WO1997008925A1 - Method of establishing a connection between at least two electrical conductors, one of which is mounted on a supporting substrate - Google Patents

Method of establishing a connection between at least two electrical conductors, one of which is mounted on a supporting substrate Download PDF

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Publication number
WO1997008925A1
WO1997008925A1 PCT/DE1996/001504 DE9601504W WO9708925A1 WO 1997008925 A1 WO1997008925 A1 WO 1997008925A1 DE 9601504 W DE9601504 W DE 9601504W WO 9708925 A1 WO9708925 A1 WO 9708925A1
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WO
WIPO (PCT)
Prior art keywords
tool
conductor
carrier substrate
substrate
connection
Prior art date
Application number
PCT/DE1996/001504
Other languages
German (de)
French (fr)
Inventor
Josef Mundigl
Michael Huber
Original Assignee
Siemens Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Aktiengesellschaft filed Critical Siemens Aktiengesellschaft
Publication of WO1997008925A1 publication Critical patent/WO1997008925A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/12—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating the heat being generated by friction; Friction welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/21—Bonding by welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0228—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections without preliminary removing of insulation before soldering or welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/38—Conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0207—Ultrasonic-, H.F.-, cold- or impact welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0221—Laser welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0352—Differences between the conductors of different layers of a multilayer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10924—Leads formed from a punched metal foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other

Definitions

  • an intermediate product can be a semiconductor chip arranged on an electrically conductive lead frame and connected to a planar antenna coil applied to a carrier film by means of lamination and etching technology, by connecting both the chip and the coil to the lead frame become.
  • connection of the two metals is usually carried out by means of pressure using a suitable tool, such as a joining die, ultrasound and / or heat preferably being used as an additional energy source.
  • a suitable tool such as a joining die, ultrasound and / or heat preferably being used as an additional energy source.
  • the tool must come into contact with one of the partners to be connected, the partners also necessarily having to be in contact with one another. It is a problem if one of the partners is attached to a carrier substrate.
  • the carrier substrate must be prepared. This preparation, such as making an opening, sometimes requires a very precisely positioned machining process and is therefore generally associated with additional costs.
  • the object of the present invention is therefore to provide a method for producing a connection between at least two electrical conductors, one of which is arranged on a carrier substrate by means of lamination and etching technology, in which no preparation of the carrier substrate is necessary.
  • the method according to the invention can be used particularly advantageously when using carrier substrates with low temperature conductivity since, in the manner according to the invention, the same energy source that is used for the mechanical introduction of energy for the actual connection of the two electrical conductors is also used for melting the carrier. serves substrate. In this way it is possible to melt the material of the carrier substrate, to connect the two electrical conductors to one another in a simple and thus inexpensive manner without special preparation and pretreatment of the carrier.
  • This type of connection technology according to the invention has the particular advantage that the process sequence can be automated very easily and in this way complex work steps can be saved.
  • Figures 1 and 2 a first variant and Figures 3 and 4 a second variant of the inventive method.
  • a first joining partner 2 which can be a lead frame, for example, is arranged on a base 1.
  • a second joining partner consists of a carrier substrate 3, on which a conductor track 4 is applied, for example in the form of a planar coil.
  • This conductor track 4 is to be connected to the first joining partner 2 by means of a tool 5.
  • energy is supplied by means of pressure and heat and / or ultrasound, so that the two joining partners 2, 3 and 4 come into contact with one another.
  • the tool 5 heats the underlying carrier material 3 via the heat and / or ultrasound coupling.
  • the conductor 4 is pressed onto the underlying joining partner 2 and connected to it. This state is shown in FIG. 2. It would of course also be possible to supply the heat energy required for melting the carrier material as a laser beam.
  • FIG. 3 A further embodiment of the method according to the invention, in which the conductor 4 applied to the carrier substrate 3 comes into direct contact with the first joining partner 2 and the tool 5 is placed on the carrier substrate 3, is shown in the figures 3 and 4.
  • the same elements as in Figures 1 and 2 are provided with the same reference numerals.
  • the joining die 5 heats the carrier material when it is placed on the substrate carrier 3.
  • the melting carrier material 3 is displaced with appropriate mechanical force coupling.
  • the contact to the first joining partner 2 can be established and the actual metal connection can thus be initiated.
  • the method according to the invention is essentially dependent on the geometrical and material-specific parameters of the conductors 2, 4 and the carrier substrate 3. It is also possible to contact several electrical conductors on corresponding carrier substrates in one working step.
  • the carrier substrate should advantageously have a melting point that is as low as possible and the electrical conductor on the carrier substrate should have a good thermal conductivity.
  • the conductors to be connected should have surfaces which are easy to alloy in order to enable a connection at an already low temperature.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Ceramic Engineering (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

