KR102160509B1 - Glass deposition apparatus - Google Patents

Abstract

A substrate deposition apparatus is disclosed. A substrate deposition apparatus according to an embodiment of the present invention includes: a process chamber in which a deposition process is performed on a substrate; A plurality of linear sources provided on one side of the process chamber and including nozzles for spraying a deposition material toward a substrate; And a deposition profile that is disposed on one side of the top of the linear sources, and limits the angle at which the deposition material sprayed from the linear sources is sprayed, but selectively adjusts the spray angle of the deposition material to indicate the degree to which the deposition material is deposited on the substrate. It includes a deposition profile changing unit to change.

Description

Substrate deposition apparatus {Glass deposition apparatus}

The present invention relates to a substrate deposition apparatus, and more particularly, it is possible to reduce the deposition material accumulated on the angle limiting plate that limits the angle at which the deposition material is sprayed during the deposition process, and even if the deposition material accumulates on the angle limiting plate It relates to a substrate deposition apparatus capable of minimizing the phenomenon of profile change.

With the rapid development of information and communication technology and the expansion of the market, flat panel displays are in the spotlight as display devices.

Such flat panel display devices include a liquid crystal display, a plasma display panel, and organic light emitting diodes.

Among them, organic light emitting devices (OLED, Organic Light Emitting Diode, hereinafter referred to as OLED) can be made ultra-thin because they have a fast response speed, lower power consumption than conventional LCDs, light weight, and do not need a separate back light device. It is in the spotlight as a next-generation display device because it has very good advantages such as high brightness and high brightness.

Such an organic light emitting device is a principle that an anode film, an organic thin film, and a cathode film are sequentially coated on a substrate, and a voltage is applied between the anode and the cathode, so that an appropriate difference in energy is formed in the organic thin film and emit light by itself.

In other words, the injected electrons and holes recombine, and the remaining excitation energy is generated as light. At this time, since the wavelength of light generated according to the amount of the dopant of the organic material can be adjusted, full color can be implemented.

1 is a schematic structural diagram of an organic light emitting diode (OLED) in which organic and inorganic layers are alternately deposited.

Referring to this drawing, the organic light emitting device 1 (OLED) includes a substrate 2 and a light emitting device 3 stacked on the substrate 2.

The substrate 2 is a glass substrate or a flexible substrate. The light emitting device 3 has a stacked structure of an anode, a three-layer organic film (hole transport layer, light emitting layer, electron transport layer), and a cathode. When an organic molecule receives energy (now, it is in an excited state), it tries to return to its original state (ground state), and has the property of emitting the received energy as light. In the light-emitting device 3, when voltage is applied, holes (+) injected from the anode and electrons (-) injected from the cathode recombine in the emission layer, and at this time, organic molecules are excited to emit light.

OLED(1) displays using the characteristic that the organic matter emits light when voltage is applied in this way, and it uses the characteristics of emitting R(Red), G(Green), and B(Blue) depending on the organic material on the light emitting device(3). Full color can be implemented.

On the other hand, since the light emitting device 3 can be easily damaged by gas or moisture in the atmosphere, a life problem may arise. In order to solve this problem, a plurality of layers of organic and inorganic layers are alternately stacked as shown in FIG. It protects the light emitting device 3 from the inflow of moisture.

In FIG. 1, a first organic film, a first inorganic film, a second organic film, a second inorganic film… a fifth organic film, and a fifth inorganic film are sequentially deposited from the light emitting device 3 to each layer. Looking at this in detail, the first inorganic layer completely surrounds (encapsulates) the first organic layer, the second organic layer partially surrounds the first inorganic layer, and then the second inorganic layer completely surrounds the second organic layer. It can be seen that the film is deposited in order.

Meanwhile, a substrate deposition apparatus may be used to implement the stacked structure as shown in FIG. 1, in particular, the stacked structure of an organic layer. In the substrate deposition apparatus, a plurality of linear sources are provided as a means for depositing an organic material on a substrate.

In the substrate deposition apparatus to which such a linear source is applied, the size of the equipment is limited and the mask shadow performance (materials emitted in a direction closer to the vertical, the smaller the shadow, so the material emitted outside a certain angle is discarded). Means are contemplated for limiting the area of the deposition material.

