JPH0888130A - Chip inductor - Google Patents
Chip inductorInfo
- Publication number
- JPH0888130A JPH0888130A JP7254450A JP25445095A JPH0888130A JP H0888130 A JPH0888130 A JP H0888130A JP 7254450 A JP7254450 A JP 7254450A JP 25445095 A JP25445095 A JP 25445095A JP H0888130 A JPH0888130 A JP H0888130A
- Authority
- JP
- Japan
- Prior art keywords
- winding
- contact element
- chip inductor
- core part
- welding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/10—Connecting leads to windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/06—Coil winding
- H01F41/076—Forming taps or terminals while winding, e.g. by wrapping or soldering the wire onto pins, or by directly forming terminals from the wire
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Coils Or Transformers For Communication (AREA)
- Coils Of Transformers For General Uses (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、強磁性又は非導電
性材料、特にフェライト、セラミック又はプラスチック
から成る中実のコア部分、1重又は多重に巻き付け可能
でコア部分の平行な端面部より引込んでいる巻間を有す
る、特に空隙コイル、リアクトル又は変成器のようなチ
ップインダクタに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solid core part made of a ferromagnetic or non-conductive material, in particular ferrite, ceramic or plastic, which can be wound in a single or multiple manner and which is drawn in from parallel end faces of the core part. In particular, it relates to chip inductors, such as air gap coils, reactors or transformers, with open windings.
【0002】[0002]
【従来の技術】このようなチップインダクタは欧州特許
出願公開第0177759号明細書から公知である。そ
こに記載されているコア部分は薄板状の接触素子を収容
するために予定されている凹部を端面部の範囲に有し、
接触素子に巻線が溶接される。2. Description of the Related Art Such a chip inductor is known from EP-A-0177759. The core part described therein has, in the area of the end face, a recess intended to accommodate a thin plate-shaped contact element,
The winding is welded to the contact element.
【0003】公知のチップインダクタの溶接は欧州特許
出願公開第0200014号明細書によれば超音波によ
り行われ、レジストにより絶縁された巻線が接触素子と
接続される。次いで電気接続部の機械的強度は溶接部位
を接着剤の滴下で覆うことにより高められる。この超音
波溶接法には従来銀製の表面被覆を有する接触素子だけ
が使用可能であるという難点がある。しかしこれはプラ
テンにおけるろう付けの際に硫化銀が形成されるため問
題を生じ、また更にろう浴中で銀が不所望に富化されか
ねない。一方接触素子が軟ろう製の被覆を有する場合に
は、超音波溶接では十分な電気接続部を形成することは
できない。それというのも錫又は錫/鉛の潤滑作用が使
用に耐える溶接接続部の形成を阻止するからである。The welding of known chip inductors is carried out ultrasonically according to EP-A-02001414, in which a winding insulated by a resist is connected to a contact element. The mechanical strength of the electrical connection is then increased by covering the welded site with a drop of adhesive. The disadvantage of this ultrasonic welding method is that only contact elements with a silver surface coating can be used. However, this creates problems because of the formation of silver sulfide during brazing in the platen, and can also lead to undesired enrichment of silver in the wax bath. On the other hand, if the contact element has a soft brazing coating, ultrasonic welding cannot form a sufficient electrical connection. This is because the lubricating action of tin or tin / lead prevents the formation of weld connections that are durable to use.
【0004】溶接範囲には銀表面をまたプラテンへのろ
う付け範囲には軟ろう製被覆を有する接触素子は、チッ
プインダクタに必要な狭い公差のために経済的に見合わ
ない経費をかけなければ製造は不可能である。Contact elements having a silver surface in the welding area and a soft brazing coating in the brazing area to the platen must be economically unprofitable due to the tight tolerances required for chip inductors. It is impossible to manufacture.
【0005】更に超音波溶接に要求される約0.5秒の
最短溶接時間は部材及び溶接電極を自動的に案内したと
しても約1秒のサイクル時間となる。Further, the minimum welding time of about 0.5 seconds required for ultrasonic welding is a cycle time of about 1 second even if the member and the welding electrode are automatically guided.
