EP0702378A2 - Chip inductor - Google Patents
Chip inductor Download PDFInfo
- Publication number
- EP0702378A2 EP0702378A2 EP95114392A EP95114392A EP0702378A2 EP 0702378 A2 EP0702378 A2 EP 0702378A2 EP 95114392 A EP95114392 A EP 95114392A EP 95114392 A EP95114392 A EP 95114392A EP 0702378 A2 EP0702378 A2 EP 0702378A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- contact elements
- winding
- core part
- chip
- chip inductance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/10—Connecting leads to windings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/06—Coil winding
- H01F41/076—Forming taps or terminals while winding, e.g. by wrapping or soldering the wire onto pins, or by directly forming terminals from the wire
Definitions
- the invention relates to a chip inductance, in particular an air coil, choke or transformer, with a solid core part made of ferromagnetic or electrically non-conductive material, in particular ferrite, ceramic or plastic, with a winding space that can be wound in one or more layers and is set apart from parallel end faces of the core part, in which the winding ends are welded to contact elements arranged on the end face.
- Such a chip inductance is known from EP-0177759-B1.
- the core part has cutouts arranged in the region of the front ends, which are intended for receiving platelet-shaped contact elements to which the winding wires are welded.
- the known chip inductors are welded on according to EP-0200014-A1 by means of ultrasonic welding, in which enamel-insulated winding wires are connected to the contact elements.
- the mechanical strength of the electrical connection is then increased by covering the weld with a drop of adhesive.
- the problem with this ultrasonic welding process is that so far only contact elements that have a surface coating of silver could be used. However, this can lead to problems when soldering in a circuit board due to the formation of silver sulfide, and silver can also accumulate in the solder bath, which is not desired. If, on the other hand, the contact elements have a coating of a solder metal, there is no adequate electrical connection during ultrasonic welding, since the lubricating effect of tin or tin / lead prevents the formation of usable welded connections.
- the minimum welding time of approx. 0.5 s required for ultrasonic welding leads to cycle times of approx. 1 s even with automatic feeding of the component and welding sonotrodes.
- EP-0410211-A1 discloses welding, in which copper wires with heat or high-temperature-resistant enamel insulation are connected to the connection elements of electrical components using phosphorus-containing hard solder in an indirect laser welding process.
- This method is also not suitable for SMT inductors, since at the soldering temperatures that can be used for chip inductors, there is insufficient wetting with the required hard solder. Electrical connections with hard solder in the welding areas and with soft solder surfaces in the soldering areas would therefore be required. Such connections for chip inductors are just as unavailable as those with a surface combination of silver and solder.
- the object of the present invention is to provide a chip inductance of the type mentioned at the beginning, the winding ends of which are welded to the contact elements, and which can be produced in automated production with cycle times of less than 1s.
- a solid core part 4 with a winding space 5 is shown.
- the winding 6 of the chip inductor is arranged, which preferably consists of a copper wire with high-temperature resistant paint insulation.
- Contact elements 2, which are part of a system carrier 1, are fastened to the end faces 8 of the core part 4, preferably glued on.
- the system carrier 1, which consists for example of CuSn6, has a surface coating of a solder metal, preferably tin or a tin-lead alloy.
- the contact elements have a recess 7, which additionally serves as a winding and unwinding point for the ends 9 of the winding 6. Furthermore, the contact elements 2 are designed such that they serve both as a shielding material and as a welding material in indirect laser welding. As can be seen in particular from FIG. 3, the ends 9 of the winding 6 are guided in the contact element 2 such that they come to lie in a sandwich-like manner in the region of the recess 7 between parts arranged on the contact elements 2. The welding point 10 is attached in this area.
- the contact elements 2 have a slot 3 such that the three-dimensional positioning of the core part 4 in the system carrier 1 is retained, but the contact elements 2 in the slot 3 are interrupted.
- chip inductors with system carrier 1 avoids the winding around winding and unwinding pins on the component.
- the sandwich technology with contact elements 2, which also serve as shielding and welding material, avoids the positioning effort for separate shielding plates.
