EP0702378B1 - Chip inductor - Google Patents
Chip inductor Download PDFInfo
- Publication number
- EP0702378B1 EP0702378B1 EP95114392A EP95114392A EP0702378B1 EP 0702378 B1 EP0702378 B1 EP 0702378B1 EP 95114392 A EP95114392 A EP 95114392A EP 95114392 A EP95114392 A EP 95114392A EP 0702378 B1 EP0702378 B1 EP 0702378B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- contact elements
- chip inductor
- winding
- inductor according
- core part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/10—Connecting leads to windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/06—Coil winding
- H01F41/076—Forming taps or terminals while winding, e.g. by wrapping or soldering the wire onto pins, or by directly forming terminals from the wire
Definitions
- the invention relates to a chip inductance, in particular Air coil, choke or transformer, with a solid core made of ferromagnetic or electrically non-conductive Material, especially ferrite, ceramic or plastic, with one can be wound in one or more layers and in parallel Front ends of the core part of the changing room, at of the winding ends with contact elements arranged on the end face are welded.
- Such a chip inductance is known from EP-0177759-B1 known.
- the core part has in the area of the front ends arranged recesses for receiving platelet-shaped Contact elements are determined to which the winding wires be welded on.
- the one required for ultrasonic welding leads minimum welding time of approx. 0.5 s even with automatic Feeding of component and welding sonotrodes at cycle times of approx. 1 s.
- DE-3307773-A1 also describes an indirect method Laser welding of contact springs is known in the thin insulated winding wires by a plate against the direct Shielding laser radiation (sandwich technology), where the plate and the winding point on the component are different Parts are.
- the material of the winding point is so neither shielding nor welding material.
- DE-2946626-A1 describes another indirect method Laser welding described. Thereby, lead wires that e.g. are the winding ends of a coil to the connector pins contacted a carrier or printed circuit board, the connecting pins Parts of one contained in the carrier plate punched circuit or in the circuit of a circuit board are welded in.
- this process is in SMT technology not applicable because the contacting of windings to connections on a board with the known High performance placement machines is not possible.
- the winding on the electrical Connections of the component can be contacted.
- the in the DE-2946626-A1 not included, to be wrapped pins on the component connections are due to the required small dimensions for chip inductors because of technical requirements for winding and because of the cost of the associated winding machines cannot be realized.
- the object of the present invention is a chip inductance of the type mentioned at the beginning, the winding ends are welded to the contact elements, and with Cycle times under 1s can be produced in automated production are.
- the contact elements are attached that the contact elements have a coating of a solder metal, and are designed such that they can be used both as shielding and as Welding material used in indirect laser welding and that Contact elements (2) have a recess (7) which as The winding and unwinding point is designed.
- the 1 to 3 is a solid core part 4 with a Changing room 5 shown.
- the winding 6 is in the winding space 5 the chip inductance arranged, which preferably consists of a There is copper wire with high temperature resistant enamel insulation.
- Contact elements 2, which are part of a system carrier 1, are attached to the end faces 8 of the core part 4, preferably glued.
- the system carrier 1, for example made of CuSn6 consists of a surface coating of a solder metal, preferably tin or a tin-lead alloy.
- the contact elements have a recess 7, which in addition as the winding and unwinding point of the ends 9 of the winding 6 serves. Furthermore, the contact elements 2 are designed such that they are used as both shielding and welding material serve indirect laser welding. How especially out 3 shows the ends 9 of the winding 6 guided in the contact element 2 that they in the area of Recess 7 sandwiched between the contact elements 2 arranged parts come to rest. In this area the weld 10 attached.
- the contact elements 2 have one Slot 3 on that the three-dimensional positioning of the Core part 4 is retained in the system carrier 1, but the Contact elements 2 in the slot 3 are interrupted.
- chip inductors with system carrier 1 avoids the wrapping of winding and unwinding pins on the Component.
- Sandwich technology with contact elements 2, which serve as shielding and welding material at the same time, avoids the positioning effort for separate shielding plates.
- the contact elements 2 with slot 3 and recess 7 result in higher quality values for the chip inductance in comparison to uninterrupted contact elements with cutouts, which act as short-circuit winding.
- the surface of the contact elements 2 made of solder is today required by the user as state of the art, and the Welded joint is stronger than a soldered joint and allows the use of winding wires with warm or highly heat-resistant paint insulation for the use of components Temperatures> 125 ° C. It is also encapsulated with high-temperature thermoplastics possible, as in DE-4023141-A1 is described. After all, laser welding only needs Welding times in the order of ms and enables thus cycle times under 1s, which are necessary for cost reasons are.
