EP0702378A2 - Inductance de puce - Google Patents

Inductance de puce Download PDF

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Publication number
EP0702378A2
EP0702378A2 EP95114392A EP95114392A EP0702378A2 EP 0702378 A2 EP0702378 A2 EP 0702378A2 EP 95114392 A EP95114392 A EP 95114392A EP 95114392 A EP95114392 A EP 95114392A EP 0702378 A2 EP0702378 A2 EP 0702378A2
Authority
EP
European Patent Office
Prior art keywords
contact elements
winding
core part
chip
chip inductance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP95114392A
Other languages
German (de)
English (en)
Other versions
EP0702378A3 (fr
EP0702378B1 (fr
Inventor
Uwe Dipl.-Phys. Hildebrandt
Wilfried Dipl.-Ing.(FH) Scherer
Manfred Dipl.-Phys. Espenhain
Ralf Dr. Ing. Humke
Hans-Dieter Dipl.-Ing. Eckhardt
Winfried Dipl.-Ing. Grauer
Lothar Hock
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Electronics AG
Original Assignee
Siemens Matsushita Components GmbH and Co KG
Epcos AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Matsushita Components GmbH and Co KG, Epcos AG filed Critical Siemens Matsushita Components GmbH and Co KG
Publication of EP0702378A2 publication Critical patent/EP0702378A2/fr
Publication of EP0702378A3 publication Critical patent/EP0702378A3/xx
Application granted granted Critical
Publication of EP0702378B1 publication Critical patent/EP0702378B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/10—Connecting leads to windings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/06—Coil winding
    • H01F41/076—Forming taps or terminals while winding, e.g. by wrapping or soldering the wire onto pins, or by directly forming terminals from the wire

Definitions

  • the invention relates to a chip inductance, in particular an air coil, choke or transformer, with a solid core part made of ferromagnetic or electrically non-conductive material, in particular ferrite, ceramic or plastic, with a winding space that can be wound in one or more layers and is set apart from parallel end faces of the core part, in which the winding ends are welded to contact elements arranged on the end face.
  • Such a chip inductance is known from EP-0177759-B1.
  • the core part has cutouts arranged in the region of the front ends, which are intended for receiving platelet-shaped contact elements to which the winding wires are welded.
  • the known chip inductors are welded on according to EP-0200014-A1 by means of ultrasonic welding, in which enamel-insulated winding wires are connected to the contact elements.
  • the mechanical strength of the electrical connection is then increased by covering the weld with a drop of adhesive.
  • the problem with this ultrasonic welding process is that so far only contact elements that have a surface coating of silver could be used. However, this can lead to problems when soldering in a circuit board due to the formation of silver sulfide, and silver can also accumulate in the solder bath, which is not desired. If, on the other hand, the contact elements have a coating of a solder metal, there is no adequate electrical connection during ultrasonic welding, since the lubricating effect of tin or tin / lead prevents the formation of usable welded connections.
  • the minimum welding time of approx. 0.5 s required for ultrasonic welding leads to cycle times of approx. 1 s even with automatic feeding of the component and welding sonotrodes.
  • EP-0410211-A1 discloses welding, in which copper wires with heat or high-temperature-resistant enamel insulation are connected to the connection elements of electrical components using phosphorus-containing hard solder in an indirect laser welding process.
  • This method is also not suitable for SMT inductors, since at the soldering temperatures that can be used for chip inductors, there is insufficient wetting with the required hard solder. Electrical connections with hard solder in the welding areas and with soft solder surfaces in the soldering areas would therefore be required. Such connections for chip inductors are just as unavailable as those with a surface combination of silver and solder.
  • the object of the present invention is to provide a chip inductance of the type mentioned at the beginning, the winding ends of which are welded to the contact elements, and which can be produced in automated production with cycle times of less than 1s.
  • a solid core part 4 with a winding space 5 is shown.
  • the winding 6 of the chip inductor is arranged, which preferably consists of a copper wire with high-temperature resistant paint insulation.
  • Contact elements 2, which are part of a system carrier 1, are fastened to the end faces 8 of the core part 4, preferably glued on.
  • the system carrier 1, which consists for example of CuSn6, has a surface coating of a solder metal, preferably tin or a tin-lead alloy.
  • the contact elements have a recess 7, which additionally serves as a winding and unwinding point for the ends 9 of the winding 6. Furthermore, the contact elements 2 are designed such that they serve both as a shielding material and as a welding material in indirect laser welding. As can be seen in particular from FIG. 3, the ends 9 of the winding 6 are guided in the contact element 2 such that they come to lie in a sandwich-like manner in the region of the recess 7 between parts arranged on the contact elements 2. The welding point 10 is attached in this area.
  • the contact elements 2 have a slot 3 such that the three-dimensional positioning of the core part 4 in the system carrier 1 is retained, but the contact elements 2 in the slot 3 are interrupted.
  • chip inductors with system carrier 1 avoids the winding around winding and unwinding pins on the component.
  • the sandwich technology with contact elements 2, which also serve as shielding and welding material, avoids the positioning effort for separate shielding plates.
  • the contact elements 2 with slot 3 and recess 7 result in higher quality values for the chip inductance compared to uninterrupted contact elements with recesses which act as a short-circuit winding.
  • the surface of the contact elements 2 made of soldering metal is required by the user as state of the art today, and the welded connection is stronger than a soldered connection and allows the use of winding wires with heat or high-temperature resistant enamel insulation for the use of components at temperatures> 125 ° C.
  • Overmolding with high-temperature thermoplastics is also possible, as described in DE-4023141-A1. After all, laser welding only requires welding times in the order of ms and thus enables cycle times under 1s, which are necessary for cost reasons.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Coils Of Transformers For General Uses (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
EP95114392A 1994-09-14 1995-09-13 Inductance de puce Expired - Lifetime EP0702378B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4432740A DE4432740A1 (de) 1994-09-14 1994-09-14 Chip-Induktivität
DE4432740 1994-09-14

