KR102020768B1 - Glass Deposition Apparatus - Google Patents

Abstract

A substrate deposition apparatus is disclosed. Substrate deposition apparatus according to an embodiment of the present invention, the chamber in which the deposition process for the substrate proceeds; A block housing forming an exterior, a crucible in which the deposition material is filled and partitioned into a plurality of zones independent from each other within the block housing, and one side opening of the crucible A linear deposition source coupled to, wherein the linear deposition source includes a cover having a plurality of nozzles formed in the plurality of zones, respectively, forming a path toward the substrate while the deposition material in the crucible evaporates; And a control unit controlling the linear deposition sources independently of each other in a plurality of zones by controlling the injection amount of the deposition material sprayed from the plurality of nozzles corresponding to the plurality of zones.

Description

Substrate Deposition Apparatus {Glass Deposition Apparatus}

The present invention relates to a substrate deposition apparatus, and more particularly, to a substrate deposition apparatus that controls the thickness of the deposition material deposited on the substrate in part without changing the nozzle tuning process in a vacuum state.

With the rapid development of information and communication technology and the expansion of the market, flat panel displays have been in the spotlight as display devices. Such flat panel display devices include liquid crystal displays, plasma display panels, and organic light emitting diodes.

Among them, organic light emitting diodes, such as OLEDs, have very good advantages such as faster response speed, lower power consumption than conventional LCDs, light weight, and can be made ultra thin because no separate back light device is required. In recent years, it has been spotlighted as a display element.

The organic light emitting diode is a principle of applying an anode film, an organic thin film, and a cathode film on a substrate in order, and applying a voltage between the anode and the cathode so that an appropriate energy difference is formed in the organic thin film and emits light by itself.

In other words, the injected electrons and holes are recombined, and the remaining excitation energy is generated as light. At this time, since the wavelength of the light generated according to the amount of the dopant of the organic material can be adjusted, it is possible to realize full color.

1 is a structural diagram of an organic light emitting display device.

As shown in the figure, the organic light emitting display device has an anode, a hole injection layer, a hole transfer layer, an emitting layer, a hole blocking layer on a substrate. A layer, an electron transfer layer, an electron injection layer, a cathode, and the like are sequentially stacked.

In this structure, ITO (Indium Tin Oxide) having a small surface resistance and good permeability is mainly used as the anode. The organic thin film is composed of a multilayer of a hole injection layer, a hole transport layer, a light emitting layer, a hole blocking layer, an electron transport layer, and an electron injection layer in order to increase luminous efficiency. Organic materials used as the light emitting layer include Alq3, TPD, PBD, m-MTDATA, TCTA and the like. As the cathode, a Lie-Al metal film is used. In addition, since the organic thin film is very weak to moisture and oxygen in the air, an encapsulation film is formed on the top to increase the life time of the device.

Briefly summarized again, the organic EL device shown in FIG. 1 includes an anode, a cathode, and a light emitting layer interposed between the anode and the cathode, and when driven, holes are injected from the anode into the light emitting layer, and the electrons Is injected from the cathode into the light emitting layer. Holes and electrons injected into the light emitting layer combine in the light emitting layer to generate excitons, and the excitons emit light as they transition from the excited state to the ground state.

The organic light emitting diodes may be classified into monochromatic or full color organic light emitting diodes according to the color to be implemented. The full color organic light emitting diodes are red (R), green (G), and three primary colors of light. Full color is realized by providing a light emitting layer patterned for each blue (B).

A substrate deposition apparatus is applied to make the organic electroluminescent device shown in FIG. 1, namely to deposit a light emitting layer (organic material) and an electrode layer (inorganic material).

A substrate deposition apparatus to which a thermal evaporation is applied is provided with a linear evaporation source for injecting a deposition material toward a substrate. Recently, linear type deposition sources have been applied to ensure uniformity of thin film thickness, simplify control devices, and reduce volume of chambers.

2 is a structural diagram schematically showing a conventional substrate deposition apparatus.