【0006】サイクル時間の短縮はドイツ連邦共和国特
許第4039527号明細書から公知の直接レーザ溶接
法で可能であろうが、この方法は接続すべき巻線をレー
ザ照射に対して遮蔽することなくまたシステムホルダな
しで行われる。しかしそこで提案されている方法を実施
するには新規の接着、溶接及び巻付け技術に関する広範
囲な研究開発が必要となる。A reduction in cycle time may be possible with the direct laser welding method known from DE 40 39 527 A1, but this method also does not shield the windings to be connected from laser irradiation. Done without system holder. However, the implementation of the method proposed therein requires extensive research and development on new bonding, welding and winding techniques.
【0007】更にドイツ連邦共和国特許出願公開第33
07773号明細書から接点ばねの間接レーザ溶接法が
公知であり、これは細い絶縁された巻線を直接のレーザ
照射に対して薄板により遮蔽するものであり(サンドイ
ッチ法)、その際薄板と巻始め箇所はデバイス上で異な
る部品である。つまり巻始め箇所の材料は遮蔽材でも溶
接材でもない。この方法の問題点はレーザ溶接の際に接
触素子及びコア、巻始め及び巻終わり素子とを有するシ
ステムホルダ並びに2枚の遮蔽薄板を位置決めするため
に必要となる大きな機械的経費にある。Further, German Patent Application Publication No. 33
From 077773, an indirect laser welding method for contact springs is known, which shields a thin insulated winding against direct laser irradiation by means of a thin plate (sandwich process), in which case the thin plate and the winding are wound. The starting point is a different part on the device. That is, the material at the winding start portion is neither a shielding material nor a welding material. The problem with this method lies in the large mechanical outlay required for positioning the system holder with the contact element and the core, the start and end elements and the two shielding lamellas during laser welding.
【0008】ドイツ連邦共和国特許出願公開第2946
626号明細書には間接的にレーザ溶接する他の方法が
記載されている。その場合例えばコイルの巻端である導
線は支持板又は印刷回路板の端子ピンに接触化される
が、その際端子ピンは支持板に含まれる打抜き加工され
た回路の部品として構成されるか又は印刷回路板の回路
内に溶接されている。しかしこの方法はSMT技術には
使用できない。それというのもコイルをプラテン上の端
子に公知の高出力自動実装装置で接触化することは不可
能であるからである。自動実装装置の組立性能を低下さ
せないためにSMTチップインダクタの場合コイルはデ
バイスの電気端子に接触化されなければならない。この
ドイツ連邦共和国特許出願公開第2946626号明細
書には含まれていないが、デバイス端子上に巻き付けら
れる端子ピンは、チップインダクタに求められる寸法が
小さいために、巻付けに要求される技術的課題のため
に、また自動巻付けにかかる付加的な費用のために実現
不可能である。Published German patent application No. 2946
No. 626 describes another method of indirectly laser welding. In that case, for example, the conductor wire, which is the winding end of the coil, is brought into contact with the terminal pins of the support plate or of the printed circuit board, the terminal pins being configured as parts of the stamped circuit contained in the support plate or It is welded into the circuit of the printed circuit board. However, this method cannot be used for SMT technology. This is because it is impossible to bring the coil into contact with the terminal on the platen by a known high-power automatic mounting device. In the case of the SMT chip inductor, the coil must be brought into contact with the electrical terminals of the device in order not to deteriorate the assembly performance of the automatic mounting apparatus. Although not included in the German Patent Publication No. 2946626, the terminal pin wound on the device terminal requires a small size for a chip inductor, and therefore, a technical problem required for winding. Due to the additional cost of automatic winding.
【0009】また欧州特許出願公開第0410211号
明細書から、燐を含有する硬ろうを使用しての耐熱性及
び耐高熱性のレジスト絶縁物を有する銅線を間接レーザ
溶接法で電気デバイスの端子素子と接続するろう付け溶
接法が公知である。この方法はSMTインダクタにはや
はり適していない。それというのもチップインダクタで
使用することのできるろう付け温度では硬ろうに必要と
される十分なぬれは生じないからである。従って溶接範
囲には硬ろうの表面を有し、またろう付け範囲には軟ろ
うの表面を有する電気端子が必要となろう。しかしチッ
プインダクタにとってこのような端子は銀及び軟ろうの
組み合せの表面を有するものと同様に殆ど使用できない
ものである。From EP-A-0410211, a copper wire having a heat-resistant and high-heat-resistant resist insulator using a hard solder containing phosphorus is indirect laser welded to a terminal of an electric device. Brazing welding methods for connecting elements are known. This method is still not suitable for SMT inductors. This is because the brazing temperatures that can be used in chip inductors do not result in the sufficient wetting required for hard solder. Therefore, an electrical terminal with a hard solder surface in the welding area and a soft solder surface in the brazing area would be required. However, for chip inductors such terminals are almost unusable, as are those having a combination silver and soft solder surface.