- the contact elements 2 with slot 3 and recess 7 result in higher quality values for the chip inductance compared to uninterrupted contact elements with recesses which act as a short-circuit winding.
- the surface of the contact elements 2 made of soldering metal is required by the user as state of the art today, and the welded connection is stronger than a soldered connection and allows the use of winding wires with heat or high-temperature resistant enamel insulation for the use of components at temperatures> 125 ° C.
- Overmolding with high-temperature thermoplastics is also possible, as described in DE-4023141-A1. After all, laser welding only requires welding times in the order of ms and thus enables cycle times under 1s, which are necessary for cost reasons.
Abstract
Description
Die Erfindung betrifft eine Chip-Induktivität, insbesondere Luftspule, Drossel oder Übertrager, mit einem massiven Kernteil aus ferromagnetischem oder elektrisch nicht leitendem Werkstoff, insbesondere Ferrit, Keramik oder Kunststoff, mit einem ein- oder mehrlagig bewickelbaren und gegenüber parallelen Stirnenden des Kernteils abgesetzten Wickelraum, bei der die Wicklungsenden mit stirnseitig angeordneten Kontaktelementen verschweißt sind.The invention relates to a chip inductance, in particular an air coil, choke or transformer, with a solid core part made of ferromagnetic or electrically non-conductive material, in particular ferrite, ceramic or plastic, with a winding space that can be wound in one or more layers and is set apart from parallel end faces of the core part, in which the winding ends are welded to contact elements arranged on the end face.
Eine derartige Chip-Induktivität ist aus der EP-0177759-B1 bekannt. Dort besitzt das Kernteil im Bereich der Stirnenden angeordnete Aussparungen, die zur Aufnahme von plättchenförmigen Kontaktelementen bestimmt sind, an die die Wicklungsdrähte angeschweißt werden.Such a chip inductance is known from EP-0177759-B1. There, the core part has cutouts arranged in the region of the front ends, which are intended for receiving platelet-shaped contact elements to which the winding wires are welded.
Das Anschweißen bei den bekannten Chip-Induktivitäten geschieht nach der EP-0200014-A1 mittels Ultraschallschweißung bei der lackisolierte Wicklungsdrähte mit den Kontaktelementen verbunden werden. Die mechanische Festigkeit der elektrischen Verbindung wird anschließend durch Abdecken der Schweißstelle mit einem Klebertropfen erhöht. Bei diesem Ultraschall-Schweißverfahren besteht die Schwierigkeit, daß bisher nur Kontaktelemente verwendet werden konnten, die einen Oberflächenüberzug aus Silber besitzen. Dies kann aber beim Verlöten in einer Platine wegen der Bildung von Silbersulfid zu Problemen führen und außerdem kann sich im Lötbad Silber anreichern, was nicht erwünscht ist. Wenn die Kontaktelemente dagegen einen Überzug aus einem Lötmetall besitzen, kommt keine ausreichende elektrische Verbindung beim Ultraschallschweißen zustande, da die Schmierwirkung von Zinn bzw. Zinn/Blei die Ausbildung von brauchbaren Schweißverbindungen verhindert.The known chip inductors are welded on according to EP-0200014-A1 by means of ultrasonic welding, in which enamel-insulated winding wires are connected to the contact elements. The mechanical strength of the electrical connection is then increased by covering the weld with a drop of adhesive. The problem with this ultrasonic welding process is that so far only contact elements that have a surface coating of silver could be used. However, this can lead to problems when soldering in a circuit board due to the formation of silver sulfide, and silver can also accumulate in the solder bath, which is not desired. If, on the other hand, the contact elements have a coating of a solder metal, there is no adequate electrical connection during ultrasonic welding, since the lubricating effect of tin or tin / lead prevents the formation of usable welded connections.
Kontaktelemente, die in den Schweißbereichen eine Silberoberfläche und in den Lötbereichen zum Auflöten auf die Platine einen Überzug aus Lötmetall besitzen, können wegen der für Chip-Induktivitäten benötigten engen Toleranzen nur mit wirtschaftlich nicht vertretbarem Aufwand hergestellt werden.Contact elements that have a silver surface in the welding areas and a coating of solder metal in the soldering areas for soldering onto the circuit board can only be produced with economically unreasonable expense because of the narrow tolerances required for chip inductors.