Referring to FIG. 2, a conventional substrate deposition apparatus 1 ′ is provided with a chamber 10 ′ in which a deposition process is performed on a substrate, and a linear deposition source provided on one side of the chamber 10 ′ to inject a deposition material toward the substrate. 30 '.

The substrate deposition apparatus generally applies heat to a heater in a vacuum state, so that the deposition material released through the cylindrical nozzle is deposited to the same thickness on the entire surface of the substrate.

However, in the related art, since the linear deposition source 30 is generally formed as one rectangular box that is long in the horizontal direction, even when heated to the same temperature, the temperature gradient may not be exactly the same in the longitudinal direction, and various other Since the injection amount of the deposition material may be different for each part according to environmental factors, it may not be deposited at the same thickness on the entire surface of the substrate.

Accordingly, in order to deposit the same thickness on the entire surface of the substrate, a nozzle tuning process of adjusting the amount of material by changing the diameter of the cylindrical nozzle is required.

In some cases, there may be a case where the thickness of a deposition material deposited on a substrate is partially changed. In this case, nozzle tuning is required.

This nozzle tuning process has a limitation in that it is possible in a standby state rather than a vacuum state, there is a time constraint and a disadvantage in terms of cost because a plurality of diameter-specific nozzles are required.

Republic of Korea Patent No. 10-1479942, 2015.01.12.

Accordingly, a technical object of the present invention is to provide a substrate deposition apparatus that partially controls a thickness of a deposition material deposited on a substrate without undergoing a nozzle tuning process in a vacuum state.

According to an aspect of the present invention, a chamber in which a deposition process for a substrate is performed; A block housing forming an exterior, a crucible in which a deposition material is filled inside and partitioned into a plurality of zones independent from each other in the block housing; A linear deposition source coupled to one opening, the cover including a cover having a plurality of nozzles respectively formed in the plurality of zones to form a path toward the substrate while the deposition material in the crucible evaporates. ; And a controller configured to control the linear deposition source independently of each other in the plurality of zones by controlling the injection amount of the deposition material sprayed from the plurality of nozzles corresponding to the plurality of zones. Can be.

And a sensor unit installed in the chamber to measure the amount of deposition material evaporated from the nozzle, wherein the controller controls the amount of deposition of the deposition material sprayed from the plurality of nozzles based on a detection signal of the sensor unit. It may be characterized by.

The sensor unit may include a plurality of crystal sensors disposed at positions corresponding to the plurality of zones, respectively.

The plurality of zones may include a center zone disposed in the center area of the crucible; And

It may include a first side zone and a second side zone disposed on both sides of the center zone.

The crucible is a crucible body; And a first partition wall and a second partition wall respectively coupled to the crucible body between the center zone and the first side zone, the center zone and the second side zone.

The crucible may further include a plurality of inner plates disposed independently of each of the plurality of zones and supported by the crucible body, the first partition wall, and the second partition wall, and having a plurality of through holes formed therein. .

The plurality of nozzles may include a plurality of center zone nozzles spaced apart from each other in the center zone; And a plurality of first side zone nozzles and a second side zone nozzle disposed to be spaced apart from each other in the first side zone and the second side zone.

The linear deposition source may further include a heating block provided in the block housing and heating the crucible.

The heating block is disposed on one side of the crucible, and includes a plurality of heating heaters corresponding to the plurality of zones, and the controller controls the heating heaters independently of each other in the plurality of zones. It can be characterized.

The heating block may further include a common heater disposed above the plurality of heating heaters, the heater being narrower than the width of the heating heater and integrally provided over the plurality of zones.

The linear deposition source may be disposed to partially surround the crucible in the block housing, and the deposition material diffusion preventing shield for preventing the leaking deposition material from the crucible side toward the inner wall of the block housing ( vapor shield).

The deposition preventing material diffusion shield, the upper body is opened, the shield body is provided to accommodate the crucible; And a shield flange provided to extend outward from an upper end opening of the shield body.

