EP0970492B1 - Chip inductance - Google Patents

Chip inductance Download PDF

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Publication number
EP0970492B1
EP0970492B1 EP98924025A EP98924025A EP0970492B1 EP 0970492 B1 EP0970492 B1 EP 0970492B1 EP 98924025 A EP98924025 A EP 98924025A EP 98924025 A EP98924025 A EP 98924025A EP 0970492 B1 EP0970492 B1 EP 0970492B1
Authority
EP
European Patent Office
Prior art keywords
winding
coil core
chip inductor
lugs
system carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP98924025A
Other languages
German (de)
French (fr)
Other versions
EP0970492A1 (en
Inventor
Gerhard Proks
Elmar Walter
Hans-Dieter Eckardt
Manfred Espenhain
Jörg-Rudolf MAIER
Kurt Marth
Wilfried Scherer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Electronics AG
Original Assignee
Epcos AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epcos AG filed Critical Epcos AG
Publication of EP0970492A1 publication Critical patent/EP0970492A1/en
Application granted granted Critical
Publication of EP0970492B1 publication Critical patent/EP0970492B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/10—Connecting leads to windings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H01F27/292—Surface mounted devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H01F27/292—Surface mounted devices
    • H01F2027/295—Surface mounted devices with flexible terminals

Definitions

  • the invention relates to a chip inductor with a wound coil core, which is arranged standing on pads that are part of a system carrier.
  • Such a chip inductance is from the EP 0 212 812 A1 known.
  • This embodiment in which the board-side end face of the core and the connecting parts lie in the system tray level, is characterized in that the influence of the metallic system carrier parts is reduced to the electromagnetic field produced by the coil.
  • it is difficult to position the bobbin and the electrical pads with sufficient accuracy on the leadframe terminals.
  • a miniature inductive component in which a wound ferrite core is placed on a system carrier with connection tabs and glued to this. Measures for positioning the ferrite core are not mentioned in the document.
  • the object of the present invention is therefore to further develop the chip inductance of the type mentioned at the beginning in such a way that a better positioning accuracy of coil core and electrical contacts on the terminals is achieved, without degrading the electrical properties.
  • the pads have tabs with which the coil core is positioned and fixed and which serve the electrical connection of winding and terminals, that the coil core is located within a space that exists between the Stirnebenen the spool and the tabs , And that the remaining parts of the connections are arranged outside this space.
  • a bobbin 1 is arranged with arranged winding 2.
  • the bobbin 1 is with its board-side end face on pads 5, which are part of a system support 6 made of sheet metal.
  • the winding tension causes bending of the terminals 5 due to their elasticity.
  • tumbling movements of the coil core 1 which exclude precise winding patterns and, consequently, too lead to increased dispersion of the electrical coil data.
  • the connections to reduce the core tumbling must be prevented as close as possible to the core 1 on the movement.
  • the adjacent bobbins are connected to each other by the system carrier for automated production, which are on the system carriers per bobbin two winding bases.
  • the winding wire sections between guide plates and the winding support points lie after winding on the connections in the system carrier level, which are formed perpendicular to the longitudinal direction of the system carrier. In this case, hold-downs would be required from both sides of the system carrier, but the winding wire sections passing through the connections and the winding support points would be disturbing.
  • the known design requires a two-sided, mechanical cutting of the winding wire sections not required for the application.
  • the automated production is also carried out with the system carriers 6, on which per coil core 1 but only one winding support 8 is.
  • the winding wire sections 9 between the lugs 7 and the winding support 8 are not after winding on the terminals in system tray level, which are formed parallel to the longitudinal direction of the system carrier 6.
  • connection and system support structure can be realized for the Starkdrahteln hold-down from one side of the system, so that the winding sections 9 and the winding support 8 are not in the work area of the hold-down. Furthermore, in the embodiment according to the invention, only one-sided cutting of the unwanted winding wire sections 9 is required.
  • the embodiment according to the invention therefore leads to closer tolerancing of the electrical coil data through better reproducible winding patterns and to easier separation of the excess winding wire.
  • welded joints are required because they are more temperature stable than solder joints.
  • a direct welding connection by means of the known ultrasonic method is associated with cycle times of about 1 s and therefore leads to high production costs.
  • the tabs 4 which improve the positioning of the spool core 1 and the adhesive strength, are partly formed with and partly without winding hooks. With wrap hooks, they also serve as electrical connections positioned with low tolerances. For Starkdrahtwicklitch those tabs 4, where the electrical connection of the coil end and terminal is divided by two slots 10, wherein the part connected to the winding 2 part flaps prevent the springing of the winding wire, since they are not melted, while the through the winding wire section 9 with the Winding base 8 connected part flaps the material for the Welding beads for indirect laser welding according to DE 44 32 740 A1 deliver.
  • the chip inductances are separated by disconnecting the terminals 5 at the dashed lines 12 from the system carrier 6.
  • the electrical connections are made, which are required for soldering in boards.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)

Description

Die Erfindung betrifft eine Chip-Induktivität mit einem bewickelten Spulenkern , der stehend auf Anschlußflächen angeordnet ist, die Teil eines Systemträgers sind.The invention relates to a chip inductor with a wound coil core, which is arranged standing on pads that are part of a system carrier.