For example, assuming that the first to third linear sources are applied to the conventional substrate deposition apparatus, while only a material incident within an angle of -30 degrees to +30 degrees relative to the vertical direction is used, spraying from the first linear source for geometric reasons A deposition material between +20 and -30 degrees is used for the deposition material to be directed to the substrate, and a deposition material between +25 and -25 degrees is used for the deposition material sprayed from the second linear source and directed to the substrate. The deposition material sprayed from the linear source and directed to the substrate may be a deposition material between +30 and -20 degrees.

In this way, an angle limiting plate is provided to limit the angle at which the deposition material is incident, and the angle limiting plate is a component that adjusts the spray angle of the material sprayed through the nozzle so that it can reach the desired substrate area in the process. As a result, the amount deposited on the substrate area as well as the effective area may vary.

Also, depending on the degree of processing of the angle limiting plate, the deposition profile indicating the uniformity in which the deposition material is deposited on the substrate may be affected, and as the operation time continues, the amount of material deposited on the angle limiting plate accumulates and the process proceeds further. Sometimes it can't be done.

In the conventional substrate deposition apparatus in which the angle limiting plate is provided, the process is repeated by stopping the process after a certain period of time and before the amount of material accumulated on the angle limiting plate reaches the limit and cleaning the angle limiting plate or replacing the cleaned angle limiting plate. shall.

Therefore, despite the sufficient amount of material inside the crucible, there is a problem in that the process is inevitably stopped and maintenance work is performed due to the accumulation amount of the material of the angle limiting plate.

In addition, if a lot of material is accumulated on the angle limiting plate, the amount of material going to the sensor or the substrate slightly changes due to the accumulated material, so that the deposition profile changes, and depending on the degree, there is a problem that the desired uniformity is deviated. This can cause serious problems such as nozzle clogging.

Korean Intellectual Property Office Application No. 10-2007-0013776

Accordingly, the technical problem to be achieved by the present invention is provided with an angle limiting mechanism for limiting the angle at which the deposition material is sprayed from the source unit, but it is possible to minimize a phenomenon in which the deposition profile changes even if the deposition material is accumulated in the angle limiting device, Further, it is to provide a substrate deposition apparatus capable of reducing the deposition material accumulated on the angle limiting plate.

According to an aspect of the present invention, a process chamber in which a deposition process for a substrate is performed;

A plurality of linear sources provided on one side of the process chamber and including nozzles for spraying a deposition material toward the substrate; And limiting an angle at which the deposition material sprayed from the linear sources is sprayed, but selectively adjusting the spray angle of the deposition material to control the uniformity at which the deposition material is deposited on the substrate. A substrate deposition apparatus comprising a deposition profile changing unit for changing the indicated deposition profile may be provided.

The deposition profile changing unit is fixedly disposed on one side of the top of the linear sources, and limits the spray angle of the deposition material so that deposition on the substrate is prevented while the deposition material sprayed from the linear sources is diffracted and spread. Fixed injection angle limiting module; And a movable spray angle change module that is connected to one side of the fixed spray angle limiting module so as to be relatively movable, and changes the spray angle of the deposition material by relative movement.

The fixed injection angle limiting module may include: a first angle limiting plate protruding from an upper side of the linear sources in a vertical direction to be coupled; And a second angle limiting plate intersectingly connected to an upper portion of the first angle limiting plate to limit the spray angle of the deposition material.

The movable injection angle change module is connected to one side of the fixed injection angle limiting module so as to be rotatable, and the movable injection angle change module is connected to the second angle limiting plate so as to be relatively rotatable. Change plate; And a driving part connected to one side of the spray angle change plate to rotate the spray angle change plate.

The spray angle change plate may include a plurality of unit spray angle change plates disposed in each section divided at predetermined intervals along a direction in which nozzles are disposed in the linear source.

The unit injection angle changing plate may have a shape of an arc having a predetermined radius.

The driving unit of the movable injection angle changing module is disposed inside one side of the process chamber and is provided inside an ATM box that forms the inside at atmospheric pressure, and the driving unit includes: a motor; And a driving transmission unit connected to the motor and the injection angle changing plate to transmit a driving force of the motor to the injection angle changing plate.

