display device includes a liquid crystal display, a plasma display panel, an organic light emitting diode, etc. Hereinafter, a flat panel display device is referred to as an organic electric field And a substrate for a light emitting device (OLED).

Referring to FIG. 2, the substrate deposition apparatus for a flat panel display device includes a process chamber 10 on which a deposition process is performed on a substrate, a linear deposition source for high temperature, which is provided on one side of the process chamber 10, (100).

The process chamber 10 is where the deposition process proceeds to the substrate. That is, a place for depositing a light emitting layer (organic material) and an electrode layer (inorganic material) is formed for manufacturing the organic electroluminescent device shown in FIG. The deposition apparatus of this embodiment may be a deposition apparatus for depositing an organic material.

During the deposition process, the inside of the process chamber 10 maintains a vacuum atmosphere. Therefore, a vacuum pump or the like may be connected to the process chamber 10.

On the other hand, the high-temperature linear deposition source 100 is provided at one side of the process chamber 10 to spray the deposition material toward the substrate.

As will be described later in detail, since the high-temperature linear deposition source 100 according to the present embodiment is arranged long in the longitudinal direction of the process chamber 10 and does not require additional assembly, a temperature variation that can be caused in every use .

Particularly, since the deposition material in the crucible 120 can be heated from the outside of the crucible 120 by applying the linear deposition source 100 according to the present embodiment having the following structural features It is possible to increase the capacity of the crucible 120 under the same conditions as before, and further improve the conductance in the evaporation source and the uniformity of the substrate.

Hereinafter, the high-temperature linear deposition source 100 of the present embodiment will be described in detail with reference to FIGS. 3 to 10. FIG.

Fig. 5 is a perspective view of the nozzle head and the built-in heating module, Fig. 6 is an enlarged view of the region B in Fig. 5, Fig. 6 is a cross- Fig. 7 is an enlarged view of the crucible region of Fig. 3, Fig. 8 is a front view of Fig. 7, Fig. 9 is a layout diagram of the externally disposed heating wire and wire clamp for the region C of Fig. 7, This is an exploded view of the clamp.

Referring to these drawings, since the deposition material in the crucible 120 can be heated outside the crucible 120, it is possible to increase the capacity of the crucible 120 under the same conditions as the conventional one A crucible accommodating unit 110 in which a crucible 120 having an evaporation material is accommodated therein and a deposition material 110 on the side of the crucible 120 which is connected to cross the crucible accommodating unit 110, A deposition material transfer unit 115 for transferring the deposition material from the crucible 120 to the crucible 120, a deposition material transfer unit 115 for transferring the deposition material from the crucible 120 to the crucible 120, A material external heating unit 160 and a built-in heating module 130 provided in the deposition material transfer unit 115 and heating the deposition material transferred from the crucible 120. [

The crucible accommodating unit 110 and the evaporation material conveyance unit 115 are cabinets of a kind, respectively, which respectively receive and support the crucible 120 and the built-in heating module 130 at the corresponding positions. Cooling means may be interposed in the crucible accommodating unit 110 and the evaporation material transfer unit 115, respectively. The cooling means may include, for example, the cooling line (C / L) shown in Figs. 7 and 8. The cooling water can be cooled by the cooling line (C / L) while cooling the crucible accommodating unit 110 or the evaporation material transfer unit 115. For convenience, the cooling line (C / L) on the evaporation material transfer unit 115 side is not shown.

The crucible 120 is a tubular structure disposed within the crucible receiving unit 110. In this crucible 120, a deposition material that is evaporated on heating and deposited on the substrate surface of Fig. 2 is received. The deposition material contained in the crucible 120 may be organic or inorganic.

On the other hand, as described above, since a series of means for heating the deposition material accommodated in the crucible 120 has been previously disposed inside the crucible 120, the capacity of the crucible 120 The increase in the height of the crucible or the increase in the outer diameter was inevitable.

However, increasing the height of the crucible 120 is limited because it causes height increase of the chamber 10 (see FIG. 2), and increasing the outer diameter of the crucible 120 is crucible 120 is difficult to apply because it raises the thermal gradient of the deposition material in the deposition chamber, thereby making it difficult to control the rate.

