KR102190641B1 - Deposition source and glass deposition apparatus having the same - Google Patents

Abstract

The deposition source is started. The deposition source according to the present invention includes a crucible in which a deposition material is filled, a heating unit supporting the crucible and heating the crucible, and a crucible and a heating unit supporting the heating unit. A cooling jacket unit that accommodates and shields the heating unit from dissipating heat generated from the heating unit to the outside. It includes a heat transfer unit supported by the cooling jacket unit, connected to the crucible, and transferring heat from the crucible to the cooling jacket unit.

Description

Deposition source and substrate deposition apparatus having the same

The present invention relates to a deposition source and a substrate deposition apparatus including the same, and to a deposition source capable of preventing the deposition material filled therein from being denatured by heat, and a substrate deposition apparatus having the same.

With the rapid development of information and communication technology and the expansion of the market, flat panel displays are in the spotlight as display devices.

Such flat panel display devices include a liquid crystal display, a plasma display panel, and organic light emitting diodes.

Among them, organic light emitting devices (OLED, Organic Light Emitting Diode, hereinafter referred to as OLED) can be made ultra-thin because they have a fast response speed, lower power consumption than conventional LCDs, light weight, and do not need a separate back light device. It is in the spotlight as a next-generation display device because it has very good advantages such as high brightness and high brightness.

Such an organic light emitting device is a principle that an anode film, an organic thin film, and a cathode film are sequentially coated on a substrate, and a voltage is applied between the anode and the cathode, so that an appropriate difference in energy is formed in the organic thin film and emit light by itself.

In other words, the injected electrons and holes recombine, and the remaining excitation energy is generated as light. At this time, since the wavelength of light generated according to the amount of the dopant of the organic material can be adjusted, full color can be implemented.

1 is a schematic structural diagram of an organic light emitting diode (OLED) in which organic and inorganic layers are alternately deposited.

Referring to this drawing, the organic light emitting device 1 (OLED) includes a substrate 2 and a light emitting device 3 stacked on the substrate 2.

The substrate 2 is a glass substrate or a flexible substrate. The light emitting device 3 has a stacked structure of an anode, a three-layer organic film (hole transport layer, light emitting layer, electron transport layer), and a cathode. When an organic molecule receives energy (now, it is in an excited state), it tries to return to its original state (ground state), and has the property of emitting the received energy as light. In the light-emitting device 3, when voltage is applied, holes (+) injected from the anode and electrons (-) injected from the cathode recombine in the emission layer, and at this time, organic molecules are excited to emit light.

OLED(1) displays using the characteristic that the organic matter emits light when voltage is applied in this way, and it uses the characteristics of emitting R(Red), G(Green), and B(Blue) depending on the organic material on the light emitting device(3). Full color can be implemented.

On the other hand, as previously described, since the light emitting device 3 can be easily damaged by gas or moisture in the atmosphere, a lifespan problem may arise. To solve this problem, the organic layer and the inorganic layer are alternately formed as shown in FIG. By stacking multiple layers, the light emitting device 3 is protected from the inflow of gas or moisture.

In FIG. 1, a first organic film, a first inorganic film, a second organic film, a second inorganic film… a fifth organic film, and a fifth inorganic film are sequentially deposited from the light emitting device 3 to each layer. Looking at this in detail, the first inorganic layer completely surrounds (encapsulates) the first organic layer, the second organic layer partially surrounds the first inorganic layer, and then the second inorganic layer completely surrounds the second organic layer. It can be seen that the film is deposited in order.

Meanwhile, a substrate deposition apparatus may be used to implement the stacked structure as shown in FIG. 1, in particular, the stacked structure of an organic layer. In the substrate deposition apparatus, a plurality of linear sources are provided as a means for depositing an organic material on a substrate. This linear source is a device that heats and evaporates the organic matter filled therein.

On the other hand, organic matter filled in the linear source is gradually consumed by the evaporation process performed in the linear source, and the organic material remaining in the linear source receives thermal energy for a long time and the molecular structure is deformed (denatured).