Described is a method of establishing a connection between at least one first electrical conductor forming a first joint partner (2) and a second conductor (4) mounted using laminating or etching techniques on a supporting substrate (3) and forming, together with the substrate, a second joint partner. The at least two joint partners (2, 3 and 4) are first brought into contact with each other by a tool (5) to which mechanical energy is supplied, and the substrate (3) is then melted in the vicinity of the tool (5) by also supplying heat. This causes the substrate to give way to the tool (5), and the at least two conductors (2, 4) are thus connected to each other by the tool (5).

Description

Beschreibungdescription
Verfahren zur Herstellung einer Verbindung zwischen zumindest zwei elektrischen Leitern, von denen einer auf einem Träger- Substrat angeordnet istMethod for producing a connection between at least two electrical conductors, one of which is arranged on a carrier substrate
Bei der Montage elektronischer und elektrischer Bauteile müs¬ sen diese Bauteile regelmäßig mit Leitern oder Leiterbahnen elektrisch und mechanisch miteinander verbunden werden. Sol- ehe Bauteile können neben Halbleiterchips auch Leitungsbau¬ elemente wie beispielsweise gewickelte Spulen oder auf einem Trägersubstrat angeordnete planare Spulen sein. Zur Herstel¬ lung kontaktloser Chipkarte kann beispielsweise als Zwischen¬ produkt ein auf einem elektrisch leitenden Leadframe angeord- neter Halbleiterchip mit einer auf einer Trägerfolie mittels Laminier- und Ätzcechnik aufgebrachten planaren Antennenspule verbunden werden, indem sowohl der Chip als auch die Spule mit dem Leadframe verbunden werden.When assembling electronic and electrical components, these components must be electrically and mechanically connected to one another regularly using conductors or conductor tracks. In addition to semiconductor chips, such components can also be line components, such as wound coils or planar coils arranged on a carrier substrate. To produce contactless chip cards, for example, an intermediate product can be a semiconductor chip arranged on an electrically conductive lead frame and connected to a planar antenna coil applied to a carrier film by means of lamination and etching technology, by connecting both the chip and the coil to the lead frame become.
Die Verbindung der zwei Metalle erfolgt hierbei üblicherweise mittels Druck durch ein geeignetes Werkzeug, wie beispiels¬ weise einem Fügestempel, wobei vorzugsweise Ultraschall und/oder Wärme als zusätzliche Energiequelle genutzt werden. Das Werkzeug muß hierbei jedoch mit einem der zu verbindenden Partner in Kontakt kommen, wobei die Partner zwangsläufig auch miteinander in Kontakt sein müssen. Dabei stellt es ein Problem dar, wenn einer der Partner auf einem Trägersubstrat aufgebracht ist.The connection of the two metals is usually carried out by means of pressure using a suitable tool, such as a joining die, ultrasound and / or heat preferably being used as an additional energy source. However, the tool must come into contact with one of the partners to be connected, the partners also necessarily having to be in contact with one another. It is a problem if one of the partners is attached to a carrier substrate.
Bei auf dem Markt erhältlichen Lösungen ist es beispielsweise bekannt, im Trägersubstrat an den zu verbindenden Stellen ei¬ nen Durchbruch vorzusehen, und durch diesen Durchbruch eine leitende Verbindung von der Ober- zur Unterseite des Träger¬ substrats zu schaffen, so daß bei Druck auf die Oberseite der leitende Bereich der Unterseite mit dem zu verbindenden Mate¬ rial in Kontakt kommt und sich dabei mit diesem verbindet. Es ist auch bekannt, eine Leiterbahn auf dem Trägersubstrat über einen Durchbruch im Trägersubstrat hinwegzuführen. Das Fügewerkzeug deformiert dann bei Ausübung eines Drucks die Leiterbahn und führt sie durch den Durchbruch zum zu verbin- denden Material.In the case of solutions available on the market, it is known, for example, to provide an opening in the carrier substrate at the points to be connected, and to use this opening to create a conductive connection from the top to the bottom of the carrier substrate, so that pressure on the The conductive area of the underside comes into contact with the material to be connected and thereby connects to it. It is also known to guide a conductor track on the carrier substrate over an opening in the carrier substrate. The joining tool then deforms the conductor track when pressure is exerted and guides it through the opening to the material to be connected.