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Coils Or Transformers For Communication (AREA)
- Coils Of Transformers For General Uses (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
Description
Die Erfindung betrifft eine Chip-Induktivität, insbesondere Luftspule, Drossel oder Übertrager, mit einem massiven Kernteil aus ferromagnetischem oder elektrisch nicht leitendem Werkstoff, insbesondere Ferrit, Keramik oder Kunststoff, mit einem ein- oder mehrlagig bewickelbaren und gegenüber parallelen Stirnenden des Kernteils abgesetzten Wickelraum, bei der die Wicklungsenden mit stirnseitig angeordneten Kontaktelementen verschweißt sind.The invention relates to a chip inductance, in particular Air coil, choke or transformer, with a solid core made of ferromagnetic or electrically non-conductive Material, especially ferrite, ceramic or plastic, with one can be wound in one or more layers and in parallel Front ends of the core part of the changing room, at of the winding ends with contact elements arranged on the end face are welded.
Eine derartige Chip-Induktivität ist aus der EP-0177759-B1 bekannt. Dort besitzt das Kernteil im Bereich der Stirnenden angeordnete Aussparungen, die zur Aufnahme von plättchenförmigen Kontaktelementen bestimmt sind, an die die Wicklungsdrähte angeschweißt werden.Such a chip inductance is known from EP-0177759-B1 known. There the core part has in the area of the front ends arranged recesses for receiving platelet-shaped Contact elements are determined to which the winding wires be welded on.
Das Anschweißen bei den bekannten Chip-Induktivitäten geschieht nach der EP-0200014-A1 mittels Ultraschallschweißung bei der lackisolierte Wicklungsdrähte mit den Kontaktelementen verbunden werden. Die mechanische Festigkeit der elektrischen Verbindung wird anschließend durch Abdecken der Schweißstelle mit einem Klebertropfen erhöht. Bei diesem Ultraschall-Schweißverfahren besteht die Schwierigkeit, daß bisher nur Kontaktelemente verwendet werden konnten, die einen Oberflächenüberzug aus Silber besitzen. Dies kann aber beim Verlöten in einer Platine wegen der Bildung von Silbersulfid zu Problemen führen und außerdem kann sich im Lötbad Silber anreichern, was nicht erwünscht ist. Wenn die Kontaktelemente dagegen einen Überzug aus einem Lötmetall besitzen, kommt keine ausreichende elektrische Verbindung beim Ultraschallschweißen zustande, da die Schmierwirkung von Zinn bzw. Zinn/Blei die Ausbildung von brauchbaren Schweißverbindungen verhindert. The welding in the known chip inductors takes place according to EP-0200014-A1 by means of ultrasonic welding in the case of enamelled winding wires with the contact elements get connected. The mechanical strength of the electrical The connection is then covered by covering the Increased weld with a drop of glue. With this Ultrasonic welding processes have the difficulty that previously only contact elements could be used that have a silver surface coating. But this can when soldering in a circuit board due to the formation of silver sulfide lead to problems and can also in the solder bath Enrich silver, which is not desirable. If the contact elements on the other hand have a coating of a solder metal, there is no adequate electrical connection during ultrasonic welding occurs because the lubricating effect of tin or Tin / lead the formation of usable welded joints prevented.
Kontaktelemente, die in den Schweißbereichen eine Silberoberfläche und in den Lötbereichen zum Auflöten auf die Platine einen Überzug aus Lötmetall besitzen, können wegen der für Chip-Induktivitäten benötigten engen Toleranzen nur mit wirtschaftlich nicht vertretbarem Aufwand hergestellt werden.Contact elements that have a silver surface in the welding areas and in the soldering areas for soldering onto the board have a coating of solder, because of the for Chip inductors only need tight tolerances economically unreasonable effort.
Ferner führt die beim Ultraschallschweißen erforderliche minimale Schweißzeit von ca. 0,5 s auch bei automatischer Zuführung von Bauteil und Schweißsonotroden zu Zykluszeiten von ca. 1 s.Furthermore, the one required for ultrasonic welding leads minimum welding time of approx. 0.5 s even with automatic Feeding of component and welding sonotrodes at cycle times of approx. 1 s.