【0010】[0010]
【発明が解決しようとする課題】本発明の課題は、その
巻線端部が接触素子に溶接されており、1秒以下のサイ
クル時間で自動的な実装が可能の冒頭に記載した形式の
チップインダクタを提供することにある。SUMMARY OF THE INVENTION The object of the invention is to provide a chip of the type mentioned at the beginning, whose winding ends are welded to the contact element and which can be mounted automatically with a cycle time of less than 1 second. It is to provide an inductor.
【0011】[0011]
【課題を解決するための手段】この課題は本発明によ
り、巻線端部が間接レーザ溶接により接触素子に固定さ
れ、接触素子が軟ろうから成る被覆を有し、また接触素
子が巻始めと巻終わり箇所として設置される凹部を有
し、同時に間接レーザ溶接の際に遮蔽材及び溶接材とし
て使用されることにより解決される。SUMMARY OF THE INVENTION According to the invention, the object of the invention is that the winding ends are fixed to the contact element by indirect laser welding, the contact element having a coating made of soft solder, and It is solved by having a concave portion installed as a winding end portion, and at the same time used as a shielding material and a welding material in indirect laser welding.
【0012】[0012]
【実施例】本発明を実施例及び図面に基づき以下に詳述
する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail below with reference to embodiments and drawings.
【0013】図1〜3には巻間5を有する中実のコア部
分4が示されている。巻間5内には有利には高温耐性の
レジスト絶縁物を有する銅線からなるチップインダクタ
の巻線6が配置されている。システムホルダ1の一部で
ある接触素子2はコア部分4の端面部8に固定され、有
利には貼付けられている。例えばCuSn6から成るシ
ステムホルダ1は軟ろう、有利には錫又は錫−鉛合金か
ら成る表面被覆を有する。1-3, a solid core portion 4 having a winding gap 5 is shown. In the winding space 5 there is arranged a winding 6 of a chip inductor, which is preferably made of copper wire with a high temperature resistant resist insulation. The contact element 2, which is part of the system holder 1, is fixed to the end face 8 of the core part 4 and is preferably attached. The system holder 1 made of CuSn 6, for example, has a surface coating made of soft solder, preferably tin or a tin-lead alloy.
【0014】接触素子2は凹部7を有し、これが補助的
に巻線6の端部9の巻始め及び巻終わり箇所となる。更
に接触素子2は間接レーザ溶接の際に遮蔽材にも溶接材
にも用いられるように形成されている。特に図3に見ら
れるように巻線6の端部9は接触素子2内を案内され、
凹部7の範囲で接触素子2に接する部分の間にサンドイ
ッチ状に通される。この範囲内に溶接箇所10が作られ
る。The contact element 2 has a recess 7, which additionally serves as the winding start and winding end points of the end 9 of the winding 6. Furthermore, the contact element 2 is designed to be used both as a shielding material and as a welding material during indirect laser welding. As can be seen in particular in FIG. 3, the end 9 of the winding 6 is guided in the contact element 2,
In the region of the recess 7, a sandwich is passed between the parts which contact the contact element 2. The welding spot 10 is formed within this range.
【0015】更に接触素子2はコア部分4の三次元的な
位置決めがシステムホルダ1内で引続き得られるように
スリット3を有するが、接触素子2はこのスリット3で
中断されている。Furthermore, the contact element 2 has a slit 3 so that the three-dimensional positioning of the core part 4 can still be obtained in the system holder 1, but the contact element 2 is interrupted by this slit 3.