Embodiments of the present invention provide a linear deposition source that is divided into a plurality of zones that are independent of each other and independently controlled, so that the thickness of the deposition material deposited on the substrate can be partially changed without undergoing a nozzle tuning process in a vacuum state. can do.

1 is a structural diagram of an organic light emitting display device.
2 is a structural diagram schematically showing a conventional substrate deposition apparatus.
3 is a cross-sectional structural view schematically showing a substrate deposition apparatus according to an embodiment of the present invention.
4 is a perspective view showing a linear deposition source according to an embodiment of the present invention.
5 is a cross-sectional structural view of FIG. 4.
FIG. 6 is a schematic cross-sectional view of the heating block inside the block housing as a cross-sectional view of FIG. 4.
7 is a vertical cross-sectional view of FIG. 4.
8 is a perspective view of a shield for preventing deposition of a deposition material.

In order to fully understand the present invention, the operational advantages of the present invention, and the objects achieved by the practice of the present invention, reference should be made to the accompanying drawings which illustrate preferred embodiments of the present invention and the contents described in the accompanying drawings.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. Like reference numerals in the drawings denote like elements.

3 is a cross-sectional structural view schematically showing a substrate deposition apparatus according to an embodiment of the present invention, Figure 4 is a perspective view showing a linear deposition source according to an embodiment of the present invention, Figure 5 is a cross-sectional view of FIG. FIG. 6 is a cross-sectional structural view of FIG. 4 schematically illustrating a heating block inside a block housing, FIG. 7 is a vertical cross-sectional view of FIG. 4, and FIG. 8 is a perspective view of a shield for preventing deposition of deposition materials.

Prior to the drawings, the substrate deposition apparatus will be described based on a substrate deposition apparatus for a flat panel display device. The flat panel display device may be a liquid crystal display device, a plasma display panel, or an organic light emitting display device. Organic Light Emitting Diodes) and the like will be described below as a flat panel display device as an organic light emitting diode (OLED) substrate.

As shown in these drawings, the substrate deposition apparatus 1 according to an embodiment of the present invention includes a chamber 10, a linear deposition source 30, a controller (not shown), and a sensor unit 50. Include.

The chamber 10 is a place where a deposition process for a substrate is performed. That is, a place for depositing a light emitting layer (organic material) and an electrode layer (inorganic material) is formed for manufacturing the organic light emitting display device shown in FIG. 1. The substrate deposition apparatus of this embodiment may be a substrate deposition apparatus for depositing an organic material.

In the deposition process, the inside of the chamber 10 maintains a vacuum atmosphere. Therefore, a vacuum pump or the like may be connected to the process chamber 10.

Meanwhile, the linear deposition source 30 is provided on one side of the chamber 10 to inject a deposition material toward the substrate, and includes a block housing 310, a crucible 330 and a cover. (cover, 350) and a heating block (heating block 370, see FIG. 7).

In addition, the linear deposition source 30 according to the present embodiment is a deposition shield for preventing the deposition material diffusion (vapor shield 390, to prevent the leaking deposition material from the side of the crucible 330 toward the inner wall of the block housing 310) 7) may be further included.

When the deposition material diffusion prevention shield 390 is applied, problems such as a short circuit may occur by preventing the deposition material leaking from the crucible 330 toward the inner wall of the block housing 310 in which a plurality of components are mounted. You can prevent it.

Of course, the deposition preventing diffusion shield 390 is not necessarily applied to the linear deposition source 30 according to the present embodiment.

In other words, it may be applied only to the linear deposition source 30 having no structure for preventing the deposition material diffusion shield 390, all of which should be included in the scope of the present invention.

However, hereinafter, it will be described that all of the deposition material diffusion prevention shield 390 is applied to the linear deposition source 30 according to the present embodiment as shown in the drawings.

Looking at the structure, the block housing 310 forms an appearance. The block housing 310 has a hermetic structure in order to protect the internal crucible 330 while preventing the crucible 330 from lowering in temperature.