Eine derartige Chip-Induktivität ist aus der EP 0 212 812 A1 bekannt. Diese Ausführung, bei der die platinenseitige Stirnfläche des Kerns und die Anschlußteile in der Systemträgerebene liegen, zeichnet sich dadurch aus, daß der Einfluß der metallischen Systemträgerteile auf das durch die Spule produzierte elektromagnetische Feld reduziert ist. Allerdings ist es schwierig, den Spulenkern und die elektrischen Kontaktstellen mit hinreichender Genauigkeit auf den Systemträgeranschlüssen zu positionieren.Such a chip inductance is from the EP 0 212 812 A1 known. This embodiment, in which the board-side end face of the core and the connecting parts lie in the system tray level, is characterized in that the influence of the metallic system carrier parts is reduced to the electromagnetic field produced by the coil. However, it is difficult to position the bobbin and the electrical pads with sufficient accuracy on the leadframe terminals.

In der genannten Druckschrift ist deswegen eine Lösung mit Anschlußlaschen vorgeschlagen, bei der die Spulenkerne in Vertiefungen derart eingeklebt werden, daß die platinenseitige Stirnflächen der Kerne unter der Systemträgerebene liegt. Hierdurch wird zwar eine bessere Positioniergenauigkeit erreicht, jedoch wird dies durch eine gewisse Verschlechterung der elektrischen Eigenschaften in Kauf genommen.In the cited document, therefore, a solution with terminal lugs is proposed, in which the coil cores are glued into recesses such that the board-side end faces of the cores lies below the system support plane. Although this achieves a better positioning accuracy, this is tolerated by a certain deterioration of the electrical properties.

Weiterhin ist aus der DE 35 10 638 C1 ein induktives Miniatur-Bauelement bekannt, bei dem ein bewickelter Ferritkern auf einen Systemträger mit Anschlußlaschen aufgesetzt und mit diesem verklebt wird. Maßnahmen zur Positionierung des Ferritkerns sind in der Druckschrift nicht angeführt.Furthermore, from the DE 35 10 638 C1 a miniature inductive component is known in which a wound ferrite core is placed on a system carrier with connection tabs and glued to this. Measures for positioning the ferrite core are not mentioned in the document.

Aufgabe der vorliegenden Erfindung ist es daher, die Chip-Induktivität der eingangs genannten Art derart weiterzubilden, daß eine bessere Positioniergenauigkeit von Spulenkern und elektrischen Kontakten auf den Anschlüssen erreicht wird, ohne daß die elektrischen Eigenschaften verschlechtert werden.The object of the present invention is therefore to further develop the chip inductance of the type mentioned at the beginning in such a way that a better positioning accuracy of coil core and electrical contacts on the terminals is achieved, without degrading the electrical properties.

Diese Aufgabe wird erfindungsgemäß dadurch gelöst, daß die Anschlußflächen Laschen aufweisen mit denen der Spulenkern positioniert und fixiert ist und die der elektrischen Verbindung von Wicklung und Anschlüssen dienen, daß der Spulenkern sich innerhalb eines Raums befindet, der zwischen den Stirnebenen des Spulenkerns und den Laschen besteht, und daß die übrigen Teile der Anschlüsse außerhalb dieses Raums angeordnet sind.This object is achieved in that the pads have tabs with which the coil core is positioned and fixed and which serve the electrical connection of winding and terminals, that the coil core is located within a space that exists between the Stirnebenen the spool and the tabs , And that the remaining parts of the connections are arranged outside this space.

Vorteilhafte Weiterbildungen des Gegenstandes der Erfindung sind in den Unteransprüchen angeführt.Advantageous developments of the subject invention are set forth in the dependent claims.

Die Erfindung wird im folgenden anhand eines Ausführungsbeispiels näher erläutert.The invention will be explained in more detail below with reference to an embodiment.