When the deformed (modified) organic material is deposited on the substrate, there is a problem in that the functions (color change, lifetime, etc.) of the organic electroluminescent device (OLED) deteriorate.

Republic of Korea Patent Publication No. 10-2007-0013776, (2008.08.13.)

The problem to be solved by the present invention is to provide a deposition source capable of preventing the deposition material contained therein from being denatured by heat, and a substrate deposition apparatus having the same.

According to an aspect of the present invention, a crucible in which a deposition material is filled therein; A heating unit supporting the crucible and heating the crucible; a heating unit supporting the heating unit and receiving the crucible and the heating unit therein, and shielding the heating unit to be generated in the heating unit. A cooling jacket unit that blocks heat from being radiated to the outside; And a heat transfer unit supported by the cooling jacket unit and connected to the crucible, and transferring heat from the crucible to the cooling jacket unit.

The cooling jacket unit may include: a lower cooling block disposed in a lower region of the crucible and spaced apart from a lower surface of the crucible; And a side cooling block connected to the lower cooling block and disposed in a side area of the crucible.

The heat transfer unit may include a jacket coupling part detachably coupled to the lower cooling block; And a connection part for heat transfer connected to the jacket coupling part and the crucible.

The heat transfer connection part may include a spring member whose upper end is connected to the lower end of the crucible and the lower end is connected to the upper surface of the lower cooling block.

The spring member, a spring body; And a contact plate connected to the spring body and contacting at least one of a lower end of the crucible and an upper surface of the lower cooling block.

The jacket coupling portion includes: a connection block supporting a plurality of connection portions for heat transfer and connected to the lower cooling block; And a block coupling member coupling the connection block to the lower cooling block.

The jacket coupling portion may further include a coupling member for a connection portion for coupling the connection portion for heat transfer to the connection block.

The heat transfer connection part may include a spring member whose upper end is connected to the lower end of the crucible and the lower end is connected to the upper surface of the connection block.

The spring member, a spring body; And a contact plate connected to the spring body and contacting at least one of a lower end of the crucible and an upper surface of the connection block.

The heating unit includes a heater unit for dissipating heat; And a heater frame portion mounted with the heater unit and supporting the crucible.

According to another aspect of the present invention, there is provided a process chamber in which a deposition process is performed on a substrate; And a deposition source disposed inside the process chamber and supplying a deposition material to the substrate, wherein the deposition source includes: a crucible in which the deposition material is filled; A heating unit supporting the crucible and heating the crucible; A cooling jacket unit supporting the heating unit, accommodating the crucible and the heating unit therein, and shielding the heating unit from dissipating heat generated by the heating unit to the outside; And a heat transfer unit supported by the cooling jacket unit, connected to the crucible, and transferring heat from the crucible to the cooling jacket unit.

The cooling jacket unit may include: a lower cooling block disposed in a lower region of the crucible and spaced apart from a lower surface of the crucible; And a side cooling block connected to the lower cooling block and disposed in a side region of the crucible, wherein the heat transfer unit includes: a jacket coupling part detachably coupled to the lower cooling block; And a connection part for heat transfer connected to the jacket coupling part and the crucible.

The heat transfer connection portion includes a spring member having an upper end connected to a lower end of the crucible and a lower end connected to an upper surface of the lower cooling block, the spring member comprising: a spring body; And a contact plate connected to the spring body and contacting at least one of a lower end of the crucible and an upper surface of the lower cooling block.

The jacket coupling part may include a connection block supporting the heat transfer connection part and connected to the lower cooling block; A block coupling member coupling the connection block to the lower cooling block; And a coupling member for a connection part coupling the heat transfer connection part to the connection block, wherein the heat transfer connection part includes an upper end connected to a lower end of the crucible and a lower end connected to an upper surface of the connection block. Including, the spring member, the spring body; And a contact plate connected to the spring body and contacting at least one of a lower end of the crucible and an upper surface of the connection block.