Ferner führt die beim Ultraschallschweißen erforderliche minimale Schweißzeit von ca. 0,5 s auch bei automatischer Zuführung von Bauteil und Schweißsonotroden zu Zykluszeiten von ca. 1 s.Furthermore, the minimum welding time of approx. 0.5 s required for ultrasonic welding leads to cycle times of approx. 1 s even with automatic feeding of the component and welding sonotrodes.
Eine Verkürzung der Zykluszeiten wäre an und für sich mit dem aus der DE-4039527-C1 bekannten direkten Laserschweißen möglich, das ohne Abschirmung des zu kontaktierenden Wickeldrahts gegen die Laserbestrahlung und ohne Systemträger arbeitet, jedoch setzt das dort vorgeschlagene Verfahren umfangreiche Entwicklungsarbeiten für neue Klebe-, Schweiß- und Wickeltechnologie voraus.A shortening of the cycle times would in itself be possible with the direct laser welding known from DE-4039527-C1, which works without shielding the winding wire to be contacted against laser radiation and without a system carrier. However, the method proposed there involves extensive development work for new adhesives. , Welding and winding technology ahead.
Weiter ist aus der DE-3307773-A1 ein Verfahren zum indirekten Laserschweißen von Kontaktfedern bekannt, bei dem dünne isolierte Wickeldrähte durch ein Plättchen gegen die direkte Laserbestrahlung abgeschirmt werden (Sandwich-Technologie), wobei Plättchen und Anwickelstelle auf dem Bauelement verschiedene Teile sind. Das Material der Anwickelstelle ist also weder Abschirm- noch Schweißmaterial. Schwierigkeiten bereitet bei diesem Verfahren der große maschinelle Aufwand, der erforderlich ist, um beim Laserschweißen den Systemträger mit Kontaktelementen und Kern, An- und Abwickelelemente und zusätzlich die beiden Abschirmplättchen zu positionieren.Furthermore, from DE-3307773-A1 a method for indirect laser welding of contact springs is known, in which thin insulated winding wires are shielded from direct laser radiation by a plate (sandwich technology), the plate and the winding point on the component being different parts. The material of the winding point is therefore neither shielding nor welding material. Difficulties with this method are the great mechanical outlay required to position the system carrier with contact elements and core, winding and unwinding elements and additionally the two shielding plates during laser welding.
In der DE-2946626-A1 ist ein anderes Verfahren zum indirekten Laserschweißen beschrieben. Dabei werden Leitungsdrähte, die z.B. die Wickelenden einer Spule sind, an die Anschlußstifte einer Träger- oder Leiterplatte kontaktiert, wobei die Anschlußstifte Teile einer in der Trägerplatte enthaltenen gestanzten Schaltung oder in die Schaltung einer Leiterplatte eingeschweißt sind. Dieses verfahren ist jedoch in der SMT-Technologie nicht anwendbar, da das Kontaktieren von Wicklungen an Anschlüsse auf einer Platine mit den bekannten Hochleistungsbestückautomaten nicht möglich ist. Um die Montageleistung der Bestückaotomaten nicht zu reduzieren, muß bei SMT-(Chip-)Induktivitäten die Wicklung an die elektrischen Anschlüsse des Bauelements kontaktiert sein. Die in der DE-2946626-A1 nicht enthaltenen, zu umwickelnden Anschlußstifte auf den Bauelementeanschlüssen sind wegen der geforderten kleinen Abmessungen bei Chip-Induktivitäten wegen der technischen Anforderungen beim Wickeln und wegen der Kosten der zugehörigen Wickelautomaten nicht realisierbar.Another method for indirect laser welding is described in DE-2946626-A1. In this case, lead wires, which are, for example, the winding ends of a coil, are contacted to the connecting pins of a carrier or printed circuit board, the connecting pins containing parts of one in the carrier plate punched circuit or welded into the circuit of a circuit board. However, this method cannot be used in SMT technology, since it is not possible to connect windings to connections on a circuit board with the known high-performance placement machines. In order not to reduce the assembly performance of the placement machines, the winding must be contacted to the electrical connections of the component in the case of SMT (chip) inductors. The not included in DE-2946626-A1, to be wrapped pins on the component connections are not feasible because of the small dimensions required for chip inductors due to the technical requirements for winding and because of the costs of the associated winding machines.