Eine Verkürzung der Zykluszeiten wäre an und für sich mit dem aus der DE-4039527-C1 bekannten direkten Laserschweißen möglich, das ohne Abschirmung des zu kontaktierenden Wickeldrahts gegen die Laserbestrahlung und ohne Systemträger arbeitet, jedoch setzt das dort vorgeschlagene Verfahren umfangreiche Entwicklungsarbeiten für neue Klebe-, Schweißund Wickeltechnologie voraus.A shortening of the cycle times would be in itself with the direct laser welding known from DE-4039527-C1 possible, without shielding the winding wire to be contacted against laser radiation and without system support works, but the procedure proposed there sets extensive development work for new adhesive, welding and Wrapping technology ahead.
Weiter ist aus der DE-3307773-A1 ein Verfahren zum indirekten Laserschweißen von Kontaktfedern bekannt, bei dem dünne isolierte Wickeldrähte durch ein Plättchen gegen die direkte Laserbestrahlung abgeschirmt werden (Sandwich-Technologie), wobei Plättchen und Anwickelstelle auf dem Bauelement verschiedene Teile sind. Das Material der Anwickelstelle ist also weder Abschirm- noch Schweißmaterial. Schwierigkeiten bereitet bei diesem Verfahren der große maschinelle Aufwand, der erforderlich ist, um beim Laserschweißen den Systemträger mit Kontaktelementen und Kern, An- und Abwickelelemente und zusätzlich die beiden Abschirmplättchen zu positionieren.DE-3307773-A1 also describes an indirect method Laser welding of contact springs is known in the thin insulated winding wires by a plate against the direct Shielding laser radiation (sandwich technology), where the plate and the winding point on the component are different Parts are. The material of the winding point is so neither shielding nor welding material. trouble The great mechanical effort involved in this process which is required to support the leadframe during laser welding with contact elements and core, winding and unwinding elements and additionally position the two shielding plates.
In der DE-2946626-A1 ist ein anderes Verfahren zum indirekten Laserschweißen beschrieben. Dabei werden Leitungsdrähte, die z.B. die Wickelenden einer Spule sind, an die Anschlußstifte einer Träger- oder Leiterplatte kontaktiert, wobei die Anschlußstifte Teile einer in der Trägerplatte enthaltenen gestanzten Schaltung oder in die Schaltung einer Leiterplatte eingeschweißt sind. Dieses verfahren ist jedoch in der SMT-Technologie nicht anwendbar, da das Kontaktieren von Wicklungen an Anschlüsse auf einer Platine mit den bekannten Hochleistungsbestückautomaten nicht möglich ist. Um die Montageleistung der Bestückaotomaten nicht zu reduzieren, muß bei SMT-(Chip-)Induktivitäten die Wicklung an die elektrischen Anschlüsse des Bauelements kontaktiert sein. Die in der DE-2946626-A1 nicht enthaltenen, zu umwickelnden Anschlußstifte auf den Bauelementeanschlüssen sind wegen der geforderten kleinen Abmessungen bei Chip-Induktivitäten wegen der technischen Anforderungen beim Wickeln und wegen der Kosten der zugehörigen Wickelautomaten nicht realisierbar.DE-2946626-A1 describes another indirect method Laser welding described. Thereby, lead wires that e.g. are the winding ends of a coil to the connector pins contacted a carrier or printed circuit board, the connecting pins Parts of one contained in the carrier plate punched circuit or in the circuit of a circuit board are welded in. However, this process is in SMT technology not applicable because the contacting of windings to connections on a board with the known High performance placement machines is not possible. To the Not to reduce assembly performance of the placement machines for SMT (chip) inductors, the winding on the electrical Connections of the component can be contacted. The in the DE-2946626-A1 not included, to be wrapped pins on the component connections are due to the required small dimensions for chip inductors because of technical requirements for winding and because of the cost of the associated winding machines cannot be realized.