Embodiments of the present invention are provided with a heat transfer unit supported by the cooling jacket unit and connected to the crucible to transfer heat from the crucible to the cooling jacket unit, thereby preventing the deposition material filled inside from being denatured by heat. can do.

1 is a schematic structural diagram of an organic light emitting diode (OLED) in which organic and inorganic layers are alternately deposited.
2 is a view showing a substrate deposition apparatus according to the first embodiment of the present invention.
3 is a diagram illustrating the inside of the deposition source of FIG. 2.
4 is a diagram illustrating the heat transfer unit of FIG. 3.
5 is a cross-sectional view showing the inside of the crucible of FIG. 2.
6 is a diagram illustrating a heat transfer unit according to a second embodiment of the present invention.
7 is a diagram illustrating a heat transfer unit according to a third embodiment of the present invention.
8 is a diagram illustrating a heat transfer unit according to a fourth embodiment of the present invention.

In order to fully understand the present invention, the operational advantages of the present invention, and the objects achieved by the implementation of the present invention, reference should be made to the accompanying drawings illustrating preferred embodiments of the present invention and the contents described in the accompanying drawings.

Hereinafter, the present invention will be described in detail by describing a preferred embodiment of the present invention with reference to the accompanying drawings. However, in describing the present invention, a description of a function or configuration that is already known will be omitted in order to clarify the gist of the present invention.

Meanwhile, the substrate described below may be a substrate for an organic light emitting diode display (OLED display).

FIG. 2 is a view showing a substrate deposition apparatus according to a first embodiment of the present invention, FIG. 3 is a view showing the inside of the deposition source of FIG. 2, and FIG. 4 is a view showing the heat transfer unit of FIG. 3 , FIG. 5 is a cross-sectional view showing the inside of the crucible of FIG. 2.

The substrate deposition apparatus according to the present embodiment, as shown in FIGS. 2 to 5, is provided on one side of a process chamber CM in which a deposition process for a substrate is performed, and a process chamber CM, and is deposited toward a substrate. And a deposition source 100 having a nozzle N for spraying a material.

First, the process chamber (CM) will be described. The process chamber CM forms a place where a deposition process for a substrate is performed. In the case of the present embodiment, a horizontal upward deposition method is proposed in which a deposition process is performed on a substrate by an upwardly facing deposition material after the substrate is disposed horizontally. However, the scope of the present invention may be applied to a deposition apparatus to which a vertical deposition method is applied, in which configurations such as a substrate and a mask (not shown) are vertically or obliquely disposed.

Inside the process chamber CM, a vacuum atmosphere is formed so that the deposition process for the substrate can be reliably performed.

To this end, a vacuum pump (not shown) is connected to a lower portion of the process chamber CM as a means for maintaining the inside of the process chamber CM in a vacuum atmosphere. The vacuum pump (not shown) may be a so-called cryo pump.

In addition, an entrance gate T through which a substrate enters and exits may be provided on a sidewall of the process chamber CM. In addition, a substrate support (not shown) for holding a substrate is provided in an upper region of the process chamber CM.

The deposition source 100 is disposed inside the process chamber CM. The deposition source 100 injects a deposition material toward the substrate. As shown in detail in FIG. 2, the deposition source 100 supports the crucible 130 and the crucible 130 in which the deposition material is filled, and heats the crucible 130. The heating unit 110 and the heating unit 110 are supported, the crucible 130 and the heating unit 110 are accommodated therein, and the heating unit 110 is shielded so that the heat generated by the heating unit 110 is A cooling jacket unit 120 that blocks radiation to the outside, is supported by the cooling jacket unit 120 and connected to the crucible 130, and transfers heat from the crucible 130 to the cooling jacket unit 120 It includes a heat transfer unit 140.

A deposition material is filled inside the crucible 130. The crucible 130 is a structure called a crucible, and evaporates the deposition material charged therein by the action of the heating unit 110 and sprays it onto the substrate. As described above, the deposition material applied to the deposition source 100 according to the present embodiment may be an organic material. A detailed structure of the crucible 130 will be described later for convenience of description.