The drive transmission unit, the rotation shaft connected to one side of the injection angle change plate; A pinion gear coupled to one side of the rotation shaft; And a rack connecting the motor and the pinion gear.

The fixed spray angle limiting module is disposed inside the first angle limiting plate and the second angle limiting plate to prevent the deposition material from accumulating to heat the first angle limiting plate and the second angle limiting plate. It may further include a heater coil.

The linear source includes: a block housing forming an exterior; And a crucible disposed in the block housing and filled with a deposition material therein.

The crucible may include a crucible body filled with the deposition material; And a crucible cover coupled to an upper portion of the crucible body and having a plurality of nozzles through which the deposition material is sprayed.

The block housing may include a lower cooling block; A plurality of side cooling blocks forming side walls of the lower cooling block; And an upper cooling block forming an upper portion of the lower cooling block and the plurality of side cooling blocks.

Embodiments of the present invention are provided with an angle limiting mechanism for limiting the angle at which the deposition material is sprayed from the source unit by providing a deposition profile change unit including a movable spray angle change module, but the limiting angle can be changed, Even if the deposition material accumulates in the angle limiting mechanism, the phenomenon of changing the deposition profile can be minimized, and further, the deposition profile can be changed without stopping the deposition process.

In addition, by providing a fixed injection angle limiting module including a heater coil, it is possible to reduce the deposition material accumulated on the angle limiting plate.

1 is a schematic structural diagram of an organic light emitting diode (OLED) in which organic and inorganic layers are alternately deposited.
2 is a diagram illustrating a substrate deposition apparatus according to an embodiment of the present invention.
3 is a schematic layout diagram between a plurality of linear sources and a deposition profile changing unit in FIG. 2.
FIG. 4 is a schematic layout diagram between a plurality of linear sources and a deposition profile changing unit in a direction viewed from the top of the linear source of FIG. 3.
FIG. 5 is a schematic cross-sectional view of a plurality of linear sources and a deposition profile changing unit of FIG. 3.
6 is a perspective view of the linear source of FIG. 1.
7 is a cross-sectional view taken along line AA of FIG. 6.

In order to fully understand the present invention, operational advantages of the present invention, and objects achieved by the implementation of the present invention, reference should be made to the accompanying drawings illustrating preferred embodiments of the present invention and the contents described in the accompanying drawings.

Hereinafter, the present invention will be described in detail by describing a preferred embodiment of the present invention with reference to the accompanying drawings. The same reference numerals in each drawing indicate the same member.

2 is a diagram illustrating a substrate deposition apparatus according to an embodiment of the present invention, FIG. 3 is a schematic layout diagram between a plurality of linear sources and a deposition profile changing unit in FIG. 2, and FIG. 4 is a diagram of the linear source of FIG. It is a schematic layout diagram between a plurality of linear sources and a deposition profile change unit in a direction viewed from the top, FIG. 5 is a view schematically showing a cross section of a plurality of linear sources and a deposition profile change unit of FIG. 3, and FIG. 1 is a perspective view of the linear source, and FIG. 7 is a cross-sectional view taken along line AA of FIG. 6.

As shown in these drawings, the substrate deposition apparatus according to an embodiment of the present invention includes a process chamber 10, linear sources 100a, 100b, and 100c, and a deposition profile change unit 200.

First, referring to FIGS. 2 and 3, the substrate deposition apparatus according to the present embodiment allows the deposition material sprayed from the linear sources 100a to 100c to be diffracted and spread, effectively limiting unnecessary deposition on the substrate. As such, it includes a process chamber 10 in which a deposition process is performed on a substrate, and linear sources 100a to 100c provided on one side of the process chamber 10 and spraying a deposition material toward the substrate.

In this embodiment, three first to third linear sources 100a to 100c are applied. Of course, the scope of the present invention is not limited to the number of them. And the substrate may be for the manufacture of the organic light emitting device (1, OLED), but this is also not limited to these matters.

First, the process chamber 10 will be described. The process chamber 10 is a place where a deposition process for a substrate is performed. That is, a place for depositing an organic layer and an inorganic layer is formed for manufacturing the organic electroluminescent device 1 (OLED) shown in FIG. 1. The deposition apparatus of this embodiment may be a deposition apparatus for depositing an organic material.

