WO1999006948A1 - Method for producing a chip card for the contactless transmission of data and/or energy, and corresponding chip card - Google Patents

Method for producing a chip card for the contactless transmission of data and/or energy, and corresponding chip card Download PDF

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Publication number
WO1999006948A1
WO1999006948A1 PCT/DE1998/002047 DE9802047W WO9906948A1 WO 1999006948 A1 WO1999006948 A1 WO 1999006948A1 DE 9802047 W DE9802047 W DE 9802047W WO 9906948 A1 WO9906948 A1 WO 9906948A1
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WO
WIPO (PCT)
Prior art keywords
chip
card
coating
cavity
card body
Prior art date
Application number
PCT/DE1998/002047
Other languages
German (de)
French (fr)
Inventor
Thies Janczek
Frank PÜSCHNER
Original Assignee
Siemens Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Aktiengesellschaft filed Critical Siemens Aktiengesellschaft
Publication of WO1999006948A1 publication Critical patent/WO1999006948A1/en

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]

Definitions

  • the invention relates to a method for producing a chip card for contactless data and / or energy transmission with external devices according to the preamble of patent claim 1. Furthermore, the invention relates to a corresponding chip card according to the preamble of patent claim 5.
  • Chip cards of this type are used, for example, as credit cards or ID cards for cashless payment transactions or to prove access authorization.
  • the chip cards can be divided into two categories with contact and contactless.
  • Chip cards for contact-related data and / or energy transmission have a chip module on the card surface with connection contacts which come into contact with a reading device when the chip card is inserted into an external device.
  • contactless chip cards have a coil which is arranged in the interior of the card body and acts as an antenna and which is connected on the one hand to the chip and on the other hand is used for contact-free data and / or energy transmission.
  • Chip cards are also known which are suitable for both contactless and contact-based transmission.
  • the invention is therefore based on the object of providing a method of the type mentioned at the outset with which a contactless chip card which can also be printed in the chip module area can be produced in the simplest and most economical manner.
  • a contactless chip card is to be created in the simplest and cheapest possible way, which also enables problem-free printing in the chip module area.
  • the chip module is provided with a coating of printable plastic on the side facing away from the chip before it is inserted into the cavity.
  • the exposed surface of the chip module is covered with a printable plastic plate only after it has been installed in the cavity of the card body
  • the surface which is subsequently exposed is already plastic-coated during the manufacture of the chip module that it is printable.
  • the subsequent punching out and implementation of a plastic plate on the chip module used is therefore eliminated.
  • Another advantage is that existing implanting devices, which are usually used for contact-type chip cards, can also be used for the production of contactless chip cards without modification or extension.
  • the coating with plastic is expediently carried out as the last method step of module production, since the temperatures required in the preceding module production steps could impair the quality of the plastic or destroy it.
  • the chip module is produced from a metal strip using leadframe technology and the plastic coating is applied to the metal strip.
  • a metal strip which serves as a chip carrier, can be produced and coated in a very cost-effective manner.
  • the coating material is advantageously passed through slots in the chip carrier and formed into a rivet on the opposite side. This results in an additional form fit through the rear grip sections of the rivet, so that the coating is held on the chip carrier in a very secure manner.
  • Another advantage is that these rivets can be used at the same time, for example by means of ultrasound or high-frequency welding, to establish a firm connection with the rest of the card body after the chip module has been inserted into the cavity.
  • the chip module has a separate coating made of printable plastic on the side facing away from the chip, which advantageously has a thickness of 50-500 ⁇ m.
  • This coating can be made of PVC or ABS.
  • FIG. 1 a schematic sectional illustration of the contactless chip card according to the invention before the chip module is inserted into the cavity of the card body, and
  • FIG. 2 shows a slightly modified embodiment of the chip card shown in FIG. 1 after the chip module has been inserted into the cavity of the card body.
  • FIG. 1 and 2 show a card body 1 which has a middle layer 2 which serves as a coil carrier. On this middle layer 2 there is an as
  • Antenna-acting coil 3 which has four windings in the exemplary embodiment shown and ends in two free coil ends 4, 5.
  • a bottom layer 7 is also provided on the lower side of the middle layer 2.