Schließlich ist aus der EP-0410211-A1 eine Schweißlötung bekannt, bei der Kupferdrähte mit warm- oder hochwarmfester Lackisolation bei Einsatz von phosphorhaltigem Hartlot in indirektem Laserschweißverfahren mit den Anschlußelementen von elektrischen Bauelementen verbunden werden. Dieses Verfahren ist für SMT-Induktivitäten ebenfalls nicht geeignet, da bei den Löttemperaturen, die bei Chip-Induktivitäten angewandt werden können mit dem erforderlichen Hartlot keine ausreichende Benetzung stattfindet. Erforderlich wären deshalb elektrische Anschlüsse mit Hartlot in den Schweißbereichen und mit Weichlotoberflächen in den Lötbereichen. Derartige Anschlüsse für Chip-Induktivitäten sind ebensowenig verfügbar wie solche mit einer Oberflächenkombination Silber und Lötmetall.Finally, welding soldering is known from EP-0410211-A1, for copper wires with heat or high temperature resistant Paint insulation when using phosphorus-containing hard solder in indirect laser welding process with the connection elements be connected by electrical components. This method is also not suitable for SMT inductors, because at the soldering temperatures that with chip inductors none can be used with the required brazing alloy sufficient wetting takes place. That would be necessary electrical connections with hard solder in the welding areas and with soft solder surfaces in the soldering areas. such Connections for chip inductors are just as little available like those with a silver surface combination and solder.
Aufgabe der vorliegenden Erfindung ist es, eine Chip-Induktivität der eingangs genannten Art anzugeben, deren Wicklungsenden an die Kontaktelemente angeschweißt sind, und die mit Zykluszeiten unter 1s in automatisierter Fertigung herstellbar sind.The object of the present invention is a chip inductance of the type mentioned at the beginning, the winding ends are welded to the contact elements, and with Cycle times under 1s can be produced in automated production are.
Diese Aufgabe wird erfindungsgemäß dadurch gelöst, daß die Wicklungsenden mittels einer indirekten Laserschweißung an den Kontaktelementen befestigt sind, daß die Kontaktelemente einen Überzug aus einem Lotmetall besitzen, und derart ausgebildet sind, daß sie sowohl als Abschirm- als auch als Schweißmaterial bei der indirekten Laserschweißung dienen und daß die Kontaktelemente (2) eine Aussparung (7) aufweisen, die als An- und Abwickelstelle ausgelegt ist.This object is achieved in that the Winding ends by means of indirect laser welding the contact elements are attached that the contact elements have a coating of a solder metal, and are designed such that they can be used both as shielding and as Welding material used in indirect laser welding and that Contact elements (2) have a recess (7) which as The winding and unwinding point is designed.
Vorteilhafte Ausgestaltungen des Gegenstandes der Erfindung sind in den Unteransprüchen angeführt.Advantageous refinements of the subject matter of the invention are set out in the subclaims.
Die Erfindung wird im folgenden anhand von Ausführungsbeispielen erläutert.The invention is described below using exemplary embodiments explained.
In der dazugehörenden Zeichnung zeigen:
In den Fig. 1 bis 3 ist ein massives Kernteil 4 mit einem
Wickelraum 5 dargestellt. Im Wickelraum 5 ist die Wicklung 6
der Chip-Induktivität angeordnet, die vorzugsweise aus einem
Kupferdraht mit hochtemperaturfester Lackisolation besteht.
Kontaktelemente 2, die Teil eines Systemträgers 1 sind, sind
an den Stirnseiten 8 des Kernteils 4 befestigt, vorzugsweise
angeklebt. Der Systemträger 1, der beispielsweise aus CuSn6
besteht, weist einen Oberflächenüberzug aus einem Lotmetall,
vorzugsweise Zinn oder eine Zinn-Blei-Legierung, auf.1 to 3 is a
Die Kontaktelemente weisen eine Aussparung 7 auf, die zusätzlich
als An- und Abwickelstelle der Enden 9 der Wicklung 6
dient. Ferner sind die Kontaktelemente 2 derart ausgebildet,
daß sie sowohl als Abschirm- als auch als Schweißmaterial bei
der indirekten Laserschweißung dienen. Wie insbesondere aus
Fig. 3 ersichtlich ist, werden die Enden 9 der Wicklung 6
derart im Kontaktelement 2 geführt, daß sie im Bereich der
Aussparung 7 sandwichartig zwischen an den Kontaktelemente 2
angeordneten Teilen zu liegen kommen. In diesem Bereich wird
die Schweißstelle 10 angebracht. The contact elements have a recess 7, which in addition
as the winding and unwinding point of the
Weiterhin weisen die Kontaktelemente 2 einen derartigen
Schlitz 3 auf, daß die dreidimensionale Positionierung des
Kernteils 4 im Systemträger 1 erhalten bleibt, aber die
Kontaktelemente 2 im Schlitz 3 unterbrochen sind.Furthermore, the contact elements 2 have one
Slot 3 on that the three-dimensional positioning of the
Die Fertigung von Chip-Induktivitäten mit Systemträger 1 vermeidet das Umwickeln von An- und Abwickelstiften auf dem Bauelement. Die Sandwichtechnologie mit Kontaktelementen 2, die gleichzeitig als Abschirm- und Schweißmaterial dienen, vermeidet den Positionieraufwand für separate Abschirmplättchen. Die Kontaktelemente 2 mit Schlitz 3 und Aussparung 7 ergeben höhere Gütewerte für die Chip-Induktivität im Vergleich zu nicht unterbrochenen Kontaktelementen mit Aussparungen, die als Kurzschlußwicklung wirken.The production of chip inductors with system carrier 1 avoids the wrapping of winding and unwinding pins on the Component. Sandwich technology with contact elements 2, which serve as shielding and welding material at the same time, avoids the positioning effort for separate shielding plates. The contact elements 2 with slot 3 and recess 7 result in higher quality values for the chip inductance in comparison to uninterrupted contact elements with cutouts, which act as short-circuit winding.