Schließlich ist aus der EP-0410211-A1 eine Schweißlötung bekannt, bei der Kupferdrähte mit warm- oder hochwarmfester Lackisolation bei Einsatz von phosphorhaltigem Hartlot in indirektem Laserschweißverfahren mit den Anschlußelementen von elektrischen Bauelementen verbunden werden. Dieses Verfahren ist für SMT-Induktivitäten ebenfalls nicht geeignet, da bei den Löttemperaturen, die bei Chip-Induktivitäten angewandt werden können mit dem erforderlichen Hartlot keine ausreichende Benetzung stattfindet. Erforderlich wären deshalb elektrische Anschlüsse mit Hartlot in den Schweißbereichen und mit Weichlotoberflächen in den Lötbereichen. Derartige Anschlüsse für Chip-Induktivitäten sind ebensowenig verfügbar wie solche mit einer Oberflächenkombination Silber und Lötmetall.Finally, EP-0410211-A1 discloses welding, in which copper wires with heat or high-temperature-resistant enamel insulation are connected to the connection elements of electrical components using phosphorus-containing hard solder in an indirect laser welding process. This method is also not suitable for SMT inductors, since at the soldering temperatures that can be used for chip inductors, there is insufficient wetting with the required hard solder. Electrical connections with hard solder in the welding areas and with soft solder surfaces in the soldering areas would therefore be required. Such connections for chip inductors are just as unavailable as those with a surface combination of silver and solder.
Aufgabe der vorliegenden Erfindung ist es, eine Chip-Induktivität der eingangs genannten Art anzugeben, deren Wicklungsenden an die Kontaktelemente angeschweißt sind, und die mit Zykluszeiten unter 1s in automatisierter Fertigung herstellbar sind.The object of the present invention is to provide a chip inductance of the type mentioned at the beginning, the winding ends of which are welded to the contact elements, and which can be produced in automated production with cycle times of less than 1s.
Diese Aufgabe wird erfindungsgemäß dadurch gelöst, daß die Wicklungsenden mittels einer indirekten Laserschweißung an den Kontaktelementen befestigt sind, daß die Kontaktelemente einen Überzug aus einem Lotmetall besitzen, und daß die Kontaktelemente eine Aussparung aufweisen, die als An- und Abwickelstelle ausgelegt ist und gleichzeitig als Abschirm- und Schweißmaterial bei der indirekten Laserschweißung dient.This object is achieved in that the winding ends by means of indirect laser welding the contact elements are fastened, that the contact elements have a coating of a solder metal, and that the contact elements have a recess which is designed as a winding and unwinding point and at the same time serves as a shielding and welding material for indirect laser welding.
Vorteilhafte Ausgestaltungen des Gegenstandes der Erfindung sind in den Unteransprüchen angeführt.Advantageous refinements of the subject matter of the invention are set out in the subclaims.
Die Erfindung wird im folgenden anhand von Ausführungsbeispielen erläutert.The invention is explained below using exemplary embodiments.
In der dazugehörenden Zeichnung zeigen:
- Fig.1 eine Seitenansicht einer Chip-Induktivität,
- Fig.2 eine Draufsicht auf eine Chip-Induktivität und
- Fig.3 eine stirnseitige Ansicht einer Chip-Induktivität.
- 1 shows a side view of a chip inductance,
- 2 shows a plan view of a chip inductance and
- 3 shows an end view of a chip inductance.