Accordingly, in this embodiment, a series of means for heating the deposition material is disposed outside the crucible 120 to solve this problem.

That is, in the present embodiment, the deposition material external heating unit 160 is applied so that the capacity of the crucible 120 can be increased more than the conventional one under the same condition as the conventional one. In other words, the evaporation material external heating portion 160 is disposed outside the crucible 120 in the crucible accommodating unit 110 as shown in detail in FIGS. 7 to 10, And serves to heat the deposition material in the deposition chamber 120.

Since the deposition material external heating portion 160 can heat the deposition material in the crucible 120 from outside the crucible 120, the capacity of the crucible 120 can be increased under the same conditions have. That is, the capacity of the crucible 120 can be increased because it is not necessary to provide a separate part in the crucible 120.

The deposition material external heating unit 160 includes a heater 161 provided in the crucible accommodating unit 110 and a heater 161 connected to the heater 161 in the crucible accommodating unit 110, And a heating wire 163 disposed outside in a zigzag shape to heat the deposition material.

In the case of the linear deposition source 100 for a high temperature in which the process temperature is higher than, for example, 1000 ° C as in the present embodiment, the heater 161 is provided with a resistance for applying voltage and current to the externally disposed heating wire 163 such as tungsten or tantalum Heating method is used. At this time, since the temperature of the external placement type heating wire 163 exceeds 1000 ° C, the external placement type heating wire 163 can be applied as a nude type exposed to the outside.

Such an externally disposed heating wire 163 is disposed in a staggered manner on the wire support plate 165. Since the externally disposed heating wire 163 is arranged in a staggered manner, the thermal efficiency can be increased. The wire support plate 165 supports the externally disposed heating wire 163 as a structure disposed in the crucible accommodating unit 110.

The wire support plate 165 is provided with a metal reflector 166 for heat reflection. The heat reflected by the metal reflector 166 may be directed to the crucible 120 and thus the thermal efficiency may be increased.

A plurality of wire clamps 170 are provided for clamping the externally disposed heating wire 163 onto the wire support plate 165. A plurality of wire clamps 170 are provided on the wire support plate 165 for each position, and serve to clamp the externally disposed heating wire 163.

The wire clamp 170 includes a metal supporting boss 171 disposed on the wire supporting plate 165 and a metal supporting boss 171 inserted into the metal supporting boss 171, And a release pin 173 fastened to the metal support boss 171 through the wire guide holder 172 to prevent the wire guide holder 172 from being displaced.

In this embodiment, the wire guide holder 172 may have a roller or a slot shape. Accordingly, when the external placement type heating wire 163 is arranged in a staggered configuration as shown in Fig. 9, the external placement type heating wire 163 can be easily guided without being cut. The wire guide holder 172 can be made of a ceramic material resistant to thermal deformation.

3 to 6, the high-temperature linear deposition source 100 according to the present embodiment is connected to the crucible accommodating unit 110 in a crossing manner, and the evaporation material on the crucible 120 side The deposition material transfer unit 115 is provided.

The deposition material transfer unit 115 is provided with a built-in heating module 130 for heating the deposition material transferred from the crucible 120.

In the case of this embodiment, the evaporation material is heated by the external heating method on the side of the crucible accommodating unit 110, while the evaporation material is heated by the internal heating method by the built-in heating module 130 on the evaporation material transfer unit 115 side do.

As shown in FIG. 4, the deposition material transfer unit 115 is formed with a nozzle arrangement hole 111 in which a nozzle 150 through which the heated deposition material is injected is disposed. The nozzle arrangement hole 111 is formed in a larger volume than the nozzle 150. The nozzle 150 is disposed in the nozzle arrangement hole 111 and is not exposed to the outside of the nozzle arrangement hole 111. [

The deposition material transfer unit 115 is provided with a nozzle head 140 to which a plurality of nozzles 150 are coupled. The end of the nozzle head 140 is engaged with the outlet 120a of the crucible 120 (see Fig. 8).