Die Oberfläche der Kontaktelemente 2 aus Lötmetall wird heute vom Anwender als Stand der Technik gefordert, und die Schweißverbindung ist fester als eine Lötverbindung und gestattet den Einsatz von Wickeldrähten mit warm- oder hochwarmfester Lackisolation für den Bauelementeeinsatz bei Temperaturen >125°C. Weiterhin ist ein Umspritzen mit Hochtemperaturthermoplasten möglich, wie es in der DE-4023141-A1 beschrieben ist. Schließlich benötigt das Laserschweißen nur Schweißzeiten in der Größenordnung von ms und ermöglicht damit Zykluszeiten unter 1s, die aus Kostengründen erforderlich sind.The surface of the contact elements 2 made of solder is today required by the user as state of the art, and the Welded joint is stronger than a soldered joint and allows the use of winding wires with warm or highly heat-resistant paint insulation for the use of components Temperatures> 125 ° C. It is also encapsulated with high-temperature thermoplastics possible, as in DE-4023141-A1 is described. After all, laser welding only needs Welding times in the order of ms and enables thus cycle times under 1s, which are necessary for cost reasons are.
Claims (7)
- Chip inductor, in particular an air-core coil, choke or transformer, with a solid core part made of ferromagnetic or electrically non-conducting material, in particular ferrite, ceramic or plastic, with a winding space which can be wound with one or more layers and is offset with respect to parallel end faces of the core part, in which the ends of the windings are welded to contact elements arranged on the end faces, characterized in that the winding ends (9) are fastened to the contact elements (2) by means of indirect laser welding, in that the contact elements (2) have a coating of a solder metal and are formed in such a way that they serve both as a shielding material and a welding material during the indirect laser welding and in that the contact elements (2) have a relief (7), which is designed as a winding-on and unwinding location.
- Chip inductor according to Claim 1, characterized in that the coating consists of tin or a tin/lead alloy.
- Chip inductor according to Claim 1 or 2, characterized in that the contact elements (2) are formed as a lead frame (1).
- Chip inductor according to one of Claims 1 to 3, characterized in that the contact elements (2) have a slit (3) of such a kind that the three-dimensional positioning of the core part (4) in the lead frame (1) is retained and the contact elements (2) are interrupted in the slit (3).
- Chip inductor according to one of Claims 1 to 4, characterized in that the contact elements (2) are fastened to the end faces (8) of the core part (4) by means of an adhesive.
- Chip inductor according to one of Claims 1 to 5, characterized in that the contact elements (2) consist of CuSn6 with a solder metal coating.