During the deposition process, the inside of the process chamber 10 maintains a vacuum atmosphere. Therefore, a vacuum pump or the like may be connected to the process chamber 10.

Meanwhile, the first to third linear sources 100a to 100c are provided on one side of the process chamber 10 to spray a deposition material toward the substrate.

As will be described later in detail, since the first to third linear sources 100a to 100c applied to the present embodiment are disposed long in the longitudinal direction of the process chamber 10 and disclose an integrated structure that does not require additional assembly, each use It is possible to reduce the occurrence of temperature deviation that may be caused.

The structures of the first to third linear sources 100a to 100c are all the same. Hereinafter, specific structures of the first to third linear sources 100a to 100c will be described first with reference to FIGS. 6 to 7.

All of the first to third linear sources 100a to 100c include a block housing 110 and a crucible 130 disposed in the block housing 110.

Looking at the structure, the block housing 110 forms the exterior of the equipment. In order to protect the internal crucible 130 and prevent the temperature of the crucible 130 from falling, the block housing 110 has a closed structure.

The block housing 110 includes a lower cooling block 111 forming a lower portion, a plurality of side cooling blocks 112 forming a sidewall of the lower cooling block 111, a lower cooling block 111 and a plurality of side cooling blocks. It includes an upper cooling block 113 forming the upper part of (112).

The cooling water flow path 115 through which the cooling water flows is formed in the lower cooling block 111, the plurality of side cooling blocks 112, and the upper cooling block 113 at the end of the process or for process control.

A top shield 114 is disposed on the upper end of the upper cooling block 113. The top shield 114 prevents the deposition material from accumulating in the block housing 110, particularly, the upper cooling block 113. The top shield 114 is formed with a nozzle arrangement hole 114a in which the nozzle 132 of the crucible 130 is disposed.

A heating block 120 for heating the crucible 130 is provided on an inner wall of the block housing 110, in particular, an inner wall of the side cooling block 112. Structures such as a reflector or ceramic are provided around the heating block 120, but these will be omitted.

Heaters 121 and 122 may be mounted on the heating block 120. Although not shown in detail, the heater may be divided into a relatively short upper heater 122 and a relatively long lower heater 121. A heater that substantially heats the crucible 130 is the lower heater 121, and the upper heater 122 is individually controlled for temperature management.

The heaters 121 and 122 applied to this embodiment use a resistance heating method in which voltage and current are applied to a high-temperature metal wire such as tungsten or tantalum. At this time, since the temperature of the high-temperature metal wire exceeds 1000° C., the high-temperature metal wire may be applied as a nude type exposed to the outside.

The crucible 130 is a structure called a crucible, and evaporates the deposition material filled therein by the action of the heaters 121 and 122 and sprays it onto the substrate. As described above, the deposition material applied to the linear source 100 according to the present embodiment may be an organic material.

The crucible 130 includes a crucible body 131 filled with a deposition material, and a crucible cover 134 coupled to an upper portion of the crucible body 131.

A plurality of nozzles 132 through which the deposition material in the crucible body 131 is sprayed onto the substrate is formed on the crucible cover 134. The plurality of nozzles 132 are disposed in the nozzle arrangement opening 114a of the top shield 114.

A crucible pedestal 140 is provided on the lower cooling block 111 forming the lower portion of the block housing 110 to support and support a lower portion of the crucible 130 at a corresponding position.

Since the crucible 130 is supported and supported from the bottom through the crucible pedestal 140 disposed on the lower cooling block 111, structural stability due to support of the crucible 130 can be secured at high temperatures. have.

Although not necessarily the case, a shield 150 for preventing diffusion of a deposition material may be provided outside the crucible 130. The shield 150 for preventing diffusion of deposition material is a structure disposed to partially surround the crucible 130 in the block housing 110, and the deposition material that can leak from the crucible 130 side is the block housing 110 It plays a role in preventing heading toward the inner wall of A plurality of components such as heaters 121 and 122 are mounted on the inner wall of the block housing 110, and the deposition material that can leak from the crucible 130 side due to the shield 150 for preventing diffusion of deposition material is the inner wall of the block housing 110 There is an advantage in that heading toward can be prevented.