In den Fig. 1 bis 3 ist ein massives Kernteil 4 mit einem Wickelraum 5 dargestellt. Im Wickelraum 5 ist die Wicklung 6 der Chip-Induktivität angeordnet, die vorzugsweise aus einem Kupferdraht mit hochtemperaturfester Lackisolation besteht. Kontaktelemente 2, die Teil eines Systemträgers 1 sind, sind an den Stirnseiten 8 des Kernteils 4 befestigt, vorzugsweise angeklebt. Der Systemträger 1, der beispielsweise aus CuSn6 besteht, weist einen Oberflächenüberzug aus einem Lotmetall, vorzugsweise Zinn oder eine Zinn-Blei-Legierung, auf.1 to 3, a solid core part 4 with a
Die Kontaktelemente weisen eine Aussparung 7 auf, die zusätzlich als An- und Abwickelstelle der Enden 9 der Wicklung 6 dient. Ferner sind die Kontaktelemente 2 derart ausgebildet, daß sie sowohl als Abschirm- als auch als Schweißmaterial bei der indirekten Laserschweißung dienen. Wie insbesondere aus Fig. 3 ersichtlich ist, werden die Enden 9 der Wicklung 6 derart im Kontaktelement 2 geführt, daß sie im Bereich der Aussparung 7 sandwichartig zwischen an den Kontaktelemente 2 angeordneten Teilen zu liegen kommen. In diesem Bereich wird die Schweißstelle 10 angebracht.The contact elements have a recess 7, which additionally serves as a winding and unwinding point for the
Weiterhin weisen die Kontaktelemente 2 einen derartigen Schlitz 3 auf, daß die dreidimensionale Positionierung des Kernteils 4 im Systemträger 1 erhalten bleibt, aber die Kontaktelemente 2 im Schlitz 3 unterbrochen sind.Furthermore, the
Die Fertigung von Chip-Induktivitäten mit Systemträger 1 vermeidet das Umwickeln von An- und Abwickelstiften auf dem Bauelement. Die Sandwichtechnologie mit Kontaktelementen 2, die gleichzeitig als Abschirm- und Schweißmaterial dienen, vermeidet den Positionieraufwand für separate Abschirmplättchen. Die Kontaktelemente 2 mit Schlitz 3 und Aussparung 7 ergeben höhere Gütewerte für die Chip-Induktivität im Vergleich zu nicht unterbrochenen Kontaktelementen mit Aussparungen, die als Kurzschlußwicklung wirken.The production of chip inductors with system carrier 1 avoids the winding around winding and unwinding pins on the component. The sandwich technology with
Die Oberfläche der Kontaktelemente 2 aus Lötmetall wird heute vom Anwender als Stand der Technik gefordert, und die Schweißverbindung ist fester als eine Lötverbindung und gestattet den Einsatz von Wickeldrähten mit warm- oder hochwarmfester Lackisolation für den Bauelementeeinsatz bei Temperaturen >125°C. Weiterhin ist ein Umspritzen mit Hochtemperaturthermoplasten möglich, wie es in der DE-4023141-A1 beschrieben ist. Schließlich benötigt das Laserschweißen nur Schweißzeiten in der Größenordnung von ms und ermöglicht damit Zykluszeiten unter 1s, die aus Kostengründen erforderlich sind.The surface of the
Claims (7)
dadurch gekennzeichnet,
daß die Wicklungsenden (9) mittels einer indirekten Laserschweißung an den Kontaktelementen (2) befestigt sind, daß die Kontaktelemente (2) einen Überzug aus einem Lotmetall besitzen, und daß die Kontaktelemente (2) eine Aussparung (7) aufweisen, die als An- und Abwickelstelle ausgelegt ist und gleichzeitig als Abschirm- und Schweißmaterial bei der indirekten Laserschweißung dient.Chip inductance, in particular air coil, choke or transformer, with a solid core part made of ferromagnetic or electrically non-conductive material, in particular ferrite, ceramic or plastic, with a winding space that can be wound in one or more layers and is set apart from the parallel ends of the core part, in which the winding ends are welded to contact elements arranged on the face,
characterized,
that the winding ends (9) are attached to the contact elements (2) by means of indirect laser welding, that the contact elements (2) have a coating of a solder metal, and that the contact elements (2) have a recess (7) and unwinding point is designed and at the same time serves as a shielding and welding material for indirect laser welding.