  • the layers 2, 6, 7, which consist of a non-conductive plastic, can be sprayed on or connected to one another by means of a laminating technique.
  • the middle layer 2 and the layer 6 lying thereon are initially in a cuboid state.
  • a cavity 8 is subsequently introduced from above, e.g. milled in.
  • the shape and size of this cavity 8 is adapted to a chip module 9 which is later inserted into this cavity 8.
  • the depth of the cavity 8 is dimensioned in the region of the coil ends 4, 5 in such a way that these coil ends 4, 5 are roughly milled to half, so that exposed coil end contact surfaces are created.
  • the cavity 8 extends down to the bottom layer 7.
  • the chip module 9 to be inserted into the cavity 8 consists of a chip carrier 10 which is punched out of a metal strip.
  • the chip carrier 10 has a chip carrier center section 11, on the underside of which an electronic chip 12 is fastened.
  • chip carrier side sections 13 which are spaced apart from the chip carrier center section 11, i.e. are isolated, and serve as connection contact surfaces for the chip 12.
  • Chip carrier side sections 13 connected, which is referred to as "wire bonding". Then a potting compound 15 made of resin (globe top) is applied to that side of the chip carrier 11 on which the chip 12 is located, so that the latter together with the connecting wires 14 completely confined will pour. This serves for additional fixation and
  • a plastic coating 16 is applied to the opposite side of the chip carrier 10 and consists of a plastic material suitable for printing, for example PVC or ABS.
  • a plastic material suitable for printing for example PVC or ABS.
  • slots or passages 17 can be provided in the chip carrier side sections 13, through which the plastic material of the plastic coating 16 passes on the opposite side of the chip carrier 10.
  • the plastic material passing through is shaped such that plastic rivets 18 are formed which engage behind the chip carrier side sections 13.
  • the plastic coating 16 is only applied to the chip carrier 10 when the chip 12 and the connecting wires 14 are placed on the chip carrier 10 and the casting compound 15 has been applied. This is because the temperatures used in these manufacturing steps could undesirably change or destroy the plastic coating 16.
  • the chip module 9 is expediently produced using lead-free technology, that is to say that many adjacent chip carriers 10 are in the form of a coherent metal strip and are accordingly equipped with chips 12.
  • the chip module 9 produced in this way is then inserted into the cavity 8 of the card body 1, as can be seen from FIG.
  • the chip carrier side sections 13, which serve as contact connection areas for the chip 12 are soldered or soldered with conductive adhesive 19 to the machined coil ends 4, 5 electrically connected.
  • the card body 1 can be connected to the card body 1 by means of ultrasound or high-frequency welding.
  • an adhesive for example cyanoacrylate, for this connection.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

The invention relates to a method for producing a chip card for the contactless transmission of data and/or energy with external devices. According to said method, a chip module (9) is provided with a coating (16) consisting of printable plastic on the side facing away from the chip before being inserted into a cavity (8) of a card body (1). The corresponding chip module (9) therefore has a separate printable plastic coating (16) on the side facing away from the chip.

Description

Beschreibungdescription
Verfahren zur Herstellung einer Chipkarte für kontaktlose Daten- und/oder Energieübertragung sowie ChipkarteMethod for producing a chip card for contactless data and / or energy transmission and chip card
Die Erfindung betrifft ein Verfahren zur Herstellung einer Chipkarte für kontaktlose Daten- und/oder Energieübertragung mit externen Geräten gemäß dem Oberbegriff des Patentanspruchs 1. Weiterhin betrifft die Erfindung eine entspre- chende Chipkarte gemäß dem Oberbegriff des Patentanspruchs 5.The invention relates to a method for producing a chip card for contactless data and / or energy transmission with external devices according to the preamble of patent claim 1. Furthermore, the invention relates to a corresponding chip card according to the preamble of patent claim 5.