In der dazugehörenden Zeichnung mit einer einzigen Figur ist ein Spulenkern 1 mit darauf angeordneter Wicklung 2 dargestellt. Der Spulenkörper 1 steht mit seiner platinenseitigen Stirnfläche auf Anschlußflächen 5, die Teil eines Systemträgers 6 aus Metallblech sind.In the accompanying drawing with a single figure, a bobbin 1 is arranged with arranged winding 2. The bobbin 1 is with its board-side end face on pads 5, which are part of a system support 6 made of sheet metal.

Auf den Anschlußflächen 5 sind senkrecht stehende Laschen 7 angeordnet, so daß ein Raum gebildet wird, der der Positionierung des Spulenkerns 1 dient. Die Befestigung des Spulenkerns 1 geschieht mittels Klebeverbindungen zwischen platinenseitiger Stirnfläche des Spulenkörpers 1 und den Anschlußflächen 5 einerseits und zwischen den Laschen 7 und dem Kern 1 andererseits.On the pads 5 perpendicular tabs 7 are arranged so that a space is formed, which serves to position the spool core 1. The attachment of the spool core 1 is done by means of adhesive connections between the platinenseitiger end face of the bobbin 1 and the pads 5 on the one hand and between the tabs 7 and the core 1 on the other.

Während des Wickelns bewirkt der Wickelzug ein Verbiegen der Anschlüsse 5 infolge ihrer Elastizität. Insbesondere beim Starkdrahtwickeln mit Wickeldrahtdurchmessern von zum Beispiel 0,3 mm resultieren Taumelbewegungen des Spulenkerns 1, die präzise Wickelbilder ausschließen und infolgedessen zu erhöhter Streuung der elektrischen Spulendaten führen. Um präzise und reproduzierbare Wickelbilder zu erhalten, müssen deshalb die Anschlüsse zur Verringerung des Kerntaumelns möglichst nah am Kern 1 an der Bewegung gehindert werden.During winding, the winding tension causes bending of the terminals 5 due to their elasticity. Particularly in the case of heavy-wire winding with winding wire diameters of, for example, 0.3 mm, tumbling movements of the coil core 1 which exclude precise winding patterns and, consequently, too lead to increased dispersion of the electrical coil data. In order to obtain precise and reproducible winding images, therefore, the connections to reduce the core tumbling must be prevented as close as possible to the core 1 on the movement.

Bei der aus der EP 0 212 812 A1 bekannten Ausführung sind für die automatisierte Fertigung die benachbarten Spulenkörper durch die Systemträger miteinander verbunden, wobei sich auf den Systemträgern pro Spulenkern zwei Wickelstützpunkte befinden. Die Wickeldrahtabschnitte zwischen Führungslaschen und den Wickelstützpunkten liegen nach dem Wickeln auf den Anschlüssen in Systemträgerebene, die senkrecht zur Längsrichtung der Systemträger ausgebildet sind. Erforderlich wären hierbei Niederhalter von beiden Seiten des Systemträgers, wobei aber die über die Anschlüsse laufenden Wickeldrahtabschnitte sowie die Wickelstützpunkte stören würden. Weiterhin erfordert die bekannte Ausführung ein zweiseitiges, mechanisches Abschneiden der für den Anwendungsfall nicht benötigten Wickeldrahtabschnitte.At the time of the EP 0 212 812 A1 known design, the adjacent bobbins are connected to each other by the system carrier for automated production, which are on the system carriers per bobbin two winding bases. The winding wire sections between guide plates and the winding support points lie after winding on the connections in the system carrier level, which are formed perpendicular to the longitudinal direction of the system carrier. In this case, hold-downs would be required from both sides of the system carrier, but the winding wire sections passing through the connections and the winding support points would be disturbing. Furthermore, the known design requires a two-sided, mechanical cutting of the winding wire sections not required for the application.

Bei Gegenstand der Erfindung erfolgt die automatisierte Fertigung ebenfalls mit den Systemträgern 6, auf denen sich pro Spulenkern 1 aber nur ein Wickelstützpunkt 8 befindet. Die Wickeldrahtabschnitte 9 zwischen den Laschen 7 und dem Wickelstützpunkt 8 liegen nach dem Wickeln nicht auf den Anschlüssen in Systemträgerebene, die parallel zur Längsrichtung der Systemträger 6 ausgebildet sind.In the subject invention, the automated production is also carried out with the system carriers 6, on which per coil core 1 but only one winding support 8 is. The winding wire sections 9 between the lugs 7 and the winding support 8 are not after winding on the terminals in system tray level, which are formed parallel to the longitudinal direction of the system carrier 6.