Meanwhile, the heating unit 110 supports the crucible 130 and heats the crucible 130. This heating unit 110, as shown in detail in Figure 2, is mounted on the heater 111 for heating the crucible 130, the heater 111 and supporting the crucible 130 It includes a heater frame part 112.

The heater part 111 is mounted on the heater frame part 112 and emits heat. The heater 111 applied in this embodiment uses a resistance heating method in which voltage and current are applied to a high-temperature metal wire such as tungsten or tantalum. At this time, since the temperature of the high-temperature metal wire exceeds 1000° C., the high-temperature metal wire may be applied as a nude type exposed to the outside.

The heater frame part 112 is supported by the cooling jacket unit 120 to support the crucible 130. As shown in detail in FIG. 2, the crucible 130 is coupled to the upper end of the heater frame part 112, and the lower end of the heater frame part 112 is supported by the cooling jacket unit 120. The heater frame part 112 also serves to support the heater part 111.

Meanwhile, the cooling jacket unit 120 forms the exterior of the deposition source 100. A crucible 130 and a heating unit 110 are accommodated in the cooling jacket unit 120. The cooling jacket unit 120 has a closed structure to prevent the temperature of the crucible 130 from lowering while protecting the crucible 130 inside. In addition, the cooling jacket unit 120 shields the heating unit 110 from dissipating heat generated from the heating unit 110 into the process chamber CM.

In this embodiment, the cooling jacket unit 120 is located in the lower region of the crucible 130 and is spaced apart from the lower surface of the crucible 130, as shown in detail in FIG. 2. Block 121 and. The side cooling block 125 connected to the lower cooling block 121 and disposed in the side area of the crucible 130, and the upper cooling block forming the upper part of the lower cooling block 121 and the side cooling block 125 Includes (not shown).

In this embodiment, the cooling jacket unit 120 is provided in a hexahedral shape with a hollow inside. The upper cooling block (not shown) and the lower cooling block 121 are spaced apart in the vertical direction, and four side cooling blocks 125 are disposed between the upper cooling block (not shown) and the lower cooling block 121.

The lower cooling block 121 is located in the lower area of the crucible 130. As shown in detail in FIG. 2, the lower cooling block 121 is disposed with a predetermined space G between the lower surface of the crucible 130.

The space G between the upper surface of the lower cooling block 121 and the lower surface of the crucible 130 is thermally expanded in the direction of the substrate when the crucible 130 is thermally expanded. And induces thermal expansion in the direction of the lower cooling block 121.

Since the distance between the nozzle N of the crucible 130 and the substrate affects the deposition quality, the distance between the nozzle N of the crucible 130 and the substrate should be kept constant during the deposition process.

By the way, during the deposition process, the crucible 130 is heated by the heating unit 110 and thermally expanded. When the crucible 130 is thermally expanded in the direction of the substrate, the nozzle N of the crucible 130 and the substrate are The distance of can be changed.

In this way, when the crucible 130 is thermally expanded in the direction of the substrate, in order to prevent the distance between the nozzle N of the crucible 130 and the substrate from being changed, the upper region of the crucible 130 is It is coupled to 112 and the lower surface of the crucible 130 does not directly contact the lower cooling block 121 and is disposed in the upper region of the lower cooling block 121 with a space G.

In this way, the lower surface of the crucible 130 is not directly in contact with the lower cooling block 121 and is disposed in the upper region of the lower cooling block 121 with a space G, thereby thermal expansion of the crucible 130 The crucible 130 thermally expands in the direction of the lower cooling block 121 and does not move in the direction of the substrate, so that the distance between the nozzle N and the substrate may be kept constant.

A heating block (not shown) for heating the crucible 130 is provided on the inner wall of the lower cooling block 121. This heating block may be provided with a reflector or the like.

In addition, the lower cooling block 121 has a thread formed on the inner circumferential surface and a coupling groove 122 for a coupling portion to which the heat transfer unit 140 is coupled is provided.