Chipkarten dieser Art werden beispielsweise als Kreditkarten oder Ausweiskarten für den bargeldlosen Zahlungsverkehr oder zum Nachweis einer Zugangsberechtigung eingesetzt. Grundsätz- lieh können die Chipkarten in die beiden Kategorien kontaktbehaftet und kontaktlos eingeteilt werden. Chipkarten für die kontaktbehaftete Daten- und/oder Engergieübertragung weisen ein an der Kartenoberfläche liegendes Chipmodul mit Anschlußkontakten auf, die beim Einschieben der Chipkarte in ein ex- ternes Gerät mit einer Leseeinrichtung in Kontakt gelangen.Chip cards of this type are used, for example, as credit cards or ID cards for cashless payment transactions or to prove access authorization. In principle, the chip cards can be divided into two categories with contact and contactless. Chip cards for contact-related data and / or energy transmission have a chip module on the card surface with connection contacts which come into contact with a reading device when the chip card is inserted into an external device.
Demgegenüber weisen kontaktlose Chipkarten eine im Inneren des Kartenkörpers angeordnete, als Antenne wirkende Spule auf, welche einerseits mit dem Chip in Verbindung steht und andererseits für eine kontaktfreie Daten- und/oder Energie- Übertragung dient. Weiterhin sind auch Chipkarten bekannt, die sowohl für die kontaktfreie als auch für die kontaktbehaftete Übertragung geeignet sind.In contrast, contactless chip cards have a coil which is arranged in the interior of the card body and acts as an antenna and which is connected on the one hand to the chip and on the other hand is used for contact-free data and / or energy transmission. Chip cards are also known which are suitable for both contactless and contact-based transmission.
Es ist bekannt, ein Chipmodul vor der eigentlichen Kartenher- Stellung zunächst auf einem Spulenträger anzuordnen und mit der Antenne zu verbinden, worauf dieser Verbund zusammen mit mindestens zwei weiteren Schichten zum Kartenkörper verpresst wird. Weiterhin kann das aus Spulenträger und Chipmodul bestehende Inlay auch mittels Spritztechniken zum endgültigen Kartenkörper geformt werden. Nach Herstellung des vollständi- gen Kartenkörpers wird dieser in der gewünschten Weise bedruckt. Nachteilig ist hierbei jedoch, daß sowohl beim Lami- nieren als auch beim Spritzen des Kartenkörpers häufig Verwerfungen auftreten, wodurch die gesamte Chipkarte mitsamt dem relativ teueren Chip unbrauchbar wird. Dies ist auch dann der Fall, wenn beim nachfolgenden Bedrucken Fehler auftreten.It is known to place a chip module on a coil carrier and to connect it to the antenna before the actual card manufacture, whereupon this composite is pressed together with at least two further layers to form the card body. Furthermore, the inlay consisting of coil carrier and chip module can also be formed into the final card body by means of spraying techniques. After the complete card body is printed in the desired manner. The disadvantage here, however, is that warping frequently occurs both when laminating and when the card body is sprayed, as a result of which the entire chip card together with the relatively expensive chip becomes unusable. This is also the case if errors occur during subsequent printing.
Weiterhin ist es bei kontaktlosen Chipkarten bekannt, in den Kartenkörper nachträglich eine Kavitat einzufräsen und ein Standard-Chipmodul mit einem aus herkömmlichem Glas-Epoxy-Ma- terial oder PET bestehenden Chipträger nachträglich in diese Kavitat einzusetzen und mit der Antenne zu verbinden. Da dieses herkömmliche Chipträgermaterial nicht oder nur schwer bedruckbar ist, wird dieses anschließend von einem gestanzten Kunststoffplättchen, beispielsweise aus PVC, abgedeckt, um das Bedrucken der gesamten Karte zu ermöglichen. Nachteilig ist hierbei, daß das Stanzen des Kunststoffabdeckplättchens und dessen nachträgliche Montage auf dem Chipmodul das Herstellverfahren in unerwünschter Weise verteuert.Furthermore, in the case of contactless chip cards, it is known to subsequently mill a cavity into the card body and to subsequently insert a standard chip module with a chip carrier consisting of conventional glass epoxy material or PET into this cavity and to connect it to the antenna. Since this conventional chip carrier material cannot be printed or can only be printed with difficulty, it is subsequently covered by a stamped plastic plate, for example made of PVC, in order to enable printing of the entire card. The disadvantage here is that the punching of the plastic cover plate and its subsequent mounting on the chip module makes the manufacturing process more expensive.