Bei dieser Anschluß- und Systemträgerkonstruktion lassen sich für das Starkdrahtwickeln Niederhalter von einer Seite des Systems realisieren, so daß sich die Wickelabschnitte 9 und der Wickelstützpunkt 8 nicht im Arbeitsbereich der Niederhalter befinden. Weiterhin ist bei der Ausführungsform nach der Erfindung nur noch ein einseitiges Schneiden der nicht benötigten Wickeldrahtabschnitte 9 erforderlich.In this connection and system support structure can be realized for the Starkdrahteln hold-down from one side of the system, so that the winding sections 9 and the winding support 8 are not in the work area of the hold-down. Furthermore, in the embodiment according to the invention, only one-sided cutting of the unwanted winding wire sections 9 is required.

Die Ausführungsform gemäß der Erfindung führt deshalb zu engerer Tolerierung der elektrischen Spulendaten durch bessere reproduzierbare Wickelbilder und zu einfacherem Abtrennen des überschüssigen Wickeldrahts.The embodiment according to the invention therefore leads to closer tolerancing of the electrical coil data through better reproducible winding patterns and to easier separation of the excess winding wire.

Für die Anwendung bei erhöhten Temperaturen, wie zum Beispiel in der Motorelektronik, sind Schweißverbindungen erforderlich, da sie temperaturstabiler sind als Lötverbindungen.For use at elevated temperatures, such as in engine electronics, welded joints are required because they are more temperature stable than solder joints.

Für die automatisierte Fertigung von Chip-Induktivitäten mit Starkdrahtwicklung existiert bislang kein geeignetes Schweißverfahren.For the automated production of chip inductors with strong wire winding, there is currently no suitable welding process.

Eine direkte Schweißverbindung mittels des bekannten Ultraschallverfahrens ist mit Taktzeiten von ca. 1 s verbunden und führt deshalb zu hohen Fertigungskosten.A direct welding connection by means of the known ultrasonic method is associated with cycle times of about 1 s and therefore leads to high production costs.

Für eine direkte Schweißverbindung mittels Laser, die beispielsweise aus der DE 40 39 527 C1 bekannt ist, ist noch kein Fertigungsverfahren entwickelt.For a direct welding connection by means of laser, for example, from the DE 40 39 527 C1 is known, no manufacturing process has yet been developed.

Das aus der DE 44 32 740 A1 bekannte indirekte Laserschweißen ist bei Starkdrahtwicklung nicht durchführbar, da die Rückfederung des Wickeldrahts im Moment des Aufschmelzens zu Unterbrechungen oder zu unzureichenden Schweißverbindungen führt.That from the DE 44 32 740 A1 known indirect laser welding is not feasible in heavy-wire winding, since the spring back of the winding wire at the moment of melting leads to interruptions or insufficient welds.

Die Laschen 4, die die Positionierung des Spulenkerns 1 und die Klebefestigkeit verbessern, sind teils mit und teils ohne Wickelhaken ausgebildet. Mit Wickelhaken dienen sie zusätzlich als mit geringen Toleranzen positionierte elektrische Anschlüsse. Für Starkdrahtwicklungen sind diejenigen Laschen 4, an denen die elektrische Verbindung von Wickelende und Anschluß erfolgt durch Schlitze 10 zweigeteilt, wobei die mit der Wicklung 2 verbundenen Teillaschen das Auffedern des Wickeldrahts verhindern, da sie nicht aufgeschmolzen werden, während die durch den Wickeldrahtabschnitt 9 mit dem Wickelstützpunkt 8 verbundenen Teillaschen das Material für die Schweißperlen bei indirekter Laserschweißung gemäß DE 44 32 740 A1 liefern.The tabs 4, which improve the positioning of the spool core 1 and the adhesive strength, are partly formed with and partly without winding hooks. With wrap hooks, they also serve as electrical connections positioned with low tolerances. For Starkdrahtwicklungen those tabs 4, where the electrical connection of the coil end and terminal is divided by two slots 10, wherein the part connected to the winding 2 part flaps prevent the springing of the winding wire, since they are not melted, while the through the winding wire section 9 with the Winding base 8 connected part flaps the material for the Welding beads for indirect laser welding according to DE 44 32 740 A1 deliver.

Durch die Ausführungsform gemäß der Erfindung wird dadurch das indirekte Laserschweißen von Starkdrahtwicklungen mit zum Beispiel 0,3 mm Drahtdurchmesser ermöglicht.By the embodiment according to the invention, the indirect laser welding of Starkdrahtwicklungen with, for example, 0.3 mm wire diameter is made possible.

Nach fertiggestellter Bewicklung des Spulenkerns 1 sowie der Befestigung der Wickeldrahtenden 9 an den entsprechenden Laschen 7 erfolgt eine Umhüllung mit einem Kunststoff 11, zum Beispiel einem flüssigkristallinem Polymer.After completed winding of the bobbin 1 and the attachment of the winding wire ends 9 to the corresponding tabs 7, a casing with a plastic 11, for example, a liquid-crystalline polymer takes place.