As previously described, in the substrate deposition apparatus to which the first to third linear sources 100a to 100c are applied as in this embodiment, the size of the equipment is limited and the mask shadow performance (the more the material emitted in the vertical direction, the more A means to limit the area of the deposition material reaching the substrate is considered (for discarding material emitted outside a certain angle because it becomes smaller).

For example, an angle limiting plate is provided to limit the angle at which the deposition material is incident. The angle limiting plate is a component that adjusts the spray angle of the material sprayed through the nozzle so that it can reach a desired substrate area in the process. By controlling the spray angle, not only the effective area but also the amount of deposition on the substrate area may vary.

Also, depending on the degree of processing of the angle limiting plate, the deposition profile indicating the uniformity in which the deposition material is deposited on the substrate may be affected, and as the operation time continues, the amount of material deposited on the angle limiting plate accumulates and the process proceeds further. Sometimes it can't be done.

In the conventional substrate deposition apparatus in which the angle limiting plate is provided, the process is repeated by stopping the process after a certain period of time and before the amount of material accumulated on the angle limiting plate reaches the limit and cleaning the angle limiting plate or replacing the cleaned angle limiting plate. shall.

Therefore, despite the sufficient amount of material inside the crucible, there is a problem in that the process is inevitably stopped and maintenance work is performed due to the accumulation amount of the material of the angle limiting plate.

According to an embodiment of the present invention, by providing the deposition profile changing unit 200, an angle limiting mechanism for limiting the angle at which the deposition material is sprayed from the source unit is provided, but the limiting angle can be changed, so that the deposition material is Even if it is accumulated in the angle limiting mechanism, the phenomenon of changing the deposition profile can be minimized, and further, the deposition profile can be changed without stopping the deposition process.

The deposition profile changing unit 200 is disposed on one side above the linear sources 100a to 100c, and limits the angle at which the deposition material sprayed from the linear sources 100a to 100c is sprayed, but the spray angle of the deposition material By selectively controlling the evaporation material serves to change the deposition profile indicating the degree to which the deposition material is deposited on the substrate.

The deposition profile changing unit 200 includes a fixed spray angle limiting module 210 and a movable spray angle changing module 230.

The fixed spray angle limiting module 210 is fixedly disposed on one side of the top of the linear sources 100a-100c, and the deposition material sprayed from the linear sources 100a-100c is diffracted and spread to prevent deposition on the substrate. It serves to limit the spray angle of the deposition material.

This fixed injection angle limiting module 210, as shown in detail in FIGS. 3 and 5, includes a first angle limiting plate 211, a second angle limiting plate 312, and a heater coil 213. .

The first angle limiting plate 211 protrudes from one side of the top of the linear sources 100a to 100c in a vertical direction and is combined to first limit the spray angle of the deposition material sprayed from the linear sources 100a to 100c. do. Accordingly, as shown in detail in FIG. 3, as shown in the dotted line A, the spray angle of the deposition material is limited.

The second angle limiting plate 312 is intersected with the upper portion of the first angle limiting plate 211 and serves to secondly limit the spray angle of the deposition material. That is, by providing the second angle limiting plate 312, it is possible to further limit the spray angle than when only the first angle limiting plate 211 is provided. Accordingly, as shown in detail in FIG. 3, as shown in the dotted line B, the spray angle of the deposition material is limited.

When a large amount of deposition material is accumulated on the first angle limiting plate 211 and the second angle limiting plate 312, the amount of material going to the sensor or the substrate slightly changes due to the accumulated material, and the deposition profile changes. There is a problem that the desired uniformity is deviated, and serious problems such as nozzle clogging may occur due to the accumulated material falling.

Therefore, according to an embodiment of the present invention, by providing the heater coil 213 as shown in detail in FIG. 5, it is possible to prevent a lot of materials from accumulating on the angle limiting plate. Serious problems such as nozzle clogging caused by material dropping can be prevented in advance.

The heater coil 213 is disposed inside the first angle limiting plate 211 and the second angle limiting plate 212 to prevent the deposition material from accumulating, so that the first angle limiting plate 211 and the second angle limiting plate It serves to heat (212). In addition, as shown in detail in FIG. 5, it may be additionally provided in the upper portion of the linear source.