- Chip inductor according to one of Claims 1 to 6, characterized in that the winding wires (6) consist of, preferably highly heat-resistant, enamelled copper wire.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE4432740A DE4432740A1 (en) | 1994-09-14 | 1994-09-14 | Chip inductance |
| DE4432740 | 1994-09-14 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| EP0702378A2 EP0702378A2 (en) | 1996-03-20 |
| EP0702378A3 EP0702378A3 (en) | 1996-04-24 |
| EP0702378B1 true EP0702378B1 (en) | 2004-08-18 |
Family
ID=6528209
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP95114392A Expired - Lifetime EP0702378B1 (en) | 1994-09-14 | 1995-09-13 | Chip inductor |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP0702378B1 (en) |
| JP (1) | JP3961036B2 (en) |
| DE (2) | DE4432740A1 (en) |
| FI (1) | FI954320A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19710462C2 (en) * | 1997-03-13 | 1999-05-20 | Siemens Matsushita Components | Electrical component, in particular chip inductance |
| DE19713147C2 (en) * | 1997-03-27 | 1999-09-09 | Siemens Matsushita Components | Chip inductance |
| DE202005019497U1 (en) * | 2005-12-14 | 2007-04-26 | Neosid Pemetzrieder Gmbh & Co Kg | Inductive miniature component for SMD assembly, has entrance opening in connection flange extending in direction from upper to lower face of component |
| DE202005019496U1 (en) * | 2005-12-14 | 2007-04-26 | Neosid Pemetzrieder Gmbh & Co Kg | Inductive miniature component e.g., for SMD assemblies, has entrance aperture extending to transverse bars normal to the plane of frame |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR1596509A (en) * | 1968-07-18 | 1970-06-22 | ||
| DE2636674A1 (en) * | 1976-08-14 | 1978-02-16 | Bosch Gmbh Robert | Wire terminal element connection prodn. - by placing wires parallel on bulge on terminal element, fusing and tamping |
| DE2946626C2 (en) * | 1979-11-19 | 1982-04-08 | Telefonbau Und Normalzeit Gmbh, 6000 Frankfurt | Method for contacting thin electrical conductors |
| JPS57114207A (en) * | 1981-01-08 | 1982-07-16 | Toshiba Corp | Electromagnetic coil and manufacture thereof |
| JPS57132306A (en) * | 1981-02-10 | 1982-08-16 | Toshiba Corp | Electromagnetic coil and manufacture therefor |
| JPS57153419A (en) * | 1981-03-18 | 1982-09-22 | Toshiba Corp | Laser welding method |
| DE3307773A1 (en) | 1983-03-04 | 1984-09-06 | Siemens AG, 1000 Berlin und 8000 München | Method for laser-welding thin wires and films |
| US4704592A (en) | 1984-09-13 | 1987-11-03 | Siemens Aktiengesellschaft | Chip inductor electronic component |
| DE3513435A1 (en) | 1985-04-15 | 1986-10-16 | Siemens AG, 1000 Berlin und 8000 München | METHOD FOR Tear-proof Contacting of Lacquer-Insulated Wires, ESPECIALLY FOR USE ON ELECTRONIC COMPONENTS |
| DE8620265U1 (en) * | 1986-07-29 | 1986-11-20 | Weiner, Rene, 5275 Bergneustadt, De | |
| EP0410211A1 (en) | 1989-07-28 | 1991-01-30 | Siemens Aktiengesellschaft | Process for producing an electrically conductive connection between enamelled copper wires and terminals |
| DE9017912U1 (en) * | 1990-07-20 | 1993-04-01 | Siemens Matsushita Components Gmbh & Co. Kg, 8000 Muenchen, De | |
| DE4039527C1 (en) | 1990-12-11 | 1992-06-25 | Siemens Matsushita Components Gmbh & Co. Kg, 8000 Muenchen, De | |
| JPH04369811A (en) * | 1991-04-05 | 1992-12-22 | Matsushita Electric Works Ltd | Coil-end treating method |
| DE4139437A1 (en) * | 1991-11-29 | 1993-06-03 | Siemens Ag | METHOD FOR PRODUCING ADHESIVE CONNECTIONS BETWEEN WINDING BODIES FOR ELECTRICAL COMPONENTS AND THEIR CONNECTING WIRE |
-
1994
- 1994-09-14 DE DE4432740A patent/DE4432740A1/en not_active Withdrawn
-
1995
- 1995-09-07 JP JP25445095A patent/JP3961036B2/en not_active Expired - Lifetime
- 1995-09-13 DE DE59510936T patent/DE59510936D1/en not_active Expired - Lifetime
- 1995-09-13 EP EP95114392A patent/EP0702378B1/en not_active Expired - Lifetime
- 1995-09-14 FI FI954320A patent/FI954320A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| FI954320A (en) | 1996-03-15 |
| EP0702378A3 (en) | 1996-04-24 |
| JPH0888130A (en) | 1996-04-02 |
| EP0702378A2 (en) | 1996-03-20 |
| JP3961036B2 (en) | 2007-08-15 |
| DE59510936D1 (en) | 2004-09-23 |
| DE4432740A1 (en) | 1996-03-21 |
| FI954320A0 (en) | 1995-09-14 |
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