In beiden beschriebenen Fällen muß jedoch das Trägersubstrat vorbereitet werden. Diese Vorbereitung, wie beispielsweise das Anbringen eines Durchbruchs, erfordert zum Teil einen sehr genau positionierten Bearbeitungsvorgang und ist daher generell mit zusätzlichen Kosten verbunden.In both cases described, however, the carrier substrate must be prepared. This preparation, such as making an opening, sometimes requires a very precisely positioned machining process and is therefore generally associated with additional costs.
Aus der DE 43 01 692 AI ist es bekannt, auf Trägersubstrate gedruckte Leiterbahnen mittels Druck und Ultraschall mitein- ander zu verbinden. Das dortige Verfahren ist jedoch nur bei gedruckten Leiterbahnen verwendbar, wobei die Anwendung bei mittels Laminier- und Ätztechnik hergestellten Leitern aus¬ drücklich verneint wird.From DE 43 01 692 AI it is known to connect printed conductors printed on carrier substrates to one another by means of pressure and ultrasound. However, the method there can only be used with printed conductor tracks, the use in the case of conductors produced by means of laminating and etching technology being expressly denied.
Die Aufgabe vorliegender Erfindung besteht somit darin, ein Verfahren zur Herstellung einer Verbindung zwischen zumindest zwei elektrischen Leitern, von denen einer mittels Laminier- und Ätztechnik auf einem Trägersubstrat angeordnet ist, anzu¬ geben, bei dem keine Vorbereitung des Trägersubstrats erfor- derlich ist.The object of the present invention is therefore to provide a method for producing a connection between at least two electrical conductors, one of which is arranged on a carrier substrate by means of lamination and etching technology, in which no preparation of the carrier substrate is necessary.
Die Aufgabe wird durch ein Verfahren gemäß Anspruch l gelöst. Vorteilhafte Weiterbildungen sind in den Unteransprüchen an¬ gegeben.The object is achieved by a method according to claim 1. Advantageous further developments are given in the subclaims.
Das erfindungsgemäße Verfahren kann besonders vorteilhaft bei Einsatz von Trägersubstraten mit niedriger Temperaturleitfä¬ higkeit genutzt werden, da in erfindungsgemäßer Weise die gleiche Energiequelle, die für die mechanische Energieein- bringung zur eigentlichen Verbindung der beiden elektrischen Leiter eingesetzt wird, auch für das Aufschmelzen des Träger- substrats dient. Auf diese Weise ist es möglich, unter Auf- schmelzen des Materials des Trägersubstrats, die beiden elek¬ trischen Leiter ohne besondere Vorbereitung und Vorbehandlung des Trägers auf einfache und somit kostengünstige Weise mit¬ einander zu verbinden. Diese erfindungsgemäße Art der Verbin- dungstechnik hat den besonderen Vorteil, daß der Prozeßablauf sehr einfach automatisierbar ist und dabei aufwendige Ar¬ beitsschritte eingespart werden können.The method according to the invention can be used particularly advantageously when using carrier substrates with low temperature conductivity since, in the manner according to the invention, the same energy source that is used for the mechanical introduction of energy for the actual connection of the two electrical conductors is also used for melting the carrier. serves substrate. In this way it is possible to melt the material of the carrier substrate, to connect the two electrical conductors to one another in a simple and thus inexpensive manner without special preparation and pretreatment of the carrier. This type of connection technology according to the invention has the particular advantage that the process sequence can be automated very easily and in this way complex work steps can be saved.
Die Erfindung wird nachfolgend anhand von Ausführungsbeispie- len mit Hilfe von Figuren näher erläutert. Dabei zeigen:The invention is explained in more detail below on the basis of exemplary embodiments with the aid of figures. Show:
Figuren 1 und 2 eine erste Variante und Figuren 3 und 4 eine zweite Variante des erfindungsge¬ mäßen Verfahrens.Figures 1 and 2 a first variant and Figures 3 and 4 a second variant of the inventive method.