The movable spray angle change module 230 is connected to one side of the fixed spray angle limiting module 210 to be relatively movable, and serves to change the spray angle of the deposition material by relative movement. That is, by providing the movable spray angle change module 230, it is possible to further limit the spray angle than when the first angle limiting plate 211 and the second angle limiting plate 212 are provided. Accordingly, as shown in detail in FIG. 3, the spray angle of the deposition material is limited as shown in the dotted line C. The dotted line C is

Further, since the movable spray angle change module 230 can adjust the spray angle, from a state in which the spray angle change plate 231, which will be described later, is erected, lay horizontally in the same direction as the second angle limiting plate 212 It is possible to adjust the range limiting the spray angle while rotating until the position is present. That is, the dotted line C shown in FIG. 3 is changed according to the angle at which the spray angle change plate 231 is adjusted.

In addition, by selectively changing the direction in which the spray angle change plate 231 rotates, as shown in detail in FIG. 4, the spray angle of the second linear source 100b spraying the deposition material toward the central region of the substrate is at the edge. It can be even more restrictive than the area.

In the present embodiment, the movable spray angle change module 230 is connected to one side of the fixed spray angle limiting module 210 so as to be able to rotate relative, but the present invention is not limited thereto, and a slide method, etc. It will be possible to limit the spray angle of the deposition material by sliding motion.

The movable injection angle change module 230 includes an injection angle change plate 231 and a driving unit 232.

The spray angle change plate 231 is connected to the upper portion of the second angle limiting plate 212 so as to be able to rotate, and is arranged at predetermined intervals along the direction in which the nozzles are arranged in the linear sources 100a to 100c. A plurality of unit injection angle changing plates 231 may be disposed.

According to an embodiment of the present invention, as shown in detail in FIG. 4, three unit spray angle changing plates 231 divided into three equal parts along the direction in which the nozzles are arranged in the linear sources 100a to 100c are adjacent. Was deployed.

Since the three unit spray angle change plates 231 are arranged adjacent to each other, by setting the fixed angle of each unit spray angle change plate 231 differently, it is possible to individually limit the spray angle for each specific position of the substrate. It is possible to change the deposition profile in detail.

However, the present invention is not limited thereto, and the number of the unit spray angle change plates 231 may be changed according to the degree of subdivision of a specific position of the substrate for individually limiting the spray angle.

Meanwhile, as shown in detail in FIG. 4, each unit injection angle changing plate 231 is provided in the form of an arc having a predetermined radius.

By being provided in the form of an arc in this way, the spray angle of the portion corresponding to the central area of the unit spray angle change plate 231 is determined according to the fixed angle of the unit spray angle change plate 231. It is possible to limit more than the spray angle of the part corresponding to the area.

However, the present invention is not limited thereto, and the shape of the unit spray angle change plate 231 may be changed according to an area for individually limiting the spray angle.

The driving unit 232 is connected to one side of the injection angle changing plate and serves to rotate the injection angle changing plate, and includes a motor 233 and a driving transmission unit 234.

In this embodiment, the driving unit 232 is disposed on one side of the process chamber 10, but is provided inside the ATM box 300 that forms the inside of the process chamber 10 at atmospheric pressure, which keeps the process chamber 10 in a vacuum atmosphere. Because it should be.

The drive transmission unit 234 is connected to the motor 233 and the injection angle change plate 231, respectively, and serves to transmit the driving force of the motor 233 to the injection angle change plate 231.

In this embodiment, the drive transmission unit 234 includes a rotation shaft 235 connected to one side of the injection angle change plate 231, a pinion gear 236 coupled to one side of the rotation shaft 235, and a motor 233 It is provided by a rack and pinion combination including a rack 236 connecting the pinion gear 237 to each other.

However, the present invention is not limited thereto, and various combinations of drive transmission units 234 capable of efficiently transmitting the driving force of the motor 233 may be provided.

As described above, according to this embodiment, by providing a deposition profile changing unit including a movable spray angle changing module, an angle limiting mechanism for limiting the angle at which the deposition material is sprayed from the source unit is provided, but the limiting angle can be changed Therefore, even if the deposition material accumulates in the angle limiting mechanism, a phenomenon in which the deposition profile is changed can be minimized, and further, the deposition profile can be changed without stopping the deposition process.