The side cooling block 125 is connected to the lower cooling block 121 and is disposed in the side area of the crucible 130. The side cooling block 125 is spaced apart from the crucible 130 by a predetermined interval so that the heating unit 110 may be disposed between the crucible 130 and the crucible 130.

A heating block (not shown) for heating the crucible 130 is provided on the inner wall of the side cooling block 125. This heating block may be provided with a reflector or the like.

A cooling water flow path through which cooling water flows is formed in the lower cooling block 121, the side cooling block 125, and the upper cooling block (not shown) when the process is finished or for process control.

Meanwhile, the heat transfer unit 140 is supported by the cooling jacket unit 120 and connected to the crucible 130. The heat transfer unit 140 transfers the heat of the crucible 130 to the cooling jacket unit 120.

The heat transfer unit 140 prevents the deposition material heated for a long time inside the crucible 130 from being denatured by heat. That is, the evaporation material filled in the crucible 130 is continuously heated by the heater unit 111, and the evaporation material evaporated at the late stage of the process is exposed to thermal energy longer than the evaporation material evaporated at the beginning of the process. The molecular structure can be deformed (denatured) by heat.

In order to prevent the deposition material filled in the crucible 130 from being deformed (denatured) by heat, the heat transfer unit 140 directly connects the crucible 130 and the cooling jacket unit 120 to be crucible. The thermal energy of 130 is transferred to the cooling jacket unit 120.

In this embodiment, the heat transfer unit 140 is connected to the lower part of the crucible 130, and the deposition material located at the bottom in the inner space of the crucible 130 evaporates after the deposition material located at the top is evaporated. Therefore, the deposition material located at the bottom in the inner space of the crucible 130 is exposed to thermal energy for a long time compared to the deposition material located at the top, and accordingly, the deposition material located at the top is likely to be deformed (denatured) by heat. This is because it is higher than

As described above, the heat transfer unit 140 according to the present embodiment is in direct contact with the lower portion of the crucible 130 to move the thermal energy of the crucible 130 to the cooling jacket unit 120, so that the crucible 130 It is possible to prevent the evaporation material located at the bottom of the inner space from being thermally deformed (denatured) by heating for a long time.

This heat transfer unit 140, as shown in detail in Figures 2 to 4, the jacket coupling portion 141 detachably coupled to the lower cooling block 121, the jacket coupling portion 141 and crucible It includes a connection part 145 for heat transfer connected to (130).

The jacket coupling part 141 is detachably coupled to the lower cooling block 121. In this embodiment, the jacket coupling portion 141 is provided with a coupling bolt that meshes with the coupling groove 122 for the coupling portion of the lower cooling block 121.

The heat transfer connection part 145 is connected to the jacket coupling part 141 and the crucible 130. The heat transfer connection part 145 includes spring members SC and ST whose upper end is connected to the lower end of the crucible 130 and the lower end is connected to the upper surface of the lower cooling block 121. These spring members SC and ST are made of a metal material having a high heat transfer rate.

In this embodiment, the spring members SC and ST are provided in a leaf spring shape. These spring members (SC, ST), as shown in detail, the spring body (SC), the contact plate (ST) connected to the spring body (SC) and in contact with the upper surface of the lower cooling block (121) Includes.

The spring body (SC) is deformed by the pressure of the crucible 130 during thermal expansion of the crucible 130, and the original shape by elastic force when the thermal expansion is eliminated by cooling of the crucible 130. To the original position.

As described above, the heat transfer unit 140 according to the present embodiment includes a spring body SC that returns to its original position by an elastic force even if its shape is deformed, so that the crucible 130 is irrespective of the thermal expansion of the crucible 130 And the cooling jacket unit 120 can be connected.

The contact plate ST is connected to the spring body SC. This contact plate ST is in contact with the upper surface of the lower cooling block 121. In this embodiment, the contact plate ST is provided in a shape having a contact area larger than the cross-sectional area of the spring body SC in order to increase the heat transfer rate to the lower cooling block 121.