Gemäß Figur l ist auf einer Unterlage 1 ein erster Fügepart¬ ner 2, der beispielsweise ein Leadframe sein kann, angeord¬ net. Ein zweiter Fügepartner besteht aus einem Trägersubstrat 3, auf dem eine Leiterbahn 4 beispielsweise in Form einer planaren Spule aufgebracht ist. Mittels eines Werkzeugs 5 soll diese Leiterbahn 4 mit dem ersten Fügepartner 2 verbun¬ den werden. Hierzu wird Energie mittels Druck und Wärme und/oder Ultraschall zugeführt, so daß die beiden Fügepartner 2, 3 und 4 miteinander in Kontakt kommen. Das Werkzeug 5 er- wärmt dabei beim Aufsetzen auf den Leiter 4 über die Wärme- und/oder Ultraschalleinkopplung das darunterliegende Träger¬ material 3. Bei entsprechendem Druck wird der Leiter 4 auf den darunterliegenden ersten Fügepartner 2 gedrückt und mit diesem verbunden. Diesen Zustand zeigt Figur 2. Es wäre na- türlich auch möglich, die zum Aufschmelzen des Trägermateri¬ als erforderliche Wärmeenergie mittels eines Laserstrahls zu¬ zuführen.According to FIG. 1, a first joining partner 2, which can be a lead frame, for example, is arranged on a base 1. A second joining partner consists of a carrier substrate 3, on which a conductor track 4 is applied, for example in the form of a planar coil. This conductor track 4 is to be connected to the first joining partner 2 by means of a tool 5. For this purpose, energy is supplied by means of pressure and heat and / or ultrasound, so that the two joining partners 2, 3 and 4 come into contact with one another. When placed on the conductor 4, the tool 5 heats the underlying carrier material 3 via the heat and / or ultrasound coupling. When the pressure is appropriate, the conductor 4 is pressed onto the underlying joining partner 2 and connected to it. This state is shown in FIG. 2. It would of course also be possible to supply the heat energy required for melting the carrier material as a laser beam.
Eine weitere Ausführung des erfindungsgemäßen Verfahrens, bei dem der auf dem Trägersubstrat 3 aufgebrachte Leiter 4 direkt mit dem ersten Fügepartner 2 in Kontakt kommt und das Werk¬ zeug 5 auf das Trägersubstrat 3 aufsetzt, ist in den Figuren 3 und 4 dargestellt. Gleiche Elemente wie in den Figuren 1 und 2 sind mit gleichen Bezugszeichen versehen.A further embodiment of the method according to the invention, in which the conductor 4 applied to the carrier substrate 3 comes into direct contact with the first joining partner 2 and the tool 5 is placed on the carrier substrate 3, is shown in the figures 3 and 4. The same elements as in Figures 1 and 2 are provided with the same reference numerals.
Der Fügestempel 5 erwärmt beim Aufsetzen auf den Substratträ¬ ger 3 das Trägermaterial. Das schmelzende Trägermaterial 3 wird unter entsprechender mechanischer Krafteinkopplung ver¬ drängt. Der Kontakt zum ersten Fügepartner 2 kann hergestellt und somit die eigentliche Metallverbindung eingeleitet wer¬ den.The joining die 5 heats the carrier material when it is placed on the substrate carrier 3. The melting carrier material 3 is displaced with appropriate mechanical force coupling. The contact to the first joining partner 2 can be established and the actual metal connection can thus be initiated.
Das erfindungsgemäße Verfahren ist im wesentlichen abhängig von den geometrischen und materialspezifischen Kenngrößen der Leiter 2, 4 und des Trägersubstrats 3. Es ist ebenso möglich, mehrere elektrische Leiter auf entsprechenden Trägersubstra- ten miteinander in einem Arbeitsschritt zu kontaktieren. Das Trägersubstrat sollte in vorteilhafter Weise einen möglichst geringen Schmelzpunkt und der elektrische Leiter auf dem Trä¬ gersubstrat einen guten Wärmeleitwert aufweisen. Die zu ver¬ bindenden Leiter sollten gut legierbare Oberflächen aufwei- sen, um bei bereits geringer Temperatur eine Verbindung zu ermöglichen. The method according to the invention is essentially dependent on the geometrical and material-specific parameters of the conductors 2, 4 and the carrier substrate 3. It is also possible to contact several electrical conductors on corresponding carrier substrates in one working step. The carrier substrate should advantageously have a melting point that is as low as possible and the electrical conductor on the carrier substrate should have a good thermal conductivity. The conductors to be connected should have surfaces which are easy to alloy in order to enable a connection at an already low temperature.