【0016】システムホルダ1を有するチップインダク
タの完成はデバイス上の巻始め及び巻終わりピンの巻き
付けを回避する。同時に遮蔽材及び溶接材として使用さ
れる接触素子2によるサンドイッチ法は別個の遮蔽薄板
を必要とする位置決めのための経費を不要とする。スリ
ット3及び凹部7を有する接触素子2は短絡巻線の役目
をする凹部で中断されない接触素子に比べてチップイン
ダクタとしての高い性能を示す。Completion of the chip inductor with the system holder 1 avoids winding start and end pins on the device. The sandwich method with the contact element 2 used at the same time as a shield and a welding material eliminates the expense of positioning, which requires a separate shield lamella. The contact element 2 having the slit 3 and the recess 7 exhibits higher performance as a chip inductor than a contact element which is not interrupted by the recess serving as a short-circuit winding.
【0017】軟ろうからなる接触素子2の表面は今日使
用者により標準技術として求められているものであり、
また溶接接合はろう付け接合よりも堅牢であり、耐熱性
又は耐高熱性レジスト絶縁物を有する巻線によりデバイ
スを125℃以上の温度で使用することを可能にする。
更にドイツ連邦共和国特許出願公開第4023141号
明細書に記載されているように高温の熱可塑性物質を噴
射塗布することを可能にする。またレーザ溶接はm秒程
度の溶接時間を必要とするに過ぎず、従って経費上必要
とされる1秒以下のサイクル時間を可能にする。The surface of the contact element 2 made of soft solder is what is demanded by the user as a standard technique today.
Also, welded joints are more robust than brazed joints, and windings with heat or high heat resistant resist insulation allow the device to be used at temperatures above 125 ° C.
It also makes it possible to spray-apply high temperature thermoplastics as described in DE-A-4023141. Also, laser welding requires welding times on the order of milliseconds only, thus enabling cost-required cycle times of less than 1 second.
【図1】本発明によるチップインダクタの側面図。FIG. 1 is a side view of a chip inductor according to the present invention.
【図2】本発明によるチップインダクタの平面図。FIG. 2 is a plan view of a chip inductor according to the present invention.
【図3】本発明によるチップインダクタの端面拡大図。FIG. 3 is an enlarged end view of the chip inductor according to the present invention.
1 システムホルダ 2 接触素子 3 スリット 4 コア部分 5 巻間 6 巻線 7 凹部 8 端面部 9 巻線端部 10 溶接箇所 1 System Holder 2 Contact Element 3 Slit 4 Core Part 5 Winding 6 Winding 7 Recess 8 End Face 9 Winding End 10 Welding Point
───────────────────────────────────────────────────── フロントページの続き (71)出願人 390041508 シーメンス、マツシタ、コンポーネンツ、 ゲゼルシヤフト、ミツト、ベシユレンクテ ル、ハフツング、ウント、コンパニ、コマ ンデイート、ゲゼルシヤフト SIEMENS MATSUSHITA COMPONENTS GESELLSC HAFT MIT BESCHRANKT ER HAFTUNG & COMPAN Y KOMMANDITGESELLSC HAFT ドイツ連邦共和国ミユンヘン (番地な し) (72)発明者 ウイルフリート シエラー ドイツ連邦共和国 89522 ハイデンハイ ム デゲンハルトシユトラーセ 26 (72)発明者 マンフレート エスペンハイン ドイツ連邦共和国 89522 ハイデンハイ ム ラントシユトラーセ 6 (72)発明者 ハンス‐デイーター エカルト ドイツ連邦共和国 89542 ヘルブレヒチ ンゲン ウイーデンウイーゼン 26 (72)発明者 ウインフリート グラウエル ドイツ連邦共和国 73430 アーレン フ ランツ‐シユーベルト‐シユトラーセ 6 (72)発明者 ウヴエ ヒルデブラント ドイツ連邦共和国 81737 ミユンヘン フアザンガルテンシユトラーセ 1アー (72)発明者 ラルフ フムケ ドイツ連邦共和国 13089 ベルリン チ ニウスシユトラーセ 55 (72)発明者 ロタール ホツク ドイツ連邦共和国 12307 ベルリン イ リツヒシユトラーセ 17アー ─────────────────────────────────────────────────── ─── Continuation of the front page (71) Applicant 