Der Erfindung liegt daher die Aufgabe zugrunde, ein Verfahren der eingangs genannten Art zu schaffen, mit dem auf möglichst einfache und kostengünstige Weise eine auch im Chipmodulbereich bedruckbare kontaktlose Chipkarte hergestellt werden kann. Außerdem soll auf eine möglichst einfache und kostengünstige Weise eine kontaktlose Chipkarte geschaffen werden, welche auch im Chipmodul-Bereich ein problemloses Bedrucken ermöglicht .The invention is therefore based on the object of providing a method of the type mentioned at the outset with which a contactless chip card which can also be printed in the chip module area can be produced in the simplest and most economical manner. In addition, a contactless chip card is to be created in the simplest and cheapest possible way, which also enables problem-free printing in the chip module area.
Diese Aufgabe wird erfindungsgemäß durch ein Verfahren gemäß Anspruch 1 bzw. eine Vorrichtung gemäß Anspruch 5 gelöst. Vorteilhafte Ausführungsformen der Erfindung sind in den weiteren Ansprüchen beschrieben. Gemäß dem erfindungsgemäßen Verfahren wird das Chipmodul vor dem Einsetzen in die Kavitat auf der dem Chip abgewandten Seite mit einer Beschichtung aus bedruckbarem Kunststoff versehen .This object is achieved according to the invention by a method according to claim 1 or an apparatus according to claim 5. Advantageous embodiments of the invention are described in the further claims. According to the method according to the invention, the chip module is provided with a coating of printable plastic on the side facing away from the chip before it is inserted into the cavity.
Im Gegensatz zur bekannten Technik, bei welcher die freiliegende Fläche des Chipmoduls erst nach dessen Einbau in die Kavitat des Kartenkörpers mit einem bedruckbaren Kunststoff- plättchen überdeckt wird, wird beim erfindungsgemäßen Verfah- ren bereits bei der Herstellung des Chipmoduls die später freiliegende Fläche kunststoffbeschichtet, so daß sie bedruckbar ist. Das nachträgliche Ausstanzen und Implementieren eines Kunststoffplättchens auf dem eingesetzten Chipmodul entfällt somit. Von Vorteil ist weiterhin, daß bestehende Im- plant.ing-Vorrichtungen, die üblicherweise für kontaktbehaftete Chipkarten verwendet werden, ohne Modifizierung oder Erweiterung auch für die Herstellung kontaktloser Chipkarten verwendet werden können.In contrast to the known technology, in which the exposed surface of the chip module is covered with a printable plastic plate only after it has been installed in the cavity of the card body, in the method according to the invention, the surface which is subsequently exposed is already plastic-coated during the manufacture of the chip module that it is printable. The subsequent punching out and implementation of a plastic plate on the chip module used is therefore eliminated. Another advantage is that existing implanting devices, which are usually used for contact-type chip cards, can also be used for the production of contactless chip cards without modification or extension.
Zweckmäßigerweise erfolgt das Beschichten mit Kunststoff als letzter Verfahrensschritt der Modulherstellung, da die bei den vorausgehenden Modulherstellungsschritten benötigten Temperaturen den Kunststoff qualitativ beeinträchtigen oder zerstören könnten.The coating with plastic is expediently carried out as the last method step of module production, since the temperatures required in the preceding module production steps could impair the quality of the plastic or destroy it.
Gemäß einer vorteilhaften Ausführungsform der Erfindung wird das Chipmodul aus einem Metallband in Leadframe-Technik hergestellt und die Kunststoffbesc ichtung auf das Metallband aufgebracht. Ein derartiges Metallband, welches als Chipträ- ger dient, kann auf sehr kostengünstige Weise hergestellt und beschichtet werden.According to an advantageous embodiment of the invention, the chip module is produced from a metal strip using leadframe technology and the plastic coating is applied to the metal strip. Such a metal strip, which serves as a chip carrier, can be produced and coated in a very cost-effective manner.