dadurch gekennzeichnet,
daß der Überzug aus Zinn oder einer Zinn/Bleilegierung besteht.Chip inductor according to claim 1,
characterized,
that the coating consists of tin or a tin / lead alloy.
dadurch gekennzeichnet,
daß die Kontaktelemente (2) als Systemträger (1) ausgebildet sind.Chip inductance according to claim 1 or 2,
characterized,
that the contact elements (2) are designed as system carriers (1).
dadurch gekennzeichnet,
daß die Kontaktelemente (2) einen derartigen Schlitz (3) aufweisen, daß die dreidimensionale Positionierung des Kernteils (4) im Systemträger (1) erhalten bleibt und die Kontaktelemente (2) im Schlitz (3) unterbrochen sind.Chip inductance according to one of Claims 1 to 3,
characterized,
that the contact elements (2) have such a slot (3) that the three-dimensional positioning of the core part (4) in the system carrier (1) is maintained and the contact elements (2) in the slot (3) are interrupted.
dadurch gekennzeichnet,
daß die Kontaktelemente (2) an den Stirnenden (8) des Kernteils (4) mittels eines Klebers befestigt sind.Chip inductance according to one of Claims 1 to 4,
characterized,
that the contact elements (2) are attached to the end faces (8) of the core part (4) by means of an adhesive.
dadurch gekennzeichnet,
daß die Kontaktelemente (2) aus CuSn6 mit einem Lötmetallüberzug bestehen.Chip inductance according to one of Claims 1 to 5,
characterized,
that the contact elements (2) consist of CuSn6 with a solder coating.
dadurch gekennzeichnet,
daß die Wicklungsdrähte (6) aus, vorzugsweise hochtemperaturfestem, Kupferlackdraht bestehen.Chip inductance according to one of Claims 1 to 6,
characterized,
that the winding wires (6) consist of, preferably high temperature resistant, enamelled copper wire.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE4432740A DE4432740A1 (en) | 1994-09-14 | 1994-09-14 | Chip inductance |
| DE4432740 | 1994-09-14 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| EP0702378A2 true EP0702378A2 (en) | 1996-03-20 |
| EP0702378A3 EP0702378A3 (en) | 1996-04-24 |
| EP0702378B1 EP0702378B1 (en) | 2004-08-18 |
Family
ID=6528209
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP95114392A Expired - Lifetime EP0702378B1 (en) | 1994-09-14 | 1995-09-13 | Chip inductor |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP0702378B1 (en) |
| JP (1) | JP3961036B2 (en) |
| DE (2) | DE4432740A1 (en) |
| FI (1) | FI954320A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998040897A1 (en) * | 1997-03-13 | 1998-09-17 | Siemens Matsushita Components Gmbh & Co. Kg | Electrical component, specially a chip inductive resistor |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19713147C2 (en) * | 1997-03-27 | 1999-09-09 | Siemens Matsushita Components | Chip inductance |
| DE202005019497U1 (en) * | 2005-12-14 | 2007-04-26 | Neosid Pemetzrieder Gmbh & Co Kg | Inductive miniature component for SMD assembly, has entrance opening in connection flange extending in direction from upper to lower face of component |
| DE202005019496U1 (en) * | 2005-12-14 | 2007-04-26 | Neosid Pemetzrieder Gmbh & Co Kg | Inductive miniature component e.g., for SMD assemblies, has entrance aperture extending to transverse bars normal to the plane of frame |
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| DE3307773A1 (en) | 1983-03-04 | 1984-09-06 | Siemens AG, 1000 Berlin und 8000 München | Method for laser-welding thin wires and films |
| EP0200014A1 (en) | 1985-04-15 | 1986-11-05 | Siemens Aktiengesellschaft | Process for the break-proof contacting of varnish-insulated wires |