390041508 Siemens, Matsushita, Components, Gezelshyaft, Mitt, Besilyenktel, Haftung, und, Companion, Comandate, Geselsyaft Siefelt Science Sights, Things, Things, and Things, Things, Things Federal Republic of Germany Miyunchen (no street number) (72) Inventor Wilfried Schieler, Federal Republic of Germany 89522 Heidenheim Degenhardt Siyutrase 26 (72) Inventor Manfred Espenhain, Federal Republic of Germany 89522 Heidenheim Landshuttraße 6 (72) Inventor Hans-Dieeter Eckart, Germany 89542 Helbrechtingen Wiedenwiesen 26 (72) Inventor Winfried Glauer, Germany 73430 Aalen Franz-Schubert-Schutrasse 6 (72) ) Inventor Uwe Hildebrand Germany 81737 Miyunchen Huazangarten Schutler 1 Ar (72) Inventor Ralph Fumke Germany 13089 Berlin Chinius Schutler 55 (72) Inventor Rothal Hock Germany 12307 Berlin I Ritsuhishi Yutrase 17
Claims (7)
ト、セラミック又はプラスチックから成る中実のコア部
分、1重又は多重に巻き付け可能で、コア部分の平行な
端面部(8)より引込んでいる巻間を有する特に空隙コ
イル、リアクトル又は変成器のようなチップインダクタ
において、巻線端部(9)が間接レーザ溶接により接触
素子(2)に固定されており、この接触素子(2)が軟
ろう製被覆を有しており、また接触素子(2)が巻始め
及び巻終わり箇所として設置される凹部(7)を有し、
同時に間接レーザ溶接の際に遮蔽材及び溶接材として用
いられていることを特徴とするチップインダクタ。1. A solid core part made of a ferromagnetic or non-conductive material, in particular ferrite, ceramic or plastic, which can be wound in single or multiple folds and which is retracted from the parallel end faces (8) of the core part. In a chip inductor such as a gap coil, a reactor or a transformer having a winding gap, the winding end (9) is fixed to the contact element (2) by indirect laser welding, and the contact element (2) is softened. Has a brazing coating and also has recesses (7) in which the contact elements (2) are provided as winding start and winding end points,
At the same time, the chip inductor is used as a shielding material and a welding material during indirect laser welding.
特徴とする請求項1記載のチップインダクタ。2. The chip inductor according to claim 1, wherein the coating is made of tin or a tin / lead alloy.
として形成されていることを特徴とする請求項1又は2
記載のチップインダクタ。3. The contact element (2) comprises a system holder (1).
3. The structure according to claim 1 or 2, characterized in that
The listed chip inductor.
次元的な位置決めをシステムホルダ(1)内で引続き得
られるようにスリット(3)を有しており、接触素子
(2)がスリット(3)で中断されていることを特徴と
する請求項1ないし3の1つに記載のチップインダク
タ。4. The contact element (2) has a slit (3) so that a three-dimensional positioning of the core part (4) can still be obtained in the system holder (1), the contact element (2) ) Is interrupted by a slit (3).
部(8)に接着剤により固定されていることを特徴とす
る請求項1ないし4の1つに記載のチップインダクタ。5. Chip inductor according to claim 1, characterized in that the contact element (2) is fixed to the end face (8) of the core part (4) by means of an adhesive.
CuSn6からなることを特徴とする請求項1ないし5
の1つに記載のチップインダクタ。6. The contact element (2) with a soft brazing coating consists of CuSn 6.
The chip inductor according to any one of 1.