Vorteilhafterweise wird das Beschichtungsmaterial durch Schlitze im Chipträger hindurchgeführt und auf der gegenüber- liegenden Seite zu einer Niete geformt. Hierdurch ergibt sich ein zusätzlicher Formschluß durch die Hintergreifabschnitte der Niete, so daß die Beschichtung auf sehr sichere Weise auf dem Chipträger gehalten wird. Von Vorteil ist weiterhin, daß diese Nieten gleichzeitig verwendet werden können, um bei- spielsweise mittels einer Ultraschall- oder Hochfrequenzver- schweißung eine feste Verbindung mit dem übrigen Kartenkörper herbeizuführen, nachdem das Chipmodul in die Kavitat eingesetzt worden ist.The coating material is advantageously passed through slots in the chip carrier and formed into a rivet on the opposite side. This results in an additional form fit through the rear grip sections of the rivet, so that the coating is held on the chip carrier in a very secure manner. Another advantage is that these rivets can be used at the same time, for example by means of ultrasound or high-frequency welding, to establish a firm connection with the rest of the card body after the chip module has been inserted into the cavity.
Bei der erfindungsgemäßen Chipkarte weist das Chipmodul auf der dem Chip abgewandten Seite eine separate Beschichtung aus bedruckbaren Kunststoff auf, die vorteilhafterweise eine Stärke von 50 - 500 μm hat. Diese Beschichtung kann aus PVC oder ABS bestehen.In the chip card according to the invention, the chip module has a separate coating made of printable plastic on the side facing away from the chip, which advantageously has a thickness of 50-500 μm. This coating can be made of PVC or ABS.
Die Erfindung wird nachfolgend anhand der Zeichnungen beispielhaft näher erläutert. In diesen zeigen:The invention is explained in more detail below using the drawings as an example. In these show:
Figur 1 : eine schematische Schnittdarstellung der erfin- dungsgemäßen kontaktlosen Chipkarte vor dem Einsetzen des Chipmoduls in die Kavitat des Kartenkörpers , undFIG. 1: a schematic sectional illustration of the contactless chip card according to the invention before the chip module is inserted into the cavity of the card body, and
Figur 2 : eine geringfügig abgewandelte Ausfü rungsform der in Figur 1 gezeigten Chipkarte nach dem Einsetzen des Chipmoduls in die Kavitat des Kartenkörpers.FIG. 2 shows a slightly modified embodiment of the chip card shown in FIG. 1 after the chip module has been inserted into the cavity of the card body.
Aus den Figuren 1 und 2 ist ein Kartenkörper 1 ersichtlich, der eine mittlere Schicht 2 aufweist, welche als Spulenträger dient. Auf dieser mittleren Schicht 2 befindet sich eine als1 and 2 show a card body 1 which has a middle layer 2 which serves as a coil carrier. On this middle layer 2 there is an as
Antenne wirkende Spule 3, die im gezeigten Ausführungsbei- spiel vier Windungen aufweist und in zwei freie Spulenenden 4, 5 endet. Auf der mittleren Schicht 2 befindet sich eine weitere Kartenschicht 6 größerer Dicke, in welcher die Spule 3 vollständig eingebettet ist. Auf der unteren Seite der mittleren Schicht 2 ist weiterhin eine Bodenschicht 7 vorgesehen. Die Schichten 2, 6, 7, welche aus einem nichtleitenden Kunststoff bestehen, können aufgespritzt oder mittels einer Laminiertechnik miteinander verbunden werden.Antenna-acting coil 3, which has four windings in the exemplary embodiment shown and ends in two free coil ends 4, 5. On the middle layer 2 there is another card layer 6 of greater thickness, in which the coil 3 is fully embedded. A bottom layer 7 is also provided on the lower side of the middle layer 2. The layers 2, 6, 7, which consist of a non-conductive plastic, can be sprayed on or connected to one another by means of a laminating technique.