The crucible 330 is a structure called a crucible, and vaporizes a deposition material filled therein by the action of the heating block 370 to be described later, and sprays the vapor deposition material onto the substrate. As described above, the deposition material applied to the linear deposition source 30 according to the present embodiment may be an inorganic material, and may be deposited on a substrate while evaporating under a condition of more than 1000 ° C.

The crucible 330 includes a crucible body 331 filled with a deposition material, a first partition 333a, a second partition 333b, and an inner plate, as shown in detail in FIG. 3. (335L, 335C, 335R).

According to an embodiment of the present invention, the crucible 330 is divided into a plurality of zones that are independent of each other. Thus, the crucible 330 is divided into a plurality of zones so that the injection amount of the deposition material for each zone is controlled to control the plurality of zones. The linear deposition source can be controlled independently of each other.

In the present exemplary embodiment, the plurality of zones include the center zone ZC disposed in the center region of the crucible 330, the first side zone ZL disposed on both sides of the center zone ZC, and the second side zone. (ZR), but the present invention is not limited thereto, and may be divided into four or more zones in consideration of the size of the substrate and the linear deposition source and the thickness of the deposition material deposited on the substrate. The explanation is based on the following.

The first partition 333a is provided between the center zone ZC and the first side zone ZL, and the second partition 333b is provided between the center zone ZC and the second side zone ZR. By physically separating the crucible 330 into a plurality of zones, it is possible to control the heating temperature differently for each zone by isolating the exchange of deposition material between the zones.

In the crucible body 331, a deposition material is filled therein, and an inner plate 335 (inner plate) in which a plurality of holes are formed is provided on the filled deposition material.

The inner plate 335 may have various shapes, and may adjust the amount and direction of the deposition material by adjusting the size and number of the through holes.

In an embodiment of the present invention, as shown in detail in FIG. 5, the inner plate 335 is disposed independently of each of the plurality of zones, and includes a crucible body 331, a first partition 333a, and a second partition wall ( 333b) is provided as a structure supported by, but is not limited to this may be combined in a variety of ways.

A center inner plate 335C inside the center zone ZC, a first side zone inner plate 335L inside the first side zone ZL, and a second side zone inner inside the second side zone ZL. Since the plates 335R are provided independently of each other, the inner shapes of the respective inner plates 335L, 335C, and 335R may be differently controlled to independently control the injection amount of the deposition material in each zone.

Meanwhile, a cover 350 is coupled to an upper portion of the crucible 330, and a plurality of nozzles 351 (see FIG. 7) in which the deposition material in the crucible body 330 is sprayed onto the substrate are provided on the cover 350. Is formed.

According to the present exemplary embodiment, the plurality of nozzles 351 are a plurality of nozzles respectively provided in the plurality of zones, respectively, on one side of the center zone ZC, the first side zone ZL, and the second side zone ZR. The center zone nozzle 351C, the first side zone nozzle 351L, and the second side zone nozzle 351R may be disposed.

As shown in detail in FIG. 5, each of the four center zone nozzles 351C, the first side zone nozzles 351L, and the second side zone nozzles 351R for each of the zones ZC, ZL, and ZR are respectively formed. Although arranged, the number may be changed in consideration of the size of the substrate and the linear deposition source and the thickness of the deposition material deposited on the substrate.

Meanwhile, referring to FIG. 7, the heating block 370 is provided in the block housing 310 and serves to heat the crucible 330.

The heating block 370 includes a heating heater 371 and a common heater 372, and structures such as a reflector plate and ceramics are provided around the heating block 370, and the description thereof will be omitted.

According to the embodiment of the present invention, by controlling the heating heaters independently in a plurality of zones, the temperature for evaporating the deposition material in each zone can be different, so that the injection amount of the deposition material injected from the nozzle of each zone is adjusted Ultimately, the thickness of the deposition material deposited on the substrate can be partially controlled.

As shown in detail in FIG. 6, the heating heaters 371L, 371C, and 371R are disposed on one side of the crucible 330, and are provided in plural numbers corresponding to the plurality of zones, respectively, and the center zone heating heaters 371C. ), First side zone heating heater 371L, and second side zone heating heater 371R.