ジスト線からなることを特徴とする請求項1ないし6の
1つに記載のチップインダクタ。7. Chip inductor according to claim 1, characterized in that the winding (6) is preferably made of high temperature resistant copper resist wire.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4432740A DE4432740A1 (en) | 1994-09-14 | 1994-09-14 | Chip inductance |
DE4432740.4 | 1994-09-14 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0888130A true JPH0888130A (en) | 1996-04-02 |
JP3961036B2 JP3961036B2 (en) | 2007-08-15 |
Family
ID=6528209
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP25445095A Expired - Lifetime JP3961036B2 (en) | 1994-09-14 | 1995-09-07 | Chip inductor |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0702378B1 (en) |
JP (1) | JP3961036B2 (en) |
DE (2) | DE4432740A1 (en) |
FI (1) | FI954320A (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19710462C2 (en) * | 1997-03-13 | 1999-05-20 | Siemens Matsushita Components | Electrical component, in particular chip inductance |
DE19713147C2 (en) * | 1997-03-27 | 1999-09-09 | Siemens Matsushita Components | Chip inductance |
DE202005019497U1 (en) * | 2005-12-14 | 2007-04-26 | Neosid Pemetzrieder Gmbh & Co Kg | Inductive miniature component for SMD assembly, has entrance opening in connection flange extending in direction from upper to lower face of component |
DE202005019496U1 (en) * | 2005-12-14 | 2007-04-26 | Neosid Pemetzrieder Gmbh & Co Kg | Inductive miniature component e.g., for SMD assemblies, has entrance aperture extending to transverse bars normal to the plane of frame |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1596509A (en) * | 1968-07-18 | 1970-06-22 | ||
DE2636674A1 (en) * | 1976-08-14 | 1978-02-16 | Bosch Gmbh Robert | Wire terminal element connection prodn. - by placing wires parallel on bulge on terminal element, fusing and tamping |
DE2946626C2 (en) * | 1979-11-19 | 1982-04-08 | Telefonbau Und Normalzeit Gmbh, 6000 Frankfurt | Method for contacting thin electrical conductors |
JPS57114207A (en) * | 1981-01-08 | 1982-07-16 | Toshiba Corp | Electromagnetic coil and manufacture thereof |
JPS57132306A (en) * | 1981-02-10 | 1982-08-16 | Toshiba Corp | Electromagnetic coil and manufacture therefor |
JPS57153419A (en) * | 1981-03-18 | 1982-09-22 | Toshiba Corp | Laser welding method |
DE3307773A1 (en) | 1983-03-04 | 1984-09-06 | Siemens AG, 1000 Berlin und 8000 München | Method for laser-welding thin wires and films |
US4704592A (en) | 1984-09-13 | 1987-11-03 | Siemens Aktiengesellschaft | Chip inductor electronic component |
DE3513435A1 (en) | 1985-04-15 | 1986-10-16 | Siemens AG, 1000 Berlin und 8000 München | METHOD FOR Tear-proof Contacting of Lacquer-Insulated Wires, ESPECIALLY FOR USE ON ELECTRONIC COMPONENTS |
DE8620265U1 (en) * | 1986-07-29 | 1986-11-20 | Weiner, Rene, 5275 Bergneustadt, De | |
EP0410211A1 (en) | 1989-07-28 | 1991-01-30 | Siemens Aktiengesellschaft | Process for producing an electrically conductive connection between enamelled copper wires and terminals |
DE9017912U1 (en) * | 1990-07-20 | 1993-04-01 | Siemens Matsushita Components Gmbh & Co. Kg, 8000 Muenchen, De | |
DE4039527C1 (en) | 1990-12-11 | 1992-06-25 | Siemens Matsushita Components Gmbh & Co. Kg, 8000 Muenchen, De | |
JPH04369811A (en) * | 1991-04-05 | 1992-12-22 | Matsushita Electric Works Ltd | Coil-end treating method |
DE4139437A1 (en) * | 1991-11-29 | 1993-06-03 | Siemens Ag | METHOD FOR PRODUCING ADHESIVE CONNECTIONS BETWEEN WINDING BODIES FOR ELECTRICAL COMPONENTS AND THEIR CONNECTING WIRE |
-
1994
- 1994-09-14 DE DE4432740A patent/DE4432740A1/en not_active Withdrawn
-
1995
- 1995-09-07 JP JP25445095A patent/JP3961036B2/en not_active Expired - Lifetime
- 1995-09-13 DE DE59510936T patent/DE59510936D1/en not_active Expired - Lifetime
- 1995-09-13 EP EP95114392A patent/EP0702378B1/en not_active Expired - Lifetime
- 1995-09-14 FI FI954320A patent/FI954320A/en unknown
Also Published As
Publication number | Publication date |
---|---|
FI954320A (en) | 1996-03-15 |
EP0702378A3 (en) | 1996-04-24 |
EP0702378A2 (en) | 1996-03-20 |
EP0702378B1 (en) | 2004-08-18 |
JP3961036B2 (en) | 2007-08-15 |
DE59510936D1 (en) | 2004-09-23 |
DE4432740A1 (en) | 1996-03-21 |
FI954320A0 (en) | 1995-09-14 |
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