Publications (3)

Publication Number Publication Date
EP0702378A2 true EP0702378A2 (fr) 1996-03-20
EP0702378A3 EP0702378A3 (fr) 1996-04-24
EP0702378B1 EP0702378B1 (fr) 2004-08-18

Family

ID=6528209

Family Applications (1)

Application Number Title Priority Date Filing Date
EP95114392A Expired - Lifetime EP0702378B1 (fr) 1994-09-14 1995-09-13 Inductance de puce

Country Status (4)

Country Link
EP (1) EP0702378B1 (fr)
JP (1) JP3961036B2 (fr)
DE (2) DE4432740A1 (fr)
FI (1) FI954320A (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998040897A1 (fr) * 1997-03-13 1998-09-17 Siemens Matsushita Components Gmbh & Co. Kg Composant electrique, en particulier une inductance pastille

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19713147C2 (de) * 1997-03-27 1999-09-09 Siemens Matsushita Components Chip-Induktivität
DE202005019497U1 (de) * 2005-12-14 2007-04-26 Neosid Pemetzrieder Gmbh & Co Kg Induktives Miniatur-Bauelement für SMD-Montage
DE202005019496U1 (de) * 2005-12-14 2007-04-26 Neosid Pemetzrieder Gmbh & Co Kg Induktives Miniatur-Bauelement für SMD-Montage