Bei der Herstellung des Kartenkörpers 1 liegen die mittlere Schicht 2 und die daraufliegende Schicht 6 zunächst in einem quaderförmigen Zustand vor. In diesen quaderförmigen Karten- körper 1 wird nachfolgend, wie aus der Herstellung kontaktbehafteter Chipkarten bekannt ist, eine Kavitat 8 von oben her eingebracht, z.B. eingefräst. Die Form und Größe dieser Kavitat 8 ist an ein Chipmodul 9 angepaßt, welches später in diese Kavitat 8 eingesetzt wird. Die Tiefe der Kavitat 8 ist im Bereich der Spulenenden 4, 5 derart bemessen, daß diese Spulenenden 4, 5 etwa zur Hälfte freigefräst werden, so daß freiliegende Spulenendenkontaktflachen geschaffen werden. Im Bereich zwischen den Spulenenden 4, 5 erstreckt sich die Kavitat 8 bis zur Bodenschicht 7 hinab.In the production of the card body 1, the middle layer 2 and the layer 6 lying thereon are initially in a cuboid state. In this cuboid card body 1, as is known from the manufacture of contact-type chip cards, a cavity 8 is subsequently introduced from above, e.g. milled in. The shape and size of this cavity 8 is adapted to a chip module 9 which is later inserted into this cavity 8. The depth of the cavity 8 is dimensioned in the region of the coil ends 4, 5 in such a way that these coil ends 4, 5 are roughly milled to half, so that exposed coil end contact surfaces are created. In the area between the coil ends 4, 5, the cavity 8 extends down to the bottom layer 7.
Das in die Kavitat 8 einzusetzende Chipmodul 9 besteht aus einem Chipträger 10, der aus einem Metallband ausgestanzt wird. Der Chipträger 10 weist einen Chipträgermittenabschnitt 11 auf, auf dessen Unterseite ein elektronischer Chip 12 be- festigt ist. Seitlich neben dem Chipträgermittenabschnitt 11 befinden sich Chipträgerseitenabschnitte 13 , welche vom Chipträgermittenabschnitt 11 beabstandet, d.h. isoliert, sind und als Anschlußkontaktflächen für den Chip 12 dienen. Nach dem Aufkleben des Chips 12 auf den Chipträgermittenabschnitt 12 werden zunächst Anschlußdrähtchen 14 des Chips 12 mit denThe chip module 9 to be inserted into the cavity 8 consists of a chip carrier 10 which is punched out of a metal strip. The chip carrier 10 has a chip carrier center section 11, on the underside of which an electronic chip 12 is fastened. To the side of the chip carrier center section 11 are chip carrier side sections 13 which are spaced apart from the chip carrier center section 11, i.e. are isolated, and serve as connection contact surfaces for the chip 12. After the chip 12 has been stuck onto the chip carrier center section 12, connecting wires 14 of the chip 12 are first connected to the
Chipträgerseitenabschnitten 13 verbunden, was als „wire bonding" bezeichnet wird. Danach wird eine Vergießmasse 15 aus Harz (globe top) auf derjenigen Seite des Chipträgers 11 aufgebracht, auf welcher sich der Chip 12 befindet, so daß die- ser zusammen mit den Anschlußdrähtchen 14 vollkommen einge- gössen wird. Dies dient zur zusätzlichen Fixierung und zumChip carrier side sections 13 connected, which is referred to as "wire bonding". Then a potting compound 15 made of resin (globe top) is applied to that side of the chip carrier 11 on which the chip 12 is located, so that the latter together with the connecting wires 14 completely confined will pour. This serves for additional fixation and
Schutz des Chips 12 und der Anschlußdrähtchen 14.Protection of the chip 12 and the connecting wires 14.
Nach dem Aufbringen der Vergießmasse 15 wird auf der gegen- überliegenden Seite des Chipträgers 10 eine Kunststoffbe- schichtung 16 aufgebracht, die aus einem zum Bedrucken geeigneten Kunststoffmaterial, beispielsweise PVC oder ABS, besteht. Um einen besonders guten Halt der Kunststoffbeschich- tung 16 auf dem Chipträger 10 zu erhalten, können in den Chipträgerseitenabschnitten 13 Schlitze oder Durchlässe 17 vorgesehen sein, durch welche das Kunststoffmaterial der Kunststoffbeschichtung 16 auf die gegenüberliegende Seite des Chipträgers 10 hindurchtritt. Das hindurchtretende Kunststoffmaterial wird derart geformt, daß Kunststoffnieten 18 ausgebildet werden, welche die Chipträgerseitenabschnitte 13 hintergreifen .After the potting compound 15 has been applied, a plastic coating 16 is applied to the opposite side of the chip carrier 10 and consists of a plastic material suitable for printing, for example PVC or ABS. In order to obtain a particularly good hold of the plastic coating 16 on the chip carrier 10, slots or passages 17 can be provided in the chip carrier side sections 13, through which the plastic material of the plastic coating 16 passes on the opposite side of the chip carrier 10. The plastic material passing through is shaped such that plastic rivets 18 are formed which engage behind the chip carrier side sections 13.