The built-in heating module 130 serves to heat the deposition material transferred from the crucible 120 into the nozzle head 140.

The built-in heating module 130 includes a module body 131, a helical heating wire 132 disposed spirally outside the module body 131, a helical heating wire 132 disposed outside the module body 131, And an insulator 133 for preventing the helical heating wire 132 from contacting the module body 131 and the nozzle head 140 directly.

When the built-in heating module 130 is manufactured by providing the insulator 133 on the outside of the module body 131 and winding the helical heating wire 132 in the form of a spiral through the insulator 133, The convenience of fabrication can be greatly improved.

A plurality of insulators 133 may be disposed at equal angular intervals along the circumferential direction from the outside of the module body 131. In this embodiment, four insulators 133 are arranged at equal angular intervals along the circumferential direction from the outside of the module body 131, but the number of the insulators 133 is not limited to the scope of the present invention.

A head coupling portion 134 is formed at one end of the module body 131 to which an end of the nozzle head 140 is coupled. The head coupling portion 134 has a stepped structure. Although not necessarily, a plurality of cutouts 134a are further formed in the head coupling portion 134. [

A plurality of ring members 135 are coupled to the module body 131 along the longitudinal direction of the module body 131. The ring members (135) serve to support the insulator (133).

In addition, the nozzle head 140 not only forms a place where the deposition material from the crucible 120 is transmitted, but also has a built-in heating module 130 mounted therein, and a plurality of nozzles 150 do.

The nozzle head 140 has a double tube structure unlike the prior art. That is, the nozzle head 140 includes a deposition material receiving portion 141 that receives and receives a deposition material from the crucible 120, and a nozzle mounting portion 141 that is disposed radially inward of the deposition material receiving portion 141, And a module arrangement unit 142 in which the module arrangement unit 142 is disposed.

In this way, the built-in heating module 130 is disposed and heated in the module placement part 142 which is the innermost part of the nozzle head 140, and the evaporation material receiving part 141 outside the nozzle head 140 is evaporated from the crucible 120 As the material is transferred and housed, the deposition material can be heated by the built-in heating module 130 and ejected to the outside.

Particularly, in such a structure, there is an advantage that the structure is simplified because a structure of a reflector or the like is not required, so that it is advantageous in that manufacturing is easy and installation or maintenance is simple.

One end of the nozzle 150 is coupled to the deposition material receiving portion 141 of the nozzle head 140 and the other end of the nozzle 150 is exposed to the outside of the nozzle head 140, And is disposed in the placement hole 111 and serves to inject the evaporation material evaporated by the built-in heating module 130 toward the substrate of FIG.

In the present embodiment, the built-in heating module 130 is disposed in the module arrangement part 142, which is the innermost part of the nozzle head 140, to generate heat, and a crucible 120 The deposition material is heated by the built-in heating module 130 and the nozzle 150 is connected to the deposition material receiving portion 141. Thus, unlike the prior art, The length of the nozzle 150 can be kept as short as possible. Therefore, it is preferable to prevent the phenomenon of clogging, which is a phenomenon that the organic material as the deposition material is hardened and the hole of the nozzle 150 is clogged.

The operation of the substrate deposition apparatus for flat panel display devices having such a configuration will be briefly described below.

Power is supplied to the external heating portion 160 of the deposition material of the high-temperature linear deposition source 100 in order to perform the deposition process on the substrate. Then, the heater 161 is operated to heat the deposition material in the crucible 120 as the externally disposed heating wire 163 is heated.

The deposition material in the heated crucible 120 is injected through the nozzle 150 into the substrate via the deposition material transfer unit 115. At this time, since the built-in heating module 130 is operated, the heat of the built-in heating module 130 is transferred to the deposition material receiving portion 141 of the nozzle head 140.

Then, the deposition material from the crucible 120 passing through the deposition material receiving portion 141 can be kept heated to maintain the evaporation state, whereby the deposition material is deposited onto the surface of the substrate through the plurality of nozzles 150 .