| EP0177759B1 (en) | 1984-09-13 | 1990-05-16 | Siemens Aktiengesellschaft | Electronic component, in particular for a chip inductor |
| EP0410211A1 (en) | 1989-07-28 | 1991-01-30 | Siemens Aktiengesellschaft | Process for producing an electrically conductive connection between enamelled copper wires and terminals |
| DE4023141A1 (en) | 1990-07-20 | 1992-01-30 | Siemens Matsushita Components | Encapsulating prismatic inductance - has fixing contact ends in off=centre split plane of mould and injecting resin asymmetrically to inductance |
| DE4039527C1 (en) | 1990-12-11 | 1992-06-25 | Siemens Matsushita Components Gmbh & Co. Kg, 8000 Muenchen, De |
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| DE8620265U1 (en) * | 1986-07-29 | 1986-11-20 | Weiner, Rene, 5275 Bergneustadt, De | |
| JPH04369811A (en) * | 1991-04-05 | 1992-12-22 | Matsushita Electric Works Ltd | Coil-end treating method |
| DE4139437A1 (en) * | 1991-11-29 | 1993-06-03 | Siemens Ag | METHOD FOR PRODUCING ADHESIVE CONNECTIONS BETWEEN WINDING BODIES FOR ELECTRICAL COMPONENTS AND THEIR CONNECTING WIRE |
-
1994
- 1994-09-14 DE DE4432740A patent/DE4432740A1/en not_active Withdrawn
-
1995
- 1995-09-07 JP JP25445095A patent/JP3961036B2/en not_active Expired - Lifetime
- 1995-09-13 EP EP95114392A patent/EP0702378B1/en not_active Expired - Lifetime
- 1995-09-13 DE DE59510936T patent/DE59510936D1/en not_active Expired - Lifetime
- 1995-09-14 FI FI954320A patent/FI954320A/en unknown
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2946626A1 (en) | 1979-11-19 | 1981-05-21 | Telefonbau Und Normalzeit Gmbh, 6000 Frankfurt | METHOD FOR CONTACTING THICK ELECTRIC WIRES |
| DE3307773A1 (en) | 1983-03-04 | 1984-09-06 | Siemens AG, 1000 Berlin und 8000 München | Method for laser-welding thin wires and films |
| EP0177759B1 (en) | 1984-09-13 | 1990-05-16 | Siemens Aktiengesellschaft | Electronic component, in particular for a chip inductor |
| EP0200014A1 (en) | 1985-04-15 | 1986-11-05 | Siemens Aktiengesellschaft | Process for the break-proof contacting of varnish-insulated wires |
| EP0410211A1 (en) | 1989-07-28 | 1991-01-30 | Siemens Aktiengesellschaft | Process for producing an electrically conductive connection between enamelled copper wires and terminals |
| DE4023141A1 (en) | 1990-07-20 | 1992-01-30 | Siemens Matsushita Components | Encapsulating prismatic inductance - has fixing contact ends in off=centre split plane of mould and injecting resin asymmetrically to inductance |
| DE4039527C1 (en) | 1990-12-11 | 1992-06-25 | Siemens Matsushita Components Gmbh & Co. Kg, 8000 Muenchen, De |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998040897A1 (en) * | 1997-03-13 | 1998-09-17 | Siemens Matsushita Components Gmbh & Co. Kg | Electrical component, specially a chip inductive resistor |
| DE19710462A1 (en) * | 1997-03-13 | 1998-09-24 | Siemens Matsushita Components | Electrical component, in particular chip inductance |
| DE19710462C2 (en) * | 1997-03-13 | 1999-05-20 | Siemens Matsushita Components | Electrical component, in particular chip inductance |
Also Published As
| Publication number | Publication date |
|---|---|
| EP0702378B1 (en) | 2004-08-18 |
| DE59510936D1 (en) | 2004-09-23 |
| FI954320A0 (en) | 1995-09-14 |
| DE4432740A1 (en) | 1996-03-21 |
| EP0702378A3 (en) | 1996-04-24 |
| FI954320A (en) | 1996-03-15 |
| JPH0888130A (en) | 1996-04-02 |
| JP3961036B2 (en) | 2007-08-15 |
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