The contact plate ST is pressed against the bolt head of the coupling bolt and is in close contact with the upper surface of the lower cooling block 121.

As described above, the heat transfer unit 140 of the present embodiment has a contact plate ST that directly contacts the upper surface of the lower cooling block 121 with a wide contact area to increase the heat transfer rate, so that the heat of the crucible 130 Can be quickly moved to the lower cooling block 121.

Meanwhile, as shown in detail in FIG. 5, the crucible 130 includes a crucible body 131 filled with a deposition material and a crucible cover coupled to an upper portion of the crucible body 131 ( 134).

A plurality of nozzles N through which the deposition material in the crucible body 131 is sprayed onto the substrate are formed on the crucible cover 134. A plug 133 for spraying a deposition material is provided inside the nozzle N. It is preferable that the plug 133 has a detachable structure.

An inner plate 135 in which a plurality of through holes 135a is formed is provided in the crucible body 131. The inner plate 135 controls the amount and direction of the deposition material.

Hereinafter, the operation of the substrate deposition apparatus according to the present embodiment will be described with reference to FIGS. 2 to 5 focusing on the heat transfer unit 140.

As shown in FIG. 2, the heat transfer unit 140 is supported by the cooling jacket unit 120 and connected to the crucible 130 to transfer heat from the crucible 130 to the cooling jacket unit 120. .

The lower surface of the crucible 130 is not directly in contact with the lower cooling block 121 and is disposed in the upper region of the lower cooling block 121 with a space G. During thermal expansion, the crucible 130 thermally expands in the direction of the lower cooling block 121 to press the spring body SC.

The shape of the spring body SC is deformed by the pressure of the crucible 130. At this time, since the spring body (SC) is continuously connected to the crucible 130, the heat transfer unit 140 moves the heat of the crucible 130 to the cooling jacket unit 120 so that the crucible 130 It prevents the deposition material inside from being deformed (denatured) by heat.

Next, when the thermal expansion by cooling the crucible 130 is eliminated, the spring body SC is returned to its original shape by the elastic force. At this time, the spring body SC is continuously connected to the crucible 130.

As described above, the heat transfer unit 140 according to the present embodiment has a spring body SC whose shape is changed by an external force and returns to its original position by an elastic force when the external force is removed, thereby preventing thermal expansion of the crucible 130. Regardless, the crucible 130 and the cooling jacket unit 120 may be connected.

In addition, the substrate deposition apparatus according to the present embodiment is a heat transfer unit supported by the cooling jacket unit 120 and connected to the crucible 130 to transfer heat from the crucible 130 to the cooling jacket unit 120 By providing 140, it is possible to prevent the evaporation material contained therein from being denatured by heat.

6 is a diagram illustrating a heat transfer unit according to a second embodiment of the present invention.

Compared with the first embodiment, the present embodiment only has a difference in that a contact plate ST contacting the lower end of the crucible 130 is added, and in other configurations, the configuration of the first embodiment of FIGS. 2 to 5 Since it is the same as, hereinafter, the same reference numerals are used for the same configuration, and the description thereof is omitted.

The spring members SC and ST according to the present embodiment include a contact plate ST' connected to the spring body SC and contacting the lower end of the crucible 130.

In this embodiment, the contact plate ST' is provided in a shape having a contact area larger than the cross-sectional area of the spring body SC in order to increase the heat transfer rate with the crucible 130.

In this way, the heat transfer unit 140 includes a contact plate ST' that directly contacts the lower end of the crucible 130 with a wide contact area to increase the heat transfer rate, thereby cooling the heat of the crucible 130 under the It can be quickly moved to block 121.

7 is a diagram illustrating a heat transfer unit according to a third embodiment of the present invention.

Compared with the first embodiment, the present embodiment differs only in that the connection portion for heat transfer is provided in the shape of a coil spring, and in other configurations, it is the same as the configuration of the first embodiment of FIGS. For the configuration, the same reference numerals are used and the description thereof is omitted.