Die Kunststoffbeschichtung 16 wird erst dann auf den Chipträger 10 aufgebracht, wenn der Chip 12 und die Anschlußdräht- chen 14 auf den Chipträger 10 aufgesetzt und die Vergießmasse 15 aufgebracht ist. Dies erfolgt deshalb, da die bei diesen Herstellschritte verwendete Temperaturen die Kunststoffbeschichtung 16 in unerwünschter Weise verändern oder zerstören könnten .The plastic coating 16 is only applied to the chip carrier 10 when the chip 12 and the connecting wires 14 are placed on the chip carrier 10 and the casting compound 15 has been applied. This is because the temperatures used in these manufacturing steps could undesirably change or destroy the plastic coating 16.
Zweckmäßigerweise wird das Chipmodul 9 in Leadfra e- Technik hergestellt, d.h., daß viele nebeneinanderliegende Chipträger 10 in Form eines zusammenhängenden Metallstreifens vorliegen und entsprechend mit Chips 12 bestückt werden.The chip module 9 is expediently produced using lead-free technology, that is to say that many adjacent chip carriers 10 are in the form of a coherent metal strip and are accordingly equipped with chips 12.
Das derart hergestellte Chipmodul 9 wird anschließend in die Kavitat 8 des Kartenkörpers 1 eingesetzt, wie aus Figur 2 ersichtlich ist. Hierbei werden die Chipträgerseitenabschnitte 13, die als Kontaktanschluß- flächen für den Chip 12 dienen, mittels Lot oder Leitkleber 19 mit den freigefrästen Spulen- enden 4, 5 elektrisch leitend verbunden. Die KunststoffnietenThe chip module 9 produced in this way is then inserted into the cavity 8 of the card body 1, as can be seen from FIG. In this case, the chip carrier side sections 13, which serve as contact connection areas for the chip 12, are soldered or soldered with conductive adhesive 19 to the machined coil ends 4, 5 electrically connected. The plastic rivets
18 können mittels einer Ultraschall- oder Hochfrequenzver- schweißung mit dem Kartenkörper 1 verbunden werden. Alternativ ist es auch möglich, für diese Verbindung einen Kleber, beispielsweise Cyanacrylat, zu verwenden.18 can be connected to the card body 1 by means of ultrasound or high-frequency welding. Alternatively, it is also possible to use an adhesive, for example cyanoacrylate, for this connection.
Im fertig implantierten Zustand, der in Figur 2 gezeigt ist, fluchtet die Aussenfläche der Kunststoffbeschichtung 16 mit derjenigen des Kartenkörpers 1, so daß eine hindurchgehende, ebene Oberfläche geschaffen wird. Diese Oberfläche kann anschließend bedruckt werden, wie durch die Pfeile 20 angedeutet ist. In the fully implanted state, which is shown in Figure 2, the outer surface of the plastic coating 16 is flush with that of the card body 1, so that a continuous, flat surface is created. This surface can then be printed, as indicated by the arrows 20.