According to the present embodiment having the structure and operation as described above, since the deposition material in the crucible 120 can be heated from the outside of the crucible 120, the crucible 120 can be heated under the same conditions, It is possible to increase the capacitance of the evaporation source and further improve the conductance in the evaporation source and the uniformity of the substrate.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention. It is therefore intended that such modifications or alterations be within the scope of the claims appended hereto.

10: process chamber 100: linear deposition source for high temperature
110: Crucible accommodating unit 115: Evaporated material transfer unit
120: Crucible 130: Built-in heating module
131: Module body 132: Heating wire
133: insulator 134: head coupling portion
134a: incision part 135: ring member
140: nozzle head 140a: first flange portion
141: deposition material receiving portion 142: module arrangement portion
150: nozzle 160: deposition material external heating portion
161: heater 163: external arrangement type heating wire
165: wire support plate 166: metal reflector
170: wire clamp 171: metal support boss
172: wire guide holder 173: release preventing pin

Claims (17)

A crucible accommodating unit in which a crucible having an evaporation material is accommodated; And
And an evaporation material external heating portion disposed outside the crucible in the crucible accommodating unit and heating the evaporation material in the crucible at the position. The method according to claim 1,
The deposition material external heating portion may include:
A heater provided in the crucible accommodating unit; And
And an external arrangement type heating wire connected to the heater and arranged in a zigzag shape outside the crucible in the crucible accommodating unit to heat the evaporation material. Linear evaporation source for high temperature. 3. The method of claim 2,
The deposition material external heating portion may include:
Further comprising a wire support plate disposed within the crucible receiving unit for supporting the externally disposed heating wire. The method of claim 3,
A plurality of wire clamps provided on the wire support plate for each position and clamping the outer placement type heating wire. The method of claim 3,
Wherein the wire clamp comprises:
A metal supporting boss disposed on the wire supporting plate; And
And a wire guide holder inserted into the metal supporting boss and guided by the outer arrangement type heating wire on a circumferential surface thereof. 6. The method of claim 5,
Wherein the wire clamp comprises:
Further comprising a release pin for fastening to the metal support boss through the wire guide holder to prevent displacement of the wire guide holder. 6. The method of claim 5,
The wire guide holder has a long shape,
Wherein the wire guide roller is made of a ceramic material. The method of claim 3,
Wherein the wire support plate is provided with a metal reflector for heat reflection. The method according to claim 1,
Further comprising a vapor deposition material transfer unit connected to the crucible storage unit in a crossing manner to transfer the deposition material on the crucible side. 10. The method of claim 9,
Wherein a cooling means is interposed in the crucible accommodating unit and the evaporation material transfer unit. 10. The method of claim 9,
And a built-in heating module provided in the deposition material transfer unit for heating the deposition material transferred from the crucible. 12. The method of claim 11,
A nozzle head including a deposition material receiving portion for receiving the deposition material from the crucible and receiving the deposition material and a module arrangement portion disposed radially inward of the deposition material receiving portion to dispose the built- Wherein the high-temperature linear evaporation source is a high-temperature linear evaporation source. 13. The method of claim 12,
One end of the nozzle head is connected to the deposition material receiving portion of the nozzle head and the other end of the nozzle head is exposed to the outside of the nozzle head to eject a plurality of evaporation materials evaporated by the built- Wherein the high-temperature linear evaporation source is a high-temperature linear evaporation source. 13. The method of claim 12,
The built-in heating module includes:
Module body; And
Further comprising: a helical heating wire disposed spirally outside the module body. ≪ RTI ID = 0.0 > 11. < / RTI > 15. The method of claim 14,
The built-in heating module includes:
Further comprising an insulator disposed outside the module body to support the helical heating wire and to prevent direct contact of the helical heating wire with the module body and the nozzle head. Evaporation source. 16. The method of claim 15,
Wherein a plurality of insulators are disposed at equal angular intervals along the circumferential direction from the outside of the module body and are supported by a plurality of ring members. 15. The method of claim 14,
The module body is further formed with a stepped head coupling portion to which an end of the nozzle head is coupled,
Wherein a plurality of cutouts are formed in the head coupling portion.

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