Claims

Patentansprüche claims
1. Verfahren zum Herstellen einer Verbindung zwischen zu¬ mindest einem mit einem ersten elektrischen Leiter gebildeten ersten Fügepartner (2) und einem auf einem Trägersubstrat (3) mittels Laminier- und Ätztechnik aufgebrachten und mit diesem einen zweiten Fügepartner bildenden zweiten Leiter (4) , dadurch gekennzeichnet, daß die zumindest zwei Fügepartner (2, 3 und 4) durch Zufüh- ren von mechanischer Energie zu einem Werkzeug (5) mittels diesem zunächst in Kontakt gebracht werden und anschließend das Trägersubstrat (3) durch zusätzliches Zuführen von Wärme im Bereich des Werkzeugs (5) aufgeschmolzen wird und dadurch dem Werkzeug (5) weicht, so daß die zumindest zwei elektri- sehen Leiter (2, 4) mittels des Werkzeugs (5) miteinander verbunden werden.1. A method for establishing a connection between at least one first joining partner (2) formed with a first electrical conductor and a second conductor (4) applied to a carrier substrate (3) by means of lamination and etching technology and forming a second joining partner with the latter, characterized in that the at least two joining partners (2, 3 and 4) are first brought into contact by supplying mechanical energy to a tool (5) and then the carrier substrate (3) by additionally supplying heat in the region of the Tool (5) is melted and thereby gives way to the tool (5), so that the at least two electrical conductors (2, 4) are connected to one another by means of the tool (5).
2. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß der zweite Leiter (4) auf der Oberseite des Träger- Substrats (3) aufgebracht ist.2. The method according to claim 1, characterized in that the second conductor (4) on the top of the carrier substrate (3) is applied.
3. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß der zweite Leiter (4) auf der Unterseite des Träger¬ substrats (3) aufgebracht ist.3. The method according to claim 1, characterized in that the second conductor (4) on the underside of the Träger¬ substrate (3) is applied.
4. Verfahren nach einem der vorhergehenden Ansprüche, da¬ durch gekennzeichnet, daß die dem Werkzeug (5) zugeführte Energie mechanischer Druck ist.4. The method according to any one of the preceding claims, da¬ characterized in that the tool (5) supplied energy is mechanical pressure.
5. Verfahren nach einem der Ansprüche 1 bis 4, dadurch ge¬ kennzeichnet, daß die Wärme mittels eines Lasers zugeführt wird.5. The method according to any one of claims 1 to 4, characterized in that the heat is supplied by means of a laser.
6. Verfahren nach einem der Ansprüche 1 bis 4, dadurch ge¬ kennzeichnet, daß die Wärme dem Werkzeug direkt durch Erwärmung zugeführt wird.6. The method according to any one of claims 1 to 4, characterized ge indicates that the heat is supplied to the tool directly by heating.
7. Verfahren nach einem der Ansprüche 1 bis 4, dadurch ge- kennzeichnet, daß die Wärme den Fügepartnern (2, 3 und 4) durch Zuführen von Ultraschallenergie zu dem Werkzeug (5) zugeführt wird. 7. The method according to any one of claims 1 to 4, characterized in that the heat is supplied to the joining partners (2, 3 and 4) by supplying ultrasonic energy to the tool (5).
PCT/DE1996/001504 1995-08-30 1996-08-13 Method of establishing a connection between at least two electrical conductors, one of which is mounted on a supporting substrate WO1997008925A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19531970.2 1995-08-30
DE19531970A DE19531970A1 (en) 1995-08-30 1995-08-30 Method for producing a connection between at least two electrical conductors, one of which is arranged on a carrier substrate

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WO1997008925A1 true WO1997008925A1 (en) 1997-03-06

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US6346538B1 (en) 1997-12-18 2002-02-12 Basf Aktiengesellschaft Fungicide mixtures based on amide compounds and pyridine derivatives
US6489348B1 (en) * 1997-12-18 2002-12-03 Basf Aktiengesellschaft Fungicidal mixtures based on amide compounds and pyridine derivatives
CN106034378A (en) * 2015-03-11 2016-10-19 深圳市英内尔科技有限公司 Reel-to-reel flexible circuit board made of novel material and manufacturing method thereof

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WO1999049708A1 (en) * 1998-03-27 1999-09-30 Minnesota Mining And Manufacturing Company Method for making electrical connections between conductors separated by a dielectric
DE10205521A1 (en) * 2002-02-08 2003-08-28 Heraeus Gmbh W C Process for the electrical contacting of two metal structures
WO2007059797A1 (en) * 2005-11-25 2007-05-31 Fci Method to weld conductive tracks together
EP3297409B1 (en) * 2016-09-16 2022-10-12 OSRAM GmbH A method of connecting lighting modules and corresponding device

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Cited By (3)

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US6346538B1 (en) 1997-12-18 2002-02-12 Basf Aktiengesellschaft Fungicide mixtures based on amide compounds and pyridine derivatives
US6489348B1 (en) * 1997-12-18 2002-12-03 Basf Aktiengesellschaft Fungicidal mixtures based on amide compounds and pyridine derivatives
CN106034378A (en) * 2015-03-11 2016-10-19 深圳市英内尔科技有限公司 Reel-to-reel flexible circuit board made of novel material and manufacturing method thereof

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