In addition, by providing a fixed spray angle limiting module including a heater coil, it is possible to reduce the deposition material accumulated on the angle limiting plate.

As described above, the present invention is not limited to the described embodiments, and it is obvious to those of ordinary skill in the art that various modifications and variations can be made without departing from the spirit and scope of the present invention. Therefore, it should be said that such modifications or variations belong to the claims of the present invention.

10: process chamber 100a~100c: linear source
110: block housing 111: lower cooling block
112: side cooling block 113: upper cooling block
114: top shield 120: heating block
121: lower heater 122: upper heater
130: crucible 131: crucible body
132: nozzle 134: crucible cover
200: deposition profile change unit 210: fixed spray angle limiting module
211: first angle limiting plate 212: second angle limiting plate
213: heater coil 230: movable injection angle change module
231: spray angle change plate 232: drive unit
233: motor 234: drive transmission unit

Claims (12)

A process chamber in which a deposition process is performed on a substrate;
A plurality of linear sources provided on one side of the process chamber and including nozzles for spraying a deposition material toward the substrate; And
It is disposed on one side of the upper portion of the linear sources, and limits the angle at which the deposition material sprayed from the linear sources is sprayed, but indicates the uniformity at which the deposition material is deposited on the substrate by selectively adjusting the spray angle of the deposition material It includes a deposition profile changing unit for changing the deposition profile,
The deposition profile changing unit,
A fixed spray angle limiting module that is fixedly disposed on one side of the top of the linear sources, and limits the spray angle of the deposition material so that deposition on the substrate is prevented while the deposition material sprayed from the linear sources is diffracted and spread; And
It is connected to one side of the fixed injection angle limiting module to be relatively movable, and includes a movable injection angle change module for changing the injection angle of the deposition material by the relative movement,
The fixed injection angle limiting module,
A first angle limiting plate protruding in a vertical direction from an upper side of the linear sources to be coupled;
A second angle limiting plate intersectingly connected to an upper portion of the first angle limiting plate to limit the spray angle of the deposition material; And
And a heater coil disposed inside the first angle limiting plate and the second angle limiting plate to heat the first angle limiting plate and the second angle limiting plate to prevent the deposition material from accumulating,
The movable injection angle change module is connected to one side of the fixed injection angle limiting module so as to be able to rotate relative,
The movable injection angle change module,
A spray angle changing plate connected to an upper portion of the second angle limiting plate so as to be rotatable; And
It is connected to one side of the injection angle change plate and includes a driving unit for rotating the injection angle change plate,
The spray angle change plate,
A substrate deposition apparatus comprising a plurality of unit spray angle changing plates that are disposed in each section divided at predetermined intervals along a direction in which the nozzles are disposed in the linear source, and individually set differently fixed angles. delete delete delete delete The method of claim 1,
The unit spray angle change plate,
A substrate deposition apparatus, characterized in that it has a shape of an arc having a predetermined radius. The method of claim 1,
The driving part of the movable injection angle change module is disposed inside one side of the process chamber, and is provided inside an ATM box that forms the inside at atmospheric pressure,
The driving unit,
motor; And
And a drive transmission unit connected to the motor and the spray angle change plate, respectively, to transmit a driving force of the motor to the spray angle change plate. The method of claim 7,
The drive transmission unit,
A rotation shaft connected to one side of the spray angle change plate;
A pinion gear coupled to one side of the rotation shaft; And
And a rack connecting the motor and the pinion gear. delete The method of claim 1,
The linear source,
A block housing forming the exterior; And
A substrate deposition apparatus comprising a crucible disposed in the block housing and filled with a deposition material. The method of claim 10,
The crucible is,
A crucible body filled with the deposition material; And
And a crucible cover coupled to an upper portion of the crucible body and having a plurality of nozzles through which the deposition material is sprayed. The method of claim 10,
The block housing,
Lower cooling block;
A plurality of side cooling blocks forming side walls of the lower cooling block; And
And an upper cooling block forming an upper portion of the lower cooling block and the plurality of side cooling blocks.

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