In this embodiment, the connection part 345 for heat transfer is provided in the shape of a coil spring. As described above, since the connection portion 345 for heat transfer according to the present embodiment is provided in a coil spring shape, there is an advantage of less deformation even when used for a long time.

8 is a diagram illustrating a heat transfer unit according to a fourth embodiment of the present invention.

Compared with the first embodiment, this embodiment only has a difference in the structure of the jacket coupling portion 441, and in other configurations, it is the same as the configuration of the first embodiment of Figs. The same reference numerals are used and their descriptions are omitted.

Jacket coupling portion 441 according to the present embodiment, as shown in detail in Figure 8, a plurality of heat transfer connection portion 445 is supported and connected to the lower cooling block 121, the connection block 442, the connection A block coupling member 443 for coupling the block 442 to the lower cooling block 121 and a coupling member 444 for a connection portion coupling the heat transfer connection 445 to the connection block 442.

A plurality of connection portions 445 for heat transfer are supported on the connection block 442. The connection block 442 directly contacts the lower cooling block 121 and transfers the heat of the crucible 130 received through the connection part 445 for heat transfer to the lower cooling block 121.

In this embodiment, the connection block 442 is provided in a hexahedral block shape, and the lower surface of the connection block 442 directly contacts the upper surface of the lower cooling block 121. The connection block 442 is provided with a through hole 442a through which the block coupling member 443 passes.

In addition, the connection block 442 has a thread formed on the inner circumferential surface and a coupling groove 442b for a connection block to which the coupling member 444 for the connection portion is coupled is provided.

In this embodiment, a plurality of heat transfer connection portions 445 are disposed on the connection block 442 to be spaced apart from each other.

The block coupling member 443 couples the connection block 442 to the lower cooling block 121. In this embodiment, the jacket coupling portion 441 is provided with a coupling bolt that penetrates through the through hole 442a and meshes with the coupling groove of the lower cooling block 121.

The coupling member 444 for the connection part couples the connection part 445 for heat transfer to the connection block 442. In this embodiment, the coupling member 444 for the connection part is provided with a coupling bolt that meshes with the coupling groove 442b for the connection block of the connection block 442.

In this embodiment, the spring members (SC, ST), as shown in detail in Figure 8, the spring body (SC), the contact plate connected to the spring body (SC) and in contact with the upper surface of the connection block 442 Includes (ST).

The contact plate ST is connected to the spring body SC. This contact plate (ST) is in contact with the upper surface of the connection block (442). In this embodiment, the contact plate ST is provided in a shape having a contact area larger than the cross-sectional area of the spring body SC in order to increase the heat transfer rate to the connection block 442.

In this embodiment, the contact plate ST is pressed against the bolt head of the coupling bolt to be in close contact with the upper surface of the connection block 442.

As described above, the substrate deposition apparatus according to the present embodiment supports a plurality of connection portions 445 for heat transfer and includes a connection block 442 detachably coupled to the lower cooling block 121, thereby replacing the connection block 442 There is an advantage in that maintenance is easy because it is possible to replace the connection portions 445 for heat transfer whose service life has ended at one time.

Although the present embodiment has been described in detail with reference to the drawings above, the scope of the present embodiment is not limited to the above-described drawings and description.

As described above, the present invention is not limited to the described embodiments, and it is obvious to those of ordinary skill in the art that various modifications and variations can be made without departing from the spirit and scope of the present invention. Therefore, such modifications or variations will have to belong to the scope of the claims of the present invention.