The common heater 372 may be disposed above the plurality of heating heaters 371L, 371C, and 371R, and may be integrally provided across the plurality of zones and narrower than the width of the heating heaters 371L, 371C, and 371R.

At this time, since the heating heaters 371L, 371C, and 371R directly transmit heat to the deposition material in terms of the location where the deposition material is filled, the heaters 371L, 371C, and 371R are disposed below the common heater 372 and have a width L2. ), Although the common heater 372 is intended to maintain the evaporation state of the evaporated deposition material and to prevent condensation by contact with the nozzle when passing through the nozzle, the heating heaters 371L, 371C, and 371R. It may be arranged in a relatively high position relative to the width L1 is arranged narrow.

In addition, since the necessity to adjust the temperature of the center zone (ZC), the first side zone (ZL), the second side zone (ZR) differently to achieve the above object is low, the common heater is a plurality of zones, unlike the heating heater It can be provided integrally over.

Meanwhile, as illustrated in detail with reference to FIGS. 7 and 8, the deposition material diffusion preventing shield 390 is a structure disposed to partially surround the crucible 330 in the block housing 310. The leaking deposition material on the side of the 330 serves to block the internal wall of the block housing 310.

In the linear deposition source 30 having a process temperature of more than 1000 ° C. as shown in this embodiment, a heater uses a resistance heating method that applies voltage and current to a high temperature metal wire such as tungsten or tantalum, and a high temperature metal wire. Is applied to the external type.

When the deposition process proceeds, the deposition material is sprayed through the nozzle 351. In this case, the deposition material may leak from the crucible body 330, the cover 350, or the nozzle 351. The leaked deposition material floats in the block housing 310 and passes through a cooling process to be nude. It can be squeezed on a metal wire of the type (nude type).

Since the deposition material is electrically conductive as an inorganic material, when the deposition material is caught on the metal wire, problems such as a short circuit may occur when the electricity is applied to the metal wire. In order to prevent this phenomenon, the deposition preventing shield 390 is applied.

The shield 390 for preventing deposition material diffusion is opened at an upper portion thereof, and includes a shield body 391 for receiving the crucible 330 and a shield flange extending outward from an upper end opening of the shield body 391. 392). The shield flange 392 may be a portion supported on one side of the block housing 310.

The center portion of the shield body 391 is formed to have a narrower width than a neighboring position, and a crucible pocket 393 into which the lower end of the crucible 330 is inserted is further protruded. That is, a part of the lower end of the rubble 330 is inserted into the crucible pocket 393 tightly inserted. Thus in this area they can form a body. As such a structure is applied, the crucible 330 can be easily mounted at a corresponding position, and the crucible 330 is prevented from being bent or bent due to the shock of the deposition material diffusion prevention shield 390. Can be effectively prevented.

Meanwhile, as shown in detail in FIG. 3, the sensor unit 50 includes a plurality of crystal sensors 510L, 510C, and 510R, respectively disposed at positions corresponding to the plurality of zones, and each center zone crystal sensor 510C. And a first side zone crystal sensor 510L and a second side zone crystal sensor 510R.

Each of the crystal sensors 510L, 510C, and 510R is installed in each zone in the chamber 10 to measure the amount of deposition material evaporated from the nozzles 351L, 351C, and 351R of each zone. The thickness of the deposition material deposited on the substrate may be measured by measuring the amount of the deposition material evaporated.

On the other hand, the controller (not shown) serves to control the linear deposition source 30 independently of each other in a plurality of zones by controlling the injection amount of the deposition material sprayed from a plurality of nozzles corresponding to the plurality of zones.

Hereinafter, a process of controlling the linear deposition source by the substrate deposition apparatus having such a structure will be described.

First, when the heating heaters 371L, 371C, and 371R of each zone are operated at a predetermined temperature, the deposition material evaporates and is sprayed from the nozzles 351L, 351C, and 351R of each zone, where each zone (ZL, The injection amount is measured by the crystal sensors 510L, 510C, and 510R of each zone disposed in ZC and ZR.