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2946626A1 (de) 1979-11-19 1981-05-21 Telefonbau Und Normalzeit Gmbh, 6000 Frankfurt Verfahren zur ankontaktierung von duennen elektrischen leitungsdraehten
DE3307773A1 (de) 1983-03-04 1984-09-06 Siemens AG, 1000 Berlin und 8000 München Verfahren zum laserschweissen von duennen draehten und folien
EP0200014A1 (fr) 1985-04-15 1986-11-05 Siemens Aktiengesellschaft Procédé de réalisation de contacts inarrachables pour des fils isolés par du vernis
EP0177759B1 (fr) 1984-09-13 1990-05-16 Siemens Aktiengesellschaft Composant électronique, en particulier pour une micro-inductance
EP0410211A1 (fr) 1989-07-28 1991-01-30 Siemens Aktiengesellschaft Procédé de fabrication d'une connexion électrique conductrice entre des fils de cuivre émaillés et des bornes
DE4023141A1 (de) 1990-07-20 1992-01-30 Siemens Matsushita Components Verfahren zum herstellen einer quaderaehnlichen umhuellten induktivitaet zur oberflaechenmontage
DE4039527C1 (fr) 1990-12-11 1992-06-25 Siemens Matsushita Components Gmbh & Co. Kg, 8000 Muenchen, De

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1596509A (fr) * 1968-07-18 1970-06-22
DE2636674A1 (de) * 1976-08-14 1978-02-16 Bosch Gmbh Robert Verfahren zur herstellung einer draht-anschlusselement-verbindung
JPS57114207A (en) * 1981-01-08 1982-07-16 Toshiba Corp Electromagnetic coil and manufacture thereof
JPS57132306A (en) * 1981-02-10 1982-08-16 Toshiba Corp Electromagnetic coil and manufacture therefor
JPS57153419A (en) * 1981-03-18 1982-09-22 Toshiba Corp Laser welding method
DE8620265U1 (fr) * 1986-07-29 1986-11-20 Weiner, Rene, 5275 Bergneustadt, De
JPH04369811A (ja) * 1991-04-05 1992-12-22 Matsushita Electric Works Ltd コイル端末処理方法
DE4139437A1 (de) * 1991-11-29 1993-06-03 Siemens Ag Verfahren zum herstellen von klebverbindungen zwischen wickelkoerpern fuer elektrische bauelemente und deren anschlussdraehten

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2946626A1 (de) 1979-11-19 1981-05-21 Telefonbau Und Normalzeit Gmbh, 6000 Frankfurt Verfahren zur ankontaktierung von duennen elektrischen leitungsdraehten
DE3307773A1 (de) 1983-03-04 1984-09-06 Siemens AG, 1000 Berlin und 8000 München Verfahren zum laserschweissen von duennen draehten und folien
EP0177759B1 (fr) 1984-09-13 1990-05-16 Siemens Aktiengesellschaft Composant électronique, en particulier pour une micro-inductance
EP0200014A1 (fr) 1985-04-15 1986-11-05 Siemens Aktiengesellschaft Procédé de réalisation de contacts inarrachables pour des fils isolés par du vernis
EP0410211A1 (fr) 1989-07-28 1991-01-30 Siemens Aktiengesellschaft Procédé de fabrication d'une connexion électrique conductrice entre des fils de cuivre émaillés et des bornes
DE4023141A1 (de) 1990-07-20 1992-01-30 Siemens Matsushita Components Verfahren zum herstellen einer quaderaehnlichen umhuellten induktivitaet zur oberflaechenmontage
DE4039527C1 (fr) 1990-12-11 1992-06-25 Siemens Matsushita Components Gmbh & Co. Kg, 8000 Muenchen, De

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998040897A1 (fr) * 1997-03-13 1998-09-17 Siemens Matsushita Components Gmbh & Co. Kg Composant electrique, en particulier une inductance pastille
DE19710462A1 (de) * 1997-03-13 1998-09-24 Siemens Matsushita Components Elektrisches Bauelement, insbesondere Chipinduktivität
DE19710462C2 (de) * 1997-03-13 1999-05-20 Siemens Matsushita Components Elektrisches Bauelement, insbesondere Chipinduktivität

Also Published As

Publication number Publication date
FI954320A (fi) 1996-03-15
EP0702378A3 (fr) 1996-04-24
JPH0888130A (ja) 1996-04-02
EP0702378B1 (fr) 2004-08-18
JP3961036B2 (ja) 2007-08-15
DE59510936D1 (de) 2004-09-23
DE4432740A1 (de) 1996-03-21
FI954320A0 (fi) 1995-09-14

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