100: deposition source 110: heating unit
111: heater part 112: heater frame part
120: cooling jacket unit 121: lower cooling block
122: coupling groove for coupling portion 125: side cooling block
130: crucible 140: heat transfer unit
141, 441: jacket joint
145, 245, 345, 445: connection for heat transfer
442: connection block 442a: through hole
442b: coupling groove for connection block 443: block coupling member
444: coupling member for the connection part CM: process chamber
SC: Spring body ST: Contact plate
G: space

Claims (14)

Crucible in which the deposition material is filled therein;
A heating unit supporting the crucible and heating the crucible;
A cooling jacket unit supporting the heating unit, accommodating the crucible and the heating unit therein, and shielding the heating unit from dissipating heat generated by the heating unit to the outside; And
And a heat transfer unit supported by the cooling jacket unit and connected to the crucible, and transferring heat from the crucible to the cooling jacket unit,
The cooling jacket unit,
A lower cooling block located in a lower area of the crucible and spaced apart from the lower surface of the crucible; And
A side cooling block connected to the lower cooling block and disposed in a side area of the crucible,
The heat transfer unit,
A jacket coupling part detachably coupled to the lower cooling block; And
It includes a connection part for heat transfer connected to the jacket coupling part and the crucible,
The jacket coupling portion,
A connection block supporting a plurality of connection portions for heat transfer and connected to the lower cooling block; And
A deposition source comprising a block coupling member coupling the connection block to the lower cooling block. delete delete The method of claim 1,
The heat transfer connection part,
A deposition source comprising a spring member having an upper end connected to a lower end of the crucible and a lower end connected to an upper surface of the lower cooling block. The method of claim 4,
The spring member,
Spring body; And
And a contact plate connected to the spring body and contacting at least one of a lower end of the crucible and an upper surface of the lower cooling block. delete The method of claim 1,
The jacket coupling portion,
A deposition source further comprising a coupling member for a connection portion for coupling the connection portion for heat transfer to the connection block. The method of claim 7,
The heat transfer connection part,
A deposition source comprising a spring member having an upper end connected to a lower end of the crucible and a lower end connected to an upper surface of the connection block. The method of claim 8,
The spring member,
Spring body; And
And a contact plate connected to the spring body and contacting at least one of a lower end of the crucible and an upper surface of the connection block. The method of claim 1,
The heating unit,
A heater unit for dissipating heat; And
A deposition source including a heater frame portion mounted with the heater unit and supporting the crucible. A process chamber in which a deposition process is performed on the substrate; And
It is disposed inside the process chamber and includes a deposition source for supplying a deposition material to the substrate,
The deposition source,
A crucible in which the deposition material is filled therein;
A heating unit supporting the crucible and heating the crucible;
A cooling jacket unit supporting the heating unit, accommodating the crucible and the heating unit therein, and shielding the heating unit from dissipating heat generated by the heating unit to the outside; And
And a heat transfer unit supported by the cooling jacket unit and connected to the crucible, and transferring heat from the crucible to the cooling jacket unit,
The cooling jacket unit,
A lower cooling block located in a lower area of the crucible and spaced apart from the lower surface of the crucible; And
A side cooling block connected to the lower cooling block and disposed in a side area of the crucible,
The heat transfer unit,
A jacket coupling part detachably coupled to the lower cooling block; And
Including a connection for heat transfer connected to the jacket coupling portion and the crucible,
The jacket coupling portion,
A connection block supporting a plurality of connection portions for heat transfer and connected to the lower cooling block; And
A substrate deposition apparatus comprising a block coupling member coupling the connection block to the lower cooling block. delete The method of claim 11,
The heat transfer connection part,
A spring member having an upper end connected to the lower end of the crucible and a lower end connected to the upper surface of the lower cooling block,
The spring member,
Spring body; And
A substrate deposition apparatus comprising a contact plate connected to the spring body and contacting at least one of a lower end of the crucible and an upper surface of the lower cooling block. The method of claim 11,
The jacket coupling portion,
Further comprising a coupling member for a connection portion for coupling the connection portion for heat transfer to the connection block,
The heat transfer connection part,
A spring member having an upper end connected to a lower end of the crucible and a lower end connected to an upper surface of the connection block,
The spring member,
Spring body; And
A substrate deposition apparatus comprising a contact plate connected to the spring body and in contact with at least one of a lower end of the crucible and an upper surface of the connection block.

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