Nachdem die Umhüllung 11 hergestellt ist, werden die Chip-Induktivitäten vereinzelt, indem die Anschlüsse 5 an den gestrichelten Linien 12 vom Systemträger 6 getrennt werden. Durch Umbiegen der Anschlüsse 5 auf die Umhüllung 11 werden die elektrischen Anschlüsse hergestellt, die zum Einlöten in Platinen erforderlich sind.After the sheath 11 has been produced, the chip inductances are separated by disconnecting the terminals 5 at the dashed lines 12 from the system carrier 6. By bending the terminals 5 on the envelope 11, the electrical connections are made, which are required for soldering in boards.

Claims (5)

  1. Chip inductor with a wound coil core (1), which is arranged vertically on connector surfaces (5), which are part of a system carrier (6), characterized in that the connector surfaces (5) have lugs (7) with which the coil core (1) is positioned and fixed and which are used to electrically connect winding (2) and connectors, that the coil core (1) is located in a space, which exists between the face planes of the coil core (1) and the lugs (7), and that the remaining parts of the connectors are arranged outside this space.
  2. Chip inductor according to Claim 1, characterized in that the coil core (1) is fixed to the system carrier (6) by means of a glued connection.
  3. Chip inductor according to Claim 1 or 2, characterized in that the winding ends (9) are connected to the lugs (7) abutting the coil core (1) by means of indirect laser welding.
  4. Chip inductor according to one of Claims 1 to 3, characterized in that the lugs (7) connected to the winding ends (9) consist of two parts, and that one part provides the material for a welding bead.
  5. Chip inductor according to one of Claims 1 to 4, characterized in that it is mounted with the connectors parallel to the longitudinal direction of the carrier strip on a system carrier (6), which has only one winding support point (8) per chip inductor.
EP98924025A 1997-03-27 1998-03-19 Chip inductance Expired - Lifetime EP0970492B1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19713147 1997-03-27
DE19713147A DE19713147C2 (en) 1997-03-27 1997-03-27 Chip inductance
PCT/DE1998/000812 WO1998044518A1 (en) 1997-03-27 1998-03-19 Chip inductance

Publications (2)

Publication Number Publication Date
EP0970492A1 EP0970492A1 (en) 2000-01-12
EP0970492B1 true EP0970492B1 (en) 2007-08-15

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ID=7824948

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Application Number Title Priority Date Filing Date
EP98924025A Expired - Lifetime EP0970492B1 (en) 1997-03-27 1998-03-19 Chip inductance

Country Status (5)

Country Link
US (1) US6249208B1 (en)
EP (1) EP0970492B1 (en)
JP (1) JP2001516509A (en)
DE (2) DE19713147C2 (en)
WO (1) WO1998044518A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005027943A1 (en) * 2005-06-16 2006-12-28 Epcos Ag Carrier device for a toroidal core choke, holder for an inductive component and inductive component

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3001600C2 (en) * 1980-01-17 1982-02-11 Siemens AG, 1000 Berlin und 8000 München Method for the permanent connection of electrical connection elements with an electrical component
JPS58223306A (en) * 1982-06-22 1983-12-24 Toko Inc Manufacture of lead-less type fixed inductor
DE3510638C1 (en) * 1985-03-23 1986-10-16 Neosid Pemetzrieder Gmbh & Co Kg, 5884 Halver Inductive miniature component, especially a miniature coil, and a method for producing such a component
JPS625618A (en) * 1985-07-02 1987-01-12 Matsushita Electric Ind Co Ltd Chip inductor
FR2606544B1 (en) * 1986-11-07 1990-05-18 Thomson Csf INDUCTANCE
DE4039527C1 (en) * 1990-12-11 1992-06-25 Siemens Matsushita Components Gmbh & Co. Kg, 8000 Muenchen, De
JPH04273112A (en) * 1991-02-28 1992-09-29 Murata Mfg Co Ltd Molded chip electronic component
DE4432740A1 (en) * 1994-09-14 1996-03-21 Siemens Matsushita Components Chip inductance

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
None *

Also Published As

Publication number Publication date
JP2001516509A (en) 2001-09-25
DE19713147C2 (en) 1999-09-09
DE59814075D1 (en) 2007-09-27
US6249208B1 (en) 2001-06-19
WO1998044518A1 (en) 1998-10-08
DE19713147A1 (en) 1998-10-08
EP0970492A1 (en) 2000-01-12

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