At this time, the control unit (not shown) is deposited material deposited on the substrate close to the position of each zone based on the detection signal generated after measuring the injection amount of the deposition material in the crystal sensor (510L, 510C, 510R) of each zone The thickness of is calculated.

If a zone is deposited with a thickness different from the preset thickness, the controller adjusts the injection amount of the nozzles disposed in the zone by feedback control to change the temperature of the heating heater of the zone.

As described above, according to the present exemplary embodiment, the linear deposition source can be partially controlled by measuring the injection amounts of the deposition materials independently of each other in each zone and controlling the heating heaters disposed independently of each other. In this state, the thickness of the deposition material deposited on the substrate may be partially changed without performing the nozzle tuning process.

As described above, the present invention is not limited to the described embodiments, and various modifications and changes can be made without departing from the spirit and scope of the present invention, which will be apparent to those skilled in the art. Therefore, such modifications or variations will have to be belong to the claims of the present invention.

ZC: Center Zone ZL: First Side Zone
ZR: Second side zone 10: Chamber
30: linear deposition source 50: sensor unit
310: block housing 330: crucible
331: crucible body 333a: first partition wall
333b: second partition 335: inner plate
350: cover 351: nozzle
370: heating block 371: heating heater
372: common heater 390: shield for preventing the deposition of deposition materials
391 shield body 392 shield flange
510: Crystal Sensor

Claims (12)

A chamber in which the deposition process for the substrate is performed;
A block housing forming an exterior, a crucible in which a deposition material is filled inside and partitioned into a plurality of zones independent from each other in the block housing; A cover coupled to one opening, the cover having a plurality of nozzles provided in the plurality of zones, respectively, forming a path toward the substrate as the deposition material in the crucible evaporates; A linear deposition source provided and including a heating block for heating the crucible;
A control unit controlling the linear deposition source independently of each other by the plurality of zones by controlling the injection amount of the deposition material sprayed from the plurality of nozzles corresponding to the plurality of zones; And
A sensor unit installed in the chamber to measure an amount of evaporated material evaporated from the nozzle,
The heating block,
A plurality of heating heaters disposed on one side of the crucible and respectively corresponding to the plurality of zones; And
A common heater disposed above the plurality of heating heaters, the shared heater being narrower than the width of the heating heater and integrally provided over the plurality of zones;
The control unit controls the heating heaters independently of each other in the plurality of zones in order to control the injection amount of the deposition material sprayed from the plurality of nozzles based on the detection signal of the sensor unit. . delete The method of claim 1,
The sensor unit,
And a plurality of crystal sensors disposed at positions corresponding to the plurality of zones, respectively. The method of claim 1,
The plurality of zones,
A center zone disposed in the center area of the crucible; And
And a first side zone and a second side zone disposed at both sides of the center zone. The method of claim 4, wherein
The crucible is,
Crucible body; And
And a first partition wall and a second partition wall respectively coupled to the crucible body between the center zone and the first side zone and between the center zone and the second side zone. The method of claim 5,
The crucible is,
And a plurality of inner plates disposed independently of each of the plurality of zones and supported by the crucible body, the first and second partition walls, and having a plurality of through holes formed therein. The method of claim 4, wherein
The plurality of nozzles,
A plurality of center zone nozzles spaced apart from each other in the center zone; And
And a plurality of first side zone nozzles and a second side zone nozzle disposed to be spaced apart from each other in the first side zone and the second side zone. delete delete delete The method of claim 1,
The linear deposition source,
A deposition shield for preventing diffusion of a deposition material disposed to partially surround the crucible in the block housing and preventing a leaking deposition material from the crucible side toward the inner wall of the block housing; Substrate deposition apparatus, characterized in that. The method of claim 11,
The deposition material diffusion prevention shield,
A shield body having an upper opening and provided with the crucible; And
Substrate deposition apparatus comprising a shield flange provided to extend outward in the upper end opening of the shield body.

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