Claims

Patentansprüche claims
1. Verfahren zur Herstellung einer Chipkarte für kontaktlose Daten- und/oder Energieübertragung mit externen Geräten, wo- bei ein Chipmodul (9) geschaffen wird, indem ein elektronischer Chip (12) auf einem Chipträger (10) befestigt, der Chip (12) mit Anschlußkontakten des Chipträger (10) leitend verbunden und in eine Vergießmasse (15) eingegossen wird, worauf das Chipmodul (9) in eine Kavitat (8) eines aus ein oder meh- reren Schichten (2, 6, 1 ) bestehenden Kartenkörpers (1) eingesetzt und die Anschlußkontakte des Chipträgers (10) mit Spulenenden (4, 5) einer im Kartenkörper (1) integrierten, als Antenne wirkenden Spule (3) leitend verbunden werden, dadurch gekennzeichnet, daß das Chipmodul (9) vor dem Einsetzen in die Kavitat (8) auf der dem Chip (12) abgewandten Seite mit einer Beschichtung (16) aus bedruckbarem Kunststoff versehen wird.1. Method for producing a chip card for contactless data and / or energy transmission with external devices, whereby a chip module (9) is created by attaching an electronic chip (12) to a chip carrier (10), the chip (12) is connected in a conductive manner to connection contacts of the chip carrier (10) and poured into a potting compound (15), whereupon the chip module (9) into a cavity (8) of a card body (1.) consisting of one or more layers (2, 6, 1) ) and the connection contacts of the chip carrier (10) with coil ends (4, 5) of a coil (3) integrated in the card body (1) and acting as an antenna are conductively connected, characterized in that the chip module (9) before insertion into the Cavity (8) on the side facing away from the chip (12) is provided with a coating (16) made of printable plastic.
2. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß das Chipmodul (9) aus einem Metallband in Leadframe-Technik hergestellt und die Kunststoffbeschichtung (16) auf das Metallband aufgebracht wird.2. The method according to claim 1, characterized in that the chip module (9) made of a metal strip in lead frame technology and the plastic coating (16) is applied to the metal strip.
3. Verfahren nach Anspruch 1 oder 2, dadurch gekennzeichnet, daß das Beschichtungsmaterial durch Schlitze (17) im Chipträger (10) hindurchgeführt und auf der gegenüberliegenden Seite zu einer Niete (18) geformt wird.3. The method according to claim 1 or 2, characterized in that the coating material through slots (17) in the chip carrier (10) and is formed on the opposite side into a rivet (18).
4. Verfahren nach Anspruch 3, dadurch gekennzeichnet, daß das durch die Schlitze (17) hindurchgeführte Beschichtungsmaterial nach dem Einsetzen des Chipmoduls (9) in die Kavitat (8) mit dem Kartenkörper (1) verschweißt wird. 4. The method according to claim 3, characterized in that the coating material passed through the slots (17) after the insertion of the chip module (9) in the cavity (8) with the card body (1) is welded.
5. Chipkarte für kontaktlose Daten- und/oder Energieübertragung mit externen Geräten, bestehend aus einem ein oder mehrere Schichten (2, 6, 7) aufweisenden Kartenkörper (1), in dem eine als Antenne wirkende Spule (3) enthalten ist, und einem in die Kavität (8) des Kartenkörpers (1) eingesetzten Chipmodul (9), welches einen elektronischen Chip (12) mit einem integrierten Schaltkreis aufweist, der mit Anschlußkontakten eines Chipträgers (10) leitend verbunden ist, dadurch gekennzeichnet, daß das Chipmodul (9) auf der dem Chip (12) abgewandten Seite eine separate Beschichtung (16) aus bedruckbarem Kunststoff aufweist.5. Chip card for contactless data and / or energy transmission with external devices, consisting of one or more layers (2, 6, 7) having a card body (1), in which a coil (3) acting as an antenna is contained, and one Chip module (9) inserted into the cavity (8) of the card body (1), which has an electronic chip (12) with an integrated circuit that is conductively connected to terminal contacts of a chip carrier (10), characterized in that the chip module (9 ) on the side facing away from the chip (12) has a separate coating (16) made of printable plastic.
6. Chipkarte nach Anspruch 5, dadurch gekennzeichnet, daß die6. Chip card according to claim 5, characterized in that the
Beschichtung (16) eine Stärke von 50 - 500 μm hat.Coating (16) has a thickness of 50 - 500 microns.
7. Chipkarte nach Anspruch 5 oder 6, dadurch gekennzeichnet, daß die Beschichtung (16) aus PVC oder ABS besteht. 7. Chip card according to claim 5 or 6, characterized in that the coating (16) consists of PVC or ABS.
PCT/DE1998/002047 1997-07-29 1998-07-21 Method for producing a chip card for the contactless transmission of data and/or energy, and corresponding chip card WO1999006948A1 (en)

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DE1997132644 DE19732644C1 (en) 1997-07-29 1997-07-29 Production of non-contact smart cards with printed information
DE19732644.7 1997-07-29

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